caenrfid Hardon mini R1271C Technical document

TECHNICAL INFORMATION MANUAL
Revision 01 –8 July 2020
Hadronmini R1271C
High Performance 1-port Embedded Reader

Scope of Manual
The goal of this manual is to provide the basic information to work with the Hadronmini R1271C Reader.
Change Document Record
Date
Revision
Changes
Pages
8 July 2020
1
First Release
-
Reference Document
[RD1] EPCglobal: EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF RFID Protocol for
Communications at 860 MHz –960 MHz, Version 2.0.1 (April, 2015).
CAEN RFID srl
Via Vetraia, 11 55049 Viareggio (LU) - ITALY
Tel. [phone] Fax [phone]
[email protected]
www.caenrfid.com
© CAEN RFID srl –2020
Disclaimer
No part of this manual may be reproduced in any form or by any means, electronic, mechanical, recording,
or otherwise, without the prior written permission of CAEN RFID.
The information contained herein has been carefully checked and is believed to be accurate; however, no
responsibility is assumed for inaccuracies. CAEN RFID reserves the right to modify its products
specifications without giving any notice; for up to date information please visit www.caenrfid.com.
Visit the Hadronmini R1271C web page, you will find the latest revision
of data sheets, manuals, certifications, technical drawings, software and firmware.
All you need to start using your reader in a few clicks!

Federal Communications Commission (FCC) Notice
This device was tested and found to comply with the limits set forth in Part 15 of the FCC Rules. Operation
is subject to the following conditions: (1) this device may not cause harmful interference, and (2) this device
must accept any interference received including interference that may cause undesired operation. These
limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment.
This device generates, uses, and can radiate radio frequency energy. If not installed and used in accordance
with the instruction manual, the product may cause harmful interference to radio communications.
Operation of this product in a residential area is likely to cause harmful interference, in which case, the user
is required to correct the interference at their own expense. The authority to operate this product is
conditioned by the requirements that no modifications be made to the equipment unless the changes or
modifications are expressly approved by CAEN RFID.
Disposal of the product
Do not dispose the product in municipal or household waste. Please check your local
regulations for disposal/recycle of electronic products.

Index - Hadronmini Technical Information Manual 4
Index
Scope of Manual ................................................................................................................................................................................ 2
Change Document Record .............................................................................................................................................................. 2
Reference Document ....................................................................................................................................................................... 2
Index ................................................................................................................................................................................................................ 4
List of Figures............................................................................................................................................................................................... 5
List of Tables ................................................................................................................................................................................................ 5
1INTRODUCTION................................................................................................................................................................................ 6
Product Description.......................................................................................................................................................................... 6
Development Kit................................................................................................................................................................................ 8
Ordering Options .............................................................................................................................................................................. 9
2TECHNICAL SPECIFICATIONS ...................................................................................................................................................10
Technical Specifications Table .....................................................................................................................................................10
Key Features.....................................................................................................................................................................................11
3HARDWARE INTERFACE .............................................................................................................................................................12
Introduction......................................................................................................................................................................................12
Power Supply....................................................................................................................................................................................13
RF Connection ..................................................................................................................................................................................13
UART Communication ....................................................................................................................................................................13
Reset Pin............................................................................................................................................................................................13
Health and Status Pins ...................................................................................................................................................................14
Health Pin Behavior...........................................................................................................................................................15
Status Pin Behavior............................................................................................................................................................15
GPIO Pins ...........................................................................................................................................................................................15
Wakeup Pin .......................................................................................................................................................................................16
Pin Listing and Signal Definitions................................................................................................................................................16
Electrical Specifications .................................................................................................................................................................17
Absolute Maximum Ratings.............................................................................................................................................17
Operating Conditions........................................................................................................................................................18
Device Functional Specifications....................................................................................................................................18
UHF Gen 2 RFID Radio Specifications............................................................................................................................19
Device Input and Output Specifications.......................................................................................................................20
EPC Class-1 Generation-2 Operation..........................................................................................................................................21
Supported RF modes.........................................................................................................................................................21
EPC Class-1 Generation-2 Functionality.....................................................................................................................................22
4LAYOUT AND COMPONENTS....................................................................................................................................................23
Introduction......................................................................................................................................................................................23
PCB Layout for RF ...........................................................................................................................................................................23
50 Ohm Characteristic Impedance.................................................................................................................................23
Package and Assembly Information ...........................................................................................................................................24
Package Mass ......................................................................................................................................................................24
Package Dimensions..........................................................................................................................................................24
PCB Footprint......................................................................................................................................................................25
SMT Reflow Information ..................................................................................................................................................25
Moisture Sensitive Level 3 (MSL 3) ................................................................................................................................26
MSL 3 Handling at PCB Assembly ...........................................................................................................................26
5OPERATING MODES .....................................................................................................................................................................27
Introduction......................................................................................................................................................................................27
Startup Behavior..............................................................................................................................................................................28
Low Power Operation ....................................................................................................................................................................28
6IRI INTERFACE ................................................................................................................................................................................29
7DEVELOPMENT KIT ......................................................................................................................................................................30
Introduction......................................................................................................................................................................................30
Development Board Overview.....................................................................................................................................................30
Hadronmini R1271C Development Board Key Components ..................................................................................................31
Integrated Circuit Component Descriptions...............................................................................................................31
Connector Descriptions....................................................................................................................................................32
Development Board Default Configuration .............................................................................................................................32
Development Board Alternate Power Options .......................................................................................................................32
Development Board USB-UART Details.....................................................................................................................................32
Development Board Schematic ...................................................................................................................................................33
Development Board Layout..........................................................................................................................................................34
Development Board Bill Of Materials (BOM)...........................................................................................................................34
8REGULATORY COMPLIANCE .....................................................................................................................................................35
FCC Compliance ...............................................................................................................................................................................35
Regulatory Guidelines.......................................................................................................................................................35

