Embest SBC8600B User manual

SBC8600B
Single Board Computer
User Manual
SBC8600B-UM-V2.0
July 16, 2017

Embest Technology Co., Ltd i
Copyright © 2014 Embest Technology SBC8600B User Manual
Copyright Statement:
SBC8600B and its related intellectual property are owned by Shenzhen Embest
Technology Co., Ltd.
Shenzhen Embest Technology has the copyright of this document and reserves
all rights. Any part of the document should not be modified, distributed or
duplicated in any approach and form with the written permission issued by
Embest Technology Co., Ltd.
Microsoft, MS-DOS, Windows, Windows95, Windows98, Windows2000 and
Windows Embedded Compact 7 are trademarks of Microsoft Corporation.
Revision History:
Version
Date
Description
1.0
2012-12-21
Initial Version
1.1
2014-5-1
Document Revision
2.0
2017-6-26
HW & SW Upgrade

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Copyright © 2017 Embest Technology SBC8600B-UM-V2.0
Table of Contents
CHAPTER 0 ABBR........................................................................................................... VI
CHAPTER 1 PRODUCT OVERVIEW.................................................................................1
1.1 INTRODUCTION.............................................................................................................1
1.2 HARDWARE OVERVIEW.................................................................................................1
1.2.1 Mini8600B/Mini8610B .........................................................................................1
1.2.2 Extension Board..................................................................................................3
1.3 HARDWARE DIMENSION................................................................................................6
1.4 MODULES SUITABLE FOR THE EXTENSION BOARD .........................................................8
CHAPTER 2 HARDWARE SYSTEM..................................................................................9
2.1 CPU............................................................................................................................9
2.1.1 Introduction to CPU.............................................................................................9
2.1.2 CPU Features......................................................................................................9
2.2 INTRODUCTION TO PERIPHERALS ................................................................................11
2.2.1 NAND Flash H27U4G8F2DTR-BC ...................................................................11
2.2.2 DDR H5TQ2G83CFR-H9C ...............................................................................11
2.2.3 Ethernet AR8035...............................................................................................11
2.2.4 MAX3232...........................................................................................................12
2.3 HARDWARE INTERFACES.............................................................................................12
2.3.1 Mini86x0B..........................................................................................................12
2.3.2 Extension Board................................................................................................18
CHAPTER 3 LINUX OPERATING SYSTEM ....................................................................27
3.1 SOFTWARE RESOURCES.............................................................................................27
3.1.1 Locations of Resources.....................................................................................27
3.1.2 BSP....................................................................................................................28
3.2 STRUCTURE OF EMBEDDED LINUX SYSTEM.................................................................29

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3.3 BUILDING DEVELOPMENT ENVIRONMENT.....................................................................31
3.3.1 Installing Cross Compilation Tools....................................................................31
3.3.2 Addition of environment variables.....................................................................32
3.4 PREPARE THE SOURCE CODE.....................................................................................32
3.4.1 Get the Source Code from DVD........................................................................32
3.4.2 Get the source code by git and repo.................................................................33
3.5 COMPILATION.............................................................................................................34
3.5.1 Compiling Boot Loader......................................................................................34
3.5.2 Compiling Kernel...............................................................................................35
3.5.3 Generation Filesystem ......................................................................................35
3.6 LINUX SYSTEM CUSTOMIZATION..................................................................................35
3.6.1 Entering Configuration Menu ............................................................................35
3.6.2 Menu Options....................................................................................................36
3.6.3 Compiling Kernel...............................................................................................37
3.6.4 Testing Serial Gadget........................................................................................37
3.7 INTRODUCTION TO DRIVERS........................................................................................37
3.7.2 NAND.................................................................................................................39
3.7.3 SD/MMC............................................................................................................40
3.7.4 LCDC.................................................................................................................41
3.7.5 Audio in/out........................................................................................................42
3.8 DRIVER DEVELOPMENT ..............................................................................................43
3.8.1 GPIO_keys Driver..............................................................................................43
3.8.2 GPIO_leds Driver ..............................................................................................49
3.9 SYSTEM UPDATE........................................................................................................52
3.9.1 Update of TF Card System Image ....................................................................52
3.9.2 Update of NAND Flash......................................................................................56
3.10 DISPLAY MODE CONFIGURATIONS ABS.....................................................................61
3.11 TESTAND DEMONSTRATION ......................................................................................63

