Cypress Semiconductor CY7C185 User manual

8K x 8 Static RAM
f
ax
id
:
1013
CY7C185
Cypress Semiconductor Corporation • 3901 North First Street • San Jose • CA 95134 • 408-943-2600
Au
g
ust 12
,
1998
Features
• High speed
—15ns
• Fast tDOE
• Low active power
—715mW
• Low standby power
—220mW
• CMOS for optimum speed/power
• Easy memory expansion with CE1,CE2,andOEfeatures
• TTL-compatible inputs and outputs
• Automatic power-down when deselected
Functional Description
The CY7C185 is a high-performance CMOS static RAM orga-
nized as 8192 words by 8 bits. Easy memory expansion is
provided by an active LOW chip enable (CE1), an active HIGH
chip enable (CE2), and active LOW output enable (OE) and
three-state drivers. This device has an automatic power-down
feature(CE1orCE2),reducingthe power consumption by 70%
when deselected. The CY7C185is in astandard 300-mil-wide
DIP, SOJ, or SOIC package.
An active LOW write enable signal (WE) controls the writ-
ing/reading operation of the memory. When CE1and WE in-
puts are both LOW and CE2is HIGH, data on the eight data
input/outputpins (I/O0through I/O7) is written into the memory
location addressed by the address present on the address
pins (A0through A12). Reading the device is accomplished by
selecting the device and enabling the outputs, CE1and OE
active LOW, CE2active HIGH, while WE remains inactive or
HIGH. Under these conditions, the contents of the location ad-
dressedby the informationon address pins are presenton the
eight data input/output pins.
The input/outputpins remainin a high-impedance state unless
the chip is selected, outputs are enabled, and write enable
(WE) is HIGH. A die coat is used to insure alpha immunity.
Logic Block Diagram Pin Configurations
C185–1
A1
A2
A3
A4
A5
A6
A7
A8
A0
A10
A9
A11 A12
I/O0
C185–2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
WE
CE2
A3
A2
A1
OE
A0
CE1
I/O7
I/O6
I/O5
I/O4
I/O3
NC
A4
A5
A6
A7
A8
A9
A10
A11
A12
I/O0
I/O1
I/O2
GND
256 x 32 x 8
ARRAY
INPUT BUFFER
COLUMN DECODER
ROW DECODER
SENSE AMPS
POWER
DOWN
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
CE1
CE2
WE
OE
Top View
DIP/SOJ/SOIC
Selection Guide[1]
7C185–15 7C185–20 7C185–25 7C185–35
Maximum Access Time (ns) 15 20 25 35
Maximum Operating Current (mA) 130 110 100 100
Maximum Standby Current (mA) 40/15 20/15 20/15 20/15
Note:
1. For military specifications, see the CY7C185A datasheet.

CY7C185
2
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Power Applied.............................................–55°C to +125°C
Supply Voltage to Ground Potential...............–0.5V to +7.0V
DC Voltage Applied to Outputs
in High Z State[2]............................................ –0.5V to +7.0V
DC Input Voltage[2]......................................... –0.5V to +7.0V
Output Current into Outputs (LOW)............................. 20 mA
Static Discharge Voltage .......................................... >2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current.................................................... >200 mA
Operating Range
Range Ambient
Temperature VCC
Commercial 0°C to +70°C 5V ±10%
Industrial –40°C to +85°C 5V ±10%
Electrical Characteristics Over the Operating Range
7C185–15 7C185–20
Parameter Description Test Conditions Min. Max. Min. Max. Unit
VOH Output HIGH Voltage VCC = Min., IOH = –4.0 mA 2.4 2.4 V
VOL Output LOW Voltage VCC = Min., IOL = 8.0 mA 0.4 0.4 V
VIH Input HIGH Voltage 2.2 VCC +
0.3V 2.2 VCC+ 0.3V V
VIL Input LOW Voltage[2] –0.5 0.8 –0.5 0.8 V
IIX Input Load Current GND ≤VI≤VCC –5 +5 –5 +5 µA
IOZ Output Leakage
Current GND ≤VI ≤VCC, Output Disabled –5 +5 –5 +5 µA
IOS Output Short
Circuit Current[3] VCC = Max., VOUT = GND –300 –300 mA
ICC VCC Operating
Supply Current VCC = Max., IOUT = 0 mA 130 110 mA
ISB1 Automatic
Power-Down Current Max. VCC, CE1≥VIH or CE2 ≤VIL
Min. Duty Cycle=100% 40 20 mA
ISB2 Automatic
Power-Down Current Max. VCC, CE1≥VCC – 0.3V, or CE2 ≤0.3V
VIN ≥VCC – 0.3V or VIN ≤0.3V
15 15 mA
Notes:
2. Minimum voltage is equal to –3.0V for pulse durations less than 30 ns.
3. Not more than 1 output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.

