Ebyte E22-900M30S User manual

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EBYTE
E22-900M30S User Manual
SX1262 868/915MHz 1W SPI LoRa Module
Chengdu Ebyte Electronic Technology Co.,Ltd.

ene Chengdu Ebyte Electronic Technology Co, Ltd. E22-900M30S User manual
Contents
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4.2 SoTtWare PrOZIAMIMING........c..coii iirc seers sess seers eee ees en seen er eee 8
5 FAQ eee eee eee eee eee eee eee eee eee eee eee eee eee 8
5.1 Communication range iS 100 SNOTE..........ciiiiiiiiiiii ieee eee eres 8
5.2 Module iS €aSY 10 dAMAZE.........coimiiieiiiii ieee eee eee eee eee eens 8
5.3 HAH DIE @ITOT TALE... vce eects eee eee eee eee essere eects seen eee eres 9
6. Welding OPEration GUIAAIICE. ........c.c.viuiiiit ities teeter beseech eee b betes steht obese bees eb tates eb estab et sensei 9
6.1 Reflow Soldering TemMPEratUire. ............ciiiiiiiiiic ieee eerie eee seers eens 9
6.2 RefloOW SOIAEIING CUTIVE .......oiviiiciiie ieee seers seers eee ene 10
T. RELATE MOE... eee ete ebb ee hte h eee hee ebb et eee eee nee eee 10
8. BatCh PACKAGING. .......oiviiiei cece eee ene 11
REVISION MISTOTY erected eee eee teases seers se eases ene s en e eae as 11
AADOUE TS. hte h ete heh ee eH eh £4 ehhh Ee hehe et hehe ehhh hte sehen tee 11
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ene Chengdu Ebyte Electronic Technology Co, Ltd. E22-900M30S User manual
Disclaimer
EBYTE reserves all rights to this document and the information contained herein.
Products, names, logos and designs described herein may in whole or in part be
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including but not limited, with respect to the accuracy, correctness, reliability and
fitness for a particular purpose of the information. This document may be revised by
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I Chengdu Ebyte Electronic Technology Co, Ltd. E22-900M30S User manual
1. Overview
1.1 Introduction
The E22-900M30S is based on the SX1262, a new generation of
LoRa™ RF chip manufactured by Semtech, USA. It is an ultra-small
and self-developed 868MHz. 915MHz SMD LoRa™ wireless module.
E E22 soomzo0s COM
Because it adopted the original SX1262 as main core, the PA and -
LNA is built-in also based on the previous one, which makes the
SN: 18062500001
@
maximum transmission power to 1'W, at the same time, the receive v
sensitivity is also further improved. The overall communication stability
is greatly improved compared to the products without power amplifiers and low noise amplifiers. The anti-interference
performance and communication distance have been further improved compared to the previous generation LoRa™
transceiver, and far superior to the current FSK and GFSK modulation products. This products obtained FCC, CE and
RoHS certification already so users do not need to worry about the performance. Adopted industrial grade high precision
32MHz crystal, the product can cover an ultra-wide frequency range of 850~930MHz and is backward compatible with
SX1278 and SX1276.
Since the module is a RF transceiver module only, users need to use the MCU driver or use a dedicated SPI debug tool.
1.2 Features
Communication distance tested is up to 12km ;
Maximum transmission power of 1W, software multi-level adjustable ;
Support the global license-free ISM 868/915MHz band ;
Support air date rate of 0.018-62.5kbps in the LoRa™ mode ;
Support 300kpbs in the FSK mode;
Compatible with the transceiver of SX1278/SX1276;
With large capacity, FIFO supports 256Byte data cache;
New SF5 spreading factor to support dense networks;
Support 2.5V~5.5V power supply, more than 5.0V power supply can guarantee the best performance;
Industrial grade standard design, support -40 ~ 85 °C for working over a long time ;
IPEX and stamp hole are optional, which is convenient for secondary development and integration.
