Fujitsu FMC-8FX FAMILY MB95F430 Instructions for use

FUJITSU MICROELECTRONICS (SHANGHAI) CO., LTD.
Unit 1501, Jin Mao Tower, 88 CenturyAve., Pudong NewArea, Shanghai, P.R. China
Tel: [phone] Fax: [phone]
MCU-AN-500087-E-12
F²MC-8FX FAMILY
8-BIT MICROCONTROLLER
MB95F430 SERIES
Induction Heater Hardware
User Manual
Revision History
Version
Date
Comment
Charge
1.0
2010-04-06
Create.
Folix
1.1
2010-08-11
Modified:
1. System Feature;
2. MCU Pin Assignment;
3. IGBT Feature;
4. Power Module;
5. IGBT Driver Module;
6. Pad Driver Module;
7. Main Board SCH;
Folix
1.2
2010-9-10
Update operation description
Terry

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Contents
Revision History...................................................................................................................................1
1. Introduction...........................................................................................................................................3
2. System Features....................................................................................................................................4
3. System Introduce..................................................................................................................................5
3.1. Hardware Block Diagram.............................................................................................................................................5
3.2. MCU Resource Usage..................................................................................................................................................5
3.3. MCU Pin Assignment...................................................................................................................................................6
3.4. IGBT Features..............................................................................................................................................................7
4. System Hardware..................................................................................................................................8
4.1. System Connect Diagram ........................................................................................................................................8
4.2. Front Board..............................................................................................................................................................9
4.3. Main Board............................................................................................................................................................10
5. Module Description............................................................................................................................11
5.1. Power Module .......................................................................................................................................................11
5.2. IGBT Driver Module.............................................................................................................................................11
5.3. Pad Driver Module ................................................................................................................................................12
6. System Operate...................................................................................................................................13
6.1. Key & Led Definition............................................................................................................................................13
6.2. Operate Descript....................................................................................................................................................14
7. Debug and Programming....................................................................................................................15
7.1. Debug Environment and Tools ..............................................................................................................................15
7.2. Hardware Setup .....................................................................................................................................................15
7.3. MCU Programming...............................................................................................................................................15
8. Appendix.............................................................................................................................................16
8.1. Front Board SCH and BOM-List...........................................................................................................................16
8.2. Main Board SCH and BOM-List...........................................................................................................................17

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Induction Heater C Library User Manual Version 1.2
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1. Introduction
This document has introduced how to use the electromagnetic oven hardware.
The hardware includes two PCB boards (main board and front board), a fan and a pad.

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2. System Features
Power Control
Fan Control
Fan Delay Off
Buzz Control
Led Display
Keyboard
Kettle Detect
Kettle Empty Detect
Timing Power Off(3Hours)
Constant Power Heating
Constant Temperature Heating
IGBT Temp Detect
Plate Temp Detect
IGBT Temp Higher Protect(120℃)
Plate Temp Higher Protect(300℃)
Kettle Empty Protect(300℃)
Sensor Open/Short Detection
Over Current Protect(18A)
Over Voltage Protect(260V)
Lower Voltage Protect(150V)
Surge Protect(1000V)
No Operation for 2 Hours, auto turn off,if no timer
In the system design, we will use some feedback signals to protect system or calculate
watt. The protect signal include over current, over voltage, surge voltage and kettle detect.
Anyone of them appears, the system must stop work. If the IGBT temperature is raise over
60℃, the fan must turn on. If the IGBT temperature is raise over 120℃, the system must stop
work. If the kettle is empty, the plate temp will raise. If the temp raise up to 300℃, the system
must stop work.

