Fujitsu PRIMERGY BX924 S3 User manual

PRIMERGY BX924 S3
System configurator and order-information guide
Contents
Instructions
Configuration diagram
Configurator
#XBX924 S3 Dual Socket 20
#XI Processor 21
#XII Storage
#XIII Memory
#XIV iRMC S3, Graphics
#XV
Mezzanine Cards
#
PRIMERGY Server
January 2014

System configurator and order-information guide
PRIMERGY BX924 S3 Status: 2013-12-30
Instructions
This document contains basic product and configuration information that will enable you to configure your system via
System-Architect.
Only the tool "System-Arcitect" will ensure a fast and proper configuration of your PRIMERGY server or your complete
PRIMERGY Rack system.
Please pay attention to the naming conventions: BX924 S3 Dual Server Blade S3
You can configure your individual PRIMERGY server in order to adjust your specific requirements.
The System configurator is divided into several chapters that are identical to the current price list and PC-/ System-Architect.
Please follow the lines. If there is a junction, you can choose which way or component you would like to take. Go through
the configurator by following the lines from the top to the bottom.
Section
IV Memory, example
There are 3 free memory banks available.
The memory banks can be populated with 512MB, 1GB, 2GB and 4GB DDR Memory.
The maximum total amount of memory is 12GB.
It is possible to select memory upgrade options up to 3 times.
ECC with memory scrubbing-function and hot-spare memorybank is standard on the PRIMERGY BX600 S2 Server Blades.
S26361-XXX-XXX S26361-XXX-XXX
Memory XXX MB
Memory XXX MB
X times
max. X times per system max. X times per system
In one chapter you can only select as many components (here 3x) as the arrow indicates. 3x
Please note that there are information symbols which indicate necessary information.
For further information see:
http://ts.fujitsu.com/products/standard_servers/index.html
(internet)
https://partners.ts.fujitsu.com/com/order-supply/configurators/primergy_config/Pages/Currentconfigurators.aspx
(extranet)
Prices and availability see price list and PC-/ System-Architect
Subject to change and errors excepted
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Configuration diagram Dual Server Blade BX924 S3
Mezzanine slot 1
Row 1 (3 DIMMS)
CPU1
Row 2 (3 DIMMS)
Intel CPU
Row 3 (3 DIMMS)
Row 4 (3 DIMMS) 2.5" SSD
Mezzanine slot 2
2.5" SSD
disk mounting kit
Row 1 (3 DIMMS) disk mounting kit
CPU2
Row 2 (3 DIMMS) Disks
Intel CPU
Row 3 (3 DIMMS) UFM
Row 4 (3 DIMMS)
Processor
Memory Mezzanine slot UFM
Key:
Included in basic unit Option
The population order for the CPU is: CPU1 first, then CPU2
The population order for the DIMMs: for each CPU, the DIMM row 1 (DIMMS 1A 1B 1C) (DIMMS 1D 1E 1F) first, then row 2 (DIMMs 2A, 2B, 2C) (DIMMs 2D, 2E, 2F)
or unpopulated
FC Mezz. card
1/10 GbE Mezz. card
IB Mezz. card
CNA Mezz. Card
or
unpopulated
FC Mezz. card
1/10 GbE Mezz. card
IB Mezz. card
CNA Mezz. Card
SAS Mezz. Card
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PRIMERGY BX924 S3 Status: 2013-12-30
Section XDual Socket Server Blade BX924 S3
Server Blade with:
- Dual INTEL Romley Processor Support as Dual-Core / Quad-Core / Six-Core
- The base units with INTEL Processor
- onbaord controller for SATA / SAS (optional)
- 24 DIMM sockets, organized in 3 DPC for each CPU (12 DIMMs per CPU)
- 1x Dual channel 10 Gbit Ethernet CNA controller on-board
- 2 bays for optional 2.5" SATA SSD disks (non hot-plug)
- iRMC S3 on-board
- 1x front side USB connector
- Special connector for Y-cable (2x USB, 1x VGA).
