caenrfid Lepton9 R9100C Technical document

TECHNICAL INFORMATION MANUAL
Revision 0 - 22/12/2022
R9100C
Lepton9
30dBm 1-Port RAIN RFID Reader Module

Visit the Lepton9R9100C web page, you will find the latest revision
of data sheets, manuals, certifications, technical drawings, software and firmware.
All you need to start using your reader in a few clicks!
Scope of Manual
The goal of this manual is to provide the basic information to work with the Lepton9R9100C Reader and the
RHML37XEVB evaluation board.
This manual refers to:
•Lepton9R9100C firmware revision ≥ 1.0.0
Change Document Record
Date
Revision
Changes
Pages
22/12/2022
00
Preliminary revision
-
Reference Document
[RD1] EPCglobal: EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF RFID Protocol for
Communications at 860 MHz - 960 MHz, Version 2.0.1 (April 2015).
CAEN RFID srl
Via Vetraia, 11 55049 Viareggio (LU) - ITALY
Tel. [phone] Fax [phone]
inf[email protected]
www.caenrfid.com
© CAEN RFID srl –2022
Disclaimer
No part of this manual may be reproduced in any form or by any means, electronic, mechanical, recording, or
otherwise, without the prior written permission of CAEN RFID.
The information contained herein has been carefully checked and is believed to be accurate; however, no
responsibility is assumed for inaccuracies. CAEN RFID reserves the right to modify its products specifications
without giving any notice; for up to date information please visit www.caenrfid.com.
Preliminary Product Information
This document contains information for a new product. CAEN RFID reserves the right to modify this product
without notice.
“Preliminary” product information describes products that are ready for production, but for which full
characterization data is not yet available. CAEN RFID believes that the information contained in this document
is accurate and reliable. However, the information is subject to change without notice and is provided “AS IS”
without warranty of any kind (Express or implied). You are advised to obtain the latest version of relevant
information to verify, before placing orders, that information being relied on is current and complete. All
products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement,
including those pertaining to warranty, patent infringement, and limitation of liability. No responsibility is
assumed by CAEN RFID for the use of this information, including use of this information as the basis for
manufacture or sale of any items, or for infringement of patents or other rights of third parties.

Disposal of the product
Do not dispose the product in municipal or household waste. Please check your local
regulations for disposal/recycle of electronic products.

INDEX –Lepton9- Technical Information Manual 4
Index
Scope of Manual........................................................................................................................................................................2
Change Document Record.......................................................................................................................................................2
Reference Document................................................................................................................................................................2
1Introduction.....................................................................................................................................................................6
Description.................................................................................................................................................................................6
Reader ............................................................................................................................................................................6
Evaluation Board ..........................................................................................................................................................7
Development Kit...........................................................................................................................................................7
Ordering Options ......................................................................................................................................................................8
2Technical Specifications ................................................................................................................................................9
Technical Specifications ...........................................................................................................................................................9
Key Features ............................................................................................................................................................................10
3Hardware Interface.......................................................................................................................................................11
Introduction .............................................................................................................................................................................11
Power Supply ...........................................................................................................................................................................12
RF Connection..........................................................................................................................................................................12
UART Communication ............................................................................................................................................................12
Reset Pin...................................................................................................................................................................................13
GPIO Pins ..................................................................................................................................................................................13
Wakeup Pin ..............................................................................................................................................................................14
Pin Listing and Signal Definitions .........................................................................................................................................14
Electrical Specifications .........................................................................................................................................................15
Absolute Maximum Ratings......................................................................................................................................15
Operating Conditions ................................................................................................................................................16
Device Functional Specifications .............................................................................................................................16
UHF Gen 2 RFID Radio Specifications......................................................................................................................16
Device Input and Output Specifications .................................................................................................................17
EPC Class-1 Generation-2 Operation ...................................................................................................................................18
Supported RF modes..................................................................................................................................................18
4Layout and Components ..............................................................................................................................................19
Introduction .............................................................................................................................................................................19
PCB Layout for RF ...................................................................................................................................................................19
50 Ohm Characteristic Impedance...........................................................................................................................19
Package and Assembly Information.....................................................................................................................................20
Package Mass ..............................................................................................................................................................20
Package Dimensions ..................................................................................................................................................20
PCB Footprint..............................................................................................................................................................21
SMT Reflow Information ...........................................................................................................................................22
Moisture Sensitive Level 3 (MSL 3) ..........................................................................................................................23
5Evaluation Board...........................................................................................................................................................24
Introduction .............................................................................................................................................................................24
Technical Specifications .........................................................................................................................................................24
Evaluation Board Overview ...................................................................................................................................................25
Lepton9R9100C Evaluation Board Key Components........................................................................................................26
Integrated Circuit Component Descriptions..........................................................................................................26
Connector Descriptions.............................................................................................................................................27
Switch Descriptions ................................................................................................................................................................27
Evaluation Board Default Configuration.............................................................................................................................28
Evaluation Board USB-UART Details ....................................................................................................................................28
Evaluation Board Schematic..................................................................................................................................................28
Evaluation Board Layout........................................................................................................................................................29
Evaluation Board Bill of Materials (BOM)............................................................................................................................29
Connecting to the Lepton9R9100C reader.........................................................................................................................30
USB Communication Setup .......................................................................................................................................30
Easy Controller............................................................................................................................................................30
6Regulatory Compliance................................................................................................................................................33

