EMC2 VNXe Series Owner's manual

EMC®VNXe™ Series
VNXe3300™
Hardware Information Guide
P/N 300-12-290
REV 04

EMC VNXe3300 Hardware Information Guide
2
Copyright © 2016 EMC Corporation. All rights reserved.
Published March, 2016
EMC believes the information in this publication is accurate as of its publication date. The information is subject to change without
notice.
The information in this publication is provided as is. EMC Corporation makes no representations or warranties of any kind with respect
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All other trademarks used herein are the property of their respective owners.
For the most up-to-date regulatory document for your product line, go to the Technical Documentation and Advisories section on EMC
Powerlink.

EMC VNXe3300 Hardware Information Guide 3
CONTENTS
Preface
Chapter 1 Overview
VNXe3300 platform..................................................................................... 11
Front view ............................................................................................. 12
Rear view .............................................................................................. 12
Hardware features................................................................................. 13
System component description................................................................... 14
Disk processor enclosure ...................................................................... 14
Front view ............................................................................................. 16
Rear view .............................................................................................. 19
I/O modules................................................................................................ 33
SP I/O module types ............................................................................. 33
Disk-array enclosure.................................................................................... 38
Specifications ............................................................................................. 55

4 EMC VNXe3300 Hardware Information Guide
Contents

EMC VNXe3300 Hardware Information Guide 5
PREFACE
As part of an effort to improve and enhance the performance and capabilities of its
product lines, EMC periodically releases revisions of its hardware and software. Therefore,
some functions described in this document might not be supported by all versions of the
software or hardware currently in use. For the most up-to-date information about product
features, refer to your product release notes.
If a product does not function properly or does not function as described in this
document, please contact your EMC representative.
About this book
This guide describes the EMC®VNXe3300™. The VNXe3300 platform supports a disk
processor enclosure (DPE) with one to two storage processors (SPs).
In the VNXe3300 platform, the DPE uses either a 15 drive, 3.5-inch disk drive 3U
enclosure (DPE7) or a 25 drive, 2.5-inch disk drive 3U enclosure (DPE8). The DAE used in
the VNXe3300 platform is either a 15 drive, 3.5-inch disk drive 3U enclosure (DAE6S) or a
25 drive, 2.5-inch disk drive 2U enclosure (DAE5S). As a result, in the VNXe3300 platform,
the DPE and DAE are available in several DPE/DAE configurations (for more information,
see and “Disk-array enclosure” on page 38)
IMPORTANT
When calculating the number of drives for your VNXe3300 platform, the DPE is included in
the total drive slot quantity of from 120 to 150 drives. If the total drive slot quantity
exceeds from 120 to 150, you will not be able to add another DAE. The “Disk-array
enclosure” section on page 38 provides more information about the available DAEs for the
VNXe3300 platform as well as a configuration table.
This guide is available online at www.emc.com/vnxesupport. On this page, click
Documentation. On the page that appears, under VNXe Series, click VNXe3300. On the
next page that appears, under Content type, click Manuals and Guides. On the right side
of the page that appears, a list of all the VNXe3300 product guides will appear. Select the
VNXe3300 Hardware Information Guide from this list. The guide and other related VNX
Series guides can be downloaded from here.

6 EMC VNXe3300 Hardware Information Guide
Preface
Revision history
The following table presents the revision history of this document:
How this document is organized
The major sections of this guide are listed in the following table.
Audience
This document is designed for personnel who install, configure, and maintain the
VNXe3300. To use this hardware publication, you should be familiar with digital storage
and networking equipment. Within the document an overview of the architecture,
Revision Date Description
A04 March, 2016 Updated the following section:
•“Specifications” on page 55
A03 June 2012 Following items were changed in this
release:
• First release of the
VNXe3300 Hardware
Information Guide
in the new EMC look
and feel format
• Added information about the:
a.) 3U, 25 (2.5-inch) disk drive DPE (“3U,
25 (2.5-inch) disk drive DPE” on page 18)
b.) RAM memory 12 GB per SP (“Hardware
features” on page 13)
c.) Two-port 10 Gb/s copper Ethernet I/O
module (“Two-port 10-Gb/s RJ-45 Base-T
I/O module” on page 37)
d.) 2U, 25 (2.5-inch) disk drive DAE (“2U,
25 (2.5-inch) DAE” on page 48)
A02 July, 2011 Added information for the following items:
• DC power supply module (“DC power
supply module (optional)” on page 22)
•SPLEDs(Table 4 on page 23)
A01 February, 2011 First release of the
VNXe3300 Hardware
Information Guide
Title Description
“Overview” on page 11 Describes the software and hardware features of a typical
VNXe3300.
“VNXe3300 platform” on
page 11
Describes and shows the front and rear views of a typical
VNXe3300.
“System component
description” on page 14
Provides a description of the components that comprise a
VNXe3300. Along with a description, illustrations of each
component are also shown.
“Disk processor enclosure” on
page 14
Describes and illustrates the two types of DPEs available for the
VNXe3300.
“Disk-array enclosure” on
page 38
Describes and illustrates the two types of DAEs available for the
VNXe3300.

