DMC TSC-10/IC User manual

Analog Resistive Touch Screen Controller
TSC-10/IC product specification

1 Version 4.2 ©2001 - 2005 DMC Co., Ltd.
TSC-10/IC Product S
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Table of Contents
1. PRODUCTS OUTLINE.......................................................................................................................... 2
1-1. Scope of Application ..........................................................................................................................2
1-2. Outline................................................................................................................................................2
1-3. Features .............................................................................................................................................3
1-4. General specification..........................................................................................................................3
2. Pin layout and representation ................................................................................................................ 4
3. Pin functions.......................................................................................................................................... 5
4. Initial setting .......................................................................................................................................... 6
4-1. EEPROM setting ................................................................................................................................6
4-2. Communication mode setting.............................................................................................................6
4-3. Configuration in USB mode................................................................................................................7
4-4. Panel ID setting (USB mode) .............................................................................................................7
5. Data sheet............................................................................................................................................. 8
5-1. Absolute maximum rating...................................................................................................................8
5-2. Recommended operational conditions ...............................................................................................9
5-3. Timing requirement ..........................................................................................................................10
5-4. DC standards ...................................................................................................................................12
6. Packaging Specification....................................................................................................................... 13
6-1. Outline..............................................................................................................................................13
6-2. Notes on storage/handling ...............................................................................................................13
6-3. Basic packaging ...............................................................................................................................13
6-4. Small group packaging.....................................................................................................................14
6-5. Tray specification .............................................................................................................................15
6-6. Product name label specification......................................................................................................15
7. Storage Specification........................................................................................................................... 16
7-1. Storage Conditions...........................................................................................................................16
7-2. Baking ..............................................................................................................................................16
8. Implementation Temperature Specification .......................................................................................... 17
1. Reflow method (Infrared reflow, air reflow, VPS reflow) ......................................................................17
2. Wave soldering method (Flow soldering, solder dip method) ..............................................................17
3. Soldering iron (Manual soldering)........................................................................................................18
4. Reflow method (Infrared reflow, air reflow: When lead-free solder is used) ........................................18
5. Wave soldering method (Flow soldering, solder dip method when lead-free solder is used) ..............18
9. Changes and improvements ................................................................................................................ 19
9-1. Version history .................................................................................................................................19
10. Warranty............................................................................................................................................ 21
10-1. Warranty Period .............................................................................................................................21
10-2. Warranty Target .............................................................................................................................21
10-3. Warranty Exceptions ......................................................................................................................21
11. Notes on use ..................................................................................................................................... 22
11-1. Overall handling .............................................................................................................................22
11-2. Others ............................................................................................................................................22
Dimensional Drawing
Circuit Diagram
Part List

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1. PRODUCTS OUTLINE
1-1. Scope of Application
This specification applies to the TSC-10/IC (Lot Number: 351x * and subsequent lots).
* x = Any number
1-2. Outline
TSC-10/IC is an analog touch screen control IC that performs A/D conversion on analog signal for the
resistive analog touch screen, and transmits coordination data with 10bit resolution to the host in a
9600bps serial (asynchronous) and USB.
The serial communication enables a connection with PC’s serial port via RS-232C I/F circuit in addition to
TTL level.
At the coordinate detection, internal filtering process provides a stabilized coordinate value. By using the
correction function, in addition to the losses that occur in the circuit, display deflection between touch
screen input point that occur in each element and indicator cursor can be corrected to adjust the display
position.