INDEX –Lepton9- Technical Information Manual 5
RoHS Directive.........................................................................................................................................................................33
List of Figures
Fig. 1.1: Lepton9Reader –top view...................................................................................................................................................6
Fig. 1.2: Lepton9Reader –back view.................................................................................................................................................6
Fig. 1.3: WRHML37XEVBX Evaluation Board for Lepton9R9100C ...............................................................................................7
Fig. 1.4: Lepton9R9100C reader and WRHML37XDKEU-WRHML37XDKUS Accessories kit ....................................................7
Fig. 3.1: Lepton9R9100C - Example of Block Diagram .................................................................................................................11
Fig. 3.2: BSL sequence .......................................................................................................................................................................12
Fig. 3.3: Lepton9R9100C Pin Listing................................................................................................................................................14
Fig. 4.1: PCB Transmission Line Types.............................................................................................................................................19
Fig. 4.2: Package Dimensions, Top, Front, and Side Views ..........................................................................................................20
Fig. 4.3: Recommended Etched Copper Footprint –All Pads......................................................................................................21
Fig. 4.4: Pad size..................................................................................................................................................................................21
Fig. 4.5: Recommended Solder Reflow Profile for the Lepton9R9100C...................................................................................22
Fig. 5.1: WRHML37XEVBX Evaluation Board for R9100C ............................................................................................................24
Fig. 5.2: Evaluation Board Block Diagram.......................................................................................................................................25
Fig. 5.3: WRHML37XEVBX Evaluation Board Key Components..................................................................................................26
Fig. 5.4: SW2 and SW3 configuration ..............................................................................................................................................27
Fig. 5.5: Evaluation Board Schematic ..............................................................................................................................................28
Fig. 5.6: Evaluation Board Front and Backside(flipped) Layout ..................................................................................................29
Fig. 5.7: Evaluation Board Front and Backside(flipped) Layout - detail.....................................................................................29
List of Tables
Tab. 2.1: Lepton9R9100C Technical Specifications ........................................................................................................................9
Tab. 3.1: Pin Listing and Signal Definitions ....................................................................................................................................15
Tab. 3.2: Absolute Maximum Ratings..............................................................................................................................................15
Tab. 3.3: Operating Conditions ........................................................................................................................................................16
Tab. 3.4: Supply Current Specifications ..........................................................................................................................................16
Tab. 3.5: RF Receiver Specifications ................................................................................................................................................16
Tab. 3.6: RF Transmitter Specifications ..........................................................................................................................................16
Tab. 3.7: Digital Interface Specification..........................................................................................................................................17
Tab. 3.8: Analog Interface Specification .........................................................................................................................................18
Tab. 3.9: RF Modes –Forward and Reverse Link Profiles.............................................................................................................18
Tab. 5.1: WRHML37XEVBX Evaluation Board - Technical Specifications...................................................................................24