EMC VNXe3300 Hardware Information Guide 7
Preface
features, and components of the VNXe3300 platform are presented. The specific aspects
of the VNXe3300 platform and its major components include the front and rear LED
indicators and the connectors on the DPE and the DAE.
Related documentation
The following EMC publication provides additional information:
◆ EMC VNXe3300 System Installation Guide
◆ DC-Powered VNXe Series Enclosures Installation and Operation Guide
This guide is available online at www.emc.com/vnxesupport. On this page, click
Documentation. On the page that appears, under VNXe Series, click VNXe3300. On the
next page that appears, under Content type, click Manuals and Guides. On the right side
of the page that appears, a list of all the VNXe3300 product guides will appear. Select the
VNXe3300 Hardware Information Guide from this list. The guide and other related VNX
Series guides can be downloaded from here.
Conventions used in this document
EMC uses the following conventions for special notices:

DANGER indicates a hazardous situation which, if not avoided, will result in death or
serious injury.

WARNING indicates a hazardous situation which, if not avoided, could result in death or
serious injury.

CAUTION, used with the safety alert symbol, indicates a hazardous situation which, if not
avoided, could result in minor or moderate injury.

NOTICE is used to address practices not related to personal injury.
Note: A note presents information that is important, but not hazard-related.
IMPORTANT
An important notice contains information essential to software or hardware operation.

8 EMC VNXe3300 Hardware Information Guide
Preface
Typographical conventions
EMC uses the following type style conventions in this document:
Where to get help
EMC support, product, and licensing information can be obtained as follows.
Product information — For documentation, release notes, software updates, or for
information about EMC products, licensing, and service, go to the EMC Online Support
website (registration required) at:
http://Powerlink.EMC.com
Technical support — For technical support, go to EMC Online Support and choose
Support. On the Support page, you will see several options, including one for making a
service request. Note that to open a service request, you must have a valid support
agreement. Please contact your EMC sales representative for details about obtaining a
valid support agreement or with questions about your account.
Normal Used in running (nonprocedural) text for:
• Names of interface elements (such as names of windows, dialog boxes,
buttons, fields, and menus)
• Names of resources, attributes, pools, Boolean expressions, buttons,
DQL statements, keywords, clauses, environment variables, functions,
utilities
• URLs, pathnames, filenames, directory names, computer names,
filenames, links, groups, service keys, file systems, notifications
Bold Used in running (nonprocedural) text for:
• Names of commands, daemons, options, programs, processes,
services, applications, utilities, kernels, notifications, system calls,
man pages
Used in procedures for:
• Names of interface elements (such as names of windows, dialog boxes,
buttons, fields, and menus)
• What user specifically selects, clicks, presses, or types
Italic
Used in all text (including procedures) for:
• Full titles of publications referenced in text
• Emphasis (for example a new term)
•Variables
Courier Used for:
• System output, such as an error message or script
• URLs, complete paths, filenames, prompts, and syntax when shown
outside of running text
Courier bold Used for:
• Specific user input (such as commands)
Courier italic Used in procedures for:
• Variables on command line
• User input variables
< > Angle brackets enclose parameter or variable values supplied by the user
[ ] Square brackets enclose optional values
|Vertical bar indicates alternate selections - the bar means “or”
{ } Braces indicate content that you must specify (that is, x or y or z)
... Ellipses indicate nonessential information omitted from the example

EMC VNXe3300 Hardware Information Guide 9
Preface
Your comments
Your suggestions will help us continue to improve the accuracy, organization, and overall
quality of the user publications. Please send your opinion of this document to:
[email protected]
If you have issues, comments, or questions about specific information or procedures,
please include the title and, if available, the part number, the revision (for example, A01),
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addressing.