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3.11.1 LED Testing......................................................................................................63
3.11.2 KEYPAD Testing..............................................................................................63
3.11.3 Touch Screen Testing ......................................................................................64
3.11.4 Backlight Testing..............................................................................................65
3.11.5 ADC Testing.....................................................................................................65
3.11.6 RTC Testing.....................................................................................................66
3.11.7 TF Card Testing ...............................................................................................67
3.11.8 USB DEVICE Testing.......................................................................................69
3.11.9 USB Host Testing.............................................................................................71
3.11.10 AUDIO Testing...............................................................................................72
3.11.11 Network Testing..............................................................................................74
3.11.12 CAN Testing...................................................................................................76
3.11.13 RS485 Testing ...............................................................................................78
3.11.14 Serial Interface Testing..................................................................................80
3.11.15 Buzzer Testing ...............................................................................................80
3.11.16 Suspend & Resume Testing..........................................................................81
3.11.17 GPIO Testing .................................................................................................81
3.11.18 Debian Configuration.....................................................................................83
3.11.19 TISDK System Demonstration.......................................................................85
3.12 DEVELOPMENT OF APPLICATIONS..............................................................................88
3.12.1 Development of LED Applications...................................................................89
3.12.2 Development of CANApplications..................................................................90
3.12.3 Development of Serial Interface Applications .................................................98
CHAPTER 4 ANDROID OPERATING SYSTEM ............................................................106
4.1 DEVELOPMENT.........................................................................................................106
4.1.1 Get the Source Code.......................................................................................106
4.1.2 Compiling source code....................................................................................107

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4.2 DEMONSTRATION OF ANDROID SYSTEM.....................................................................107
CHAPTER 5 WINCE OPERATING SYSTEM.................................................................110
5.1 SOFTWARE RESOURCES...........................................................................................110
5.1.1 Locations of Software Resources ...................................................................110
5.1.2 Precomiled Images and BSP.......................................................................... 111
5.2 SYSTEM DEVELOPMENT............................................................................................112
5.2.1 Installation of IDE (Integrated Development Environment).............................112
5.2.2 Extract BSP and project files to IDE................................................................113
5.2.3 Sysgen & BSP Compilation.............................................................................113
5.2.4 Introduction of Drivers.....................................................................................113
5.3 UPDATE OF SYSTEM IMAGE.......................................................................................115
5.3.1 Update of TF Card...........................................................................................115
5.3.2 Update of NAND Flash Image.........................................................................121
5.4 INSTRUCTIONS FOR USE...........................................................................................122
5.4.1 How to use openGL ES demo.........................................................................122
5.5APPLICATION DEVELOPMENT.....................................................................................122
5.5.1 Application Interfaces and Examples..............................................................122
5.5.2 GPIOApplication Interfaces and Examples....................................................123
APPENDIX 1 INSTALLING UBUNTU LINUX SYSTEM...................................126
APPENDIX 2 INSTALLING LINUX USB ETHERNET/RNDIS GADGET.........139
APPENDIX 3 MAKING LINUX BOOT DISK.....................................................142
APPENDIX 4 BUILDING TFTP SERVER .........................................................147
APPENDIX 5 FAQ .............................................................................................149
TECHNICAL SUPPORT AND WARRANTY...................................................................150

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Copyright © 2017 Embest Technology SBC8600B-UM-V2.0
Chapter 0 ABBR
Mini86x0B: Mini8600B or Mini8610B, core board using MPU AM3358 or AM3352
SBC8600B: Extension Board of Mini86x0B