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1-3. Features
§ Two coordinate output modes are provided and selected per application: “Coordinate data mode”
where coordinate information is sent with 10bit resolution as it is, and “correction data mode” where
read coordinate is converted to the indicator’s display coordinate and sent.
§ “Correction data mode“ is available after EEPROM is externally attached. It enables to set up to nine
correction points. Coordinate data can be corrected with the base of correction points. Using this
function allows the host driver to make the implementation of correction function unnecessary. In
addition, by placing correction points at the touch screen center and center points of four edges of
touch screen, resistance value deviation of transparent electrode film can be corrected.
§ USB has multi-touch screen function enable two simultaneous connections to the host.
§ Two external switch functions are always available in the coordinate (correction) data mode. Two
pieces of external switch information are, at the transmission of coordinate data, included in the
coordinate data as pen-down/pen-up information. Since in the pen-up mode, pen-up data can be
always output to the host, this switch is available as a function switch.
§ At the touch screen input, buzzer and LED outputs are available. Input confirmation via display and
sound is available.
§ In the serial communication, when no touch screen input is performed, the state moves to “power-save
mode“ so that such application can be supported that requests a low power consumption. In USB
mode, USB suspend is supported and restored by the external interrupt of touch screen input.
§ Seven types of coordinate output rates are provided and either can be selected per application among
seven types: six types from 30 to 150p/s plus one type, a point mode that outputs the coordinate only
one time when pen-down is performed.
1-4. General specification
Item Rating Notes
Power supply voltage DC 4.1V to 5.5V (Serial)
DC 4.4V to 5.25V (USB)
Power consumption 30mW (standard)
Asynchronous serial -20 ˚C to +85 ˚C
(No dew condensation)
Operating Temp USB 0 ˚C to +70 ˚C
(No dew condensation)
Temperature range at storing -20 ˚C to +85 ˚C
(No dew condensation)
Communication scheme Asynchronous, serial
Communication rate 9600bps
Data length 8bits
Stop bit 1bit
Communication
scheme (serial)
Parity None
Each setting is fixed
Transfer rate USB Specification1.1 Low Speed
Control transfer (command)
Communication
scheme (USB) Transfer mode Interrupt transfer (coordinate)
Operation frequency 6MHz Fixed to 6MHz
Coordinate output rate (point / second)
(1) Point mode
(2) 30p/s (3) 50p/s
(4) 80p/s (5) 100p/s
(6) 130p/s (7) 150p/s
Point Mode: Only when touch screen is
input, pen-down ID is sent once. After
input ends, no pen-up ID is sent.
Linearity error ±3 LSB
Input response time 10.5ms For coordinate data mode, 150p/s,
USB mode
Coordinate resolution 10bit (1024×1024) In the correction data function,
resolution follows the setting value
Dimension (mm) 9×9×1.7

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2. Pin layout and representation
Marking specification
TSC-10x Product number x: version number
xxx ROM number
#### Lot number
INDEX
SEL4/EEP-CS16
SEL3/EEP-CLK15
SEL2/EEP-DI14
LED113
P3012
VSS11
XOUT10
XIN9
17 USBVREFOUT 18 SYD 19 SYU 20 SXL 21 SXR 22 THO 23 THI 24 RxD1AN2
2AN3 3SEL1 4EEP-DO 5VREF 6RST 7CNVSS 8VCC
USB/RS 25
RxD/D- 26
TxD/D+ 27
SW1 28
SW0 29
BEEP 30
AN0 31
AN1 32
TSC-10x
xxx
####

