Service Manual
 
2
Table of Contents 
CHAPTER 1- PRECAUTIONS & SAFETY NOTICES..................................................................................................................... 3 
1. SAFETYPRECAUTIONS .................................................................................................................................................... 3 
2. PRODUCTSAFETYNOTICE.............................................................................................................................................. 3 
3. SERVICE NOTES.................................................................................................................................................................. 3 
CHAPTER 2- SERVICE TOOLS & EQUIPMENT REQUIRED ..................................................................................................... 4 
CHAPTER 3- CIRCUIT THEORY ...................................................................................................................................................... 5 
1. BLOCK DIAGRAM ................................................................................................................................................................... 5 
2. ELECTRONIC CIRCUIT THEORY ............................................................................................................................................... 7 
3. FACTORY PRESETTIMING TABLE................................................................................................................................ 13 
4. POWER ON/OFF SEQUENCY .................................................................................................................................................. 13 
5. D-SUB CONNECTOR PIN ASSIGNMENT................................................................................................................................. 14 
6. AC OUTLET PIN ASSIGNMENT .............................................................................................................................................. 14 
7. INNER CONNECTOR PIN ASSIGNMENT................................................................................................................................... 14 
8. KEY PARTS PIN ASSIGNMENTS.............................................................................................................................................. 16 
CHAPTER 4- DISASSEMBLY &ASSEMBLY................................................................................................................................. 21 
1. EXPLODED DIAGRAM ........................................................................................................................................................... 21 
2. E2009W DISASSEMBLY BLOCK ............................................................................................................................................ 22 
3. ASSEMBLY BLOCK................................................................................................................................................................ 23 
CHAPTER 5- TESTAND ADJUSTMENT........................................................................................................................................ 24 
1. FUNCTION KEY DEFINITIONS ................................................................................................................................................ 24 
2. OSD CONTROL..................................................................................................................................................................... 24 
3. FACTORY MODE INTRODUCTION........................................................................................................................................... 26 
4. BURN-IN PATTERN................................................................................................................................................................. 27 
5. AUTO COLOR BALANCE (AUTOMATICALLY CALIBRATE CHIPADC PARAMETER BY USING CHIP INTERNAL DAC.)................ 27 
6. UPLOAD FIRMWARE TO MCU VIA VGACABLE .................................................................................................................... 27 
7. AFTER REPAIR,TO ENSURE THE QUALITY YOU SHOULD DO THE FOLLOWING TEST AND ADJUSTMENT.................................... 27 
CHAPTER 6- TROUBLE SHOOTING.............................................................................................................................................. 30 
1. COMMON ACKNOWLEDGE .................................................................................................................................................... 30 
2. NO POWER LED OFF............................................................................................................................................................ 30 
3. POWER NORMAL LEDAMBER .............................................................................................................................................. 31 
4. BACKLIGHT CAN’T BE TURNED ON........................................................................................................................................ 33 
5. NO PICTURE BACKLIGHT ON............................................................................................................................................... 34 
6. AT 32-GRAY SCALE PATTERN,COLOR LOST IN SOME SCALE ................................................................................................... 35 
CHAPTER 7- RECOMMENDED PART LIST ................................................................................................................................. 35 
ATTACHMENT 1- BILLOF MATERIAL......................................................................................................................................... 37 
ATTACHMENT 2- SCHEMATIC....................................................................................................................................................... 47 
ATTACHMENT 3- PCB LAYOUT..................................................................................................................................................... 60