INTRODUCTION –Lepton9- Technical Information Manual 6
1INTRODUCTION
Description
Reader
The Lepton9(Model R9100C), an embedded reader of the easy2read©product line, is an ultra compact
reader for low power, high performance RAIN RFID applications.
With programmable output power from 10dBm to 30dBm, the reader can detect tags at more than 5 mt of
distance (depending on antenna and tag dimensions).
Due to its low power consumption, the module is specifically designed to be easily integrated in battery
powered devices.
The radio frequency core of the module is based on the Impinj E910 IC that permits to achieve fast reading
speed and to be used in dense reader and dense tag environments for top-class rated performances.
The compactness of the device and the surface mount technology allow to embed the Lepton9inside the
new small form factor industrial handhelds, smartphone accessories and other compact form factor
devices.
The Lepton9complies with and can operate in both European and US regulatory environments and, thanks
to its multiregional capabilities, it’s ideal for integration in devices requiring compliance to different
geographical regions.
The Lepton9is pin-to-pin compatible with the Impinj RS1000 and RS500 modules making it a perfect
replacement for these devices.
Fig. 1.1: Lepton9Reader –top view
Fig. 1.2: Lepton9Reader –back view

INTRODUCTION –Lepton9- Technical Information Manual 7
Evaluation Board
The Mod. RHML37XEVB allows managing the Lepton9R9100C reader directly via USB interface.
This board is particularly suited for Lepton9R9100C reader evaluation and SW development purpose.
Fig. 1.3: WRHML37XEVBX Evaluation Board for Lepton9R9100C
Development Kit
A development accessories kit (Mod. WRHML37XDKEU, WRHML37XDKUS) is available:
The kit includes:
•n. 1 WRHML37XEVBX - Lepton9R9100C - Evaluation Board
•n.1 Circular Polarized Quadrifilar Antenna SMA (ETSI or FCC)
•n. 1 Set of Labels
•n. 1 RT0012 - Dual frequency NFC/UHF temperature logger
•n. 1 RT0005 Temperature Logger Tag
•n. 1 Support for kit assembling
•n. 2 USB cables
•n. 1 WALIM0000005 Wall mount AC-DC power supply
The Lepton9R9100C reader and its development kit are a complete set up for a quick implementation of
RFID solutions.
Fig. 1.4: Lepton9R9100C reader and WRHML37XDKEU-WRHML37XDKUS Accessories kit

INTRODUCTION –Lepton9- Technical Information Manual 8
Ordering Options
Code
Description
Reader
WR9100CXAAAA
R9100C - Lepton9- 30dBm 1-Port RAIN RFID Reader
Module
Evaluation
Board
WRHML37XEVBX
Evaluation Board for R1271C, R3100C, R7100C and R9100C
Development
Kit
WRHML37XDKEU
R1271C, R3100C, R7100C and R9100C ETSI Dev Kit with
antenna, interface, pws and tags (reader not included)
WRHML37XDKUS
R1271C, R3100C, R7100C and R9100C FCC Dev Kit with
antenna, interface, pws and tags (reader not included)

TECHNICAL SPECIFICATIONS –Lepton9- Technical Information Manual 9
2TECHNICAL SPECIFICATIONS
Technical Specifications
Frequency Range
865.600÷867.600 MHz (ETSI EN 302 208 v3.3.1)
902÷928 MHz (FCC part 15.247)
RF Power
Configurable from 10 dBm to 30 dBm (from 10 mW to 1W) conducted
power
RX Sensitivity
-90dBm –10%PER, assuming 20 dB antenna RL @ 30 dBm output
Antenna VSWR
Requirement
< 2:1 for optimum performances
Antenna Connectors
50 Ohm mono-static RF port on a single pin
Frequency Tolerance
±10ppm over the entire temperature range
Number of Channels
4 channels (compliant to ETSI EN 302 208 v3.3.1)
50 hopping channels (compliant to FCC part 15.247)
Standard Compliance
EPC C1G2 / ISO18000-63
I/O Interface
4 I/O lines 3.3V level
Iout @ 8mA max
Connectivity
−UART Serial Port
•Baudrate: from 9.6 to 921.6 kbps, default 921.6 kbps
•Databits: 8
•Stopbits:1
•Parity: none
•Flow control: none
−3.3 V I/O voltage level
Power Supply
4.75 ÷ 5.25 V DC
Power Consumption
-1.4 A @ 5 V - RF out = 30 dBm
-5 mA in idle mode - Ready to receive commands
Dimensions
(L) 32 x (W) 29 x (H) 4.1 mm3
1.26 x 1.14 x 0.16 inches3
Package Type
32 pin surface mount module (SMT compatible)
Operating Temperature
-20°C to +70°C
Weight
5.4 g
Tab. 2.1: Lepton9R9100C Technical Specifications
Warning: The RF settings must match the operating country/region to comply with local laws
and regulations.
The usage of the reader in different countries/regions from the one in which the device has
been sold is not allowed.