Index - Hadronmini Technical Information Manual 5
Product Labeling ................................................................................................................................................................35
Product Manuals.................................................................................................................................................................36
US Requirements................................................................................................................................................................36
Antenna Requirements.....................................................................................................................................................36
Maximum Power Exposure (MPE) and Usage Limitations .......................................................................................37
CE Compliance..................................................................................................................................................................................37
RoHS EU Directive ...........................................................................................................................................................................37
Hadronmini R1271C CE Declaration of Conformity ..................................................................................................................38
Hadronmini R1271C FCC Grant.......................................................................................................................................................39
List of Figures
Fig. 1.1: Hadronmini reader (Model R1271C): top view.......................................................................................................................... 6
Fig. 1.2: Hadronmini R1271CEVB with Evaluation Board....................................................................................................................... 7
Fig. 1.3: Hadronmini reader and WR1271CXDKEU - WR1271CXDKUS Accessories kit .................................................................. 8
Fig. 3.1: Hadronmini R1271C - Example of Block Diagram ..................................................................................................................12
Fig. 3.2: NRST Pin Circuit Diagram...........................................................................................................................................................14
Fig. 3.3: Hadronmini R1271C Pin Listing ..................................................................................................................................................16
Fig. 4.1: PCB Transmission Line Types....................................................................................................................................................23
Fig. 4.2: Package Dimensions, Top, Front, and Side Views ...............................................................................................................24
Fig. 4.3: Recommended Etched Copper Footprint –All Pads ..........................................................................................................25
Fig. 4.4: Recommended Solder Reflow Profile for the Hadronmini R1271C ..................................................................................25
Fig. 5.1: Operating Mode State Diagram...............................................................................................................................................27
Fig. 7.1: Development Board Block Diagram........................................................................................................................................30
Fig. 7.2: Hadronmini R1271C Development Board Key Components...............................................................................................31
Fig. 7.3: Development Board Schematic................................................................................................................................................33
Fig. 7.4: Development Board Front and Backside(flipped) Layout.................................................................................................34
List of Tables
Tab. 2.1: Hadronmini R1271C Technical Specifications........................................................................................................................10
Tab. 3.1: Health Pin Behavior ...................................................................................................................................................................15
Tab. 3.2: Status Pin Behavior....................................................................................................................................................................15
Tab. 3.3: Pin Listing and Signal Definitions...........................................................................................................................................17
Tab. 3.4: Absolute Maximum Ratings.....................................................................................................................................................17
Tab. 3.5: Operating Conditions................................................................................................................................................................18
Tab. 3.6: Supply Current Specifications .................................................................................................................................................18
Tab. 3.7: Startup and Wakeup Time........................................................................................................................................................18
Tab. 3.8: RF Receiver Specifications .......................................................................................................................................................19
Tab. 3.9: RF Transmitter Specifications .................................................................................................................................................19
Tab. 3.10: Digital Interface Specification ..............................................................................................................................................20
Tab. 3.11: Analog Interface Specification .............................................................................................................................................21
Tab. 3.12: Supported RF Modes...............................................................................................................................................................21
Tab. 3.13: RF Modes –Forward and Reverse Link Profiles................................................................................................................21
Tab. 3.14: Inventory Performance...........................................................................................................................................................21
Tab. 3.15: Gen 2 Functionality..................................................................................................................................................................22