The BX924 S3 Server Blade can be installed max. 18x in the BX900 S1 System Unit
S26361-K1407-V200 S26361-F4478-L2
PY BX924 S3 Dual Server Blade
PY BX900 Y-Cable frontside
up to 2x 2.5" SSD drives. for KVM connection to
Dual Server Blade Base Unit without Server Blade
18x
CPU and without memory modules!
2x USB, 1x VGA
For CPU and Memory configuration see below
Max. 18x per BX900 System Unit.
S26361-F3552-E1
TPM Module
Trusted Platform Module on motherboard
PY TPM Module
Be aware of import restrictions!
Max. 1x per Server Blade.
S26361-F2749-E1 S26361-F2749-E2
Service for Server Blade installation in the System Unit.
Server Blade individually packed / delivered.
Hereby the BX900 will be delivered completely The Server Blade is not built in a BX900,
configured and tested with Server Blades integrated. it is separately tested and delivered.
This order number must be in the same order as the System Unit itself. Contains ServerStart CD
min. 1x per System Unit; max. 18x per System Unit; max. 1x per Server Blade max. 1x per Server Blade
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Section
XI
Processor
There are 2 processor sockets available.
A multi-processor operating system is required for a dual-processor system.
The system can be equipped with two SSDs
The first optional SSD is mounted under the Mezz. Card 1 slot
The second optional SSD is mounted on top of the front CPU
Max. two CPU`s can be selected per basic unit
Note: Max. DDR3 Bus Speed depends on:
One of following CPU´s has to be selected as first CPU - max. DDR3 Bus Speed from the CPU and
for an orderable basic unit
- max. DDR3 Memory Speed and
Optional second CPU has to be the same type like the first CPU
- max. memory modules on one memory channel
Basic 4C CPU's
- 1x 64-bit Intel Xeon (10MB Smart Cache)
1066 MHz DDR3 Bus; 6,40 GT/s QPI Bus and passive heat sink
occupies socket for one CPU
Xeon E5-2603 4C/4T 1.80GHz 10MB 6.40GT/s 1066MHz 80W S26361-F4543-E180
Xeon E5-2609 4C/4T 2.40GHz 10MB 6.40GT/s 1066MHz 80W S26361-F4543-E240
Standard Turbo 6C CPU's
- 1x 64-bit Intel Xeon (15MB Smart Cache); Hyper-Threading (HT);
1333 MHz DDR3 Bus; 7,20 GT/s QPI Bus and passive heat sink
occupies socket for one CPU
Xeon E5-2620 6C/12T 2.00GHz 15MB 7.20GT/s 1333MHz 95W S26361-F4544-E200
Xeon E5-2630 6C/12T 2.30GHz 15MB 7.20GT/s 1333MHz 95W S26361-F4544-E230
Xeon E5-2640 6C/12T 2.50GHz 15MB 7.20GT/s 1333MHz 95W S26361-F4544-E250
Advanced Turbo+ 8C CPU`s
- 1x 64-bit Intel Xeon (20MB Smart Cache); Hyper-Threading (HT);
1600 MHz DDR3 Bus; 8,00 GT/s QPI Bus and passive heat sink
occupies socket for one CPU
Xeon E5-2650 8C/16T 2.00GHz 20MB 8.00GT/s 1600MHz 95W S26361-F4545-E200
Xeon E5-2660 8C/16T 2.20GHz 20MB 8.00GT/s 1600MHz 95W S26361-F4545-E220
Xeon E5-2665 8C/16T 2.40GHz 20MB 8.00GT/s 1600MHz 115W S26361-F4545-E240
On special release only
Xeon E5-2670 8C/16T 2.60GHz 20MB 8.00GT/s 1600MHz 115W S26361-F4545-E260
Xeon E5-2680 8C/16T 2.70GHz 20MB 8.00GT/s 1600MHz 130W S26361-F4545-E270
Xeon E5-2690 8C/16T 2.90GHz 20MB 8.00GT/s 1600MHz 135W S26361-F4545-E290
Special Heatsink required- max 10 DIMMs
Frequency Optimized Turbo 2C, 4C & 6C CPU`s
limited to max 30°C ambient
- 1x 64-bit Intel Xeon (5/10/15MB Smart Cache); Hyper-Threading (HT);
