Ebyte E73-2G4M08S1EX User manual

Chengdu Ebyte Electronic Technology Co.,Ltd. E73-2G4M08S1EX User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
0
E73-2G4M08S1EX
nRF52833 2.4GHz BLE5.1/Bluetooth Mesh/802.15.4/Thread/Zigbee
BLE Module

Chengdu Ebyte Electronic Technology Co.,Ltd. E73-2G4M08S1EX User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
1
Contents
Disclaimer...............................................................................................................................................................................2
Features...........................................................................................................................................................................3
1 Introduction..........................................................................................................................................................................4
1.1 Brief Introduction..................................................................................................................................................... 4
1.2 Application................................................................................................................................................................4
2 Specification and parameter................................................................................................................................................ 5
2.1 Limit parameter........................................................................................................................................................ 5
2.2 Operating parameter................................................................................................................................................. 5
3 Size and pin definition......................................................................................................................................................... 6
4 Development and Application............................................................................................................................................. 9
5 Basic operation.................................................................................................................................................................. 10
5.1 Hardware design and circuit schematic diagram....................................................................................................10
6 FAQ....................................................................................................................................................................................11
6.1 Communication range is too short..........................................................................................................................11
6.2 Module is easy to damage...................................................................................................................................... 11
6.3 BER(Bit Error Rate) is high................................................................................................................................... 12
7 Production guidance.......................................................................................................................................................... 13
7.1 Reflow soldering temperature................................................................................................................................ 13
7.2 Reflow soldering curve...........................................................................................................................................13
8 E73 series...........................................................................................................................................................................14
9 Bulk packing......................................................................................................................................................................14
Revision history....................................................................................................................................................................15
About us................................................................................................................................................................................15

Chengdu Ebyte Electronic Technology Co.,Ltd. E73-2G4M08S1EX User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
2
Disclaimer
The information in this document, including the URL address for reference, is
subject to change without notice. The document is provided "as is" without any
guarantee responsibility, including any guarantee for marketability, suitability for a
specific purpose, or non-infringement, and any guarantee for any proposal,
specification or sample mentioned elsewhere. This document does not bear any
responsibility, including the responsibility for infringement of any patent rights caused
by the use of the information in this document. This document does not grant any
license for the use of intellectual property rights in estoppel or other ways, whether
express or implied.
The test data obtained in the article are all obtained by the Ebyte laboratory, and
the actual results may vary slightly.
We hereby declared that all brand names, trademarks and registered trademarks
mentioned in this document are the property of their respective owners.
The final interpretation right belongs to Chengdu Ebyte Electronic Technology
Co., Ltd.
Notice :
Due to product version upgrades or other reasons, the contents of this manual may be changed. Ebyte
Electronic Technology Co., Ltd. reserves the right to modify the contents of this manual without any
hint or noticet. This manual is only used as a guide. Chengdu Ebyte Electronic Technology Co., Ltd.
makes every effort to provide accurate information in this manual. However, we does not guarantee
that the contents of the manual are completely free of errors. All statements, information and
suggestions in this manual do not constitute any express or implied guarantee.

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Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd. 3
Features
13 x 18mm, small size;
Support Bluetooth 5.1, Bluetooth mesh, 802.15.4, Thread, Zigbee and proprietary 2.4 GHz protocols;
Maximum transmission power of 6mW, software multi-level adjustable;
Support the global license- free ISM 2.4GHz band;
Built-in high performance low power ARM⑧and Cortex⑧-M4 dual core processor;
Rich resources,512KB FLASH, 128KB RAM;
Support 1.7V~5.5V power supply, power supply over 3. 3Vcan guarantee the best performance;
Industrial grade standard design, support -40 ~ 85 °C for working over a long time;
With IPEX antenna interface, an external antenna is required;
Under ideal conditions, the communication distance can reach 120m.