INTRODUCTION - Hadronmini Technical Information Manual 6
1INTRODUCTION
Product Description
The Hadronmini (Model R1271C), an embedded reader of the easy2read©product line, is an ultra compact
reader for low power, high performance RAIN RFID applications. With programmable output power from
10dBm to 27dBm, the reader can detect tags at more than 3 mt of distance (depending on antenna and tag
dimensions).
Due to its low power consumption, the module is specifically designed to be easily integrated in battery
powered devices.
The radio frequency core of the module is based on the Impinj R2000 chipset that permits to achieve fast
reading speed and to be used in dense reader and dense tag environments for top-class rated
performances.
The compactness of the device and the surface mount technology allow to embed the Hadronmini inside the
new small form factor industrial handhelds, smartphone accessories and other compact form factor
devices.
The Hadronmini is available in versions for both European and US regulatory environments and so it’s ideal
for the integration in devices requiring compliance to different geographical regions.
The Hadronmini is pin-to-pin and SW compatible with the Impinj RS1000 and RS500 module making it a
perfect replacement for these devices.
Fig. 1.1: Hadronmini reader (Model R1271C): top view

INTRODUCTION - Hadronmini Technical Information Manual 7
The Mod. R1271EVB –R1271C Hadronmini Evaluation Board allows managing the Hadronmini R1271C reader directly via
USB and RS232 interfaces. This board is particularly suited for Hadronmini R1271C reader reader evaluation and SW
development purpose.
Fig. 1.2: Hadronmini R1271CEVB with Evaluation Board

INTRODUCTION - Hadronmini Technical Information Manual 8
Development Kit
A development accessories kit is available:
The kit includes:
n. 1 WR1271CXEVBX R1271C - Hadronmini - Evaluation Board
n.1 Circular Polarized Quadrifilar Antenna SMA (ETSI or FCC)
n. 1 Set of Labels
n. 1 RT0012 - Dual frequency NFC/UHF temperature logger
n. 1 RT0005 Temperature Logger Tag
n. 1 Support for kit assembling
n. 2 USB cables
n. 1 WALIM0000004 Wall mount AC-DC power supply
The R1271C Hadronmini reader and its development kit are a complete set up for a quick implementation of
RFID solutions.
Fig. 1.3: Hadronmini reader and WR1271CXDKEU - WR1271CXDKUS Accessories kit

INTRODUCTION - Hadronmini Technical Information Manual 9
Ordering Options
Code
Description
Reader
WR1271CXEAAA
R1271C Hadronmini –High-Performance 1-port Embedded
RAIN RFID Reader ETSI
WR1271CXUAAA
R1271C Hadronmini –High-Performance 1-port Embedded
RAIN RFID Reader FCC
Development kit
WR1271CXDKEU
Hadronmini - ETSI Dev Kit with antenna, interface, power
supply and tags (reader not included)
WR1271CXDKUS
Hadronmini - FCC Dev Kit with antenna, interface, power supply
and tags (reader not included)