1600 MHz DDR3 Bus; 6,40/7,20 GT/s QPI Bus and passive heat sink
occupies socket for one CPU
Xeon E5-2637 2C/4T 3.00GHz 5MB 6.40GT/s 1600MHz 80W S26361-F4546-E300
Xeon E5-2643 4C/8T 3.3GHz 10MB 6.40GT/s 1600MHz 130W S26361-F4546-E330
Special Heatsink required- max 10 DIMMs
Xeon E5-2667 6C/12T 2.90GHz 15MB 7.20GT/s 1600MHz 130W S26361-F4546-E290
limited to max 30°C ambient
Low Power 4C/6C/8C CPU's
- 1x 64-bit Intel Xeon (15/20MB Smart Cache); Hyper-Threading (HT);
1333/1600 MHz DDR3 Bus; 7,20/8,00 GT/s QPI Bus and passive heat sink
occupies socket for one CPU
Xeon E5-2630L 6C/12T 2.00GHz 15MB 7.20GT/s 1333MHz 60W S26361-F4547-E200
Xeon E5-2650L 8C/16T 1.80GHz 20MB 8.00GT/s 1600MHz 70W S26361-F4547-E180
Max. two CPU`s can be selected per basic unit
One of following CPU´s has to be selected as second CPU
for an orderable basic unit
Optional second CPU has to be the same type like the first CPU
Basic 4C CPU's
- 1x 64-bit Intel Xeon (10MB Smart Cache)
1066 MHz DDR3 Bus; 6,40 GT/s QPI Bus and passive heat sink
occupies socket for one CPU
Xeon E5-2603 4C/4T 1.80GHz 10MB 6.40GT/s 1066MHz 80W S26361-F4548-E180
Xeon E5-2609 4C/4T 2.40GHz 10MB 6.40GT/s 1066MHz 80W S26361-F4548-E240
Standard Turbo 6C CPU's
- 1x 64-bit Intel Xeon (15MB Smart Cache); Hyper-Threading (HT);
1333 MHz DDR3 Bus; 7,20 GT/s QPI Bus and passive heat sink
occupies socket for one CPU
Xeon E5-2620 6C/12T 2.00GHz 15MB 7.20GT/s 1333MHz 95W S26361-F4549-E200
Xeon E5-2630 6C/12T 2.30GHz 15MB 7.20GT/s 1333MHz 95W S26361-F4549-E230
Xeon E5-2640 6C/12T 2.50GHz 15MB 7.20GT/s 1333MHz 95W S26361-F4549-E250
Advanced Turbo+ 8C CPU`s
- 1x 64-bit Intel Xeon (20MB Smart Cache); Hyper-Threading (HT);
1600 MHz DDR3 Bus; 8,00 GT/s QPI Bus and passive heat sink
occupies socket for one CPU
Xeon E5-2650 8C/16T 2.00GHz 20MB 8.00GT/s 1600MHz 95W S26361-F4550-E200
Xeon E5-2660 8C/16T 2.20GHz 20MB 8.00GT/s 1600MHz 95W S26361-F4550-E220
Xeon E5-2665 8C/16T 2.40GHz 20MB 8.00GT/s 1600MHz 115W S26361-F4550-E240
On special release only
Xeon E5-2670 8C/16T 2.60GHz 20MB 8.00GT/s 1600MHz 115W S26361-F4550-E260
Xeon E5-2680 8C/16T 2.70GHz 20MB 8.00GT/s 1600MHz 130W S26361-F4550-E270
Xeon E5-2690 8C/16T 2.90GHz 20MB 8.00GT/s 1600MHz 135W S26361-F4550-E290
limited to max 30°C ambient
Frequency Optimized Turbo 2C, 4C & 6C CPU`s
- 1x 64-bit Intel Xeon (5/10/15MB Smart Cache); Hyper-Threading (HT);
1600 MHz DDR3 Bus; 6,40/7,20 GT/s QPI Bus and passive heat sink
occupies socket for one CPU
Xeon E5-2637 2C/4T 3.00GHz 5MB 6.40GT/s 1600MHz 80W S26361-F4551-E300
Xeon E5-2643 4C/8T 3.3GHz 10MB 6.40GT/s 1600MHz 130W S26361-F4551-E330
limited to max 30°C ambient
Xeon E5-2667 6C/12T 2.90GHz 15MB 7.20GT/s 1600MHz 130W S26361-F4551-E290
Low Power 4C/6C/8C CPU's
- 1x 64-bit Intel Xeon (15/20MB Smart Cache); Hyper-Threading (HT);
1333/1600 MHz DDR3 Bus; 7,20/8,00 GT/s QPI Bus and passive heat sink
occupies socket for one CPU
Xeon E5-2630L 6C/12T 2.00GHz 15MB 7.20GT/s 1333MHz 60W S26361-F4552-E200
Xeon E5-2650L 8C/16T 1.80GHz 20MB 8.00GT/s 1600MHz 70W S26361-F4552-E180
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Section XII Storage
Both hard disks are plugged in directly connected to the onboard controller.
