COMBA mBDA OD Series User manual

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USER MANUAL
mBDA OD SERIES QE: 1-0-0
Comba Telecom Ltd.
mBDA OD SERIES

____________________________________________________________________________________________
_
The information contained herein is the responsibility of and is approved by the
following, to whom all enquiries should be directed in the first instance:
This is an unpublished work the copyright in which vests in Comba International
("Comba"). All rights reserved.
The information contained herein is confidential and the property of Comba and is
supplied without liability for errors or omissions. No part may be reproduced,
disclosed or used except as authorised by contract or other written permission.
The copyright and the foregoing restriction on reproduction and use extend to all
media in which the information may be embodied.

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0.1 CONTENTS
Section
Page
0.1 CONTENTS....................................................................................................................................... 3
0.2 INDEX TO FIGURES AND TABLES............................................................................................. 5
0.3 HISTORY........................................................................................................................................... 7
0.4 GLOSSARY OF TERMS................................................................................................................. 8
0.5 SAFETY NOTICES AND ADMONISHMENTS............................................................................. 9
1GENERAL INFORMATION........................................................................................................... 10
2EQUIPMENT DESCRIPTION....................................................................................................... 12
2.1 FUNCTIONAL BLOCK DIAGRAM............................................................................................... 12
2.2 EQUIPMENT LAYOUT.................................................................................................................. 13
2.3 EQUIPMENT CONSTITUTION.................................................................................................... 14
2.4 KIT OF PARTS ............................................................................................................................... 15
3INSTALLATION.............................................................................................................................. 16
3.1 WARNINGS AND ALERTS........................................................................................................... 16
3.2 SITE PLANNING CONSIDERATIONS........................................................................................ 17
3.2.1 SITE PLANNING ............................................................................................................................ 17
3.2.2 INSTALLATION CHECKLIST....................................................................................................... 18
3.3 INSTALLATION PROCEDURES................................................................................................. 19
3.3.1 GOODS INWARDS INSPECTION .............................................................................................. 19
3.3.2 TOOLS............................................................................................................................................. 19
3.3.3 PREPARATION.............................................................................................................................. 19
3.3.4 WALL MOUNTING OF SINGLE BAND....................................................................................... 20
3.3.5 WALL MOUNTING OF DUAL-BAND AND COMBINER .......................................................... 21
3.3.6 DRIP-LOOP..................................................................................................................................... 23
3.4 EQUIPMENT CONNECTORS...................................................................................................... 23
3.4.1 mBDA CONNECTORS.................................................................................................................. 23
3.4.2 COMBINER CONNECTORS........................................................................................................ 25
3.4.3 GROUNDING CONNECTION...................................................................................................... 26
3.4.4 RF CABLE CONNECTION ........................................................................................................... 26
3.4.5 COMMUNICATION CABLE CONNECTION.............................................................................. 27
3.4.6 MODEM ANTENNA CONNECTION OR ETHERNET CONNECTION.................................. 27
3.4.7 BACK-UP MONITORING LI-ION BATTERY CONNECTION.................................................. 28
3.4.8 PHYSICAL CONNECTION TO OMT PC.................................................................................... 28
4COMMISSIONING ......................................................................................................................... 29
4.1 PRE-COMMISSIONING TASKS.................................................................................................. 29
4.2 RFU LED INDICATOR................................................................................................................... 29
4.3 COMMISSIONING PROCEDURE............................................................................................... 30
5WEB GUI......................................................................................................................................... 32
5.1 WEB GUI CONNECTION ............................................................................................................. 32
5.2 WEB GUI INTRODUCTION.......................................................................................................... 32
5.2.1 [DEVICES]....................................................................................................................................... 33
5.2.2 [COMMISSIONING]....................................................................................................................... 35
5.2.3 [FIRMWARE]................................................................................................................................... 35
5.2.4 [MANAGEMENT]............................................................................................................................ 37
5.3 COMMISSIONING PROCEDURE............................................................................................... 43
6MAINTENANCE.............................................................................................................................. 49
7APPENDICES................................................................................................................................. 50

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7.1 APPENDIX A: TOOLS................................................................................................................... 50
7.2 APPENDIX B: RMA (RETURN MATERIAL AUTHORIZATION) FORM ................................ 51