TECHNICAL SPECIFICATIONS - Hadronmini Technical Information Manual 10
2TECHNICAL SPECIFICATIONS
Technical Specifications Table
Frequency Range
865.600÷867.600 MHz (ETSI EN 302 208 v3.1.1)
902÷928 MHz (FCC part 15.247)
RF Power
Configurable from 10 dBm to 27 dBm (from 10 mW to 500 mW)
conducted power
RX Sensitivity
75dBm –1%PER, assuming 15 dB antenna RL @ 27 dBm output
80dBm –1%PER, assuming 20 dB antenna RL @ 27 dBm output
Antenna VSWR
Requirement
< 2:1 for optimum performances
Antenna Connectors
50 Ohm mono-static RF port on a single pin
Frequency Tolerance
±10ppm over the entire temperature range
Number of Channels
channels (compliant to ETSI EN 302 208 v3.1.1)
50 hopping channels (compliant to FCC part 15.247)
Standard Compliance
EPC C1G2 / ISO18000-63
I/O Interface
4 I/O lines 3.3V level
Iout @ 8mA max
Connectivity
UART Serial Port
Baudrate: from 9.6 to 921.6 kbps, default 115.2 kbps
Databits: 8
Stopbits:1
Parity: none
Flow control: none
3.3 V I/O voltage level
Power Supply
3.6 to 5.25 V DC
Power Consumption
-700 mA @ 5 V - RF out = 27 dBm
-1000 mA @ 3.6 V - RF out = 27 dBm
-55 mA in idle mode - Ready to receive IRI packets - Lower latency to
return to Active mode.
-10 mA in idle mode - Ready to receive IRI packets
-0.45 mA - GPIO activity or WKUP rising edge required to wakep part.
0.08 mA - WKUP rising edge required to wakep part.
Dimensions
(L) 32 x (W) 29 x (H) 3.8 mm3
1.26 x 1.14 x 0.15 inches3
Package Type
32 pin surface mount module (SMT compatible)
Operating Temperature
-20°C to +70°C
Weight
4.6 g
Tab. 2.1: Hadronmini R1271C Technical Specifications
Warning: The RF settings must match the operating country/region to comply with local laws
and regulations.
The usage of the reader in different countries/regions from the one in which the device has
been sold is not allowed.

TECHNICAL SPECIFICATIONS - Hadronmini Technical Information Manual 11
Key Features
RAIN RFID (UHF EPC Class1 Gen2, ISO 18000-63) compliant
ETSI and FCC versions available
Ultra compact size
Up to 27 dBm (500mW) output power
-75 dBm Rx sensitivity, assuming 15 dB antenna return loss
Impinj RS500 and RS1000 pin-to-pin compatibility
Inventory (FastID, Tag Population Estimate, Select, Session, Target)
Access (Read, Write, Lock, Kill, BlockPermalock, and QT)
Shielded to prevent unwanted radiation and provide noise immunity in embedded environments
29 mm by 32 mm by 3.8 mm surface mount package with SMT compatibility
Single mono-static RF port
Field upgradability via firmware updates. Gen 2 v2 will be firmware upgradable
UART serial interface using IRI (Impinj Radio Interface)
Test features (CW, PRBS, custom regions, channel lists, and fixed frequency)

HARDWARE INTERFACE- Hadronmini Technical Information Manual 12
3HARDWARE INTERFACE
Introduction
An example Hadronmini R1271C system-level block diagram for an embedded system is shown in Fig. 3.1:
Hadronmini R1271C - Example of Block Diagram. This figure shows the electrical connections that may and
must be made to control the Hadronmini R1271C. In the figure, the required connections are illustrated with
solid lines. Recommended and optional connections are illustrated with different dotted and dashed line
patterns. More details for each connection are listed in the following paragraphs.
Fig. 3.1: Hadronmini R1271C - Example of Block Diagram
Required connections:
•VDC_IN and GND are required to power the Hadronmini R1271C.
•RF is required to connect to the UHF RFID antenna.
•UART1 Tx and Rx are required to communicate with the system host.
Recommended connections:
•nRST is used to reset the Hadronmini R1271C if UART communication is not available. This connection is
highly recommended. This pin is internally driven strong low during software resets, so it should only
be driven externally by an open drain signal. It must not be driven strong high.
•UART2 Tx and Rx may be used to examine debug information. Their behavior is defined in the
debugging section of the IRI SDK user documentation.
•HEALTH indicates successful operation of the Hadronmini R1271C. Connection to a LED provides a
visual indication of whether or not an error condition exists.
•STATUS provides an indication when the Hadronmini R1271C is in active mode (for example,
inventorying tags). Connection to a LED provides a visual indicator of the device’s activity.