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ene Chengdu Ebyte Electronic Technology Co, Ltd. E22-900M30S User manual
1.3 Application
Home security alarm and remote keyless entry ;
Smart home and industrial sensors |
Wireless alarm security system ;
Building automation solutions ;
Wireless industrial-grade remote control ;
Health care products ;
Advanced Meter Reading Architecture(AMI) ;
Automotive industry applications.
2. Specification and parameter
2.1 Limit parameter
Performance
Main parameter Remark
Min. Max.
Voltage over 5.5V will cause permanent
Power supply (V) 0 5.5
damage to module
Chances of burn is slim when modules
Blocking power (dBm> - 10 } }
are used in short distance
Operating temperature (°C) -40 85
2.2 Operating parameter
. Performance
Main parameter Remark
Min. Typ. Max.
Operating voltage (V) 2.5 5.0 5.5 It’s recommended to use 5.0V
For 5V TTL, It is recommended to add level
Communication level (V) 33 }
conversion
Operating temperature (°C) -40 - 85 Industrial design
Operating frequency (MHz) 850 868/915 930 Support ISM band
TX current (mA) 650 Instant power consumption
Power
} RX current (mA> 14
consumption
Sleep current (pA) 3 Software 1s shut down
Max Tx power (dBm) 29.5 30.0 31
Receiving sensitivity (dBm) -149 -150 -151 Air data rate 1s 0.3kbps
0.6k - 300k Controlled via user's programming
Air data rate (bps)
0.018k 62.5k Controlled via user's programming
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ene Chengdu Ebyte Electronic Technology Co, Ltd. E22-900M30S User manual
Main parameter Description Remark
Test condition : clear and open area, antenna gain: 5dBi, antenna
Distance for reference 12000m height 2.5m. air data rate: 0.3kbps
FIFO 256Byte Maximum length of single transmission
Crystal frequency 32MHz
Modulation LoRa(recommended)
Package SMD
Connector 2.54mm Stamp hole
Communication interface SPI 0-10Mbps
Size 38.5% 24*3.6 mm
Antenna IPEX/TPEX 50 ohm impedance
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ene Chengdu Ebyte Electronic Technology Co, Ltd. E22-900M30S User manual
3. Size and pin definition
240x0.1mm 3.87+0.1mm
| 2.61
12 1 [] 1" 12
u 2.54
13 10 [| 10 13
14 0 | 9 14
15 8 | 8 15 “150
16 7 | 7 16
17 5 | s 17
£ 18 5 1 5 18
= 19 4 4 1] C—
+ B
in
ES
7.60
20 3 1 3 20[ C—
u 2.54
21 2 | 2 af C—
22 1 | 1 nl C(—
IPX
I
5.46
Top pad: 0.50 Bottom pad: =
0.80 J] [1.50 080T" J] [150
Pad quantity : 22
Unit: mm
No. Name Direction Function
1 GND Ground wire, connected to the power reference ground
2 GND Ground wire, connected to the power reference ground
3 GND Ground wire, connected to the power reference ground
4 GND Ground wire, connected to the power reference ground
5 GND Ground wire, connected to the power reference ground
RF switch receiving control pin, connected to external microcontroller 10,
6 RXEN Input
valid in high level
RF switch transmitting control pin, connected to external microcontroller IO
7 TXEN Input
or DIO2, valid in high level
8 DIO2 Input/Output Configurable universal 10 port (see SX1262 manual for details)
0 vee Power supply, 2.5~5.5V(t is recommended to add external ceramic filter
capacitor)
10 VCC Power supply, 2.5~5.5V(t is recommended to add external ceramic filter
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ene Chengdu Ebyte Electronic Technology Co, Ltd. E22-900M30S User manual
capacitor)
11 GND Ground wire, connected to the power reference ground
12 GND Ground wire, connected to the power reference ground
13 DIOL Input/Output Configurable universal 10 port (see SX1262 manual for details)
14 BUSY Output For status indication (see SX1262 manual for details)
15 NRST Input Chip reset trigger input pin, valid in low level
16 MISO Output SPI data output pin
17 MOSI Input SPI data output pin
18 SCK Input SPI data output pin
19 NSS Input Module chip select pin for starting an SPI communication
20 GND Ground wire, connected to the power reference ground
21 ANT Antenna interface, stamp hole (50 ohm characteristic impedance)
22 GND Ground wire, connected to the power reference ground
4. Basic Operation
4.1 Hardware Design
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I Chengdu Ebyte Electronic Technology Co, Ltd. E22-900M30S User manual
VCC
TT —_— =
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SN Brief Connection between Module and Single Chip Microcomputer