Two disks can be configured!
One UFM can be installed independent from the disk drives
Remark: UFM is part of the VMWare Embedded solution (S26361-F2341-E431)
SSD/HDD LIMITATION
The second SSD only be configured with max. 115W CPUs
Support for 2x SSD and 115W CPUs needs MMB FW >= 5.02
Support for 1x HDD is possible and intended for HPC customer
No mixing of SAS and SATA SSDs allowed
S26361-F4008-E3 S26361-F4008-E4 Using the S26361-F4008-E4
BX924 S3 disk mount. kit (PCH) BX924 S3 disk mount. kit (SAS RAID)
requires the SAS Mezz Card
1x supports up to 2 SSDs
supports up to 2 SSDs
and the SAS connection kit
connected to onboard PCH connected to SAS RAID Mezz.
max. 1x per base unit max. 1x per base unit
SSD SAS, MLC, 6Gb/s
100GB S26361-F4580-E100
200GB S26361-F4580-E200
1-2x 400GB S26361-F4580-E400
S26361-F5124-E100 S26361-F5124-E200 S26361-F5124-E400
SSD SATA 100GB, MLC SSD SATA 200GB, MLC SSD SATA 400GB, MLC
Solid State Disk Solid State Disk Solid State Disk
1-2x SATA 6Gb/s SATA 6Gb/s SATA 6Gb/s
Mainstream Perfomance Mainstream Perfomance Mainstream Perfomance
non hot plug/hot replace
non hot plug/hot replace non hot plug/hot replace
max. 1-2x per base unit max. 1-2x per base unit max. 1-2x per base unit
S26361-F3798-E100
HD SATA 6G 1TB 5.4K rpm
1x ECO-SATA 6Gb/s, AF(512e)
non hot-plug
max. 1x per base unit
Section RAID Functionality on Server Blade
LSI
This upgrade is only needed to drive SAS devices
Patsburg B with the onboard PCH chipset controller
RAID 0, 1 & 10
F
max. 1x per system
SAS 3Gb/sec
S26361-F3674-E1
Onboard Controller SAS upgrade
Remark: Currently VMWare RAID configurations are only supported with the SAS
RAID Mezz Card and Disk mount kit (SAS RAID)
no controller cache
4 internal ports
PCIe x4
no PCI slot required
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Section
III Memory
- There are 12 memory slots per CPU for max.
384GB LRDIMM (12x 32GB 4R)
192GB RDIMM (12x 16GB 2R)
32GB UDIMM (8x 4GB)
=> max. 768GB for two CPU`s ( 384GB per CPU ), using LRDIMM
- The memory area is divided into 4 channels per CPU with 3 slots per channel
- Slot 1 of each channel belongs to memory bank 1, the slot 2 belongs to memory bank 2,
slot 3 belongs to memory bank 3
Registered, LR DIMMs and unbuffered memory modules can be selected
No mix of registered, load reduced and unbuffered modules allowed.
Memory can be operated at 1.5V or 1.35V, even if the modules are of low voltage type.
Memory operating voltage can be set within BIOS (1.5V is default setting for max. speed).
In a 2 DIMMs per channel configuration, following frequencies are supported:
- 1.5V - 1600MHz max (depending on CPU, special memory modules)
- 1.35V - 1333MHz max (depending on CPU)
In a 3 DIMMs per channel configuration, memory will operate at 1.5V only.