HARDWARE INTERFACE- Hadronmini Technical Information Manual 13
Optional connections:
•GPIOs allow interaction with the Hadronmini R1271C as both digital inputs and outputs. They may be
used to trigger inventory, generate events based on inventory activity, or provide general-purpose
user-controlled digital I/O.
•WKUP provides a mechanism to wake up the Hadronmini R1271C from the low power Sleep mode.
WKUP is also used to force entry into the CAEN RFID firmware bootstrap. If unused, this pin should be
tied to logic low.
•UC_ADC allows use of an ADC to convert an analog input voltage into a digital value.
•UC_DAC allows use of a DAC to generate an analog output voltage from a digital value.
No connect:
•SWCLK and SWD connections are reserved for connections and must be left floating.
Power Supply
The Hadronmini R1271C is powered by a voltage applied to the VDC_IN pin (pin 11) relative to the GND pins.
The supply voltage operating range is 3.6 V to 5.25 V. Current consumption varies from about 1000 mA (3.6
W) to about 80 uA (0.4 mW) depending on the operating mode. The power supply is internally bypassed
and regulated, and no external bypass or bulk storage capacitance is required, as long as the input voltage
is stable.
If Hadronmini R1271C activity is not required at all times, and power reduction is desired, the VDC_IN supply
voltage may be externally gated to remove power to the device.
RF Connection
The Hadronmini R1271C has a single RF pin (pin 1) which should be connected to a 50 Ω antenna via 50 Ω
controlled impedance connection. This connection could simply be a microstrip transmission line to a PCB
antenna or SMT antenna, or it could include a connector and coaxial cable. The RF connection is single
ended, referenced to ground.
For more information about impedance matching, see PCB Layout for RF page 23.
UART Communication
The Hadronmini R1271C has two full-duplex UART standard interfaces, accessible using pins UART1-RX,
UART1-TX, UART2-RX, and UART2-TX. UART1 implements the host communication interface via IRI, and
UART2 implements the debug interface. The Tx pins are outputs from the Hadronmini R1271C, and the Rx
pins are inputs to the Hadronmini R1271C. Both UART interfaces are 115,200 baud, with 8 data bits, 1 stop
bit, and no parity bit (8-n-1 configuration).
Each of the UART interfaces signals at 3.3 V relative to GND. The specific VIH, VIL, VOH and VOL
specifications may be found in the § Device Input and Output Specifications paragraph page 20. The TX pins
are driven strong high and low with a sink/source current of about 8 mA. If the load on a pin draws more
than the 8 mA sink and source current, the pin is not guaranteed to meet the VOH and VOL specs listed in §
Device Input and Output Specifications paragraph page 20. Excessive current sunk or sourced on the GPIO
pins can also cause electrical damage to the device.
Warning: Voltages outside of the maximum IO operating voltage range of -0.3 to 4.0 V should
not be applied to the UART pins. This can cause permanent damage to the device.
Reset Pin
The Hadronmini R1271C may be reset by a logic low voltage on the NRST pin (pin 9). Usage of this pin is
recommended in all designs. It may be used to reset the part if an unexpected operating state is entered.
The Hadronmini R1271C does have an internal watchdog circuit that will reset it if abnormal operation
occurs, but the NRST pin provides a further level of reliability.

HARDWARE INTERFACE- Hadronmini Technical Information Manual 14
The NRST pin is pulled high (3.3 V) by an internal 10 kΩ nominal resistor. To reset the part, drive the pin
strong low for at least the minimum reset pulse width as specified in § Device Input and Output
Specifications paragraph page 20 (approximately 25 μs). This pin may be driven active low to reset the part,
but should not be driven strong high. Driving the pin strong high prevents the Hadronmini R1271C from
resetting itself in case user requested software reset. This pin should be driven using an “open drain drives
low” drive mode, which creates either a strong low voltage or a floating voltage output. If the host device
has a pull-up drive mode, or a series resistor is used with a strong drive mode, the resistor value should be
selected such that the NRST voltage is above 2 V. This arrangement is shown in Fig. 3.2: NRST Pin Circuit
Diagram page 14, and the resistor size requirement is shown in Equation:
Warning: Voltages outside of the maximum IO operating voltage range of -0.3 to 4.0 V should
not be applied to the NRST pin. This can cause permanent damage to the device.
Fig. 3.2: NRST Pin Circuit Diagram
Health and Status Pins
The Hadronmini R1271C has two pins that indicate the state of the device through their voltages: HEALTH
(pin 22) and STATUS (pin 21). Their behavior is further defined in the debugging section of the IRI SDK user
documentation.
Both pins are outputs operating at a logical voltage level of 3.3 V, and can sink and source 8 mA each. If the
load on one of these pins draws more than the 8 mA sink and source current, the pin is not guaranteed to
meet the VOH and VOL specs listed in the § Device Input and Output Specifications paragraph page 20.
Warning: Excessive current sunk or sourced on the pins can also cause electrical damage to the
device.

