Fujitsu MB2145-507 User manual

FUJITSU SEMICONDUCTOR
CONTROLLER MANUAL
F²MC-16L/16LX/16F
EMULATION POD
MB2145-507
HARDWARE MANUAL
CM42-00411-1E

i
PREFACE
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■■
■Using the Emulation Pod Safely
This manual contains important information regarding the safe use of the MB2145-507
emulation pod.
Be sure to read this manual before using the MB2145-507 emulation pod and use the emulation
pod only as described in this manual.
Read “Safety Warnings” at the beginning of this manual and make a careful safety check before
using the emulation pod.
Store this manual in a convenient place so that you can refer to it at any time while you are
using the emulation pod.
■
■■
■Purpose of This Manual and Intended Audience
The MB2145-507 emulation pod is a development support tool for developing and evaluating
application products that use Fujitsu 16-bit microcontrollers, F2MC-16L/16LX/16F series
devices.
This manual explains how to handle and connect the MB2145-507 emulation pod. It is intended
for engineers who use the MB2145-507 emulation pod (hereafter “emulation pod”) to develop
application products that use the F2MC-16L/16LX/16F series devices.
■
■■
■Product Environment
The emulation pod operates properly at a temperature of 5 °C to 45 °C and a humidity of 30% to
80%. Do not use in high-temperature and high-humidity environments or in any environment
where condensation will form.
Do not put heavy objects on the emulation pod. Since the cabinet is made of plastic, it may
break.
When power is turned on, keep the emulation pod away from items that can short-circuit or fire.
Keep the emulation pod on as level a surface as possible. Do not operate the emulation pod in
a location subject to severe vibration, dust, or explosive gases.
If the emulation pod is not used in the correct environment as described above, injury to the
user and nearby persons or damage to the emulation pod or other property may result.
Packing materials used to ship the emulation pod can be reused to transport the emulation pod
in the case of a failure. If possible, keep the packing materials.

ii
■
■■
■Safety Warnings
Important warnings items are given on the following pages.
Before using the emulation pod, read each warning and make a safety check.
Indicates that improper use may cause death or severe injury.
Warning
text/symbol Warning page:
Plug If an abnormal condition such as heat, smoke, unusual odor,
or unusual noise occurs, immediately turn off the power and
disconnect the power plug from the receptacle.
When the smoke has disappeared, ask the distributor to
repair the emulation pod. Never make repairs yourself, since
it is very dangerous.
Using the emulation pod in an abnormal state may cause a
fire or electric shock.
8
If water or other liquid, a metallic object, or other foreign sub-
stance gets inside the emulation pod, immediately turn off the
power and disconnect the power plug from the receptacle.
Next, contact the distributor.
Using the emulation pod in an abnormal state may cause a
failure, fire, or electric shock.
8
If you hear thunder, disconnect the power plug from the
receptacle. Using the emulation pod during a thunderstorm
can damage the emulation pod or cause a fire.
9
Electric shock Before connecting or disconnecting cables, turn off the power
to the emulation pod and connected devices, and disconnect
the power plug from the receptacle.
Failure to do so may cause an electric shock.
9
Do not put your fingers in the connector inlet.
Putting your fingers in the connector inlet can result in an
electric shock or failure.
9
No disassembly Never open the emulation pod case. Do not modify the emu-
lation pod without permission.
Opening the case or modifying the emulation pod may cause
a failure, fire, or electric shock.
9
No moisture Do not use the emulation pod in a wet area such as a bath-
room or shower room.
Using the emulation pod in a wet area may cause a failure,
fire, or electric shock.
9
WARNING

iii
Indicates that improper use may cause death or severe injury.
Warning
text/symbol Warning page:
Prohibition Do not touch the emulation pod with wet hands.
Doing so may cause an electric shock. 10
Do not put the emulation pod in a location with a lot of mois-
ture, dust, or soot or in a location with poor ventilation. Do not
place the emulation pod near an open flame.
Doing so may cause a failure, fire, or electric shock.
10
Do not insert or drop any metallic, combustible, or other
object through a ventilation or other type of opening in the
emulation pod.
Doing so may cause a failure, fire, or electric shock.
10
Do not use a voltage other than the indicated power voltage.
Do not connect the power cord in a daisy chain.
Doing so may cause a fire or electric shock.
10
Do not damage or alter any cables.
Putting a heavy object on a cable, or pulling, forcibly bending,
distorting, or heating a cable may damage the cable and
cause a fire or electric shock.
10
WARNING

iv
Indicates that improper use may cause minor or moderate injury,
or may damage the emulation pod, connected equipment, data
or other software resources, or other property.
Warning
text/symbol Warning page:
Plug Before moving the emulation pod, disconnect the power plug
from the receptacle.
Also, disconnect all other cables.
Watch where you step during work.
Damaging a cable may cause a fire or electric shock. A falling
device may cause injury.
10
If the emulation pod will not used for a long time, for safety
reasons, disconnect the power plug from the receptacle.
Failure to do so may cause a fire or electric shock.
10
Prohibition Do not put the emulation pod in a location subject to severe
vibration or in a location that is not level or stable. Doing so
may cause a failure or cause the emulation pod to fall.
11
Do not put the emulation pod in a location near a speaker or
television tuner or in any location subject to a magnetic or
electric field. Doing so may cause a failure.
11
When disconnecting the power plug or a cable, hold the
power plug or connector itself. Do not pull on the cable.
Pulling on a cable may cause the core wire to be exposed or
cut, resulting in a failure, fire, or electric shock.
11, 12
To prevent damage from static electricity, do not let a finger or
object contact a connector pin. 12
Do not block the emulation pod's ventilation openings.
Blocking ventilation openings causes heat to accumulate and
may cause a fire.
11, 12
Do not subject the emulation pod to a shock.
Doing so may cause a failure. 12
Do not place the emulation pod in direct sunlight, in a high-
temperature or high-humidity environment, or in an environ-
ment in which condensation can form.
12
Do not store the emulation pod in a dusty location.
Doing so may cause a failure. 12
Because the emulation pod uses many electronic parts, do
not store it in a location subject to strong electric or magnetic
fields for a long period.
Doing so may cause a failure.
12
Before connecting or disconnecting a cable, turn off the
power.
Failure to do so may cause an electric shock.
17,
19, 20
CAUTION