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0.2 INDEX TO FIGURES AND TABLES
Figure 1: Front, Side and Bottom Views of the mBDA Enclosure............................................................. 10
Figure 2: Front, Side and Bottom Views of the dual-band combiner Enclosure........................................ 11
Figure 3: mBDA Functional Block Diagram................................................................................................ 12
Figure 4: Dual-band mBDA System Diagram ............................................................................................ 12
Figure 5: Layout of the mBDA.................................................................................................................... 13
Figure 6: Layout of the mBDA Combiner Unit............................................................................................ 13
Figure 7: Mounting Rack Overview............................................................................................................ 19
Figure 8: Install Mounting Rack1................................................................................................................ 20
Figure 9: Install Mounting Rack2 and Mounting Rack Bolt ........................................................................ 20
Figure 10: Hand up the mBDA................................................................................................................... 21
Figure 11: Finish Installation ...................................................................................................................... 21
Figure 12: Install Mounting Rack Bolt......................................................................................................... 22
Figure 13: Install Mounting Rack2.............................................................................................................. 22
Figure 14: Hand up and Secure the second mBDA................................................................................... 22
Figure 15: Finish Installation ...................................................................................................................... 23
Figure 16: Equipment Connectors ............................................................................................................. 24
Figure 17: Operation Window .................................................................................................................... 25
Figure 18: Combiner Connectors............................................................................................................... 25
Figure 19: Communication Cable connection............................................................................................ 27
Figure 20: Communication Cable connection............................................................................................ 27
Figure 21: Battery Connection in Operation Window................................................................................. 28
Figure 22: OMT Connection without Chassis Open................................................................................... 28
Figure 23: RFU LEDs on Outer Window.................................................................................................... 29
Figure 24: Input IP Address........................................................................................................................ 32
Figure 25: Input Domain Name.................................................................................................................. 32
Figure 26: Input User Name and Password............................................................................................... 32
Figure 27: Web GUI Main Screen.............................................................................................................. 33
Figure 28: [Devices] Screen....................................................................................................................... 33
Figure 29: Main Control Unit ...................................................................................................................... 34
Figure 30: RF Unit...................................................................................................................................... 34
Figure 31: RF Unit Detail Information......................................................................................................... 35
Figure 32: [Commissioning] Screen........................................................................................................... 35
Figure 33: [Firmware] Screen –MCU Firmware Upgrade.......................................................................... 36
Figure 34: [Firmware] Screen –Module Software Upgrade....................................................................... 36
Figure 35: [Firmware] Screen –Pop-up Window 1.................................................................................... 36
Figure 36: [Firmware] Screen - Swap......................................................................................................... 37
Figure 37: [Management] Screen............................................................................................................... 37
Figure 38: Management –Import & Export................................................................................................ 38
Figure 39: Management –IP Setting.......................................................................................................... 38
Figure 40: Management –Comm. Setting................................................................................................. 39
Figure 41: New Site Report is for easy monitoring set up.......................................................................... 39
Figure 42: Management –Security............................................................................................................ 40
Figure 43: Modify Password....................................................................................................................... 40
Figure 44: Management –Device Reset.................................................................................................... 40
Figure 45: Management –PA Reset.......................................................................................................... 41
Figure 46: Management –Device Info....................................................................................................... 41
Figure 47: Management –Isolation............................................................................................................ 42
Figure 48: Management –Report .............................................................................................................. 42
Figure 49: Commissioning Procedure - Start............................................................................................. 43
Figure 50: Commissioning Procedure –Site Info. Setting ......................................................................... 43
Figure 51: Dev Info & Date/Time................................................................................................................ 44
Figure 52: Commissioning Procedure –Isolation Detective ...................................................................... 44
Figure 53: Commissioning Procedure –Isolation Detective Confirm......................................................... 45
Figure 54: Commissioning Procedure –Isolation Detection Failed ............................................................ 45
Figure 55: Commissioning Procedure –Isolation Detection Finish............................................................. 45
Figure 56: Commissioning Procedure –Sub-band bandwidth and Switch Setting.................................... 46
Figure 57: The Protective Frequency Edge Interval (GSM system)........................................................... 46