CY7C185
3
Electrical Characteristics Over the Operating Range (continued)
7C185–25 7C185-35
Parameter Description Test Conditions Min. Max. Min. Max. Unit
VOH Output HIGH Voltage VCC = Min., IOH = –4.0 mA 2.4 2.4 V
VOL Output LOW Voltage VCC = Min., IOL = 8.0 mA 0.4 0.4 V
VIH Input HIGH Voltage 2.2 VCC +
0.3V 2.2 VCC + 0.3V V
VIL Input LOW Voltage[2] –0.5 0.8 –0.5 0.8 V
IIX Input Load Current GND ≤VI≤VCC –5 +5 –5 +5 µA
IOZ Output Leakage
Current GND ≤VI ≤VCC, Output Disabled –5 +5 –5 +5 µA
IOS Output Short
Circuit Current[3] VCC = Max., VOUT = GND –300 –300 mA
ICC VCC Operating
Supply Current VCC = Max., IOUT = 0 mA 100 100 mA
ISB1 Automatic
Power-Down Current Max. VCC, CE1≥VIH or CE2 ≤VIL
Min. Duty Cycle=100% 20 20 mA
ISB2 Automatic
Power-Down Current Max. VCC, CE1≥VCC – 0.3V or CE2 ≤0.3V
VIN ≥VCC – 0.3V or VIN ≤0.3V
15 15 mA
Capacitance[4]
Parameter Description Test Conditions Max. Unit
CIN Input Capacitance TA= 25°C, f = 1 MHz,
VCC = 5.0V 7 pF
COUT Output Capacitance 7 pF
Note:
4. Tested initially and after any design or process changes that may affect these parameters.
AC Test Loads and Waveforms
R1 481Ω
3.0V
5V
OUTPUT
R1 481Ω
R2
255Ω
30pF GND 90% 90%
10%
≤5ns ≤5ns
5V
OUTPUT
C185–4
R2
255Ω
5pF
C185–5
(a) (b)
OUTPUT 1.73V
INCLUDING
JIG AND
SCOPE
INCLUDING
JIGAND
SCOPE
10%
Equivalent to: THÉVENIN EQUIVALENT
ALL INPUT PULSES
167Ω

CY7C185
4
Switching Characteristics Over the Operating Range[5]
7C185–15 7C185–20 7C185–25 7C185–35
Parameter Description Min. Max. Min. Max. Min. Max. Min. Max. Unit
READ CYCLE
tRC Read Cycle Time 15 20 25 35 ns
tAA Address to Data Valid 15 20 25 35 ns
tOHA Data Hold from
Address Change 3 5 5 5 ns
tACE1 CE1LOW to Data Valid 15 20 25 35 ns
tACE2 CE2HIGH to Data Valid 15 20 25 35 ns
tDOE OE LOW to Data Valid 8 9 12 15 ns
tLZOE OE LOW to Low Z 3 3 3 3 ns
tHZOE OE HIGH to High Z[6] 7 8 10 10 ns
tLZCE1 CE1LOW to Low Z[7] 3 5 5 5 ns
tLZCE2 CE2HIGH to Low Z 3 3 3 3 ns
tHZCE CE1HIGH to High Z[6, 7]
CE2LOW to High Z 7 8 10 10 ns
tPU CE1LOW to Power-Up
CE2to HIGH to Power-Up 0 0 0 0 ns
tPD CE1HIGH to Power-Down
CE2 LOW to Power-Down 15 20 20 20 ns
WRITE CYCLE[8]
tWC Write Cycle Time 15 20 25 35 ns
tSCE1 CE1LOW to Write End 12 15 20 20 ns
tSCE2 CE2HIGH to Write End 12 15 20 20 ns
tAW Address Set-Up to
Write End 12 15 20 25 ns
tHA Address Hold from
Write End 0 0 0 0 ns
tSA Address Set-Up to
Write Start 0 0 0 0 ns
tPWE WE Pulse Width 12 15 15 20 ns
tSD Data Set-Up to Write End 8 10 10 12 ns
tHD Data Hold from Write End 0 0 0 0 ns
tHZWE WE LOW to High Z[6] 7 7 7 8 ns
tLZWE WE HIGH to Low Z 3 5 5 5 ns
Notes:
5. Test conditions assume signal transition time of 5 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
IOL/IOH and 30-pF load capacitance.
6. tHZOE, tHZCE, and tHZWE are specified with CL= 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady state voltage.
7. At any given temperature and voltage condition, tHZCE is less than tLZCE1 and tLZCE2 for any given device.
8. The internal write time of the memory is defined by the overlap of CE1LOW, CE2HIGH, and WE LOW. All 3 signals must be active to initiate a write and either
signalcan terminate a writebygoing HIGH. The data input set-up and hold timing shouldbereferenced to the rising edge ofthesignalthatterminates the write.