Chengdu Ebyte Electronic Technology Co.,Ltd. E73-2G4M08S1EX User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd. 4
1 Introduction
1.1 Brief Introduction
E73-2G4M08S1EX are wireless Bluetooth modules designed by
Chengdu Ebyte which feature small size, low power consumption. It adopt
the originally imported RFIC nRF52833 of NORDIC, supporting
Bluetooth 5.1, Bluetooth mesh, 802.15.4, Thread, Zigbee and proprietary
2.4 GHz protocols. The chip comes with a high-performance ARM
CORTEX-M4 core, taking use of a 32M industrial-grade crystal oscillator,
and has abundant peripheral resources such as UART, I2C, SPI, ADC,
DMA, and PWM. The module led out most IO Port of nRF52833 for
multilateral development. Please see the pin definition for details.
E73-2G4M08S1EX is hardware platform without firmware, so users
need to conduct a secondary development.The characteristics of the nRF52833 chip can be found in the official
Datasheet. The module has maximized the RF characteristics of the chip.
1.2 Application
Smart homes and industrial sensors;
Security system, positioning system;
Wireless remote control, drone;
Wireless game remote control;
Health care products;
Wireless voice, wireless headset;
Automotive industry applications.

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2 Specification and parameter
2.1 Limit parameter
Main parameter
Performance
Remark
Min
Max
Power supply（V）
0
5.5
Voltage over 5.5V will cause
permanent damage to module
Blocking power（dBm）
-
10
Chances of burn is slim when modules
are used in short distance
Operating temperature（℃）
-40
+85
Industrial
2.2 Operating parameter
Main parameter
Performance
Remark
Min
Type
Max
Operating voltage（V）
1.7
3.3
5.5
≥3.3 V ensures output power
Communication level（V）
3.3
For 5V TTL, it may be at risk of
burning down
Operating temperature（℃）
-40
-
+85
Industrial grade
Operating frequency（MHz）
2360
-
2500
Support ISM band
TX
current
（mA）
TX only run current
(DC/DC, 3 V) PRF = +8 dBm
17.05
mA
TX only run current
(DC/DC, 3 V) PRF = +4 dBm
12.68
mA
TX only run current
(DC/DC, 5 V, REG0 out = 3.3 V)PRF = 0 dBm
7.25
mA
TX only run current
(DC/DC, 3 V)PRF = 0 dBm
7.63
mA
TX only run current
(DC/DC, 3 V) PRF = +8 dBm
17.05
mA
RX
current
（mA）
RX only run current (DC/DC, 3 V)
1 Mbps / 1 Mbps BLE
7.71
mA
RX only run current (DC/DC, 3 V)
2 Mbps / 2 Mbps BLE
8.27
mA
TX power（dBm）
7
8
9
dBm
Receiving sensitivity（dBm）
-95dBm @ BLE 1Mbps
dBm

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Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd. 6
Main parameter
Description
Remark
Reference distance
120m
Test condition：clear and open area,antenna height: 2.5m，air data
rate: 1Mbps
Crystal Oscillator
32MHz/32.768KHz
32.768KHz crystal needs external connection
Protocol
BLE5.1/BT MESH
802.15.4, Thread, Zigbee and proprietary 2.4 GHz protocols
Package
SMD
-
Interface
1.27mm
Stamp hole
IC
nRF52833-QIAA/AQFN73
-
FLASH
512KB
-
RAM
128KB
-
Core
ARM® Cortex ® -M4
-
Size
13*18mm
-
Antenna
IPEX
50 ohm impedance
3 Size and pin definition