v
Indicates that improper use may cause minor or moderate injury,
or may damage the emulation pod, connected equipment, data
or other software resources, or other property.
Warning
text/symbol Warning page:
Prohibition When disconnecting a cable, hold the cable by the connector
case. Do not pull on the cable.
Doing so may break a wire in the cable.
17,19,
20
Before mounting the evaluation MCU, turn off the power.
Failure to do so may cause an electric shock. 22
Before operating the clock switch, turn off the power.
Failure to do so may cause an electric shock. 23
Before setting the jumper switch for the power supply, turn off the
power.
Failure to do so may cause an electric shock.
25
Before setting the jumper switch for the C-pin circuit connection,
turn off the power.
Failure to do so may cause an electric shock.
27
When turning on the power, follow the procedure described in the
manual.
Failure to do so may cause a device failure.
28
After the emulation pod power is turned on, do not turn off and
turn on the user system power.
Doing so cause a device failure.
28
When power is on, do not carry the emulation pod, or subject it to
shock or vibration.
Doing so may cause a device failure.
28
When turning off the power, follow the procedure described in the
manual.
Failure to do so may cause a device failure.
29
Attention Insert the power plug firmly in the receptacle.
Failure to do so may cause a failure or a fire. 11
Caution The device can be damaged during transport. Store the packing
materials used to ship the emulation pod and use them if you
need to transport it.
2
Using the emulation pod at an ambient temperature or humidity
outside the specified range may cause a device failure. Always
use the emulation pod within the specified temperature and
humidity range.
6
CAUTION

vi
■
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■Configuration of This Manual
This manual consists of two chapters.
Read the manual completely before using the emulation pod.
Chapter 1 Product Handling and Specifications
This chapter explains handling of the emulation pod and gives its specifications.
Before using the emulation pod, be sure to read this chapter and check that the product and
accessories are complete.
Chapter 2 Connection and Settings
This chapter explains how to connect the emulation pod and to set switches and describes
the power-on and power-off sequences.
Read this chapter before turning power on.
An appendix contains the specification for the emulator interface in the user system.
■
■■
■Related Manuals
Also refer to the following manuals:
• F
2
MC-16L/16LX/16/16H/16F Emulator Debugger Manual Windows Edition
• F
2
MC-16L/16LX/16/16H/16F Emulator Debugger Installation Guide
1998 FUJITSU LIMITED Printed in Japan
1. The contents of this document are subject to change without notice. Customers are advised to consult
with FUJITSU sales representatives before ordering.
2. The information and circuit diagrams in this document are presented as examples of semiconductor
device applications, and are not intended to be incorporated in devices for actual use. Also, FUJITSU is
unable to assume responsibility for infringement of any patent rights or other rights of third parties arising
from the use of this information or circuit diagrams.
3. The contents of this document may not be reproduced or copied without the permission of FUJITSU
LIMITED.
4. FUJITSU semiconductor devices are intended for use in standard applications (computers, office
automation and other office equipment, industrial, communications, and measurement equipment,
personal or household devices, etc.).
CAUTION:
Customers considering the use of our products in special applications where failure or abnormal
operation may directly affect human lives or cause physical injury or property damage, or where
extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls,
sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to
consult with FUJITSU sales representatives before such use. The company will not be responsible for
damages arising from such use without prior approval.
5. Any semiconductor devices have an inherent chance of failure.You must protect against injury, damage
or loss from such failures by incorporating safety design measures into your facility and equipment such
as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions.
6. If any products described inthis document represent goods ortechnologies subject to certain restrictions
on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by
Japanese government will be required for export of those products from Japan.

vii
READING THIS MANUAL
■
■■
■Page Layout
Each section of this manual has a summary of the section below the section title. You will get
an overview of the product by reading only the summaries.
Since the upper-level section title also appears in a lower-level section, you always know which
upper-level section your current reading belongs to.

viii

ix
CONTENTS
CHAPTER 1 PRODUCT HANDLING AND SPECIFICATIONS...........................................1
1.1 Checking the Components ......................................................................................................................2
1.2 Drawings of Emulation Pod and Names of Parts.....................................................................................3
1.3 General Specifications.............................................................................................................................6
1.4 Optional Products....................................................................................................................................7
1.5 Note on Errors .........................................................................................................................................8
1.6 Notes on Handling the Emulation Pod.....................................................................................................9
1.7 Notes on Use.........................................................................................................................................12
CHAPTER 2 CONNECTION AND SETTINGS...................................................................15
2.1 System Configuration ............................................................................................................................16
2.2 Connecting the 2140 Main Unit .............................................................................................................17
2.3 Connecting the Probe Cable..................................................................................................................19
2.4 Connecting the External Probe..............................................................................................................20
2.5 Mounting the Evaluation MCU...............................................................................................................22
2.6 Supplying a Clock to the Evaluation MCU.............................................................................................23
2.7 Switching the Power Source..................................................................................................................25
2.8 Switching the C-Pin Circuit Connection.................................................................................................27
2.9 Power-on Sequence..............................................................................................................................28
2.10 Power-off Sequence..............................................................................................................................29
APPENDIX..............................................................................................................................31
Appendix A Differences between the Emulation Pod and a Regular Production MCU ..................................32