CY7C185
5
Switching Waveforms
9. Device is continuously selected. OE, CE1= VIL. CE2= VIH.
10. WE is HIGH for read cycle.
11. Data I/O is High Z if OE = VIH, CE1= VIH, WE = VIL,or CE2=VIL.
12. The internal write time of the memory is defined by the overlap of CE1LOW, CE2HIGH and WE LOW. CE1and WE must be LOW and CE2must be HIGH
to initiate write. A write can be terminated by CE1or WE going HIGH or CE2going LOW. The data input set-up and hold timing should be referenced to the
rising edge of the signal that terminates the write.
13. During this period, the I/Os are in the output state and input signals should not be applied.
ADDRESS
DATA OUT PREVIOUS DATA VALID DATA VALID
tRC
tAA
tOHA
C185–6
Read Cycle No.1[9,10]
50%
50%
DATA VALID
tRC
tACE
tDOE
tLZOE
tLZCE
tPU
HIGH IMPEDANCE IMPEDANCE
ICC
ISB
tHZOE tHZCE
tPD
OE
HIGH
DATA OUT
VCC
SUPPLY
CURRENT
CE1
OE
CE2
C185–7
Read Cycle No.2[11,12]
C185–8
tHD
tSD
tPWE tSA
tHA tAW
tWC
tHZOE
DATA IN VALID
CE
CE1
OE
WE
CE2
DATA I/O
tSCEI
tSCE2
ADDRESS
NOTE 13
[10,12]
Write Cycle No. 1 (WE Controlled)

CY7C185
6
Notes:
14. The minimum write cycle time for write cycle #3 (WE controlled, OE LOW) is the sum of tHZWE and tSD.
15. If CE1goes HIGH or CE2goes LOW simultaneously with WE HIGH, the output remains in a high-impedance state.
Switching Waveforms (continued)
tWC
tAW
tSA
tHA
tHD tSD
tSCE1
WE
DATA I/O
ADDRESS
CE1
C185–9
DATA IN VALID
tSCE2
CE2
W
rite Cycle No. 2 (CE Controlled)[12,13,14]
tHD tSD
tLZWE
tSA
tHA tAW
tWC
tHZWE C185–10
DATA IN VALID
tSCE1
tSCE2
CE1
CE2
ADDRESS
DATA I/O
WE
Write Cycle No. 3 (WE Controlled, OE LOW)[12,13,14,15]
NOTE 13