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Copyright © 2017 Embest Technology SBC8600B-UM-V2.0
Chapter 1 Product Overview
1.1 Introduction
Mini86x0B is a small form-factor controller board based on TI’s Sitara
AM3354/AM3358 ARM Cortex-A8 processor, meauring only 60mm by 27mm; The tiny
module integrates 2*256MBytes DDR3 SDRAM and 1*512Mbytes NAND Flash; It uses
two 0.4mm pitch 40-pin board-to-board male extension connectors to bring out most
hardware peripheral signals and GPIOs from the CPU.
SBC8600B is a single board computer designed by Embest, which has an extension
board to carry the Mini86X0B core board. The flexible design allows the fast and easy way
of realizing and upgrading the controller’s capabilities. In additional to those features
offered by Mini86X0B, the SBC8600B extension board has 5 serial ports (including 2
RS232 and 3 TTL), 2 USB Hosts and 1 USB OTG, 2 Ethernet ports, CAN, RS485, LCD,
Touch screen, Audio, ADC and more other peripherals. The SBC8600B is a ready-to-run
platform to support with Linux 4.1, Android 2.3 and WinCE 7 operating systems.
1.2 Hardware Overview
The following sections list out all the hardware features of the two parts of SBC8600B
respectively.
1.2.1 Mini8600B/Mini8610B
Electric Features
Working Temperature: 0 °C ~ 70°C
Working Humidity: 20% ~ 90%, Non-Condensing
Dimensions: 60mm x 27mm

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Input Voltage: 3.3V
Processor
1GHz ARM Cortex™-A8 32-Bit RISC Microprocessor
NEON™ SIMD Coprocessor
32KB/32KB of L1 Instruction/Data Cache with Single-Error Detection
(parity)
256KB of L2 Cache with Error Correcting Code (ECC)
SGX530 Graphics Engine
Programmable Real-Time Unit Subsystem
Memories
512MB NAND Flash
2*256MB DDR3 SDRAM
Extension Interfaces and Signals Routed to Pins
Two 0.4-pitch 40-pin DIP Interfaces
A TFT LCD Interface (Support LCDs with 24-bpp parallel RGB
interface)
Two USB2.0 High-Speed OTG Interfaces
Six UART Interfaces
A SPI Interface
Two 10/100 /1000Mbps Ethernet MAC(EMAC) with Management Data
Input/Output(MDIO) Module
A Multichannel Audio Serial Ports (McASP)
8-Channel 12bit ADC Interface
Three IIC Signals
Two 4-line SD/MMC card interfaces
GPMC Signals
Note:
Some of the pins are multiplexed for UART、IIC、SPI、CAN. Please refer to the CPU datasheet

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Copyright © 2017 Embest Technology SBC8600B-UM-V2.0
and schematics in the DVD-ROM for details.
Figure 1-1 Mini86x0B Block Diagram
1.2.2 Extension Board
Electric Features
Working Temperature: 0 °C ~ 70°C
Working Humidity: 20% ~ 90%, Non-Condensing
Dimensions: 95m x 95m
Input Voltage: 12V
Audio/Video Interfaces
LCD/4-Line Resistive Touch-Screen Interface (50-pin FPC connector
with 24-bit RGB output)
An Audio Input Interface (3.5mm connector)
An Dual-Channel Audio Output Interface (3.5mm connector)
Data Transfer Interface