TECHNICAL SPECIFICATIONS –Lepton9- Technical Information Manual 10
Key Features
•RAIN RFID (UHF EPC Class1 Gen2, ISO 18000-63) compliant
•Both ETSI and FCC support in the same module
•Ultra compact size
•Up to 30 dBm (1W) output power
•-90 dBm Rx sensitivity, assuming 20 dB antenna return loss
•Impinj RS500 and RS1000 pin-to-pin compatibility
•Inventory (FastID, Tag Population Estimate, Select, Session, Target)
•Access (Read, Write, Lock, Kill, BlockPermalock, and QT)
•Shielded to prevent unwanted radiation and provide noise immunity in embedded environments
•29 mm by 32 mm by 4.1 mm surface mount package with SMT compatibility
•Single mono-static RF port
•Field upgradability via firmware updates
•UART serial interface using CAEN RFID easy2read©protocol

HARDWARE INTERFACE –Lepton9- Technical Information Manual 11
3HARDWARE INTERFACE
Introduction
An example Lepton9R9100C system-level block diagram for an embedded system is shown in Fig. 3.1:
Lepton9 R9100C - Example of Block Diagram. This figure shows the electrical connections that may and
must be made to control the Lepton9R9100C. In the figure, the required connections are illustrated with
solid lines. Recommended and optional connections are illustrated with different dotted and dashed line
patterns. More details for each connection are listed in the following paragraphs.
Fig. 3.1: Lepton9R9100C - Example of Block Diagram
Required connections:
•VDC_IN and GND are required to power the Lepton9R9100C.
•RF is required to connect to the UHF RFID antenna.
•UART1 Tx and Rx are required to communicate with the system host.
Recommended connections:
•nRST is used to reset the Lepton9R9100C if UART communication is not available. This connection is
highly recommended. This pin is internally driven strong low during software resets, so it should only
be driven externally by an open drain signal. It must not be driven strong high.
•TST and BSL_SEL shall be used for the FW recovery/upgrade procedure.
To start the Boot Strap Loader of Lepton9 internal microcontroller NRST, TST and BSL_SEL signals shall
be driven as in the picture below:

HARDWARE INTERFACE –Lepton9- Technical Information Manual 12
Fig. 3.2: BSL sequence
The BSL program execution starts when TST pin has received a minimum of two positive transitions
and if TST is high while /RST rises from low to high. BSL_SEL shall be at high level before BSL starts.
Pulses length and distance between edges of all signals shall be 10ms at least.
•UART2 Tx and Rx may be used to examine debug information.
Optional connections:
•GPIOs allow interaction with the Lepton9R9100C as both digital inputs and outputs. They may be used
to trigger inventory, generate events based on inventory activity, or provide general-purpose user-
controlled digital I/O.
•WKUP provides a mechanism to wake up the Lepton9R9100C from the low power Sleep mode. If
unused, this pin should be tied to logic low.
•UC_ADC allows use of an ADC to convert an analog input voltage into a digital value.
•UC_DAC allows use of a DAC to generate an analog output voltage from a digital value.
•RFU is a GPIO reserved for future use.
Power Supply
The Lepton9R9100C is powered by a voltage applied to the VDC_IN pin (pin 11) relative to the GND pins.
The supply voltage operating range is 4.75 V to 5.25 V. Current consumption varies from about 1400 mA to
about 5mA depending on the operating mode. The power supply is internally bypassed and regulated, and
no external bypass or bulk storage capacitance is required, as long as the input voltage is stable.
If Lepton9R9100C activity is not required at all times, and power reduction is desired, the VDC_IN supply
voltage may be externally gated to remove power to the device.
RF Connection
The Lepton9R9100C has a single RF pin (pin 1) which should be connected to a 50 Ω antenna via 50 Ω
controlled impedance connection. This connection could simply be a microstrip transmission line to a PCB
antenna or SMT antenna, or it could include a connector and coaxial cable. The RF connection is single
ended, referenced to ground.
For more information about impedance matching, see PCB Layout for RF page 19.
UART Communication
The Lepton9R9100C has two full-duplex UART standard interfaces, accessible using pins UART1-RX,
UART1-TX, UART2-RX, and UART2-TX. UART1 implements the host communication interface via
easy2read©, and UART2 implements the debug interface (RFU). The Tx pins are outputs from the Lepton9
R9100C, and the Rx pins are inputs to the Lepton9R9100C. Both UART interfaces are 921,600 baud, with 8
data bits, 1 stop bit, and no parity bit (8-n-1 configuration).
Each of the UART interfaces signals at 3.3 V relative to GND. The specific VIH, VIL, VOH and VOL
specifications may be found in the § Device Input and Output Specifications paragraph page 17. The TX pins
are driven strong high and low with a sink/source current of about 8 mA. If the load on a pin draws more