HARDWARE INTERFACE- Hadronmini Technical Information Manual 15
Health Pin Behavior
The HEALTH pin indicates whether the Hadronmini R1271C is operating in its normal mode, or if some other
condition exists. The pin is cycled high and low in specific patterns to indicate the state of the Hadronmini
R1271C. Those patterns are as follows:
Mode
HEALTH Pin Behavior
Reset
HEALTH pin is held low
Idle (no reads occurring)
1 second high, 1 second low
Active(reads occurring)
250 ms high, 750 ms low
Watchdog reset has occurred
HEALTH pin is held low
Recovery
Blink alternate pattern with STATUS LED
Tab. 3.1: Health Pin Behavior
Status Pin Behavior
The STATUS pin indicates whether the Hadronmini R1271C is operating in its active mode, or if some other
condition exists. The pin is cycled high and low in specific patterns to indicate the state of the Hadronmini
R1271C. Those patterns are as follows:
Mode
STATUS Pin Behavior
Reset
STATUS pin is held low
Idle (no reads occurring)
STATUS pin is held low
Active(reads occurring)
During inventory, the high time is between 150 ms and 750 ms based
on the number of tags in the field. The low time is 1000 ms minus the
high time. If there are no tags in the field the pin remains low.
Watchdog reset has occurred
Alternate high and low
Recovery
Toggle with a pattern of logical NOT of the HEALTH pin status
Tab. 3.2: Status Pin Behavior
GPIO Pins
The Hadronmini R1271C’s GPIOs can be controlled using the IRI interface. Their drive mode, direction, and
state are all controllable via IRI. There are two directions: input and output. In both input and output
directions, there are three possible pin states: high, low, and float. For more details on using IRI to control
the GPIOs, see the IRI Toolkit (ITK) documentation.
In the output direction, the GPIOs are driven strong high and low with a source and sink current of 8 mA,
and in float mode the pin is not driven either high or low, leaving the pin floating, also known as “high
impedance” or “high-Z”. The pins are driven to 3.3 V nominally. If the load on a pin draws more than the 8
mA sink and source current, the pin is not guaranteed to meet the VOH and VOL specs listed in the § Device
Input and Output Specifications paragraph page 20.
Warning: Excessive current sunk or sourced on the GPIO pins can also cause electrical damage
to the device.
In the input direction, the high and low states apply a pull-up or pull-down resistor, and in float mode the
pin is not pulled either high or low, leaving the pin floating, also known as “high impedance” or “high-Z”.
The pull-up and pull-down resistors are about 40 kΩ nominal. See the § Device Input and Output
Specifications paragraph page 20 for more specific ratings. The inputs logic levels are proportional to 3.3 V.
Specific VIH and VIL specs may be found in the § Device Input and Output Specifications paragraph page 20.
Warning: Voltages outside of the maximum IO operating voltage range of -0.3 to 4.0 V should
not be applied to the pins, no matter their configuration. This can cause permanent damage to
the device.

HARDWARE INTERFACE- Hadronmini Technical Information Manual 16
Wakeup Pin
The WKUP pin is used to wake the device when it is in the Standby or Sleep operating modes. This pin is
edge sensitive, and will wake the device on a rising edge. The WKUP pin must be logic low in order for the
device to re-enter Idle mode after a Sleep wakeup, so it should only be pulsed high to wake up the part.
The WKUP pin is also used to force the part into the CAEN RFID bootstrap. The pin is polled at startup, and
while it remains high, the device stays in the bootstrap. This allows bootloading of the part even if the
bootloadable code is corrupted.
The WKUP pin operates at a 3.3 V logic level. It has a 40 kΩ typical pull-down resistor inside the Hadronmini
R1271C. Voltages outside of the maximum IO operating voltage range of -0.3 to 4.0 V should not be
applied to the WKUP pin. This can cause permanent damage to the device.
If the WKUP pin is not used, it should be left floating or tied to logic low (ground). This will prevent
accidental entry into the CAEN RFID bootstrap.
Pin Listing and Signal Definitions
Fig. 3.3: Hadronmini R1271C Pin Listing
Note: GX markings are shown in Fig. 3.3: Hadronmini R1271C Pin Listing.