SDDC (Chipkill) is supported for registered / load redueced x4 organized memory modules only
1.) In the "Independent Channel Mode" is following configuration possible
Channels can be populated in any order in Independent Channel Mode. All four
channels may be populated in any order and have no matching requirements. All
channels must run at the same interface frequency but individual channels may run at
different DIMM timings (RAS latency, CAS latency, and so forth)
No mix of registered, load reduced and unbuffered modules allowed.
2.) "Rank Sparing Mode" configuration
- Within a memorychannel, one rank is a spare of the other ranks.
The Spare Rank is held inreserve and is not available as system memory
For the effective memory capacity, please refer to the spreadsheet below.
The BIOS is set to the rank sparingsetting.
Minimum configuration is: 2x 1R, 2x 2R or 1x4R DDR3 module per channel
This mode is not supported by x8 organized memory modules
3.) "Performance Mode" configuration
- In this configuration, the memory module population ex factory is spread across all channels.
The BIOS is set to the max. performance for memory.
Minimum configuration is: 4x identical modules
4.) In the "Mirrored Channel Mode" is following configuration possible
- Each memory bank can optionally be equipped with 4x registered or load reduced
In each memory bank channel Aand B / C and D of CPU 1 or channel E and F / G and H of CPU 2 have to be
equipped with identical modules for mirrored channel mode.
In channel B / D is always the mirrored memory of channel A / C of CPU 1
In channel F / H is always the mirrored memory of channel E / G of CPU 2
Minimum configuration is: 4x identical modules
This mode is not supported by x8 organized memory modules
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S26361-F3694-E10
Independent Mode
Independent Channel Mode allows all channels to be populated inany order. No specific Memory RAS features are defined
Requires min 1 memory Module per CPU
S26361-F3694-E1 Rank Sparing Mode Installation
BIOS Setup factory preinstalled to this mode. One Rank is spare of other ranks on the same channel. Spare Rank is not shown in System Memory.
For effective capacity within a channel, please have a look below.
Supported for RDIMM / LRDIMM only.
1x per CPU Requires min 2x 1R/2R or 1x 4R modules per CPU
S26361-F3694-E2 Performance Mode Installation
BIOS Setup factory preinstalled for max. Performance, LV memory might be set to 1.5V operation. Four identical memory modules
will be equipped in one memory bank to achieve highest memory performance. All four modules are active and full capacity can be used.
Multiple of 4 identical modules to be configured per CPU
S26361-F3694-E3
Mirrored Channel Mode Installation
BIOS Setup factory preinstalled to this mode. Four identical memory modules are always equipped in one memory bank to use the
Mirrored channel Mode. Only two modules contain active data, the remain two modules contain mirrored data
Supported for RDIMM / LRDIMM only.
Multiple of 4 identical modules to be configured per CPU
1R
2R
1R
2R
4R
4R
na na na na na
na na
na na
Minimum one memory module or order code per CPU = first memory
Note 1.)
Unbuffered Memory (UDIMM) no SDDC (chipkill) support
Max. DDR3 memory speed depends on the memory configuration
- one DDR3 unbuffered ECC mem. Module, 1.35V
(No of mem modules per channe) as well as on the CPU type.
Choose up to 8 order codes per CPU The memory channel with the lowest speed defines the speed
of all CPU channels in the system, also for the channels of the
2GB (1x2GB) 1Rx8 L DDR3-1600 U ECC S26361-F3694-E613 second CPU if configured.