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3. System Introduce
3.1. Hardware Block Diagram
The electromagnetic eddy current heating is our system theory. We use the PWM to control
the IGBT to generate the heating eddy current. The fan is use to cool the IGBT. The feedback
signal is used to protect the system and calculate power.
3.2. MCU Resource Usage
MB95F434K Resource Usage
No.
Resource
Usage Info
Remark
1
VCC
5.0V
2
ROM
3
RAM
4
OSC Clock
16.25MHz
5
CPU Clock
8.125MHz
6
GPIO
6 Pins
LED COM(5),Start
7
INTxx
1 Pins (Internal)
Pad osc
8
8/16Bit PPG(Timer)
1 Pins(PPG)
9
ANxx
4 Pins
10
UART0
LED Display
11
Debug
1 Pins
12
Watchdog Timer
Monitor System
13
16Bit Timer0
Keyboard Sample
14
16Bit Timer1
10MS Timer
Protect,Error
Figure-1 Hardware Block Diagram

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3.3. MCU Pin Assignment
No.
Name
Define
Note
Remark
1
PG2/PPG0/X1A/OUT1
sub oscillator
LED COM1
2
PG1/TRG0/ADTG/X0A/BZ/OUT0
sub oscillator
Fan
3
VCC
VCC
Vcc
4
C
C
C
5
P60/OPAMP_P
OPAMP_P
Current by Resistor
6
P61/OPAMP_N
OPAMP_N
7
P62/OPAMP_O
P62
LED COM2
8
P12/EC0/UI/DBG
P12/DBG
Debug
9
P00/INT00/AN00
P00
Start IGBT
10
P01/INT01/AN01/BZ
BZ
Buzzer
11
P02/INT02/AN02/UCK/TRG0
UCK
Serial Clock
12
P03/INT03/AN03/UO/PPG0
UO
Serial Data
13
P04/INT04/AN04/UI/HCLK1
AN04
AC voltage Measuring
14
P05/INT05/AN05/TO0/HCLK2
AN05
AC Current Measuring
15
P06/INT06/AN06/TO1
AN06
Temperature for IGBT
16
P07/INT07/AN07/EC0
AN07
Temperature for plate
17
P70/CMP0_O/OUT0/TRG0
P70
LED COM4
18
P71/CMP0_P
CMP0_P
PAD-L+ Input
19
P72/CMP0_N
CMP0_N
PAD-L- Input
20
P73/CMP1_O/OUT1/PPG0
PPG0
PPG-IGBT
21
P74/CMP1_P
CMP1_P
OverCurrent Reference
Input
22
P75/CMP1_N
CMP1_n
OverCurrent Compare
Input
23
P76/CMP2_O/UCK
P76
LED COM3
24
P63/CMP2_P
CMP2_P
OverVoltage Reference
Input
25
P64/CMP2_N
CMP2_N
OverVoltage Compare
Input
26
P65/CMP3_O/UO
P65
LED COM0
27
P66/CMP3_P
CMP3_P
Surge Reference Input
28
P67/CMP3_N
CMP3_N
Surge Compare Input
29
PF2/RSTX
PF2
Reset
30
PF0/X0
X0
oscillator
31
PF1/X1
X1
oscillator
32
VSS
VSS
Vss

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3.4. IGBT Features

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4. System Hardware
4.1. System Connect Diagram
The whole system includes pad, fan, main board and front board. They are connected as
below.
Figure-2 System Connect Diagram
Connect Order:
Pad to main board;
Pad temp to main board;
Fan to main board;
Front board to main board;

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4.2. Front Board
Figure-3 is the front board image. It is made up of eight led, a 4-bit digital led and eight
buttons.
Figure-3 Front Board
1. Connector, connect to main board.
2. Eight led, to display some status.
3. 4-bit digital led, to display power and time.
4. Eight buttons, to control the system.
1
2
3
4

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4.3. Main Board
Figure-4 is the main board image. It is made up of power module, mcu control module and
IGBT driver module.
Figure-4 Main Board
1. 220VAC, to supply power.
2. Pad Connector, to connect the pad.
3. Buzzer, to note some status.
4. Pad temp connector, to test the pad temperature.
5. IGBT power, to supply power to the IGBT.
6. IGBT, is the IGBT chip.
7. MCU, to control the system.
8. Fan connector, to control the fan.
9. Front connector, to connect the front board.
10.Debug connector, to connect the simulator.
IGBT Driver
Power
Mcu Control
6
2
1
4
8
9
10
3
7
5