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Figure 58: Commissioning Procedure –DL Output Power Setting Screen................................................ 47
Figure 59: Commissioning Procedure –DL Output Power Setting............................................................ 47
Figure 60: DL Output Power Over Exceed................................................................................................. 47
Figure 61: Commissioning Procedure –Finish.......................................................................................... 48
Table 1: Equipment KOP............................................................................................................................ 15
Table 2: Equipment KOP of Second unit ................................................................................................... 15
Table 3: Equipment KOP of Combiner unit................................................................................................ 15
Table 4: Equipment Connectors................................................................................................................. 24
Table 5: Operation Window........................................................................................................................ 25
Table 6: Combiner Connectors .................................................................................................................. 26
Table 7: RFU LEDs.................................................................................................................................... 29
Table 8: Commissioning Task Explanation................................................................................................ 31

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0.3 HISTORY
Change No.
ENU
Details Of Change
1
1-0-0
This manual first created and issued in Nov 2014.
.

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0.4 GLOSSARY OF TERMS
Abbreviation
Definition
ALC
Automatic Level Control
ATT
Attenuator
BTS
Base Transceiver Station
CH
Channel
CSA
Cross Sectional Area
dB
Decibel
dBm
Decibels relative to 1 milliwatt
DL
Downlink
DT
Donor Terminal
DPX
Duplexer
FS
Frequency Selection
GSM
Global Standard for Mobile Communication
Hz
Hertz
ID
Identification
IF
Intermediate Frequency
LNA
Low Noise Amplifier
LOS
Line-of-Sight
MCU
Main Control Unit
MHz
Megahertz
MT
Mobile Terminal
MTBF
Mean Time Between Failures
NF
Noise Figure
OMC
Operation & Maintenance Center
OMT
Operation & Maintenance Terminal
PA
Power Amplifier
PLL
Phase Locked Loop
PSU
Power Supply Unit
RF
Radio Frequency
SIM
Subscriber Identification Module
SMA
Sub-Miniature A Connector
SMS
Short Message Service
UL
Uplink
VAC
Volts Alternating Current
VDC
Volts Direct Current
VSWR
Voltage Standing Wave Ratio

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0.5 SAFETY NOTICES AND ADMONISHMENTS
This document contains safety notices in accordance with appropriate standards. In the interests of
conformity with the territory standards for the country concerned, the equivalent territorial admonishments
are also shown.
Any installation, adjustment, maintenance and repair of the equipment must only be carried out by trained,
authorized personnel. At all times, personnel must comply with any safety notices and instructions.
Specific hazards are indicated by symbol labels on or near the affected parts of the equipment. The labels
conform to international standards, are triangular in shape, and are colored black on a yellow background.
An informative text label may accompany the symbol label.
Hazard labeling is supplemented by safety notices in the appropriate equipment manual. These notices
contain additional information on the nature of the hazard and may also specify precautions.
Warning Notices:
These draw the attention of personnel to hazards that may cause death or injury to the operator or others.
Examples of use are cases of high voltage, laser emission, toxic substances, point of high temperature, etc.
Alert Notices:
These draw the attention of personnel to hazards that maycause damage to the equipment. An example of
use is the case of static electricity hazard.
Caution notices may also be used in the handbook to draw attention to matters that do not constitute a risk
of causing damage to the equipment but where there is a possibility of seriously impairing its performance,
e.g. bymishandlingor gross maladjustment. Warnings and Cautions within the main text do not incorporate
labels and may be in shortened form.
CAUTION: danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent
type.
End of Section