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3. Pin functions
Pin
number Pin name I/O Functional description
1 AN2 I Touch screen XL input pin.
2 AN3 I Touch screen XR input pin.
3 SEL1 I Panel ID select pin: H = ID1, L = ID0
4 EEP-DO I EEPROM DO input pin; At using no EEPROM, Vcc or GND is connected.
5 VREF I A/D converter reference voltage input pin; Vcc is connected.
6 RST I Reset input pin (active L).
7 CNVSS I Operation mode control pin; Vss is connected.
8 VCC I Power supply input pin; Vcc is connected.
9 XIN I Clock input pin; When using external clock, clock is input to this pin.
10 XOUT O Clock output pin; When using external clock, this pin is opened.
11 VSS I Power supply input pin (GND); GND is connected.
12 P30 O Opened*1.
13 LED1 O LED output pin; ON = Lo, OFF = Hi.
14 SEL2/EEP-DI I/O EEPROM DI signal output pin *2; When using EEPROM, EEPROM DI is connected.
15 SEL3/EEP-CLK I/O EEPROM SK signal output pin *2; When using EEPROM, EEPROM SK is connected.
16 SEL4/EEP-CS I/O
EEPROM setting pin shared with EEPROM CS signal output pin.
EEPROM is set via resistance and Vcc or GND is connected. (L = Used, H = Not
used).
When using EEPROM, EEPROM CS is connected.
17 USBVREFOUT O USB reference voltage output pin; Via resistance (1.5kΩ), RxD/D- is connected.
18 SYD O Touch screen YD control pin.
19 SYU O Touch screen YU control pin.
20 SXL O Touch screen XL control pin.
21 SXR O Touch screen XR control pin.
22 THO O Touch screen control pin.
23 THI I Touch screen control pin.
24 RxD I
Touch screen control pin; In serial mode, RxD/D- is connected. In USB mode, Vcc is
connected.
25 USB/RS I Communication mode setting pin; H = USB, L = serial.
26 RxD/D- I/O Data send/receive pin; In serial mode, data receive pin; In USB mode, D- pin.
27 TxD/D+ I/O Data send/receive pin; In serial mode, data send pin; In USB mode, D+ pin.
28 SW1 I SW1 input pin *3; H = ON = 1, L = OFF = 0.
29 SW0 I SW0 input pin *3; H = ON = 1, L = OFF = 0.
30 BEEP O BEEP output pin; Hi output; Output frequency =2.5kHz, Output time =50ms.
31 AN0 I Touch screen YD input pin.
32 AN1 I Touch screen YU input pin.
*1: Always open. If connected with VCC, VSS, or other circuit, an error operation may occur.
*2: Whether or not EEPROM is used, connect with GND via resistance.
*3: If neither SW0 nor SW1 function is used, connect 28 and 29 pins to GND directly.

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USB/RS
VCC
L= Serial
H = USB
(TSC-10/IC)
SEL4/EEP-CS
VCC
L= Used
H= Not used
CS
(TSC-10/IC)
(EEPROM)
4. Initial setting
4-1. EEPROM setting
Depending on that calibration is performed in either TSC-10/IC or host, you can select whether EEPROM
is used or not to store the correction data. EEPROM selection can be set via pin number 16, where
hardware reset release enables the setting.
4-2. Communication mode setting
Communication mode setting for serial/USB is performed by setting pin number 25 to “H” or “L”. When
power supply is turned on, or hardware reset is released, pin number 25 is read to turn on in either USB/
serial mode.
No both communication schemes are used at a time. After the
hardware reset, if setting is performed with jumper switch, the
setting is enabled by power supply restart or hardware reset.

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SEL1
VCC
L = PID0
H = PID1
(TSC-10/IC)
4-3. Configuration in USB mode
§ Basic configuration
Item Specification
USB standard Specification Rev1.1 Low Speed
Power supply Bus power supply
Device class Vendor definition
Interrupt (coordinate)
transfer interval 10ms
End point buffer size EP0: 8byte EP1: 5byte (EP0: control transfer, EP1: interrupt transfer)
§ Connection with Host
Coordinate data, correction value or other various output data are all output to the host as a response
to IN token. Output coordinate in coordinate data mode and correction data mode is output in the
interrupt transfer, while other data is output to the host with control transfer.
4-4. Panel ID setting (USB mode)
If two touch screens to the same host are connected simultaneously, each TSC-10/IC to the host needs
panel ID setting. This function is enabled in the USB mode, by setting pin number 3 (SEL1) to “ H” or
“ L” . Setting is enabled when hardware is reset, where Device Descriptor’ s iProduct is set to “ 0” or
“ 1” and this value is identified by the host as panel ID.
SEL1 iProduct Panel ID
L 00h 0
H 01h 1
Host TSC-10/IC
End Point 0
IN/OUT
Control transfer
(Descriptor, Device Request (command))
Interrupt transfer
(Coordinate data) End Point 1
IN
Buffer
Buffer