HARDWARE INTERFACE- Hadronmini Technical Information Manual 17
Pin#
Pin Name
Pin Type
Description
1
RF
RF
RF antenna port
2
GND
Power
Ground
3
SW_CLK
No Connect
Reserved
4
SW_DIO
No Connect
Reserved
5
GND
Power
Ground
6
NC
No Connect
Leave floating or drive to ground, resistively or strong
7
UART1-RX
Digital Input
R1271C UART Rx (Receive) from host
8
UART1-TX
Digital Output
R1271C UART Tx (Transmit) to host
9
NRST
Digital Input
Active low reset. Connect to open drain driver.
Hadronmini R1271C must be able to internally pull down
this signal to reset.
10
GND
Power
Ground
11
VDC_IN
Power
DC voltage supply (3.6 –5.25 V)
12
WKUP
Digital Input
Wakeup from sleep on rising edge
13
UC_ADC
Analog Input
Analog to digital converter input
14
UART2-TX
Digital Output
R1271C Debug UART Tx to host
15
UART2-RX
Digital Input
R1271C Debug UART Rx from host
16
UC_DAC
Analog output
Digital to analog converter output
17
GPIO1
Digital I/O
General purpose I/O
18
GPIO2
Digital I/O
General purpose I/O
19
GPIO3
Digital I/O
General purpose I/O
20
GPIO4
Digital I/O
General purpose I/O
21
STATUS
Digital Output
R1271C status indication
22
HEALTH
Digital Output
R1271C health indication
23-32
GND
Power
Ground pins on the top and bottom edge of the package
Tab. 3.3: Pin Listing and Signal Definitions
Electrical Specifications
Absolute Maximum Ratings
The absolute maximum ratings (see Tab. 3.4: Absolute Maximum Ratings) define limitations for electrical
and thermal stresses. These limits prevent permanent damage to the Hadronmini R1271C.
Operation outside maximum ratings may result in permanent damage to the device.
Parameter
Min.
Max.
Unit
Conditions
Supply voltage
-0.3
5.5
V
VDC_IN pin relative to GND
IO voltage
-0.3
4.0
V
Non-VDC_IN pin voltages relative to GND
RF input power
-
+27
dBm
Incident to pin 1 (RF)
Storage temperature
-30
+100
ºC
Humidity
-
95
% RH
Non-condensing
ESD immunity
-
2
kV
Human-body model, all I/O pads
Package moisture sensitivity
level 3
-
-
-
Hadronmini R1271C from open trays must
be baked before going through a standard
solder reflow process (48 hours at 125 ºC
or 24hrs at 150 ºC)
Tab. 3.4: Absolute Maximum Ratings

HARDWARE INTERFACE- Hadronmini Technical Information Manual 18
Operating Conditions
This section describes operating voltage, frequency, and temperature specifications for the Hadronmini
R1271C during operation.
Parameter
Min.
Max.
Unit
Conditions
Supply
3.6
5.25
V
VDC_IN relative to GND
Temperature
-20
+70
ºC
Ambient Temperature
Frequency
902
928
MHz
FCC part 15.247 (Mod. WR1271CXUAAA)
865.6
867.6
MHz
ETSI EN 302 208 v3.1.1 (Mod. WR1271CXEAAA)
Tab. 3.5: Operating Conditions
Device Functional Specifications
This section describes operating voltage, frequency, and temperature specifications for the Hadronmini
R1271C during operation.
Parameter
Typ.
Unit
Description
Supply Current
Current consumed by Hadronmini R1271C via
VDC_IN pin
Active mode - 5V supply –GX
700
mA
+27 dBm transmit power
Inventorying tags
Active mode - 3.6V supply
1000
mA
+27 dBm transmit power
Inventorying tags
Idle mode –low latency
55
mA
Ready to receive IRI packets. Lower latency to
return to Active mode.
Idle mode –standard latency
10
mA
Ready to receive IRI packets
Standby mode
0.45
mA
GPIO activity or WKUP rising edge required to
wakeup part.
Sleep mode
80
μA
WKUP rising edge required to wakeup part.
Tab. 3.6: Supply Current Specifications
Parameter
Min.
Typ.
Max.
Unit
Description
Startup Time
20
ms
Time to receive IRI packets after power supply or
nRST pin initiated startup
Wakeup Time
Time to receive IRI packets after wakeup event
Standby
50
ms
GPIO activity or WKUP rising edge required to
wakeup part.
Sleep
60
ms
WKUP rising edge required to wakeup part.
Tab. 3.7: Startup and Wakeup Time