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1 GENERAL INFORMATION
The mBDA Digital Band Selective Repeater (hereinafter called “mBDA”) is designed for a single network
system, like 850MHz, 900MHz, 1800MHz, 1900MHz, AWS, 2100MHz or 2600MHz etc. It can wireless
transmit, three-way amplify BTS uplink and downlink signals and enlarge coverage range. Digital band
selective technology effectively amplifies the desired BTS signals and provides superior out-of-band
rejection, avoid cell interference and improve call quality.
Main Features
Wideband digital processing technology, instant operation bandwidth reaches 25MHz for GSM, 20MHz
for LTE and 15MHz for WCDMA.
It supports three wideband channels; each channel can turn off separately. Operation band is
0.2-25MHz adjustable for GSM, 3-20MHz adjustable for LTE, and 5-15MHz adjustable for WCDMA.
High power bandwidth linear PA ensures signals no distortion amplification.
The system gain is compensated automatically according to the temperature variation within the
enclosure, which ensures stable operation under ambient temperature.
Has off-line isolation testing, downlink VSWR alarm, downlink input filed intensity and output power
testing function, which is convenient for installation and commissioning.
Supports multi-band expansion, convenient for configuration and upgrade.
Remote software upgrade is available.
Local Web Operation and Maintenance Terminal (Web-OMT): operating status and parameters can
be set or monitored by PC locally.
Operation Maintenance Center (OMC): system working parameters and communication configuration
can be set or inquired remotely through the build-in WCDMA modem. If alarm is generated, the
equipment will dial up to OMC automatically.
Build-in Li-ion battery ensures that alarm information can automatically report to OMC in case of
equipment power failure.
Designed for all weather installation –waterproof, damp-proof and omni-sealed.
The following figure shows the enclosure of the mBDA.
PWR
ALM
RUN
MT
DT
MODEM_ANT
AC 100V-240V
50Hz/60Hz
RS-485
361
222
260
398
135
93
Figure 1: Front, Side and Bottom Views of the mBDA Enclosure

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102
71
338
210
Figure 2: Front, Side and Bottom Views of the dual-band combiner Enclosure
Note: Only when the dual-band mBDA is required, and the combiner is ordered separately.
End of Section

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2 EQUIPMENT DESCRIPTION
2.1 FUNCTIONAL BLOCK DIAGRAM
DL PA
UL PA
DT MT
DT Port
Duplexer MT Port Duplexer
Li-ion
Battery
MODEM
Antenna/
LAN Port
LNA
LNA
Digital Integrated
Module
DLin DLout
ULinULout
MODEM
/LAN
PSU
AC 100V-240V
MCU
Figure 3: mBDA Functional Block Diagram
Note: Slave unit is not including Modem/LAN module and related connector.
In the downlink, the BTS signals are received by donor antenna of the repeater. After the duplexer, the
signals are sent to the LNA module for pre-amplification and digital RF integrated module for digital filtering
and frequency conversion. Then the DL signals will be sent to downlink PA to amplify power and filter via
duplexer. After amplification, the signals are transmitted at the MT port to the service antenna.
In the uplink, the mobile signals are received by the service antenna. After the MT port integrated duplexer,
the signals are sent to the LNA, integrated module for digital filtering, then to PA for power amplification and
to duplexer. After that, the uplink signals are sent to the donor antenna for transmission back to the BTS.
COM DT COM MT
Combiner1 Combiner2
mBDA
Slave unit
Combiner
unit
DT
DT
MT
MT
Figure 4: Dual-band mBDA System Diagram

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2.2 EQUIPMENT LAYOUT
Shown below is the internal layout of the mBDA.
RS485
POWER
MODEM/LAN
(Optional)
Distribution
Board
(above
Distribition Board)
MODEM DT
MT
DT
RF OUT
RF IN
U_RF IN
Bottom
DL PA
Digital
Integrated
Module
Cover
UL PA
PSU
MCU
RX
TX
Duplexer
Li-ion Battery
(Optional)
Operation Window
Figure 5: Layout of the mBDA
Note: When dual-band mBDA is required, these also need a second unit. The second unit does not need a
MODEM board and modem antenna connector/LAN connector. And the second unit is ordered separately.
Combiner1
Combiner2 MT
DT
Figure 6: Layout of the mBDA Combiner Unit
Note: When dual-band mBDA is required, these also need a Combiner unit. And the Combiner unit is
ordered separately.

