BOSER Technology BPF-3215-V User manual

BPF-3215-V
15” Fanless Panel PC
with Touch Screen, P-M/ULV C-M,
2W Stereo Speaker, 3 COM,
2 USB, 12V DC Adapter

Copyright Disclaimers
The accuracy of contents in this manual has passed through checking and review before
publishing. BOSER Technology Co., Ltd., the manufacturer and publisher, is not liable for
any infringements of patents or other rights resulting from its use. The manufacturer will
not be responsible for any direct, indirect, special, incidental or consequential
damages arising from the use of this product or documentation, even if advised of
the possibility of such damage(s).
This manual is copyrighted and BOSER Technology Co., Ltd. reserves all
documentation rights. Unauthorized reproduction, transmission, translation, and
storage of any form and means (i.e., electronic, mechanical, photocopying, recording)
of this document, in whole or partly, is prohibited, unless granted permission by BOSER
Technology Co., Ltd.
BOSER Technology Co., Ltd. reserves the right to change or improve the contents of
this document without due notice. BOSER Technology Co., Ltd. assumes no
responsibility for any errors or omissions that may appear in this manual, nor does
it make any commitment to update the information contained herein.
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BOSER is a registered trademark of BOSER Technology Co., Ltd.
ISB is a registered trademark of BOSER Technology Co., Ltd.
Intel is a registered trademark of Intel Corporation.
Award is a registered trademark of Award Software, Inc.
AMI is a registered trademark of AMI Software, Inc.
All other trademarks, products and or product names mentioned herein are
mentioned for identification purposes only, and may be trademarks and/or
registered trademarks of their respective companies or owners.
© Copyright 2008 BOSER Technology Co., Ltd.
All Rights Reserved.
Edition 1.3, July 8, 2011

Table of Contents
Chapter 1 General Description ..................................1
1.1 Major Features....................................................................... 2
1.2 Specifications ........................................................................ 2
1.3 Dimensions ............................................................................ 4
Chapter 2 Unpacking ..................................................5
Chapter 3 Chassis Installation ...................................7
3.1 Heat Sink Installation for SBC ............................................. 7
3.2 Installation SBC..................................................................... 8
3.3 HDD Cage Assembly............................................................. 9
3.4 Heat Sink Installation for Chassis ..................................... 10
3.5 Back Cover Installation....................................................... 11
3.6 Wall Mount Kit...................................................................... 12
3.7 VESA Mount Metal Stand Kit.............................................. 13
Chapter 4 SBC Installation ......................................15
4.1 Before Installation ............................................................... 15
4.2 Board Layout ....................................................................... 16
4.3 Jumper List .......................................................................... 17
4.4 Connector List ..................................................................... 17
4.5 Configuring the CPU ........................................................... 18
4.6 System Memory ................................................................... 18
4.7 VGA Controller .................................................................... 18
4.8 PCI E-IDE Drive Connector................................................. 20
4.9 Serial Port Connectors ....................................................... 21
4.10 Ethernet Connector............................................................. 22
4.11 USB Port............................................................................... 23
4.12 CMOS Data Clear................................................................. 23
4.13 Power and Fan Connectors................................................ 24
4.14 Keyboard/Mouse Connectors ............................................ 25
4.15 System Front Panel Control ............................................... 25
4.16 Watchdog Timer .................................................................. 26
4.17 Audio Connectors ............................................................... 27
4.18 CompactFlashConnector................................................ 27
4.19 IrDA Function....................................................................... 29
4.20 8-bit I/O Function................................................................. 29
4.21 PCI-104 Connector .............................................................. 31

Chapter 5 AMI BIOS Setup.....................................33
5.1 Starting Setup...................................................................... 33
5.2 Using Setup ......................................................................... 34
5.3 Main Menu............................................................................ 35
5.4 Advanced Settings .............................................................. 36
5.5 Advanced PCI/PnP Settings............................................... 39
5.6 Boot Settings ....................................................................... 40
5.7 Security Settings ................................................................. 41
5.8 Advanced Chipset Settings................................................ 42
5.9 Exit Options ......................................................................... 43
Chapter 6 Software Utilities.....................................45
6.1 Chipset Driver Installation.................................................. 45
6.2 VGA Driver Installation ....................................................... 48
6.3 LAN Driver Installation........................................................ 50
6.4 Audio Driver Installation..................................................... 52
6.5 Touch Screen Driver Installation ....................................... 54
6.6 Wireless LAN Device Driver Installation ........................... 58

Declaration of Conformity -- CE Mark
BOSER Technology hereby acknowledges that compliance testing in
accordance with applicable standards of the EU’s EMC Directive,
89/336/EEC, was successfully completed on a sample of the equipment
identified below:
Equipment Class: Information Technology Equipment
Product Model Series: BPF-3215-V
This Product Complies With: EN55022: Class A for Radiated emissions
EN50082-2: Heavy Industrial EMC Immunity
We, the undersigned, hereby declare that the equipment specified above
conforms to the above directives and standards.
Manufacturer:
BOSER TECHNOLOGY CO., LTD.