4GB (1x4GB) 2Rx8 L DDR3-1600 U ECC S26361-F3694-E614 For real memory speed (depending on memory type / population),
Registered Memory (RDIMM) no SDDC (chipkill) support please check the spreadsheet "Memory speed" below
- one DDR3 registered ECC mem. Module, 1.35V
No mix with any other types of memory modules possible
Choose up to 12x for 1R/2R or 8x for 4R per CPU
For performance reasons, we do not recommend
8/12x per
to configure more than 8 DIMMs per CPU
CPU, max. 4GB (1x4GB) 2Rx8 L DDR3-1600 R ECC S26361-F3695-E614
2/3 modules Registered Memory (RDIMM) with SDDC (chipkill) support
per channel - one DDR3 registered ECC mem. Module, 1.35V
1333MHz supported with up to 2DPC (8 modules/CPU)
Choose up to 12 order codes per CPU
4GB (1x4GB) 1Rx4 L DDR3-1333 R ECC S26361-F3696-E614 new due to supply
8GB (1x8GB) 2Rx4 L DDR3-1333 R ECC S26361-F3696-E615 new due to supply
2/3 modules Registered Memory (RDIMM) with SDDC (chipkill) support
per channel - one DDR3 registered ECC mem. Module, 1.35V
1600MHz supported with up to 2DPC (8 modules/CPU)
at 1.5V Mix of memory modules is only possible within the same group
Choose up to 12 order codes per CPU
4GB (1x4GB) 1Rx4 L DDR3-1600 R ECC S26361-F3697-E614
8GB (1x8GB) 2Rx4 L DDR3-1600 R ECC S26361-F3697-E615
16GB (1x16GB) 2Rx4 L DDR3-1600 R ECC S26361-F3697-E616
Load Reduced Memory (LRDIMM) with SDDC (chipkill) support
- one DDR3 load reduced ECC mem. Module, 1.35V
Choose up to 12 order codes per CPU
16GB (1x16GB) 4Rx4 L DDR3-1333 LR ECC S26361-F3698-E616
32GB (1x32GB) 4Rx4 L DDR3-1333 LR ECC S26361-F3698-E617
G
Effective Memory capacity / Rank Sparing Mode, 1 Channel populated
UDIMM
RDIMM
LRDIMM
2GB
2GB
4GB
8GB
2R
16GB
3DPC
8GB
20GB
40GB
40GB
80GB
16GB
32GB
1DPC
12GB
24GB
2DPC
4GB
12GB
24GB
28GB
56GB
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Memory Configuration PRIMERGY BX924 S3
Each CPU offers 12 Slots for DDR3 Memory Modules organised in 3 Banks and 4 Channels.
If you need more than 12 Slots you have to configure the 2nd CPU.
Depending on the amount of memory configured you can decide between 4 basic modes of operation (see explanation below).
There are 3 different kinds of DDR3 Memory Modules available: UDIMM / RDIMM and LRDIMM
UDIMM / RDIMM / LRDIMM offer different functionality. Mix of UDIMM / RDIMM / LRDIMM is not alloved.
If 1.5V and 1.35V DIMMs are mixed, the DIMMs will run at 1.5V
Mode Configuration Application
SDDC (chipkill) support any no no yes detect multi-bit errors
Independant Channel 1, 2 or 3 Modules per Bank yes yes yes offers max. flexibility, upgradeability, capacity
Mode
use UDIMM modules for lowest cost
Mirrored Channel Mode *) 4 identical Modules / Bank no no yes offers maximum security
Performance Mode 4 identical Modules / Bank yes yes yes offers maximum performance and capacity
Rank Sparing Mode *) min. 2 Ranks / Channel no no yes
balances security and capacity
*) For the delivery ex works the system will be prepared with dedicated BIOS setting.
Capacity Configuration UDIMM RDIMM LRDIMM Notes
Min. Memory per CPU
1 Module / CPU
1x2GB 1x4GB 1x 16GB
with one CPU
Max. Memory per CPU 8/12 Modules / CPU 8x4GB 12x16GB
12x 32GB
with one CPU
Max. Memory per System 16/24 Modules / System 64GB 384GB 768GB if second CPU is configured
Memory-Speed:
Max. DDR3 memory speed depends on the memory configuration on one memory channel and the speed of the CPU
The memory channel with the lowest speed defines the speed of all CPU channels in the system
Voltage setting (BIOS)
DPC DPC DPC DPC DPC DPC DPC DPC DPC DPC DPC DPC DPC DPC DPC DPC DPC DPC
CPU with 1333MHz DDR3 Bus
CPU with 1066MHz DDR3 Bus
1R - Single Rank
2R - Dual Rank
4R - Quad Rank
1DPC = 1 DIMM per Channel
2DPC = 2 DIMM per Channel
3DPC = 3 DIMM per Channel
Configuration hints:
- The memory sockets on the systemboard offer a color coding:
Bank I black sockets
Bank II blue sockets
Bank III
green sockets
- A so called Bank consits of 1 memory module on every Channel available on one CPU (examples see below)
Bank I on CPU 1/2 up to 4 memory modules connected to Channel A - H on the 1st/2nd CPU
Bank II on CPU 1/2 up to 4 memory modules connected to Channel A - E on the 1st/2nd CPU
Bank III on CPU 1/2
up to 4 memory modules connected to Channel A - E on the 1st/2nd CPU
(can not be populated by UDIMM or 4R RDIMM memory modules)
- See below and next page for a detailed descriptions of the memory configuration supported.
