Fujitsu LQFP-64P User manual

FUJITSU SEMICONDUCTOR
SUPPORT SYSTEM SS01-71060-1E
DSU-FR EMULATOR
LQFP-64P HEADER TYPE 2
MB2198-304
OPERATION MANUAL

i
PREFACE
Thank you for purchasing the LQFP-64P*1header type 2 (MB2198-304) for the DSU-FR emulator.
This product is used together with the BGA-660P adapter for the DSU-FR emulator (MB2198-
300)*2to connect the DSU-FR emulator (MB2198-01)*3and DSU-FR cable (MB2198-10)*4to a
user system that uses a MB91460 series Fujitsu FR*4microcontroller (LQFP-64P)*5.
This manual describes how to use the LQFP-64P header type 2 for the DSU-FR emulator. Please read
the manual carefully before using. Please contact your Fujitsu sales or support representative for de-
tails on which production and evaluation MCU models can be used with this product.
*1 : The lead pitch of package (FPT-64P-M23) is 0.65mm and the body size is 14mm ×14mm.
*2 : Referred to as the “adapter”
*3 : Referred to as the “emulator”
*4 : Referred to as the “DSU cable”
*5 : FR is an abbreviation of FUJITSU RISC CONTROLLER and is a product of Fujitsu Limited.
■Handling and usage
The handling and use of this product and notes regarding safety use are included in the hardware
manual of the DSU-FR family emulator.
Follow the instructions in for the use of this product.
•DSU-FR EMULATOR MB2198-01 HARDWARE MANUAL
•DSU-FR EMULATOR DSU-FR CABLE MB2198-10 OPERATION MANUAL
•DSU-FR EMULATOR BGA-660P ADAPTER MB2198-300 OPERATION MANUAL
■Caution of the products described in this manual
The following precautions apply to the product described in this manual.
CAUTION The wrong use of a device will give an injury and may cause malfunction on cus-
tomers system.
Cuts This product has parts with sharp points that are exposed. Do not touch edge of
the product with your bare hands. There is a possibility that it may be injured.
Damage
When connect the header board to the user system, correctly position the index
mark (▲) on the NQPACK mounted on the user system with the index mark (▲)
on the header board, otherwise the emulator system and user system might be
damaged.
Damage When mounting a mass production MCU, correctly position pin 1, otherwise the
mass production MCU and user system might be damaged.

ii
Copyright ©2007 FUJITSU LIMITED All rights reserved
•The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
•The information, such as descriptions of function and application circuit examples, in this document are presented sole-
ly for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU
does not warrant proper operation of the device with respect to use based on such information. When you develop
equipment incorporating the device based on such information, you must assume any responsibility arising out of such
use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the infor-
mation.
•Any information in this document, including descriptions of function and schematic diagrams, shall not be construed
as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right
of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property
right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result from the use of information contained herein.
•The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air
traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)
for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in
connection with above-mentioned uses of the products.
•Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from
such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire pro-
tection, and prevention of over-current levels and other abnormal operating conditions.
•If any products described in this document represent goods or technologies subject to certain restrictions on export un-
der the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be
required for export of those products from Japan.