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Two 10/100/1000Mbps Ethernet Interface (WinCE 7 support only one
Ethernet interface)
A CAN 2.0 Interface and a RS485 Interface (8-pin Phoenix Contact
Connector)
A USB 2.0 High-Speed OTG Ports with Integrated PHY (480Mbps, Mini
USB Interface)
Two USB 2.0 High-Speed HOST Ports with Integrated PHY
(480Mbps,USB-A Interfaces)
A TF Slot (SD/MMC compatible, 3.3V logic level)
Serial Interfaces
UART0, 3-Line RS232 Level, DB9 Debugging Serial Interface
UART2, 3-Line RS232 Level, DB9 General-Purpose Serial Interface
UART3, 3-Line TTL Level, DIP Interface
UART4, 3-Line TTL Level, DIP Interface
UART5, 3-Line TTL Level, DIP Interface
GPIO Interfaces
Input Interfaces and others
Two Customizable Buttons (MENU and BACK)
A Reset Button
A Buzzer
A Power Indication LED
Two Customizable LEDs

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Figure 1-2 SBC8600B Block Diagram

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1.3 Hardware Dimension
Figure 1-3 Mini86x0B Board Dimension

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Figure 1-4 SBC8600B Extension Board Dimension

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1.4 Modules Suitable for the Extension Board
Table 1-1
Names
Linux
Android
WinCE
Relevant Materials
VGA8000
NO*
YES*
YES*
Available in DVD-ROM
WF8000-U
NO*
NO
NO
Available in DVD-ROM
CAM8100-U
NO*
NO
NO
Available in DVD-ROM
CDMA8000-U
NO*
NO
NO
Download
WCDMA8000-U
NO*
NO
NO
Download
LVDS8000 Plus
NO*
YES*
YES*
Available in DVD-ROM and
on website
LCD8000-97C
NO*
YES*
YES*
Available in DVD-ROM and
on website

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Copyright © 2017 Embest Technology SBC8600B-UM-V2.0
Chapter 2 Hardware System
2.1 CPU
2.1.1 Introduction to CPU
The AM335x is ARM Cortex-A8 based microprocessor, enhanced in the aspect of
image, graphics processing, peripherals and industrial interface options such as Ether
CAT and PROFIBUS; The device supports high-level operating systems (HLOSs) such as
Linux, WinCE and Android.
The AM335x microprocessor contains following subsystems:
Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8
microprocessor.
POWERVR SGX™ Graphics Accelerator subsystem for 3D graphics
acceleration to support display and gaming effects.
The Programmable Real-Time Unit and Industrial Communication
Subsystem (PRU-ICSS) is separate from the ARM core, allowing
independent operation and clocking for greater efficiency and flexibility.
2.1.2 CPU Features
Clock
AM335x has two clock inputs, OSC1 and OCC0, and two clock outputs, LCKOUT1
and LCKOUT2.
OSC1 provides RTC with a 32.768 KHz reference clock. And it is used to connect
RTC_XTALIN terminal to RTC_XTALOUT terminal.

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OSC0 provides reference clocks such as 19.2-MHz, 24-MHz, 25-MHz or 26-MHz for
the clocks without RT function. It is also used to connect XTALIN terminal and XTALOUT
terminal.
Reset
Reset is controlled by PWRONRSTn signals from CPU. The reset will be effective
when active low.
General-Purpose Interfaces
There are 4 GPIO banks, each of which has 32 I/O pins, and the total pin number of
GPIO can be 128 (4x32).
Programmable Real-Time Unit Subsystem
Note:
Not applicable to SBC8610B
The PRUSS of AM3358 consists of two programmable real-time units;a 12KB shared
RAM with single-error detection (parity), tree 120B register bank that can be accessed by
each PRU, an interrupt controller module used to process input events of the system, and
the following peripherals:
An UART with data flow control and maximum rate of 12Mbps
Two MII Ethernet interface with support to industrial Ethernet such as
EtherCAT™
A MDIO interface
An enhanced capture module (eCAP)
3D Graphics Engine