HARDWARE INTERFACE- Hadronmini Technical Information Manual 19
UHF Gen 2 RFID Radio Specifications
Parameter
Min.
Typ.
Max.
Unit
Conditions
Frequency
902
928
MHz
See § Tab. 2.1: Hadronmini R1271C Technical
Specifications page 10
865.6
867.6
MHz
Input impedance
50
Ω
Input match
-10
dB
S11
Rx sensitivity
-75
dBm
1% PER, assuming 15 dB antenna RL at 27 dBm
output
RX sensitivity
-80
dBm
1% PER, assuming 20 dB antenna RL at 27 dBm
output
Tab. 3.8: RF Receiver Specifications
Parameter
Min.
Max.
Unit
Notes
Tx Power
10
27
dBm
Meets FCC and equivalent regulatory
constraints
Tx Power Error
Difference between desired Tx power and
actual Tx power at a given ambient
temperature 10 to 30 °C 30 to 60 °C -20 to
10 °C
Room temp:
23 ≤ PTX < 27 dBm
10 ≤ PTX < 23 dBm
-0.5
-1.0
0.5
1.0
dB
dB
10 to 30°C
High temp:
23 ≤ PTX < 27 dBm
10 ≤ PTX < 23 dBm
-0.75
-1.5
0.75
1.5
dB
dB
30 to 60°C
Low temp:
23 ≤ PTX < 27 dBm
10 ≤ PTX < 23 dBm
-1.0
-1.75
1.0
1.75
dB
dB
-20 to 10°C
Tx ACPR
1st Adjacent
1st Alternate
2nd Alternate
-25
-55
-65
dBch
dBch
dBch
Refer to Gen 2 dense-interrogator
transmit mask spec for definition of
channel bandwidths and measurement
regions.
Return Loss
0
dB
No damage into open RF port at 27 dBm
at any phase angle
Frequency
902
928
MHz
See § Tab. 2.1: Hadronmini R1271C
Technical Specifications page 10
Tab. 3.9: RF Transmitter Specifications

HARDWARE INTERFACE- Hadronmini Technical Information Manual 20
Device Input and Output Specifications
Parameter
Min.
Typ.
Max.
Unit
Conditions
nRST
VIL
-0.3
0.8
V
VIH
2
3.6
V
Hysteresis voltage
200
mV
Internal pull-up resistor
25
40
55
kΩ
Reset pulse width
25
μs
WKUP
VIL
-0.3
1.0
V
VIH
1.8
3.6
V
Hysteresis voltage
200
mV
Internal pull-down resistor
25
40
55
kΩ
Digital inputs
VIL
-0.3
1.0
V
VIH
1.8
3.6
V
Hysteresis voltage
200
mV
Pull-up and pull-down resistor
25
40
55
kΩ
Digital outputs
VOL
0.0
0.4
V
VOH
2.7
3.6
V
Drive current (sink or source)
8
mA
UART
Default baud rate
115.2
kbaud
Configurable baud rate
9.6
921.6
kbaud
Data bits
8
bits
Parity bit
None
Stop bits
1
bits
Tab. 3.10: Digital Interface Specification
Parameter
Min.
Typ.
Max.
Unit
Conditions
ADC (Pin 13)
Resolution
12
Bits
Conversion voltage range
1
3.3
V
Sampling rate
0.05
1
MSPs
Total conversion time
1
18
μsec
Power-up time
1
μsec
External input impedance
50
kΩ
Sampling switch resistance
1
kΩ
Internal sample and hold
capacitance
8
pF
Total unadjusted error
±3.3
±4
LSB
Offset error
±1.9
±2.8
LSB
Gain error
±2.8
±3
LSB
DNL error
±0.7
±1.3
LSB
INL error
±1.2
±1.7
LSB
DAC (Pin 16)
Resolution
12
Bits
Resistive load with buffer ON
5
kΩ
Impedance output with buffer
OFF
15
kΩ
When the buffer is OFF, the
minimum resistive load between
DAC_OUT and VSS to achieve 1%
accuracy is 1.5 MΩ.
Capacitive load
50
pF
Maximum capacitive load at the
DAC_OUT pin when the buffer is
ON