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1. Checking the Delivered Product
Before using the MB2198-304, confirm that the following components are included in the box:
•LQFP-64P header board*1: 1
•Screws for securing the header board (M2 ×10mm, 0.4mm pitch) : 4
•Washers : 4
•NQPACK064SB*2: 1
•HQPACK064SB140*3: 1
•Operation manual (Japanese version) : 1
•Operation manual (English version, this manual) : 1
*1 : The YQPACK064SB is mounted on the header board (Tokyo Eletech Corporation, referred to
as the “YQPACK”).
*2 : The IC socket (manufactured by Tokyo Eletech Corporation, referred to as “NQPACK”). This
socket is supplied with a special screwdriver and 2 guide pins. Additionally, the relatively high
reliability NQPACK064SB-SL (Tokyo Eletech Corporation, sold separately) can be used by
preparing screw holes on the user system board for mounting the socket. For more information,
contact Tokyo Eletech Corporation.
*3 : The IC socket cover (manufactured by Tokyo Eletech Corporation, and referred to as “HQ-
PACK”). This cover includes 4 screws for securing HQPACK (M2 ×6mm, 0.4mm pitch).
This product is used as an emulator system by combining with an optional emulator, DSU cable and
adapter.
Consult a sales or support representative from Fujitsu Limited for details on the adapter and emulator
for this product.
2. Handling Precautions
■Handling precautions
The header board is precision-manufactured to improve dimensional accuracy and to ensure reliable
contact. The header is therefore sensitive to mechanical shock. To ensure correct use of the header
in the proper environment, observe the following points regarding its insertion and removal:
•To avoid placing stress on the NQPACK mounted on the user system during connecting the
header board.
■Precautions when operating on the sub clock
When using this product, the evaluation MCU cannot be supplied with a sub clock from the user sys-
tem.
When the evaluation MCU is operating using the sub clock, use the sub clock on the adapter.
Refer to the operation manual for the adapter for more details.

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3. Notes on Designing
■Notes on designing the printed circuit board for the user system
If the header board is connected to a user system, the heights of parts mounted around the
header board are restricted.
When designing the printed circuit board of the user system, consider the heights of components
within the range of the header board, as shown in Figure 1, so that the components mounted on the
user system do not interfere with the header board.
Figure 1 Header board dimensions
* : The height differs slightly depending on how the sockets are engaged.
88.0mm
52.0mm
42.0mm
10.0mm
Approx.
13.0mm*
150.0mm
23.0mm
Approx.
17.0mm*
Header
User
system
Insulating plate
Adapter
1.6mm
NQPACK064SB

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■MCU footprint design notes
Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the printed cir-
cuit board of the user system.
The printed circuit board of the user system must be designed with due consideration given to this
footprint as well as to the mass production MCU.
For more information, contact the Tokyo Eletech Corporation.
Figure 2 Recommended dimensions of the footprint for mounting the NQPACK
*1 : Position of the guide pin hole (φ1.0) when mounting the NQPACK.
These holes do not need to be fabricated if the guide pins are not used.
*2 : Position of the hole (φ2.2) for the screw for affixing the IC socket when the NQPACK064SB-SL
(Tokyo Eletech Corporation, sold separately) is mounted instead of the NQPACK064SB-SL.
This hole does not need to be fabricated if the NQPACK064SB-SL is not used.
0.65mm ×15 = 9.75mm
0.65mm
1.8mm 12.0mm 1.8mm
1.8mm
12.0mm
1.8mm
No.1 pin
5.0mm
5.0mm
0.65mm ×15 = 9.75mm
3-φ1.0mm*1
φ2.2mm*2
0.4mm

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4. Procedure for Connecting to the User System
Before using the MB2198-304, mount the supplied NQPACK on the user system.
Connect the header board directly to the adapter. Refer to the operation manual of the adapter for
details on how to connect the adapter.
■Connecting
1. To connect the header board to the user system, align pin 1 indicated by the index mark (▲) on
the NQPACK mounted on the user system with the index mark (▲) on the header board and then
insert it (See Figure 3) .
The YQPACK pins are thin and easy to bend. Check that the YQPACK pins are not bent before
inserting it into the NQPACK.
2. Insert each of the screws for securing the header board through a washer and into each of the four
holes in the header board. Partially tighten one of the screws with the special screwdriver supplied
with the NQPACK and then partially tighten the screw in the diagonally opposite corner. Partially
tighten the two remaining screws. Finally repeat the process making the screws equally tight.
(See Figure 4) .
Take care not to overtighten the screws as this may cause a faulty connection.
Figure 3 Index position
Adapter I/F connector 1
Adapter I/F connector 2
YQPACK
(It mounts at the back)
NQPACK
Index mark (▲) Header board
Index mark (▲)

