Foxconn J20H090 User manual

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Project Name WLAN module
Approval Sheet Rev. 1.0
Foxconn Part No. J20H090
Prepared by Reviewed by Approved by
Clon Liu Eddie Huang Choro Chuang
Ambit Microsystems (Shanghai) LTD.
No 1925, Nanle Road Songjiang Export
Processing Zone Shanghai, China
Tel :[phone] Ext:22165
FAX:[phone]
User Manual of J20H090

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CONTENTS
1REVISION HISTORY ..................................................................... 3
2MANUFACTURING INFORMATION ........................................................ 4
3PRODUCT OVERVIEW ................................................................... 5
3.1 APPLICATION SCOPE .................................................................... 5
4MODULE HARDWARE OVERVIEW ........................................................ 6
4.1 BLOCK DIAGRAM ....................................................................... 6
4.2 FEATURES ............................................................................ 6
4.3 INTERFACE AND CONNECTOR ............................................................. 6
5ELECTRICAL SPECIFICATION ............................................................ 8
5.1 ABSOLUTE MAXIMUM RATING ............................................................. 8
5.2 RECOMMENDED OPERATING RATING ....................................................... 8
5.3 DC CHARACTERISTICS .................................................................. 8
5.4 ESD INFORMATION ..................................................................... 8
5.5 ENVIRONMENT STORAGE CONDITION ....................................................... 8
6RF SPECIFICATION ..................................................................... 9
6.1 IEEE802.11B ......................................................................... 9
6.2 IEEE802.11G ........................................................................ 10
6.3 802.11N HT20 ....................................................................... 11
6.4 ANTENNA ELECTRICAL SPECIFICATION..................................................... 11
7MECHANICAL SPECIFICATIONS......................................................... 12
7.1 SHIELDING COVER DIMENSION ........................................................... 12
7.2 PCB ASSEMBLY DIMENSION ............................................................. 13
7.3 MOUNT POSITION OF MATERIALS ......................................................... 13

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1 Revision History
Date Document revision Change Description
2015/06/30 1.0
Initial release

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2 Manufacturing Information
Manufacture Country:
Made in China
Manufacturer:
Ambit Microsystems (Shanghai) LTD.
Manufacture Address:
No 1925, Nanle Road Songjiang Export Processing Zone Shanghai, China

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3 Product Overview
The J20H090 802.11 b/g/n module provides wireless modem functionality utilizing direct
sequence spread spectrum and OFDM/CCK technology. This module is based on MTK
MT7601U solution .It fully complies with IEEE 802.11n and IEEE 802.11 b/g standards,
offering feature-rich wireless connectivity at high standards, and delivering reliable,
cost-effective throughput from an extended distance. Optimized RF architecture and
baseband algorithms provide superb performance and low power consumption. Intelligent
MAC design deploys a high efficient DMA engine and hardware data processing
accelerators which offloads the host processor.
3.1 Application scope
The wireless LAN is compliant to IEEE 802.11b and IEEE 802.11g and IEEE 802.11n
standard. The data rate of 802.11b is up to 11Mbps and fallback rates of 5.5, 2, 1Mbps.
The data rate of 802.11g is up to 54Mbps and fallback rates of 48,36,24,18,12,9, 6Mbps.
The data rate of 802.11n HT20 is up to 65Mbps and fallback rates of 58.5, 52, 39, 26, 19.5,
13, 6.5Mbps;

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4 Module Hardware Overview
4.1 Block Diagram
The general HW architecture is shown below Figure:
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Module Block Diagram
4.2 Features
♦IEEE802.11b/g/n (1X1) based on MTK MT7601U solution.
♦USB 2.0 Interface, High and Full Speeds supported.
♦Module is powered by the host with a 5.0V +/- 5% supply.
♦External PCB printed antennas.
♦2 layers through hole PCB design with halogen free FR4 material
4.3 Interface and Connector
♦Pin definition:
♦Vendor: Kyocera Elco
♦Vendor P/N: 046232105102800+
Pin Number Symbol Name Status Pin definition
1 GND Ground
2 DP I/O USB positive data
3 DM I/O USB negative data

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4 WoW O Wake on WLAN
5 UV+ P USB +5V power input