Safety Instructions
The safety recommendations outlined in this section are to be read,
understood and followed before operating the product. Keep this
information in a safe place for future reference. Failure to comply with any
of the following safety procedures could result in serious hazard.
Do not operate product for any purposes other than its intended use
This product is intended for indoor use only
Do not operate product if power cord is damaged in anyway
Do not insert objects into openings
Do not immerse product in water or permit liquids to spill inside
Turn off power when unattended or not in use. Unplug product before
moving it or when it is not in use for an extended period of time. The
socket-outlet shall be installed near the equipment and shall be easily
accessible
Do not alter or extend electric plug. Plug is configured for appropriate
electrical supply
Do not overload electrical outlets beyond their capacity as this can result in a
fire
NOTE: DO NOT TOUCH THE PRODUCT OR ANY OTHER SENSITIVE
COMPONENTS WITHOUT ALL NECESSARY ANTI-STATIC
PROTECTIONS.

Life Expectancy of Constituent Parts
This section describes the life expectancy of constituent parts (backlight,
power supply, internal cooling fan and touch screen) which make up to
BPF-3215-V.
TFT Display Backlight
Display brightness decreases over time with use. The expected operating
lifetime of the backlight time to reach 50% initial brightness) is 30,000 hours
(assuming continuous lit state at 25 degrees C). Actual lifetime before
replacement is about 30,000 hours, although this depends on operating
conditions.
Touch Screen
The operating lifetime of the touch screen is approximately 1 million
operations (as tested by mechanical manipulation under 100g of force at a
rate of two presses per second)

1
Chapter 1
General Description
The BPF-3215-V is a newest Industrial Panel PC, Panel PC features
anti-vibration design and is a best cost-effective alternative for users.
This precise streamline platform can be applied to Kiosk, DSA,
transaction terminal, POS, home security system, ATM system and
voting machine parking field and more.
It has built-in ultra low power consumption Intel® mobile processor is
response to demands of cost-effective panel system. All of BPF series
Panel PC Support resistive/SAW touch screens, highly expandable, it
is an ideal for space-limited environments, and furthermore it supports
an optional rotational WLAN antenna for wireless network connection.

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1.1 Major Features
The BPF-3215-V comes with the following features:
¾Fanless, aluminum front panel design
¾15” TFT color panel display w/resistive or SAW touch screen
¾Supports Intel® P-M/ULV C-M processor ≦24.5W
¾VGA, dual Ethernet, Audio port
¾2W Stereo Speaker
¾1 x 2.5” HDD space, 1 x slim CD-ROM space
¾1 x CF socket
¾3 x COM port, 2 x USB2.0 port
¾12V DC adapter
¾Option for Wireless LAN module
1.2 Specifications
zSystem
LCD
Size: 15”
Max. Resolution: 1024 x 768 pixels
Brightness: 350 cd/m2
Contrast Ratio: 700:1
Max. Color: 16.2M/262K colors
Pixel Pitch: 0.297 x 0.297 mm
Touch Screen
15” resistive or SAW (option)
SBC Model
HS-2616(M)
CPU
Intel® Pentium® M processor 1.8GHz or ULV Celeron® M
processor 600MHz/512K (option)
System Chipset:
Intel® 852GM(E)/ICH4
System Memory
1 x 200-pin SO-DIMM, DDR 333MHz(HS-2616)/DDR
266MHz(HS-2616M), Max. 1GB
Display Interface
1 x D-SUB 15-pin
Audio Interface
Audio jack for MIC In, Line Out
2W Amplifier with Stereo Speaker

3
Ethernet Interface
2 x RJ-45 for Ethernet
1 x USB wireless LAN module (option)
Storage
1 x 2.5” HDD space
1 x slim CD-ROM space
1 x Type II CF socket
Watchdog Timer
Software programmable time-out intervals from 1~255 sec. or
1~255 min.
H/W Status Monitor
Monitoring temperatures, voltages status
Power
12V 60W DC adapter
+12V DC IN
Operating/Storage Temperature
0~+45 degrees C/-20~+70 degrees C
Certification
FCC/CE Class A compliance
IP65 front panel protection compliance
Dimensions
41.5(L) x 32.0(H) x 5.75(W) cm
Cut Out Size
36.4(L) x 28.2(H) cm
zI/O Interface

4
1.3 Dimensions

5
Chapter 2
Unpacking
After unpacking the Panel PC, place it on a raised surface and carefully
inspect the Panel PC for any damage that might have occurred during
shipment. Ground the board and exercise extreme care to prevent
damage to the board from static electricity.
The BPF-3215-V delivery package contains the following items:
BPF-3215-V x 1, w/Power Cable x 1
Utility CD Disk x 1, including User’s Manual
It is recommended that user keeps all the parts of the delivery package
intactness and store them in a safe/dry place for any reasons that
require for returning the product. In case you find any missing and/or
damaged items from the list, please contact your dealer or sale
representatives immediately.

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Chapter 3
Chassis Installation
This chapter tells how to install components into the Panel PC system.
External interface please refers to system board’s manual.
3.1 Heat Sink Installation for SBC
1. Follow the photo instruction install the heat sink onto the SBC
with screws evenly.

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3.2 Installation SBC
1. Follow the photo instruction install the SBC onto the chassis.

9
3.3 HDD Cage Assembly
1. Follow the photo instruction install the HDD onto the HDD
mounting bracket.
2. Follow the photo instruction install the HDD_KIT onto the
chassis.

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3.4 Heat Sink Installation for Chassis
1. Follow the photo instruction install the large heat sink onto the
back cover of the chassis.

11
3.5 Back Cover Installation
1. Follow the photo instruction install the back cover onto the
chassis.

12
3.6 Wall Mount Kit
1. Follow the photo instruction install the wall mount kit onto the
chassis.