HARDWARE INTERFACE –Lepton9- Technical Information Manual 13
than the 8 mA sink and source current, the pin is not guaranteed to meet the VOH and VOL specs listed in
the § Device Input and Output Specifications paragraph page 17. Excessive current sunk or sourced on the
GPIO pins can also cause electrical damage to the device.
Warning: Voltages outside of the maximum IO operating voltage range of -0.3 to 4.0 V should
not be applied to the UART pins. This can cause permanent damage to the device.
Reset Pin
The Lepton9R9100C may be reset by a logic low voltage on the NRST pin (pin 9). Usage of this pin is
recommended in all designs. It may be used to reset the part if an unexpected operating state is entered.
The Lepton9R9100C does have an internal watchdog circuit that will reset it if abnormal operation occurs,
but the NRST pin provides a further level of reliability.
The NRST pin is pulled high (3.3 V) by an internal 51,1 kΩ nominal resistor. To reset the part, drive the pin
strong low for at least the minimum reset pulse width as specified in the § Device Input and Output
Specifications paragraph page 17 (approximately 25 μs). This pin may be driven active low to reset the part,
but should not be driven strong high. Driving the pin strong high prevents the Lepton9R9100C from
resetting itself in case user requested software reset. This pin should be driven using an “open drain drives
low” drive mode, which creates either a strong low voltage or a floating voltage output.
Warning: Voltages outside of the maximum IO operating voltage range of -0.3 to 4.0 V should
not be applied to the NRST pin. This can cause permanent damage to the device.
GPIO Pins
The Lepton9R9100C’s GPIOs can be controlled using the easy2read©interface. Their drive mode, direction,
and state are all controllable via easy2read©. There are two directions: input and output. In both input and
output directions, there are three possible pin states: high, low, and float. For more details on using
easy2read©to control the GPIOs, see the easy2read©protocol documentation.
In the output direction, the GPIOs are driven strong high and low with a source and sink current of 8 mA,
and in float mode the pin is not driven either high or low, leaving the pin floating, also known as “high
impedance” or “high-Z”. The pins are driven to 3.3 V nominally. If the load on a pin draws more than the 8
mA sink and source current, the pin is not guaranteed to meet the VOH and VOL specs listed in the § Device
Input and Output Specifications paragraph page 17.
Warning: Excessive current sunk or sourced on the GPIO pins can also cause electrical damage
to the device.
In the input direction, the high and low states apply a pull-up or pull-down resistor, and in float mode the
pin is not pulled either high or low, leaving the pin floating, also known as “high impedance” or “high-Z”.
The pull-up and pull-down resistors are about 35 kΩ nominal. See the in the § Device Input and Output
Specifications paragraph page 17 for more specific ratings. The inputs logic levels are proportional to 3.3 V.
Specific VIH and VIL specs may be found in the § Device Input and Output Specifications paragraph page 17.
Warning: Voltages outside of the maximum IO operating voltage range of -0.3 to 4.0 V should
not be applied to the pins, no matter their configuration. This can cause permanent damage to
the device.