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5 Electrical Specification
5.1 Absolute maximum rating
Element Symbol Min Typ Max Unit
DC supply voltage UV+ 5.0 6.5 (V)
5.2 Recommended operating rating
Element Symbol Min Typ Max Unit
DC supply voltage UV+ 4.5 5.0 5.5 (V)
5.3 DC Characteristics
Symbol Parameter Min Typ. Max Unit
UV+
Supply voltage 4.5 5.0 5.5 (V)
Tx Current(1M/15dBm) (mA)
Tx Current(11M/15dBm) 110 140 170 (mA)
Tx Current(6M/15dBm) (mA)
Tx Current(54M/15dBm) (mA)
Tx Current(MCS0/15Bm/HT20) 120 150 180 (mA)
Tx Current(MCS7/15dBm/HT20) 60 90 120 (mA)
Rx Current 10 30 50 (mA)
5.4 ESD Information
Mode Level Unit
HBM +/-1000 V
5.5 Environment Storage Condition
Environment condition
Temperature Operating Temperature: -10 deg.C ~70 deg.C
Storage Temperature: -40 deg.C ~85 deg.C
Humidity Operating Humidity: 20% ~90%
Storage Humidity: 20% ~90%

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6 RF Specification
6.1 IEEE802.11b
Items Contents
Specification IEEE802.11b
Mode DSSS / CCK
Channel CH1 to CH13
Data rate 1, 2, 5.5, 11Mbps
TX Characteristics Min. Typ. Max. Unit
1. Power Levels (Calibrated)
1) Target Power@1Mbps 26 26 26 dBm
2) Target Power@2Mbps 26 26 26 dBm
3) Target [email protected] 26 26 26 dBm
4) Target Power@11Mbps 26 26 26 dBm
2. Spectrum Mask @15dBm
1) fc-33MHz ＜f ＜fc-22MHz - - -50 dBr
2) fc-22MHz ＜f ＜fc-11MHz - - -30 dBr
3) fc+11MHz ＜f ＜fc+22MHz - - -30 dBr
4) fc+22MHz ＜f ＜fc+33MHz - - -50 dBr
3. Frequency Error -10 - +10 ppm
4 Modulation Accuracy(EVM)@15dBm
1) 1Mbps - -10 dB
2) 2Mbps - -10 dB
3) 5.5Mbps - -10 dB
4) 11Mbps - -10 dB
RX Characteristics Min. Typ. Max. Unit
5 Minimum Input Level Sensitivity
1) 1Mbps (FER≦8%) - -91 - dBm
2) 2Mbps (FER≦8%) - -89 - dBm
3) 5.5Mbps (FER≦8%) - -87 - dBm
4) 11Mbps (FER≦8%) - -85 - dBm
6 Maximum Input Level (FER≦8%) -10 -5 - dBm

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6.2 IEEE802.11g
Items Contents
Specification IEEE802.11g
Mode OFDM
Channel CH1 to CH13
Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps
TX Characteristics Min. Typ. Max. Unit
1. Power Levels (Calibrated)
1) Target Power@6Mbps 26 26 26 dBm
2) Target Power@9Mbps 26 26 26 dBm
3) Target Power@12Mbps 26 26 26 dBm
4) Target Power@18Mbps 26 26 26 dBm
5) Target Power@24Mbps 26 26 26 dBm
6) Target Power@36Mbps 26 26 26 dBm
7) Target Power@48Mbps 26 26 26 dBm
8) Target Power@54Mbps 26 26 26 dBm
2. Spectrum Mask @15dBm
1) at fc +/- 11MHz - - -20 dBr
2) at fc +/- 20MHz - - -28 dBr
3) at fc > +/-30MHz - - -40 dBr
3 Modulation Accuracy(EVM)@15dBm
1) 6Mbps - - -5 dB
2) 9Mbps - - -8 dB
3) 12Mbps - - -10 dB
4) 18Mbps - - -13 dB
5) 24Mbps - - -16 dB
6) 36Mbps - - -19 dB
7) 48Mbps - - -22 dB
8) 54Mbps - -28 -25 dB
4 Frequency Error -10 - +10 ppm
RX Characteristics Min. Typ. Max. Unit
5 Minimum Input Level Sensitivity
1) 6Mbps (PER <10%) - -83 - dBm
2) 9Mbps (PER < 10%) - -81 - dBm
3) 12Mbps (PER < 10%) - -79 - dBm
4) 18Mbps (PER < 10%) - -77 - dBm
5) 24Mbps (PER < 10%) - -75 - dBm
6) 36Mbps (PER < 10%) - -73 - dBm
7) 48Mbps (PER < 10%) - -71 - dBm
8) 54Mbps (PER < 10%) - -69 - dBm
6 Maximum Input Level (PER < 10%) -20 -11 - dBm