10 EMC VNXe3300 Hardware Information Guide
Preface

Overview 11
Overview
The VNXe Series provides an integrated storage platform for small/medium businesses
(SMB) and lower mid-market organizations. Providing significant advancements in
efficiency and simplicity, the VNXe Series facilitates complete storage consolidation with
advanced file and block functionality as well as a simple, application-driven approach to
managing shared storage.
Supporting high availability through the use of redundant components—power supplies,
fans, storage processors—as well as dynamic failover and failback, the VNXe Series also
supports the ability to upgrade system software or hardware while the VNXe platform is
running.
The VNXe3300 platform is one of three models that make up the VNXe Series. This
platform is ideal for businesses with physical server infrastructures, as well as those
making the move to server virtualization to drive consolidation and greater efficiency. The
VNXe3300 platform also shares a comprehensive set of features including exceptional
capacity utilization, data protection and availability solutions, and advanced support
capabilities. Figure 1 shows an example of the VNXe3300 platform with a front bezel.
Figure 1 Example of a VNXe3300 platform with front bezel
VNXe3300 platform
This section shows examples of the front and rear views of a VNXe3300 platform.
Note: A fully configured VNXe3300 platform includes up to seven DAEs supporting a
maximum of from 120 to 150 disk drives depending on the type and mix of the DPE and
DAEs used (for configuration information, see the “DPE and DAE configuration rules”
section on page 39).
VNX-000113

12 EMC VNXe3300 Hardware Information Guide
Overview
Front view
Figure 2 shows an example of the front view of the VNXe3300 platform having a 3U, 15
(3.5-inch) disk drive DPE (DPE7).
Figure 2 Example of a VNXe3300 platform with a 3U, 15 (3.5-inch) disk drive DPE (front view)
Figure 3 shows an example of the front view of the VNXe3300 platform having a 3U, 25
(2.5-inch) disk drive DPE (DPE8).
Figure 3 Example of a VNXe3300 platform with a 3U, 25 (2.5-inch) disk drive DPE (front view)
Rear view
Looking from left to right, Figure 4 shows an example of the rear view of the VNXe3300
platform having a DPE with two storage processors (SP B and A), respectively.
Figure 4 Example of a VNXe3300 DPE with two SPs (rear view)
VNX-000109
24
0
12345678910 11 12 13 14 15 16 17 18 19 20 21 22 23 24
0
VNXe-000754
0 X4
1X4
2345
1 GbE
iSCSI
TOE
B
6Gb SAS
0123
0 X4
1X4
2345
1 GbE
iSCSI
TOE
A
6Gb SAS
0123 0123 0123
VNXe-000750