HARDWARE INTERFACE –Lepton9- Technical Information Manual 14
Wakeup Pin
The WKUP pin is used to wake the device when it is in the Standby or Sleep operating modes. This pin is
edge sensitive and will wake the device on a rising edge. The WKUP pin must be logic low in order for the
device to re-enter Idle mode after a Sleep wakeup, so it should only be pulsed high to wake up the part.
The WKUP pin operates at a 3.3 V logic level. It has a 35 kΩ typical pull-down resistor inside the Lepton9
R9100C. Voltages outside of the maximum IO operating voltage range of -0.3 to 4.0 V should not be
applied to the WKUP pin. This can cause permanent damage to the device.
If the WKUP pin is not used, it should be left floating or tied to logic low (ground).
Pin Listing and Signal Definitions
Fig. 3.3: Lepton9R9100C Pin Listing

HARDWARE INTERFACE –Lepton9- Technical Information Manual 15
Pin#
Pin Name
Pin Type
Description
1
RF
RF
RF antenna port
2
GND
Power
Ground
3
RFU
Digital I/O
Reserved for Future Use
4
BSL_SEL
Digital Input
Boot Strap Loader interface enable signal
5
GND
Power
Ground
6
TST
Digital Input
TST pin to be used for FW recovery/upgrade
7
UART1-RX
Digital Input
R9100C UART Rx (Receive) from host
8
UART1-TX
Digital Output
R9100C UART Tx (Transmit) to host
9
NRST
Digital Input
Active low reset. Connect to open drain driver. R9100C must be
able to internally pull down this signal to reset.
10
GND
Power
Ground
11
VDC_IN
Power
DC voltage supply (4.75 –5.25 V)
12
WKUP
Digital Input
Wakeup from sleep on rising edge
13
UC_ADC
Analog Input
Analog to digital converter input
14
UART2-TX
Digital Output
R9100C Debug UART Tx to host
15
UART2-RX
Digital Input
R9100C Debug UART Rx from host
16
UC_DAC
Analog output
Digital to analog converter output
17
GPIO1
Digital I/O
General purpose I/O
18
GPIO2
Digital I/O
General purpose I/O
19
GPIO3
Digital I/O
General purpose I/O
20
GPIO4
Digital I/O
General purpose I/O
21
STATUS
Digital Output
R9100C status indication (RFU)
22
HEALTH
Digital Output
R9100C health indication (RFU)
23-32
GND
Power
Ground pins on the top and bottom edge of the package
Tab. 3.1: Pin Listing and Signal Definitions
Electrical Specifications
Absolute Maximum Ratings
The absolute maximum ratings (see Tab. 3.2: Absolute Maximum Ratings) define limitations for electrical
and thermal stresses. These limits prevent permanent damage to the Lepton9R9100C.
Operation outside maximum ratings may result in permanent damage to the device.
Parameter
Min.
Max.
Unit
Conditions
Supply voltage
-0.3
5.5
V
VDC_IN pin relative to GND
IO voltage
-0.3
4.0
V
Non-VDC_IN pin voltages relative to GND
RF input power
-
+30
dBm
Incident to pin 1 (RF)
Storage temperature
-30
+100
ºC
Humidity
-
95
% RH
Non-condensing
ESD immunity
-
2
kV
Human-body model, all I/O pads
Package moisture sensitivity
level 3
-
-
-
Lepton9R9100C from open trays must be
baked before going through a standard
solder reflow process (48 hours at 125 ºC
or 24hrs at 150 ºC)
Tab. 3.2: Absolute Maximum Ratings