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5. Data sheet
5-1. Absolute maximum rating
Ratin
g
Item Symbol
Minimum Maximum Unit Description
Power supply voltage VCC -0.3 7.0 V
Input voltage VI-0.3 VCC+0.3 V
Output voltage VO-0.3 VCC+0.3 V
Power consumption PD200 mW
Operation temperature TOPR -20 +85 ˚C
Storage temperature TSTG -40 +125 ˚C

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5-2. Recommended operational conditions
Rating
Item Symbol
Minimum Standard Maximum Unit Description
Power supply voltage VCC 4.1 5.0 5.5 V
Power supply voltage VSS 0 V
Analog reference voltage VREF 2.0 VCC V
“H” input voltage
(Pin number 1 - 4, 14 - 16,
23 - 29, 31, 32) VIH 0.8VCC VCC V
“H” input voltage
RST, XIN VIH 0.8VCC VCC V
“H” input voltage
D+, D- VIH 2.0 3.6 V
“L” input voltage
(Pin number 1 - 4, 14 - 16,
23 - 29, 31, 32) VIL 0 0.3VCC V
“L” input voltage
RST, CNVSS VIL 0 0.2VCC V
“L” input voltage
D+, D- VIL 0 0.8 V
“L” input voltage
XIN VIL 0 0.16VCC V
“H” output total peak current ΣIOH (peak) -80 mA
“L” output total peak current
(Pin number 18 - 22, 26, 27, 30) ΣIOL (peak) 80 mA
“L” output total peak current
(Pin number 13 - 16) ΣIOL (peak) 60 mA
“H” output total average current ΣIOH (avg) -40 mA
“L” output total average current
(Pin number 18 - 22, 26, 27, 30) ΣIOL (avg) 40 mA
“L” output total average current
(pin number 13 - 16) ΣIOL (avg) 30 mA
“H” output peak current IOH (peak) -10 mA
“L” output peak current
(Pin number 18 - 22, 26, 27, 30) IOH (peak) 10 mA
“L” output peak current
(Pin number 13 - 16) IOH (peak) 30 mA
“H” output average current IOH (avg) -5 mA
“L” output average current
(Pin number 18 - 22, 26, 27, 30) IOL (avg) 5 mA
“L” output average current
(Pin number 13 - 16) IOL (avg) 15 mA
Vibration frequency XIN 6.0 MHz
6MHz ±0.4%
* Output total current refers to the sum of electric current for all relevant ports. Total average current is an
average value within 100ms, while the total peak current refers to the peak value of total sum.
* Output peak current specifies the peak value of current per port.
* Output average current IOL (avg) and IOH (avg) refer to the average value within 100ms.
* Vibration frequency has the duty of 50%.

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5-3. Timing requirement
§ Reset
(VCC = 4.1 to 5V , VSS = 0V , Ta = -20 to 85°C)
Ratin
g
Item Symbol
Minimum Maximum Unit Description
RST L width tw 15 µs
§ Power-on reset
Reset input voltage shall be 0.82V or below at the timing when power supply voltage crosses 4.1V.
(Ta = -20 to 85°C)
RST
0.2Vcc
0.8Vcc
0.2Vcc
0.8Vcc
t
w
≦0.2Vcc
4.1V
VCC
RST
(
PWR ON
)
Reset release voltage: Vcc = 4.1V

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§ External clock timing
Rating
Item Symbol
Minimum Maximum Unit Description
Input cycle tC166 ns Clock frequency: Fixed to 6MHz
Clock pulse width tWH, tWL 70 ns
§ Clock input circuit
X
IN
X
OUT
CIN
COUT
Using ceramic vibrator
X
IN
X
OUTO
p
en
External clock input circuit
X
IN 0.2VCC
t
WH
t
WL
0.8VCC
tC