CY7C185
7
Typical DC and AC Characteristics
–55 25 125
1.2
1.0
0.8
OUTPUT SOURCE CURRENT (mA)
AMBIENT TEMPERATURE (°C)
0.6
0.4
0.2
0.0
NORMALIZED I , I
CC
ISB
VCC=5.0V
VIN=5.0V
ICC
SB
1.2
1.4
1.0
0.6
0.4
0.2
4.0 4.5 5.0 5.5 6.0
1.6
1.4
1.2
1.0
0.8
–55 25 125
NORMALIZED tAA
120
100
80
60
40
20
0.0 1.0 2.0 3.0 4.0
SUPPLY VOLTAGE (V)
NORMALIZED SUPPLY CURRENT
vs. SUPPLY VOLTAGE
NORMALIZED ACCESS TIME
vs. AMBIENT TEMPERATURE
AMBIENT TEMPERATURE (°C)
NORMALIZED SUPPLY CURRENT
vs. AMBIENT TEMPERATURE
OUTPUT VOLTAGE (V)
OUTPUT SOURCE CURRENT
vs. OUTPUT VOLTAGE
0.0
0.8
1.4
1.3
1.2
1.1
1.0
0.9
4.0 4.5 5.0 5.5 6.0
NORMALIZED tAA
SUPPLY VOLTAGE (V)
NORMALIZED ACCESS TIME
vs. SUPPLY VOLTAGE
120
140
100
60
40
20
0.0 1.0 2.0 3.0 4.0
OUTPUT SINK CURRENT (mA)
0
80
OUTPUT VOLTAGE (V)
OUTPUT SINK CURRENT
vs. OUTPUT VOLTAGE
NORMALIZED I , I
CC SB
ICC
VCC =5.0V
VCC =5.0V
TA=25°C
VCC =5.0V
TA=25°C
ISB
TA=25°C
0.6
0.8
0
3.0
2.5
2.0
1.5
1.0
0.5
0.0 1.0 2.0 3.0 4.0
NORMALIZED IPO
SUPPLY VOLTAGE (V)
TYPICAL POWER-ON CURRENT
vs. SUPPLY VOLTAGE 30.0
25.0
20.0
15.0
10.0
5.0
0 200 400 600 800
DELTA t (ns)
AA
CAPACITANCE (pF)
TYPICAL ACCESS TIME CHANGE
vs. OUTPUT LOADING 1.25
1.00
0.75
10 20 30 40
NORMALIZED ICC
CYCLE FREQUENCY (MHz)
NORMALIZED ICC vs. CYCLE TIME
0.0 5.0 0.0 1000 0.50
VCC =4.5V
TA=25°C
VCC =5.0V
TA=25°C
VCC =0.5V

CY7C185
8
Document #: 38–00037–K
Truth Table
CE1CE2WE OE Input/Output Mode
H X X X High Z Deselect/Power-Down
X L X X High Z Deselect/Power-Down
L H H L Data Out Read
L H L X Data In Write
L H H H High Z Deselect
Address Designators
Address
Name Address Function Pin Number
A4 X3 2
A5 X4 3
A6 X5 4
A7 X6 5
A8 X7 6
A9 Y1 7
A10 Y4 8
A11 Y3 9
A12 Y0 10
A0 Y2 21
A1 X0 23
A2 X1 24
A3 X2 25
Ordering Information
Speed
(ns) Ordering Code Package Name Package Type Operating Range
15 CY7C185–15PC P21 28-Lead (300-Mil) Molded DIP Commercial
CY7C185–15SC S21 28-Lead Molded SOIC
CY7C185–15VC V21 28-Lead Molded SOJ
CY7C185–15VI V21 28-Lead Molded SOJ Industrial
20 CY7C185–20PC P21 28-Lead (300-Mil) Molded DIP Commercial
CY7C185–20SC S21 28-Lead Molded SOIC
CY7C185–20VC V21 28-Lead Molded SOJ
CY7C185–20VI V21 28-Lead Molded SOJ Industrial
25 CY7C185–25PC P21 28-Lead (300-Mil) Molded DIP Commercial
CY7C185–25SC S21 28-Lead Molded SOIC
CY7C185–25VC V21 28-Lead Molded SOJ
CY7C185–25VI V21 28-Lead Molded SOJ Industrial
35 CY7C185–35PC P21 28-Lead (300-Mil) Molded DIP Commercial
CY7C185–35SC S21 28-Lead Molded SOIC
CY7C185–35VC V21 28-Lead Molded SOJ
CY7C185–35VI V21 28-Lead Molded SOJ Industrial

CY7C185
9
Package Diagrams
51-85014-B
28-Lead (300-Mil) Molded DIP P21
28-Lead (300-Mil)Molded SOIC S21
51-85026-A

CY7C185
© Cypress Semiconductor Corporation, 1998. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nordoes it conveyor imply any license underpatent or other rights. CypressSemiconductor does notauthorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
Package Diagrams (continued)
28-Lead (300-Mil) Molded SOJ V21
51-85031-B