1 The I00. 101. 102, 103 in MCU means the 10 port of MCU.
DIOI1. DIO2 is the normal IO port, which can be configured to multiple function. The DIO2 can
2 connect with TXEN, but not with the IO port of MCU. It’s used to control RF switch, see more details
in SX1262 datasheet. Also It can be floated when not in use.
3 The DIO3 is powered by a 32MHz TCXO crystal.
4 Ensure the good grounding, large area of paving, small the power supply ripple, the filter capacitor
should be increased and as close as possible to the VCC and GND pins of module.
5 It is recommended to add 200R protection resistor to RXD/TXD of external MCU.
Note:
It is recommended to use DC stabilized power supply to supply power to the module. The power supply ripple
coefficient is as small as possible, and the module needs to be reliably grounded.
Please pay attention to the correct connection of the positive and negative poles of the power supply. If the reverse
connection is connected, the module may be permanently damaged.
Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum,
the module will be permanently damaged.
Please check the stability of the power supply, the voltage can not be significantly frequent.
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, and the whole machine is beneficial for long-term stable operation.
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference.
High-frequency digital traces, high-frequency analog traces, and power traces must be avoided under the module. If
it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is
spread on the Top Layer of the module contact part(All copper-covered and well grounded), and must be close to
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ene Chengdu Ebyte Electronic Technology Co, Ltd. E22-900M30S User manual
the digital part of the module and routed in the Bottom Layer.
Assuming the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer or
other layers, which will affect the module's spurs and receiving sensitivity to varying degrees.
Assume that there are traces with large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power trace), which will greatly affect the performance of the module. It is recommended to
stay away from the module according to the strength of the interference. If necessary, appropriate isolation and
shielding can be done;
If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is
still a risk of damage).
Try to stay away from some physical layers and also have a 2.4GHz TTL protocol, for example: USB3.0
The antenna mounting structure has a great influence on the performance of the module. It is necessary to ensure
that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good
antenna extension cable to extend the antenna to the outside of the case.
The antenna must not be installed inside the metal case, which will greatly reduce the transmission distance.
Itis recommended to add a 200R protection resistor to the RXD/TXD of the external MCU.
4.2 Software Programming
S.
This module 1s SX1268/SX1262+PA+LNA. Its driving mode is exactly the same as SX1268/SX1262. Users can
operate according to SX1268/SX1262 chip datasheet.
DIO1 and DIO2 are general-purpose IO ports, which can be configured into multiple functions. DIO2 can be
connected to TXEN and not connected to the MCU's 10 port. It can be used to control the RF switch transmission.
If not used, you can hang it. For details, see the SX1262 manual.
DIO 3 is used to supply 32 MHz TCXO crystal oscillator.
FAQ
5.1 Communication range is too short
The communication distance will be affected when obstacle exists.
Data lose rate will be affected by temperature, humidity and co-channel interference.
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
The signal will be affected when the antenna is near metal object or put in a metal case.
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance).
When the power supply at room temperature is lower than the recommended low voltage, the lower the voltage is,
the lower the transmitting power is.