VNXe3300 platform 13
Overview
Hardware features
Contained in a 3U platform architecture, the VNXe3300 platform weighs approximately
96.4 lb (43.8 kg). It measures 5.25 inches high x 17.5 inches wide x 24.25 inches deep
(13.3 cm to 44.5 cm x 61.5 cm). Between the front and rear of the enclosure, a midplane
distributes power and signals to all the enclosure components. The VNXe3300 platform
DPE CPU modules and power supplies plug directly into the midplane connections.
The “Specifications” section on page 55 provides the physical, environmental, and power
details that make up the VNXe3300 platform.
Configured for AC-input power, the VNXe3300 platform includes the following hardware
features:
Note: An optional DC power supply for the SP is also available (see the “DC power supply
module (optional)” section on page 22 for more information).
◆One 3U DPE:
• On the front of the 3U DPE, three types of disk drives are supported in two types of
disk drive carriers; a 3U, 15 (3.5-inch) disk drive carrier (DPE7) and a 3U, 25
(2.5-inch) disk drive carrier (DPE8). The disk drives supported are Serial
attached-SCSI (SAS), near-line SAS (NL-SAS), Flash, and Self-Encrypting Drives
(SEDs) for SAS and NL-SAS). For more information about the disk drives supported
in the VNXe3300, refer to the
EMC
®
VNXe™ Series Storage Systems Disk and OE
Matrix
document.
Note: You cannot mix non-SED and SED drives. Either all non-SED or all SED.
• On the rear of the 3U DPE, a dual SP (A and B) is supported; each SP consists of:
– A CPU module with an Intel Xeon Quad Core 2.13-GHz processor with three
Double Data Rate Three (DDR3) synchronous dynamic RAM (SDRAM) slots
supporting 12 GB of memory per SP
– Four integrated 1-Gb/s iSCSI LAN ports (labeled 1 GBE iSCSI TOE 2, 3, 4, and 5)
– Two integrated 6-Gb/s SAS x4 ports (labeled 6Gb SAS 0 x4 and 1 x4);
supporting speeds are 1.5, 3, and 6 Gb/s
Note: 6Gb SAS port 1 x4 is not supported at this time.
– Two PCI Gen 2 x4 I/O module slots supporting the following UltraFlex™I/O
modules:
Note: Support for the second I/O module slot is available only in VNXe OE
version 2.3.x and later.
a.) Four-port 1-Gb/s (1000Base-T) copper iSCSI Ethernet (labeled 1 GbE on the
latch handle)
b.) Two-port 10-Gb/s optical iSCSI (labeled 10 GbE iSCSI on the latch handle)
c.) Two-port 10-Gb/s RJ-45 Base-T (labeled 10 GbE Base-T on the latch handle)

14 EMC VNXe3300 Hardware Information Guide
Overview
Note: Any combination of the above I/O modules is supported. However, both SPs
must have the same I/O module configuration.
– One RS-232/EIA 232 serial (up to 115 K baud) service laptop (micro DB-9) port
– One RS-232/EIA 232 serial network management (micro DB-9) port
– One 10/100/1000 LAN management (RJ-45) port
– One 10/100/1000 LAN service (RJ-45) port
– One power supply module; either AC (see the “AC power supply module”
section on page 22 for more information) or the optional DC (see the “DC power
supply module (optional)” section on page 22 for more information)
◆Either a 2U, 15 (3.5-inch) disk drive DAE (DAE6S) or a 2U, 25 (2.5-inch) disk drive DAE
(DAE5S) is supported in several configurations (for more DPE/DAE configuration
information, see Table 17 on page 39)
IMPORTANT
When calculating the number of drives for your VNXe3300 platform, the 3U DPE is
included in the total drive slot quantity of from 120 to 150 drives. If the total drive slot
quantity exceeds from 120 to 150, you will not be able to add another DAE. The
“Disk-array enclosure” section on page 38 provides more information about the available
DAEs for the VNXe3300 platform as well as a configuration table.
◆Any required cables including LAN cables, modem cables, and serial DB-9 cable.
◆Mounting rails with hardware
◆Front bezel with VNXe3300 badge
System component description
This section describes the VNXe3300 platform components. These details include
illustrations and descriptions of the front and rear connectors and the LED indicators.
Note: In the following sections, the illustrations and corresponding tables describe these
individual components. These descriptions are for illustrative purposes only.
Disk processor enclosure
As previously described, the VNXe3300 platform consists of a 3U disk processor
enclosure (DPE).
IMPORTANT
When calculating the number of drives for your VNXe3300 platform, the 3U DPE is
included in the total drive slot quantity of from 120 to 150 drives. If the total drive slot
quantity exceeds from 120 to 150, you will not be able to add another DAE. The
“Disk-array enclosure” section on page 38 provides more information about the available
DAEs for the VNXe3300 platform as well as a configuration table.