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POWERVR® SGX graphics acceleration subsystem is used to improve 3D image
processing to provide regular display and gaming effect support. The subsystem key
features as below:
Tile-Based Architecture with processing capacity up to 20 MPloy/sec
Universal Scalable Shader Engine is a Multi-Threaded Engine Incorporating
Pixel and Vertex Shader Functionality
Advanced Shader Feature Set in Excess of Microsoft VS3.0, PS3.0 and
OGL2.0
Industry Standard API Support of Direct3D Mobile, OGL-ES 1.1 and 2.0,
OpenVG 1.0, and OpenMax
2.2 Introduction to Peripherals
2.2.1 NAND Flash H27U4G8F2DTR-BC
H27U4G8F2DTR-BC is a 512MB NAND Flash used on SBC8600B; you can get more
information from below access:
Disk-SBC8600B\HW design\datasheet\ NAND Flash\ H27U4G8F2DTR-BC.pdf
2.2.2 DDR H5TQ2G83CFR-H9C
H5TQ2G83DFR-H9C is a 256MB DDR3 SDRAM used on Mini86x0B. There are two
H5TQ2G83DFR-H9C on Mini86x0B; you can get more information from below access:
Disk-SBC8600B\HW design\datasheet\DDR\ H5TQ2G83DFR.pdf
2.2.3 Ethernet AR8035
AR8035 is compliant with the IEEE 802.3az Energy Efficiency Ethernet Standard and
the Atheros’s proprietary SmartEEE standard, which allows traditional MAC/SoC devices
incompatible with 802.3az to function as a complete 802.3az system.

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SBC8600B can be connected to a hub with a straight-though network cable, or
connected to a computer with a crossover cable, you can get more information of Ethernet
chip from below access:
Disk-SBC8600B\HW design\datasheet\LAN\ AR8035.pdf
2.2.4 MAX3232
MAX3232 is used to convert TTL levels into RS232 levels so that the board can
communicate with RS232 interfaces of PCs.
SBC8600B uses UART0 as debugging serial interface. The default voltage of UART0
is 1.8V, which needs to be boosted up to 3.3V for satisfying the external use. You can get
more information about this device from below access:
SBC8600B\HW design\datasheet\ Serial\MAX3232CSE.pdf
2.3 Hardware Interfaces
2.3.1 Mini86x0B
CN1 Interface
Figure 2-1 Mini86x0B CN1 Interface

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Table 2-1 CN1 Interface
CN1
PIN
Signal
Function
1
GND
GND
2
VDDS_RTC
Supply voltage for RTC
3
CLK_OUT1
Clock out1
4
CLK_OUT2
Clock out2
5
MMC0_DAT0
MMC0 data bus
6
MMC0_DAT1
MMC0 data bus
7
MMC0_DAT2
MMC0 data bus
8
GLOBLE_RESETN
SYS_RESET IN/ OUTPUT
9
MMC0_DAT3
MMC0 data bus
10
AM335X_PWRON_RESETN
CPU PWRON Reset
11
GND
GND
12
GND
GND
13
AM355X_PRU_UART0_CTS
PRU UART0 Clear To Send
14
AM355X_PRU_UART0_RX
PRU UART0 receive data
15
AM355X_PRU_UART0_RTS
PRU UART0 request to send
16
AM355X_PRU_UART0_TX
PRU UART0 transmit data
17
AM355X_UART0_RX
UART0 receive data
18
AM355X_UART3_RX
UART3 receive data
19
AM355X_UART0_TX
UART0 transmit data
20
AM355X_UART3_TX
UART3 transmit data
21
AM355X_CAN0_RX
CAN0 receive data
22
AM355X_I2C0_SDA
I2C0 master serial data
23
AM355X_CAN0_TX
CAN0 transmit data
24
AM355X_I2C0_SCL
I2C0 master serial clock
25
AM355X_UART4_RX
UART4 receive data
26
AM355X_UART1_RX
UART1 receive data
27
AM355X_UART4_TX
UART4 transmit data
28
AM355X_UART1_TX
UART1 transmit data
29
GND
GND
30
GND
GND
31
MII1_COL
MII1 collision detect
32
AM355X_USB0_DRVVBUS
USB0 controller VBUS
control output
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