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5-4. DC standards
Rating
Item Symbol Condition
Minimum Standard Maximum
Unit
IOH = -5mA
VCC = 4.1 to 5.5V VCC-1.5
Output “H” voltage *1
(Pin number 10, 12 - 22, 26, 27, 30) VOH IOH = -1.0mA
VCC = 4.1 to 5.5V VCC-1.0
V
Output “H” voltage *2
(Pin number. 26 (D-), 27 (D+)) VOH VCC = 4.4 to 5.25*4 2.8 3.6 V
IOL = 5mA
VCC = 4.1 to 5.5V 1.5
Output “L” voltage *1
(Pin number. 18 - 22, 26, 27, 30) VOL IOL = 1.5mA
VCC = 4.1 to 5.5V 0.3
V
Output “L” voltage *2
(Pin number. 26 (D-), 27 (D+)) VOL VCC = 4.4 to 5.25V*4 0.3 V
IOL = 15mA
VCC = 4.1 to 5.5V 2.0 V
Output “L” voltage
(Pin number. 12 - 16) VOL IOL = 1.5mA
VCC = 4.1 to 5.5V 0.3 V
hysteresis *2
(Pin number. 26 (D-), 27 (D+)) VT+ - VT- 0.15 V
hysteresis
(Pin number. 23 - 25) VT+ - VT- 0.4 V
hysteresis *3
(Pin number. 26, 28, 29) VT+ - VT- 0.5 V
hysteresis
(Pin number. 6) VT+ - VT- 0.5 V
Input “H” current
(Pin number. 1 - 4, 14 - 16,
23 - 29, 31, 32) IIH VI= VCC 5.0 µA
Input “H” current
(Pin number. 6) IIH VI= VCC 5.0 µA
Input “H” current
(Pin number. 9) IIH VI= VCC 4 µA
Input “L” current
(Pin number. 1 - 4, 14 - 16,
23 - 29, 31, 32) IIL VI= VSS -5.0 µA
Input “L” current
(Pin number. 6, 7) IIL VI= VSS -5.0 µA
Input “L” current
(Pin number. 9) IIL VI= VSS -4 µA
ICC1 At reading non-coordinate 8.1 mA
ICC2 At reading coordinate 9.1 mA
ICC3 STOP mode 10 uA
Power supply current
ICC4 At USB suspend
Vcc = 4.4V to 5.25V 300 uA
*1: Excluding 26 and 27 in USB mode
*2: USB mode only
*3: Excluding 26 in USB mode
*4: For both D+ and D-, pull-down is performed via 15kΩ±5% resistance. For D- , pull-up is performed with
USBVREFOUT via 1.5kΩ±5% resistance (Ta 0 to 70 degC).

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6. Packaging Specification
6-1. Outline
With a basic packaging unit of 720, TSC-10/IC is packaged for the number of 720 and its multiple using
damp-proof aluminum laminate bags (Basic packaging). If the delivery quantity is less than 720 or not
multiple of 720, or the product can not be packaged with a unit of 720, then no damp-proof packaging
specification is applicable (Small group packaging).
If packaged with small group packaging, the products may be dampened. Before packaging, the product
shall take the baking process as specified in [Baking] defined in “TSC-10/IC Storage/Implementation
Specification”.
6-2. Notes on storage/handling
(1) Handle the packages with care and avoid throwing and dropping them. Or, a large impact may be
imposed, causing packaging material’s damage, broken package or bending lead.
(2) Cardboard box may be deteriorated in its strength and deformed due to storage site’s humidity,
stacking condition and storage duration. It is desirable to keep the storage under normal
temperature/humidity (5 to 35 °C, 45 to 75%RH). For warehousing, follow the FIFO principle.
(3) After unpacking, be careful in handling the product to avoid electrostatic breakdown.
6-3. Basic packaging
6-3-1. Packaging type
Damp-proof packaging (Aluminum laminate bag)
6-3-2. Packaging quantity specification
Nominal size Quantity per tray Number of trays Quantity per packages
7×7 144 5 720
Desiccant Tray
Humidity indicator
Packaging label
A
luminum laminate bag
Packaging box
Packaging label
Product name label
Product name
label