Chengdu Ebyte Electronic Technology Co.,Ltd. E73-2G4M08S1EX User Manual
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd. 7
Pin No.
Item
Corresponding,ch
ip pin item
Direction
Description
1
P1.11
P1.11
Common I/O
See details about nrf52833 datasheet on Nordic
website
2
P1.10
P1.10
Common I/O
Low frequency I0, standard drive
3
P0.03
P0.03/AIN1
Common I/O
Analog input 1, low frequency I/O, standard drive.
4
AI4
P0.28/AIN4
Common I/O
Analog input 4
5
GND
-
-
Single ground line , connect to the power reference
ground.
6
P1.13
P1.13
Common I/O
Low frequency I0, standard drive
7
AI0
P0.02/AIN0
Common I/O
Analog input 0, low frequency I/O, standard drive.
8
AI5
P0.29/AIN5
Common I/O
Analog input 5, low frequency I/O, standard drive.
9
AI7
P0.31/AIN7
Common I/O
Analog input 7, low frequency I/O, standard drive.
10
AI6
P0.30/AIN6
Common I/O
Analog input 6, low frequency I/O, standard drive.
11
XL1
P0.00/XL1
Common I/O
Connect to 32.768 kHz crystal
12
P0.26
P0.26
Common I/O
See details about nrf52833 datasheet on Nordic
website
13
XL2
P0.01/XL2
Common I/O
Connect to 32.768 kHz crystal
14
P0.06
P0.06
Common I/O
See details about nrf52833 datasheet on Nordic
website
15
AI3
P0.05/AIN3
Common I/O
Analog input 3
16
P0.08
P0.08
Common I/O
See details about nrf52833 datasheet on Nordic
website
17
P1.09
P1.09
Common I/O
See details about nrf52833 datasheet on Nordic
website
18
AI2
P0.04/AIN2
Common I/O
Analog input 2
19
VCC
-
-
Power supply
20
P12
P0.12
Common I/O
See details about nrf52833 datasheet on Nordic
website
21
GND
-
-
Ground line, connect to the power reference ground
22
P0.07
P0.07
Common I/O
See details about nrf52833 datasheet on Nordic
website
23
VDH
VDDH
-
High voltage power supply
24
GND
-
-
Ground line, connect to the power reference ground
25
DCH
DCCH
-
DC/DC converter output
26
RST
P0.18/RESET
Common I/O
QSPI/CSN/external reset
27
VBS
VBUS
-
USB power supply, 5W input, used to USB3.3V
voltage regulator
28
P15
P0.15
Common I/O
See details about nrf52833 datasheet on Nordic
website
29
D-
D-
-
USB D-
30
P17
P0.17
Common I/O
See details about nrf52833 datasheet on Nordic

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website
31
D+
D+
-
USB D+
32
P0.20
P0.20
Common I/O
See details about nrf52833 datasheet on Nordic
website
33
P0.13
P0.13
Common I/O
See details about nrf52833 datasheet on Nordic
website
34
P0.22
P0.22
Common I/O
QSPI
35
P0.24
P0.24
Common I/O
-
36
P1.00
P1.00
Common I/O
See details about nrf52833 datasheet on Nordic
website
37
SWD
SWDIO
-
Serial debug programming port clock
38
P1.02
P1.02
Common I/O
See details about nrf52833 datasheet on Nordic
website
39
SWC
SWDCLK
-
Serial debug programming port clock
40
P1.04
P1.04
Common I/O
Low frequency I/O, standard drive
41
NF1
P0.09/NFC1
Common I/O
NFC input
42
P1.06
P1.06
Common I/O
Low frequency I/O, standard drive
43
NF2
P0.10/NFC2
Common I/O
NFC input

Chengdu Ebyte Electronic Technology Co.,Ltd. E73-2G4M08S1EX User Manual
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9
4 Development and Application
No.
Item
Notes
1
Burn
Firmware
1.The module is embedded with ARM MCU. For program downloading, please use the J-LINK downloader.Any
other serial port or JTAG、ISP、ICP are unavailable to download.
2.The burn firmware needs to be completed in two parts. Since the protocol stack provided by NORDIC is not
loaded in the program, in the second development, you need to use the official burning tool nRFgo studio to burn
the protocol stack, and then use nRFgo studio to bum the hex of the application code; you can also use the official
burning tool nRF go studio to burn the protocol stack, and then download it with IAR or KEIL.
Website of tool download:
http://www.nordicsemi.com/eng/Products/Bluetooth-low-energy/nRF52832/(language)/eng-GB(网址是不是不
对)
2
Testing
Board
Testing board is not available at present.