Due to antenna quality or poor matching between antenna and module.
5.2 Module is easy to damage
Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will
lead to a permanent damage to the module.
Please check the stability of power supply and ensure the voltage not to fluctuate too much.
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ene Chengdu Ebyte Electronic Technology Co, Ltd. E22-900M30S User manual
® Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic
susceptibility.
® Please ensure the humidity is within limited range for some parts are sensitive to humidity.
® Please avoid using modules under too high or too low temperature.
5.3 High bit error rate
® There are co-channel signal interference nearby, keep away from interference sources or modify frequency, channel
to avoid interference.
® The clock waveform on the SPI is not standard. Check whether there is interference on the SPI line. The SPI bus
line should not be too long.
® Unsatisfactory power supply may also cause garbled characters, and ensure the reliability of the power supply.
® Ifthe extension cable or feeder is of poor quality or too long, the bit error rate will be high.
6. Welding operation guidance
6.1 Reflow Soldering Temperature
Profile Feature Curve feature Sn-Pb Assembly Pb-Free Assembly
Solder Paste Solder paste Sn63/Pb37 S1n96.5/Ag3/Cu0.5
) ) Minimum preheating
Preheat Temperature min (Tsmin) 100C° 150C°
temperature
Maximum preheating
Preheat temperature max (Tsmax) 150¢C° 200¢°
temperature
Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) Average rising rate
3C°/second max 3C°/second max
Liquidous Temperature (TL) Liquid phase temperature 183C° 217¢C°
Time (tL) Maintained Above (TL) Time above liquidus 60-90 sec 30-90 sec
Peak temperature (Tp) Peak temperature 220-235C° 230-250C°
Aveage ramp-down rate (Tp to Tsmax) Average descent rate
6C°/second max 6C°/second max
Time 25°C to peak temperature
Time of 25 © C to peak
temperature
6 minutes max 8 minutes max
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ere Chengdu Ebyte Electronic Technology Co, Ltd. E22-900M30S User manual
6.2 Reflow Soldering Curve
Tp freemen enn ny
I— Critical Zone
al Tuto Tp
l To [roms erm maa
Q TS max
=
J | ——
@®
h
2 TSmin
SN A >
2 CP ———
Preheat
Ramp-down
25
t 25°C to Peak |
Time —
7. Related Model
X Frequency Transmit | Test distance : Size Communication
Model Chip Packaging
Hz power dBm km mm Interface
E£22-900T228 S$X1262 868M 915M 22 7 SMD 16%26 UART
E£22-230T228 S$X1262 230M 22 7 SMD 16%26 UART
E22-400T228 S$X1268 433M 470M 22 7 SMD 16%26 UART
E£22-400M30S S$X1268 433M 470M 30 12 SMD 24%*38.5 SPI
E£22-900M30S S$X1262 868M 915M 30 12 SMD 24%*38.5 SPI
E22-900M22S S$X1262 868M 915M 22 6.5 SMD 14%20 SPI
£22-400M22S8 S$X1268 433M 470M 22 6.5 SMD 14%20 SPI
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I Chengdu Ebyte Electronic Technology Co, Ltd. E22-900M30S User manual
8. Batch packaging
y
4
[330£0.2
57.0+0.1 60.0£0.1
7
¥
Y
i
4
4140.1
41.3
|56.0
- d
he
,
320
2538
Each
Tray:
400
pcs
Revision
history
Version
Date
Description
Issued
by
1.0
2018-9-18
Original
version
huaa
1.1
2019-2-17
Content
added
Ray
1.2
2019-04-03
Model
No.
split
Ray
13
2020-09-09
Content
change
Switch
14
2020-11-26
Error
correction
Linson
About
us
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ddress: Innovation Center B333~D347, 4# XI-XIN road,High-tech district (west), Chengdu, Sichuan, China
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EBvYTE ChengduEbyte Electronic Technology Co.,Ltd.
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