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2.3 EQUIPMENT CONSTITUTION
The typical mBDA unit consists of the following components:
Power Amplifier (PA): It fulfils power amplification in both UL and DL branches.
Main Control Unit (MCU): The MCU is used to monitor and control the operation of the repeater. It also
provides the communication interface for remote control and indication. LED indicators provide the
operation status of the MCU.
Duplexer: The DPX is located towards the MT terminals and permits the uplink and downlink signals to
share a common antenna.
Digital Integrated Module and Power Amplifier: Consists of Power Conversion module, RF module,
digital process module and monitoring module. Power Conversion module converts +28V DC voltage in to
+9VJK and +9VRF. +9VJK, +9VRF are supplied to monitoring unit and RF unit in integrated module
separately. RF module amplifies and converts the RF signal to IF signal. Digital process module converts
the IF signal into baseband signal via AD conversion and extraction, filtering. After that, IF signal will be
amplified and converted to RF signal by RF module for RF filtering and amplification. Monitoring module
monitors and controls the system parameters and is the interface of both remote monitoring and local
commissioning.
Power Supply Unit (PSU): The PSU converts the input voltage into a stable DC to provide power for the
internal functional modules and to charge the internal Li-ion battery.
Li-ion Battery: Provides power to the Main Control Unit to send alarm signals in the event of power failure
Distribution Board: Power converts +28V DC voltage in to +9VJK and +9VRF. +9VJK, +9VRF are supplied
to main control unit and modem.
Modem: The modem is used for remote control and monitors, and for alarm transmission from the repeater
to the OMC.The first unit has modem and can share the modem for second unit remote monitor and control,
2 mBDA connect each other via RS-485 communication cable.

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2.4 KIT OF PARTS
Table 1: Equipment KOP
Identifier
Function Description
Qty
Equipment
mBDA Unit
1
Power Supply Cable
4m
1
Mounting Rack1
mBDA-2633-5808
1
Mounting Rack2
mBDA-2633-5809
1
Masonry Bolt
M10x110
4
Mounting Rack Bolt
RRU-023L-5807
2
Hex Socket with Washer Bolt
M6x12
8
Modem Antenna
XD-WCDMA ( for Modem model only)
1
RJ45 Cable
1.5m
1
T-Shaped Pentagon Key Wrench
5mm
1
Factory Test Report
N/A
1
On CD-Rom
mBDA QE
This equipment manual.
1
Table 2: Equipment KOP of Second unit
Identifier
Function Description
Qty
Equipment
mBDA Unit
1
Power Supply Cable
4m
1
Mounting Rack1
mBDA-2633-5808
1
Mounting Rack2
mBDA-2633-5809
1
Mounting Rack Bolt
RRU-023L-5807
2
Hex Socket with Washer Bolt
M6x12
8
RS-485 Communication Cable
XM14J7P,0.2m
1
Factory Test Report
N/A
1
On CD-Rom
mBDA QE
This equipment manual.
1
Only when dual-band mBDA is required, and the KOP is for Second unit.
Table 3: Equipment KOP of Combiner unit
Identifier
Function Description
Qty
Equipment
mBDA-CB-BK2
1
Jumper1
0.14m, 401FJ
2
Jumper2
0.25m, 401FJ
2
Mounting Rack Bolt
RRU-023L-5807
2
Hex Socket with Washer Bolt
M6x12
5
Only when dual-band mBDA is required, and the KOP is for Combiner unit.
End of Section

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3 INSTALLATION
3.1 WARNINGS AND ALERTS
Radio Frequency Energies
There may be situations, particularly for workplace environments near high-powered RF sources, where
recommended limits for safe exposure of human beings to RF energy could be exceeded. In such cases,
restrictive measures or actions may be necessary to ensure the safe use of RF energy.
High Voltage
The equipment has been designed and constructed to prevent, as far as reasonably, practicable danger.
Any work activity on or near equipment involving installation, operation or maintenance must be, as far as
reasonably, free from danger.
Where there is a risk of damage to electrical systems involving adverse weather, extreme temperatures,
wet, corrosive or dirty conditions, flammable or explosive atmospheres, the system must be suitably
installed to prevent danger.
Protective Earthing
Equipment provided for the purpose of protecting individuals from electrical risk must be suitable for the
purpose and properly maintained and used.
Handling Precautions
This covers a range of activities including lifting, lowering, pushing, pulling, carrying, moving, holding or
restraining an object, animal or person from the equipment. It also covers activities that require the use of
force or effort, such as pulling a lever, or operating power tools.
Where some of the abovementioned activities are required, the equipment must be handled with care to
avoid being damaged.
Electrostatic Discharge (ESD)
Observe standard precautions for handling ESD-sensitive devices. Assume that all solid-state electronic
devices are ESD-sensitive. Ensure the use of a grounded wrist strap or equivalent while working with
ESD-sensitive devices. Transport, store, and handle ESD-sensitive devices in static-safe environments.