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Copyright ©2012–2020，成都亿佰特电子科技有限公司
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5 Basic operation
5.1 Hardware design and circuit schematic diagram
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and
the module needs to be reliably grounded;
Please pay attention to the correct connection of the positive and negative poles of the power supply, reverse
connection may cause permanent damage to the module;
Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum,
the module will be permanently damaged;
Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently;
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation;
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference;
Bottom Layer；
Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided
under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer,
and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital

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Copyright ©2012–2020，成都亿佰特电子科技有限公司
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part of the module and routed in the Bottom Layer;
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer
or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;
Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,
power traces) around the module that will greatly affect the performance of the module. It is recommended to stay
away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding
can be done;
If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is
still a risk of damage);
Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;
The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure
that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good
antenna extension cable to extend the antenna to the outside;
The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
6 FAQ
6.1 Communication range is too short
The communication distance will be affected when obstacle exists;
Data lose rate will be affected by temperature, humidity and co-channel interference;
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground;
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea;
The signal will be affected when the antenna is near metal object or put in a metal case;
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance);
The power supply low voltage under room temperature is lower than recommended value, the lower the voltage, the
lower the transmitting power;
Due to antenna quality or poor matching between antenna and module.
6.2 Module is easy to damage
Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will
lead to a permanent damage to the module.
Please check the stability of power source, the voltage cannot fluctuate too much;
Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility;
Please ensure the humidity is within limited range, some parts are sensitive to humidity;
Please avoid using modules under too high or too low temperature.

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6.3 BER(Bit Error Rate) is high
There are co-channel signal interference nearby, please be away from interference sources or modify frequency and
channel to avoid interference;
The clock waveform on SPI is not standard, check whether there is interference on the SPI line, and the SPI bus line
should not be too long;
Poor power supply may cause messy code. Make sure that the power supply is reliable;
The extension line and feeder quality are poor or too long, so the bit error rate is high.

Chengdu Ebyte Electronic Technology Co.,Ltd. E73-2G4M08S1EX User Manual
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7 Production guidance
7.1 Reflow soldering temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Min preheating temp.
100℃
150℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temp.
183℃
217℃
Time（tL）Maintained Above（TL）
Time below liquid phase line
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temp.
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
Average ramp-down rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time to peak temperature for 25℃
6 minutes max
8 minutes max
7.2 Reflow soldering curve

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Copyright ©2012–2020，成都亿佰特电子科技有限公司
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8 E73 series
Model No.
IC
Frequency
Hz
Tx power
dBm
Protocol
BLE
Size
mm
Package
Antenna
E73-2G4M04S1A
nRF52810
2.4G
4
4.2/5.0
17.5*28.7
SMD
PCB/IPEX
E73-2G4M04S1B
nRF52832
2.4G
4
4.2/5.0
17.5*28.7
SMD
PCB/IPEX
E73-2G4M08S1C
nRF52840
2.4G
8
4.2/5.0
13*18
SMD
Ceramic
antenna
E73-2G4M04S1D
nRF51822
2.4G
4
4.2
17.5*28.7
SMD
PCB/IPEX
E73-2G4M04S1AX
nRF52810
2.4G
4
4.2/5.0
17.5*23.5
SMD
IPEX
E73-2G4M04S1BX
nRF52832
2.4G
4
4.2/5.0
17.5*23.5
SMD
IPEX
9 Bulk packing

Chengdu Ebyte Electronic Technology Co.,Ltd. E73-2G4M08S1EX User Manual
Copyright ©2012–2020，成都亿佰特电子科技有限公司
15
Revision history
Version
Date
Description
Issued by
1.0
2021-7-16
Initial version
Linson
About us
Sales hotline：[phone] Tel：[phone]
Technical support：[email protected] Website：www.ebyte.com/en
Address ：Building B5, Mould Industrial Park, 199# Xi-Qu Ave, West High-tech Zone, Chengdu,
611731, Sichuan, China