System component description 15
Overview
Each VNXe3300 platform 3U DPE consists of the following components:
◆Drive carrier
◆Disk drives
◆Midplane
◆Storage processor (SP)
◆Power supply module
◆EMI shielding
Drive carrier
The disk drive carriers are metal and plastic assemblies that provide smooth, reliable
contact with the enclosure slot guides and midplane connectors. Each carrier has a handle
with a latch and spring clips. The latch holds the disk drive in place to ensure proper
connection with the midplane. Disk drive activity/fault LEDs are integrated into the carrier.
The “Front view” section on page 16 provides more information about the drive carrier.
Disk drives
You can visually distinguish between the disk drive types by their different latch and
handle mechanisms and by the type, capacity, and speed labels on each disk drive. You
can add or remove a disk drive while the DPE is powered up, but you should exercise
special care when removing a disk drive while in use. Disk drives are extremely sensitive
electronic components. For more information about the disk drives supported in the
VNXe3300, refer to the
EMC
®
VNXe™ Series Storage Systems Disk and OE Matrix
document.
Midplane
A midplane separates the front-facing disk drives from the rear-facing SPs. It distributes
power and signals to all the components in the enclosure. SPs and disk drives plug
directly into the midplane.
Storage processor
The storage processor (SP) is the intelligent component of the disk processor enclosure
(DPE). Basically, it acts as the control center. Each SP includes status LEDs, PCI Gen 2 x4
I/O module slots, LAN ports, and so on. The “SP” section on page 19 provides more
information about the location and description of the connectors and LEDs.
Power supply module
When viewed from the rear of the SP, the power supply module is located on the top, left of
the SP. This module is an auto-ranging, power-factor-corrected, multi-output, off-line
converter with its own line cord. Each power supply includes status LEDs. A latch on the
power supply module locks it into place to ensure proper connection. The “AC power
supply module” section on page 22 provides more information about the location and
description of the connectors and LEDs.
Note: An optional DC power supply is available for the VNXe3300 (The “DC power supply
module (optional)” section on page 22 provides more information).

16 EMC VNXe3300 Hardware Information Guide
Overview
EMI shielding
EMI compliance requires a properly installed electromagnetic interference (EMI) shield in
front of the DPE disk drives. The VNXe3300 platform requires a front bezel that has a
locking latch and integrated EMI shield. You must remove the bezel/shield to remove and
install disk drives.
Front view
On the front of the VNXe3300 platform, two types of disk drive DPEs are supported:
◆3U, 15 (3.5-inch) disk drive DPE carrier which includes either the 3.5-inch 6-Gb/s SAS,
6-Gb/s NL-SAS, or Flash disk drives (hot-swappable)1
◆3U, 25 (2.5-inch) disk drive DPE carrier which includes either the 2.5-inch 6-Gb/s SAS,
6-Gb/s NL-SAS, or Flash disk drives (hot-swappable)1
◆Status LEDs
3U, 15 (3.5-inch) disk drive DPE
Figure 5 shows the location of these disk drives and status LEDs in a 3U, 15 (3.5-inch) disk
drive DPE.
Figure 5 VNXe3300 platform DPE with 3U disk carrier (front view)
1. You can add or remove a disk drive while the DPE is powered up, but you should exercise special
care when removing modules while they are in use. Disk drives are extremely sensitive electronic
components.
1Example of 3.5-inch 6-Gb/s SAS disk
drives1
1. The VNXe3300 platform also supports 6-Gb/s NL-SAS, Flash, or SED (NL-SAS and SAS) drives. For more
information about the disk drives supported in the VNXe3300, refer to the
EMC
®
VNXe™ Series Storage
Systems Disk and OE Matrix
document.
4Disk drive fault LED (amber)
2DPE fault LED (amber) 5Disk drive on/activity LED (green)
3DPE power on LED (blue)
123
4
VNX-000103
5

System component description 17
Overview
Table 1 describes the VNXe3300 platform DPE and the disk drive status LEDs.
Table 1 VNXe3300 platform 3U, 15 (3.5-inch) DPE and disk drive LEDs
LED Color State Description
DPE fault (location 2) Amber On Fault has occurred
Note: LED is always on at
powerup, until it is initialized.
DPE power (location 3) Blue On Powering and powered up
— Off Powered down
Disk drive fault (location 4) Amber On Fault has occurred
— Off No fault has occurred
Disk drive on/activity
(location 5)
Green On Powering and powered up
Blinking, mostly
on
Disk drive is on with I/O activity
Blinking at
constant rate
Disk drive is spinning up or down
normally
Blinking, mostly
off
Disk drive is powered up but not
spinning
Note: This is a normal part of the
spin-up sequence, occurring
during the spin-up delay of a
slot.
— Off Disk drive is powered down