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6-3-3. Diagram for packaging box sizes
6-4. Small group packaging
6-4-1. Packaging type
General packaging (No damp-proof processing)
6-4-2. Packaging quantity specification
Nominal size Quantity per tray Number of trays Quantity per packages
7×7 144 1 - 5 1 - 719
Desiccant Number of trays: 1 to 5
(Additionally, one dummy tray pl
aced at the top for reinforcing)
A
ir cap
Product name label
A
ntistatic bag
L: 302 W: 158 D: 32 (mm)
* No sizes specified for packaging box (Cardboard
box) used for transportation.

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6-5. Tray specification
This tray is heat-proof type, allowing the heating with 125 °C for 24 hours. During heating/cooling process,
however, bending may occur. In baking process, to minimize the bending, heat and cool the tray by placing
it on a flat plate.
Pocket pitch size (mm) Number of pockets Thickness (mm)
eWeLNWNLH
Upper temperature limit
16.8 15.5 8 18 5.6 125 °C MAX
6-6. Product name label specification
DMC P/N: Product number (TSC-10/IC)
QTY: Quantity
DAC: DMC Control Number
2
W-ew(Nw-1)
Zw= 2
L-eL(NL-1)
ZL=
INDEX
Pin No.1
Material: PP Compound

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7. Storage Specification
7-1. Storage Conditions
For storing the product until its implementation, it is recommended that the following storage conditions are
applied:
1. Before unpacking the damp-proof package (Aluminum laminate bag)
Temperature and humidity: 5 to 40 °C, 20 - 80%RH
Duration: Two years or less
2. After unpacking the damp-proof package (Aluminum laminate bag)
For the storing duration after the damp-proof package is unpacked and before the implementation, it is
recommended that the following storage conditions is to be applied:
(1) Reflow method: One week or less under the ambient condition: 30 °C, 70%RH or less
(2) Wave soldering method: One week or less under the ambient condition: 30 °C, 70%RH or less
3. Temporary storage after damp-proof package is unpacked
To store again temporarily the once unpacked and unused damp-proof package, it is recommended to
pack it again into another damp-proof bag with desiccant within a shorter time after opened (Around 10
minutes) as far as possible, and fold the bag’s opening, followed by sealing with adhesive material
such as adhesive tape, then store it under the following conditions:
Temperature, humidity: 5 to 40 °C, 20 - 80%RH
Duration: One month or less
7-2. Baking
If any condition among those 1 to 3 listed below is applicable, it is recommended to apply the baking as
described below to dry the moisture the package absorbs.
You may place the tray used for damp-proof packaging directly into the thermostatic chamber since the
tray is heat-proof type. When placing into the chamber or after removing from it, to avoid deformation, cool
the tray by placing it on the flat plate such as surface table.
1. Any condition among 1 to 3 in [7-1. Storage condition] is unsatisfied
2. Indicator’s 30% Humidity Check section changes the color to lavender or pink
3. Blue color indicator of desiccant (Silica gel) changes to pink or white
Baking method
Temperature: 125 °C
Duration: 20 to 24 hours
Frequency: Four times or less (Upper limit: 96 accumulative hours)