5
Figure 4 Header board connection
■Disconnection
To disconnect the header board from the user system, remove all four screws, and then pull the
header board straight out of the NQPACK.
Screws for securing
the header board
Washer
Header board
User system
YQPACK
NQPACK

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5. Mounting Mass Production MCUs
Use the supplied HQPACK to mount a mass production MCU on the user system.
■Mounting
1. To mount a mass production MCU on the user system, align the index mark (▲) on the NQPACK
mounted on the user system with the index mark (●) on the mass production MCU.
2. Confirm that the mass production MCU is correctly mounted on the NQPACK, and then align the
index mark (the only corner with an angle cut-out) of the HQPACK with the index mark of the
NQPACK, and insert it (See “Figure 5”).
The HQPACK pins are thin and easy to bend. Check that the HQPACK pins are not bent before
inserting it into the NQPACK.
3. Insert each of the screws for securing the HQPACK into each of the four screw holes on the HQ-
PACK and tighten the diagonally opposite screws in turn.
To tighten the screws, use the special screwdriver supplied with the NQPACK to finally tighten
the four screws in sequence. Tightening the screws too tight might result in a defective contact.
Figure 5 Mounting a mass production MCU
■Disconnection
To remove the HQPACK, remove all of the four screws, and pull the HQPACK vertically out from
the NQPACK.
Screws for securing
the HQPACK
HQPACK
Mass production MCU
NQPACK
User system

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6. Connector Pin Assignment
The signals from the evaluation MCU mounted on the adapter board are connected to the YQPACK
(the same assignments as mass production MCU) via adapter I/F connectors 1 and 2 on the header
board.
For details on the mass production MCU pins, refer to the data sheet or hardware manual of each
MCU.
■Pin assignment
Tables 1 to 4 show the correspondence between the pin numbers for adapter I/F connectors 1 and 2,
the evaluation MCU on the adapter board, and the mass production MCU.
The following explanations apply to these tables. Row A corresponds to the side of the connector
that displays the polarity. Row B corresponds to the opposite side.
*1 : No connection. These are not connected on either evaluation MCUs or mass production MCUs.
*2 : Pin 18 on mass production MCUs is connected to pins AA38, Y37, Y36, and Y35 on evaluation
MCUs.
- : Unconnected (open) pin
: VCC
The evaluation MCU power supply pins (VCC) are as follows:
VCC=Y38, W38, W36, W35, G5, L5, AR7, AM35, H35, D8, R5, W5, AC5, AG5, AP11,
AP19, AP23, AP31, AH34, AD34, T34, H34, E32, E28, E20, E12, G4, AL4, AR31,
D32, AL5, AP7, AP15, AP27, AR7, AM34, Y34, M34, E24, E16, E8, AP33, AP29,
AP25, AP21,AP13, AA5, D15, D25, R35, AE35, AR24, P4, AP17, AP9, AN5, AJ5,
AE5, U5, N5, J5,AR14, AD4, AK34, AF34, AB34, V34, P34, K34, F34, E30, E26, E22,
E18, E14, E10, E6
The mass production MCU power supply (VCC) pin numbers are 16 and 48.
: VSS
The evaluation MCU ground pins (VSS) are as follows:
VSS = E11, E15, E19, E23, E27, E31, G34, L34, R34, W34, AA34, AE34, M5, C3, B37, T5,
Y5, AD5, AJ34, AH5, AT36, AT3, AU37, AU2, AK5, AP8, AP12, AP16, AP20, AP24,
AP28, AP30, AL34, A1, B1, AU1, AV1, AV2, AV37, AV38, AU38, B38, A38, A37,
A2, C36, D4, AR4, AR35, D35, E5, K5, P5, V5, AB5, AF5, AM5, AP5, AP6, AP10,
AP14, AP18, AP22, AP26, AP32, AP34, AN34, AG34, AC34, U34, N34, J34, E34,
E33, E29, E25, E21, E17, E13, E7
The mass production MCU ground (VSS) pin numbers are 17, 33, and 49.