HARDWARE INTERFACE –Lepton9- Technical Information Manual 16
Operating Conditions
This section describes operating voltage, frequency, and temperature specifications for the Lepton9
R9100C during operation.
Parameter
Min.
Max.
Unit
Conditions
Supply
4.75
5.25
V
VDC_IN relative to GND
Temperature
-20
+70
ºC
Ambient Temperature
Frequency
902
928
MHz
FCC part 15.247
865.6
867.6
MHz
ETSI EN 302 208 v3.3.1
Tab. 3.3: Operating Conditions
Device Functional Specifications
This section describes operating voltage, frequency, and temperature specifications for the Lepton9
R9100C during operation.
Parameter
Typ.
Unit
Description
Supply Current
Current consumed by Lepton9R9100C via VDC_IN
pin
Active mode - 5V supply
1400
mA
+30 dBm transmit power
Inventorying tags
Idle mode –low latency
45
mA
Ready to receive easy2read©protocol packets.
Lower latency to return to Active mode.
Idle mode –standard latency
5
mA
Ready to receive easy2read©packets
Tab. 3.4: Supply Current Specifications
UHF Gen 2 RFID Radio Specifications
Parameter
Min.
Typ.
Max.
Unit
Conditions
Frequency
902
928
MHz
See § Tab. 2.1: Lepton9 R9100C Technical
Specifications page 9
865.6
867.6
MHz
Input impedance
50
Ω
Input match
-10
dB
S11
Rx sensitivity
-90
dBm
10%PER, assuming 20 dB antenna RL @ 30 dBm
output
Tab. 3.5: RF Receiver Specifications
Parameter
Min.
Max.
Unit
Notes
Tx Power
10
30
dBm
Meets FCC and equivalent regulatory
constraints
Tx Power Error
1
dB
Difference between desired Tx power and
actual Tx power
Return Loss
0
dB
No damage into open RF port at 30 dBm
at any phase angle
Frequency
865.6
867.6
MHz
ETSI EN 302 208 v3.3.1
902
928
MHz
FCC part 15.247
Tab. 3.6: RF Transmitter Specifications

HARDWARE INTERFACE –Lepton9- Technical Information Manual 17
Device Input and Output Specifications
Parameter
Min.
Typ.
Max.
Unit
Conditions
nRST
VIL
-0.3
0.8
V
VIH
2
3.6
V
Hysteresis voltage
400
mV
Internal pull-up resistor
14
21
25
kΩ
Reset pulse width
25
μs
WKUP
VIL
-0.3
0.8
V
VIH
2
3.6
V
Hysteresis voltage
400
mV
Internal pull-down resistor
20
35
50
kΩ
Digital inputs
VIL
-0.3
0.8
V
VIH
2
3.6
V
Hysteresis voltage
400
mV
Internal pull-down resistor
20
35
50
kΩ
Digital outputs
VOL
0.0
0.6
V
VOH
2.7
3.6
V
Drive current (sink or source)
8
mA
UART
Default baud rate
921.6
kbaud
Configurable baud rate
9.6
921.6
kbaud
Data bits
8
bits
Parity bit
None
Stop bits
1
bits
Tab. 3.7: Digital Interface Specification

HARDWARE INTERFACE –Lepton9- Technical Information Manual 18
Parameter
Min.
Typ.
Max.
Unit
Conditions
ADC (Pin 13)
Resolution
12
Bits
Conversion voltage range
0
3.3
V
Sampling rate
0.47
2.7
MSPs
Total conversion time
3.1
μsec
Power-up time
3.1
μsec
Sampling switch resistance
200
Ω
Internal sample and hold
capacitance
25
pF
Total unadjusted error
±3.5
±7.1
LSB
Offset error
±3.0
±5.6
LSB
Gain error
±1
±2.5
LSB
DNL error
±1
LSB
INL error
±2
LSB
DAC (Pin 16)
Resolution
12
Bits
Resistive load
3
kΩ
Capacitive load
100
pF
Maximum capacitive load at the
DAC_OUT pin
Output voltage range
0.1
3.15
V
DNL
±1
LSB
INL
±4
LSB
Offset
±21
mV
Gain error
±2.5
%FSR
Settling time
15
30
μsec
CLOAD < 50 pF & RLOAD > 5 kΩ
Tab. 3.8: Analog Interface Specification
EPC Class-1 Generation-2 Operation
Supported RF modes
The Lepton9R9100C supports the following link profiles, whose characteristics are reported in the
following table:
Link Profile
Regulation
Forward Link Profile
Reverse Link Profile
R2T Modulation
Tari
PIE
T2R Modulation
Link Frequency
1
ETSI
PR-ASK
20 μs
2
Miller M=2
320 kHz
2
ETSI
PR-ASK
20 μs
2
Miller M=4
320 kHz
3
FCC
PR-ASK
20 μs
2
Miller M=4
250 kHz
4
ETSI
PR-ASK
15 μs
2
Miller M=2
320 kHz
5
ETSI/FCC
PR-ASK
20 μs
2
Miller M=8
160 kHz
6
FCC
PR-ASK
7.5 μs
2
FM0
640 kHz
7
FCC
PR-ASK
7.5 μs
2
Miller M=2
640 kHz
8
FCC
PR-ASK
7.5 μs
2
Miller M=4
640 kHz
9
FCC
DSB-ASK
6.25 μs
2
FM0
640 kHz
10
FCC
DSB-ASK
6.25 μs
2
Miller M=2
640 kHz
Tab. 3.9: RF Modes –Forward and Reverse Link Profiles