18 EMC VNXe3300 Hardware Information Guide
Overview
3U, 25 (2.5-inch) disk drive DPE
Figure 6 shows the location of these components.
Figure 6 VNXe3300 platform 3U, 25 DPE carrier (front view)
Table 2 describes the VNXe3300 platform disk processor and 2.5-inch disk drive status
LEDs.
1Example of 2.5-inch 6-Gb/s SAS disk
drives1
1. The VNXe3300 platform also supports 6-Gb/s NL-SAS or Flash drives. For more information about the disk
drives supported in the VNXe3300, refer to the
EMC
®
VNXe™ Series Storage Systems Disk and OE Matrix
document.
4Disk drive fault LED (amber)
2DPE fault LED (amber) 5Disk drive status/activity (blue)
3DPE power status LED (blue)
24
0
12345678910 11 12 13 14 15 16 17 18 19 20 21 22 23 24
0
12
45 VNX-000281
3
Table 2 VNXe3300 platform 2.5-inch DPE and disk drive status LEDs
LED Color State Description
DPE fault (location 2) Amber On Fault has occurred
DPE power (location 3) Blue On Powering and powered up
— Off Powered down
Disk drive fault (location 4) Amber On Fault has occurred
— Off No fault has occurred
Disk drive on/activity
(location 5)
Blue On Powering and powered up
Blinking Disk drive activity

System component description 19
Overview
Rear view
On the rear, a VNXe3300 platform 3U DPE with two storage processors (SP A and B)
includes the following hardware components:
◆One power supply module
◆One I/O module slot
◆One SP (A or B)
Note: In the following sections, the illustrations and corresponding tables describe these
individual components. These descriptions are for illustrative purposes only.
SP
On the rear of the DPE, each SP (B and A), respectively, consists of the following
connectors, status LEDs, latch handles, and so on:
◆AC power supply module (for a closer view, see the “AC power supply module” section
on page 22):
• Power in (recessed) connector (plug)
• Power supply status LEDs (power on and fault)
• Power supply latch handle
◆Optional DC power supply module (for a closer view, see the “DC power supply
module (optional)” section on page 22):
• Power in (recessed) connector (plug)
• Power supply status LEDs (power on and fault)
• Power supply latch handle
◆SP B and A:
• One PCI Gen 2 x4 I/O module slot (supporting three Ultraflex I/O module types, see
page 13 and the “SP I/O module types” section on page 33)
• Two 6-Gb/s SAS x4 ports (labeled 6Gb SAS 0 x4 and 1 x4); supported speeds are
1.5, 3, and 6 Gb/s
Note: 6Gb SAS port 1 x4 is not supported at this time.
• Four 1-Gb/s iSCSI LAN ports (labeled 1 GBE iSCSI TOE 2, 3, 4, and 5)
• Two (RJ-45) LAN connectors (labeled with a network management symbol and a
wrench symbol)
• Two (micro DB-9) RS-232/EIA connectors (labeled with a battery symbol and a
wrench symbol)
• SP latch handles (bottom, left and right)

20 EMC VNXe3300 Hardware Information Guide
Overview
Looking from left to right, Figure 7 shows the rear view of an example of a 3U DPE with two
storage processors (SP B and SP A), respectively.
Figure 7 Example of VNXe3300 platform 3U DPE with two SPs, respectively (rear view)
1DPE 3Two I/O module slots1showing two
four-port copper 10/100/1000 Base-T
1Gb/s I/O modules
1. The I/O module slots support three types of UltaFlex I/O modules: the four-port copper 10/100/1000 Base-T
1-Gb/s I/O module, the two-port optical 10-Gb/s I/O module, and the two-port copper Ethernet 10-Gb/s I/O
module (for more information, see the “I/O modules” section on page 33).
2Power supply module (for a closer view,
see Figure 9 on page 22)
4SP B (for a closer view, see Figure 8 on
page 21)
0 X4
1X4
2345
1 GbE
iSCSI
TOE
A
6Gb SAS
0 X4
1X4
2345
1 GbE
iSCSI
TOE
B
6Gb SAS
0123
0123
0123 0123
231
4
SP B SP A VNXe-000748