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90
±
30s
150±10 °C
1 to 4 °C/s
200 °C or higher, 30s max.
235 °C or higher, 10s max.
240 °C max.
Time
Package’s surface temperature
80 to 150 °C (Package surface temperature)
260 °C max.
10s max. (Primary + Secondary flow
passage duration)
Time
Temperature
90±30s
150±10 °C
200 °C or higher, 30s max.
215 °C max.
20s max.
Time
Package’s surface temperature
1 to 4 °C/s
8. Implementation Temperature Specification
1. Reflow method (Infrared reflow, air reflow, VPS reflow)
Frequency: Three times or less
Temperature: Device surface temperature profile shown below is recommended.
2. Wave soldering method (Flow soldering, solder dip method)
Frequency: One time or less
Temperature: Following temperature profile is recommended (Set the optimal preheat temperature
according to the flux type)
Figure 2: VPS reflow temperature profile
Figure 1: Infrared reflow, air reflow temperature profile

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110
±
20s
175±10 °C
1 to 4 °C/s
220 °C or higher, 50s max.
255 °C or higher, 10s max.
260 °C max.
Time
Package’s surface temperature
200 °C or higher, 70s max.
3. Soldering iron (Manual soldering)
Solder under the following condition using the soldering iron for semiconductor device.
Soldering bit’s temperature: 350 °C or lower
Soldering time: Three seconds or less/terminal
Using lead-free solder.
Soldering bit’s temperature: 370 °C or lower
Soldering time: Five seconds or less/terminal
4. Reflow method (Infrared reflow, air reflow: When lead-free solder is used)
Frequency: Three times or less
Temperature: The following device surface temperature profile is recommended.
Figure 3: Infrared reflow, air reflow temperature profile
5. Wave soldering method (Flow soldering, solder dip method when lead-free solder
is used)
Follow “2. Web soldering method (Flow soldering, solder dip method)”.

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9. Changes and improvements
9-1. Version history
§ TSC-10/IC
VER1.0 (October 11, 2001)
Initial release
VER2.0 (December 2, 2001)
RS-232C I/F circuit diagram: R25, 26, 28 5.1kΩ→2.2kΩ(changed)
RS I/F circuit: Recommended Parts Table R25, 26, 28 5.1kΩ→2.2kΩ(changed)
USB I/F circuit diagram R25, 26, 28 5.1kΩ→2.2kΩ(changed)
USB I/F circuit: Recommended Parts Table R25, 26, 28 5.1kΩ→2.2kΩ(changed)
VER2.1 (July 16, 2002)
RS-232C I/F circuit: Recommended Parts Table R21, 23, 25, 26, 28, product number’s error was
corrected.
USB I/F circuit: Recommended Parts Table R21, 23 product number’s error was corrected.
Change of address described.
VER2.2 (August 1, 2003)
5-10 Command list: “Wait after issuing command”: Added.
5-4. Each flow of correction data setup mode: Waiting time was added.
5-2. To initialization mode and idle mode, reset command description was added.
3. Description about pin function’s *3 pin number was corrected and part of description was added.
RS I/F circuit: Recommended Parts Table C1, 11, 12 U2, product number’s error was corrected.
RS I/F circuit: Recommended Parts Table X1 product number was changed.
USB I/F circuit: Recommended Parts Table C1, 12, U2, product number was corrected.
USB I/F circuit: Recommended Parts Table X1, product number was changed.
VER3.0 (December 9, 2003)
1-1. Scope of application, product name display was added.
1-4. General specification “communication scheme (USB) transfer rate” was changed from “USB
Specification1.0 Low Speed” to “USB Specification1.1 Low Speed”.
1-4. General specification “Operation temperature range”: Operation temperature in USB mode was
clarified (conforming to USB Specification).
4-3. “USB standard in each USB mode configuration” was changed from “Specification Rev1.0 Low
Speed” to “Specification Rev1.1 Low Speed”.
VER3.1 (February 1, 2004)
1-1. Scope of application: Error was corrected.
2. Pin layout and representation: Title was changed and representation was added.
VER3.2 (August 9, 2004)
USB I/F circuit: The USB I/F Pin number is changed.