LAYOUT AND COMPONENTS –Lepton9- Technical Information Manual 19
4LAYOUT AND COMPONENTS
Introduction
This section describes hardware aspects of embedded RAIN RFID readers based on the Lepton9R9100C.
PCB Layout for RF
50 Ohm Characteristic Impedance
As discussed in paragraph RF Connection page 12, a properly matched RF connection is critical to achieving
high performance with Lepton9R9100C. An improperly matched RF connection will reduce performance in
multiple ways, by both reducing the transmitted RF power, and also increasing the reflected power that
interferes with Lepton9R9100C’s receive circuitry.
When impedance is improperly matched across a node, a signal’s reflection coefficient will be proportional
to the difference between the characteristic impedances on both sides of the node divided by their sum, as
shown in the following equation.
Reflection Coefficient of a Load:
In this equation, ZL represents the characteristic impedance of the transmission line, and Z0 represents the
characteristic impedance of the Lepton9R9100C, 50 Ohms. For example, if a 40 Ohm transmission line is
used, the reflection coefficient will be = 10 / 90 = 11.1%, thus 11.1% of the power will be reflected back
into the Lepton9R9100C, and only 88.9% of the power will be transmitted.
Lepton9R9100C is designed to connect to a 50-Ohm characteristic impedance load. The connection
between the Lepton9R9100C module and its antennas should all be designed for a 50 Ohm characteristic
impedance. Because the RF connection is made via PCB traces, this requires carefully designing the PCB
layout.
PCB trace characteristic impedance depends on quite a few variables, only some of which can easily be
controlled by the PCB designer. The two main categories of variables are the PCB geometry, and material
properties. PCB geometry includes both the transmission line type, be it microstrip, stripline, or others, and
also the specific dimensions of the forward and return paths and the adjacent dielectrics. Transmission line
styles are shown in Fig. 4.1: PCB Transmission Line Types page 19. Material properties to note include the
dielectric constant of the dielectrics in the PCB, and the conductivity of the conductor used.
Fig. 4.1: PCB Transmission Line Types
In most PCB designs, many of the parameters of the PCB are already set, such as dielectric thickness and
constant, trace conductivity and weight, etc. Usually, the only variables that can be easily modified are the

LAYOUT AND COMPONENTS - Lepton9- Technical Information Manual 20
style of transmission line, and its dimensions. The most common, and recommended PCB transmission line
scheme is to use a microstrip on the top or bottom layer of the PCB, with a ground plane on the layer
immediately adjacent as a return path. The width of this microstrip can then be varied to achieve the
desired characteristic impedance. Care should be taken to ensure that the microstrip trace has enough
current carrying capacity. This requires designing a trace that is heavy enough to withstand the heat
generated by power losses due to the resistance of the trace.
There are many online resources and tools designed to assist in designing PCB transmission lines with the
correct characteristic impedances. For example, the TXLine tool from National Instruments is very useful
for performing these calculations automatically. There is also an online calculator on eeweb.com. These
tools will require information about the PCB layout and also PCB characteristics, which should be obtained
from the PCB manufacturer.
Package and Assembly Information
This section provides mechanical drawings and critical dimensions needed for PCB layout and housing
design, as well as SMT assembly information.
Package Mass
The mass of the Lepton9R9100C module is roughly 5.4 grams.
Package Dimensions
Package dimensions are shown in the following figure:
Fig. 4.2: Package Dimensions, Top, Front, and Side Views
Download the Lepton9R9100C Technical drawing at Lepton9R9100C web page (Documents section).