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3.2 SITE PLANNING CONSIDERATIONS
3.2.1 SITE PLANNING
Site Considerations
Outdoor equipment are designed to be waterproof, rainproof, and with snow protection. Temporary
protection should be taken when the equipment enclosure is opened for installation or maintenance in an
outdoor environment. The equipment must not be opened for installation or maintenance in bad weather
(e.g. gale, storm rainfall, extreme temperatures and high humidity)
Installation Location
Mounting surface shall be capable of supporting the weight of the equipment.
In order to avoid electromagnetic interference, a proper mounting location must be selected to minimize
interference from electromagnetic sources such as large electrical equipment.
Environmental
Humidity has an adverse effect on the reliability of the equipment. It is recommended to install the
equipment in locations having stable temperature and unrestricted air-flow.
The installation location for the product should be well ventilated. The equipment has been designed to
operate at the temperature range and humidity level as stated in the product specifications in the datasheet.
Direct sun light exposure to the equipment should be avoided. Provide additional shelter if necessary.
Power Supply
The power supplyunit (PSU) provides power toall modules within the equipment. Depending on the product
variant, it is recommended that the PSU operates on a dedicated circuit breaker or fused circuit.
Grounding Requirement
Verify that the equipment has been well grounded. This includes antennas and all cables connected to the
system. Ensure lightning protection for the antennas is properly grounded.
Cable Routing
Depending on equipment configuration, a varietyof types of cables are required. Where applicable, ensure
cables are properly routed and secured so that they are not damaged.
Manual Handling
During transportation and installation, take necessary handling precautions to avoid potential physical injury
to the installation personnel and the equipment.

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3.2.2 INSTALLATION CHECKLIST
Working space available for installation and maintenance for each mounting arrangement. Ensure
unrestricted airflow.
Ensure earthing point is within reach of the ground wire.
Ensure a power source is within reach of the power cord and the power source has sufficient capacity.
Where appropriate, ensure unused RF connectors are terminated.
Do not locate the equipment near large transformers or motors that may cause electromagnetic
interference.
Reduce signal loss in feeder cable by minimizing the length and number of RF connections.
Ensure VSWR of antennas system < 1.5:1.
Ensure equipment will be operated within the stated environment (see datasheet)
Observe handling of all cables to prevent damage.
Donor antenna should have a narrow beamwidth and positioned in line-of-sight (LOS) to donor BTS site
so that the donor signal level is maximized. This allows the use of minimum gain to achieve the
maximum DL output power. The UL gain is typically set lower than or equal to the DL gain to minimize
noise interference to the donor BTS
Service antenna should be selected based on the type of service area, e.g., indoor antenna for indoor
application, and panel antenna for outdoor application.

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3.3 INSTALLATION PROCEDURES
3.3.1 GOODS INWARDS INSPECTION
Verify the number of packages received against the packing list.
Check all packages for external damage; report any external damage to the shipping courier. If there
is damage, a shipping agent should be present before unpacking and inspecting the contents because
damage during transit is the responsibility of the agent.
Open and check each package against the packing list. If any items are missing, contact Comba.
Do not remove items from anti-static packing until ready for installation. If damage is discovered at the
time of installation, contact the shipping agent.
3.3.2 TOOLS
See Appendix A for a full list of the recommended tools required for installation and routine maintenance.
3.3.3 PREPARATION
Wall mounting with the masonry bolts supplied, which make use of the outer holes.
Figure 7: Mounting Rack Overview

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3.3.4 WALL MOUNTING OF SINGLE BAND
Drill four holes on the wall using the position of four holes on the mounting rack as a guide. Fix the
mounting rack to the wall using four masonry bolts (M10x110mm).
Install the Mounting Rack2 on the both side of the enclosure.
Hang up the equipment and secure the enclosure to the mounting rack.
Masonry Bolt
4-M10X110
Mounting Rack1
Figure 8: Install Mounting Rack1
4-M6×12,Hex Socket
with Washer Bolt
Mounting Rack2
mBDA
Figure 9: Install Mounting Rack2 and Mounting Rack Bolt
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