UDIMM
RDIMM
RDIMM
LRDIMM
x8
x8
x4
Mem. Speed provided
by CPU
Real maximum memory-bus speed depending on CPU type, memory configuration (DPC)
and voltage setting (BIOS)
UDIMM 1600MHz
RDIMM 1600MHz
LRDIMM 1333MHz
1.5V [default]
1.35V
1.5V [default]
1.35V
1.5V [default]
1.35V
1
2
3
1
2
3
1
2
3
1
2
3
CPU with 1600MHz DDR3 Bus
1333
1333
-
1066
1066
-
1
2
3
1
2
3
1333
1333
1066
1066
1066
-
-
1600
1600
1066
1333
1333
-
-
1600
-
1333
-
1066
1066
-
1333
1333
1066
1333
1333
-
1066
1066
-
1066
1066
-
1333
1333
1066
1066
1066
1066
1333
1333
-
1066
1066
-
1066
1066
-
1066
1066
1066
1066
1066
-
on special release
as soon as available
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1. Independent Channel Mode PRIMERGY BX924 S3 Status: 2013-12-30
required
required if 2nd CPU is configured
Bank I Data Data Data Data Data Data Data Data optional, same type in Bank per CPU
(black sockets)
Bank II Data Data Data Data Data Data Data Data optional, any type
(blue sockets)
Bank III
Data Data Data Data Data Data Data Data -------- not used
(green sockets)
Independent Channel Mode allows all channels to be populated in any order
Can run with differently rated DIMMs and use the settings of the slowest DIMM installed in the system
2. Mirrored Channel Mode
required
required if 2nd CPU is configured
Bank I Data Mirror Data Mirror Data Mirror Data Mirror optional, same type in Bank per CPU
(black sockets)
Bank II Data Mirror Data Mirror Data Mirror Data Mirror -------- not used
(blue sockets)
Bank III
Data Mirror Data Mirror Data Mirror Data Mirror
(green sockets)
Mirrored Channel Mode requires identical modules on channel A,B, C, D (1st CPU) or channel E, F, G and H (2nd CPU)
50% of the capacity is used for the mirror => the available memory for applications is only half of the installed memory
If this mode is used, a multiple of 4 identical modules has to be ordered.
3. Performance Channel Mode
required
required if 2nd CPU is configured
Bank I Data Data Data Data Data Data Data Data optional, same type in Bank per CPU
(black sockets)
Bank II Data Data Data Data Data Data Data Data optional, any type
(blue sockets)
Bank III
Data Data Data Data Data Data Data Data -------- not used
(green sockets)
Performance Channel Mode requires identical modules on all channels of each Bank per CPU.
If this mode is used, a multiple of 4 identical modules has to be ordered.
Channel G
Channel H
1st XEON CPU
(4/6/8 Core)
2nd XEON CPU
(4/6/8 Core)
Channel A
Channel B
Channel C
Channel D
Channel E
Channel F
Channel A
Channel B
Channel C
Channel D
Channel E
Channel F
Channel G
Channel H
1st XEON CPU
(4/6/8 Core)
2nd XEON CPU
(4/6/8) Core)
Channel A
Channel B
Channel C
Channel D
Channel E
Channel F
Channel G
Channel H
1st XEON CPU
(4/6/8 Core)
2nd XEON CPU
(4/6/8) Core)
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4. Rank Sparing Mode PRIMERGY BX924 S3 Status: 2013-12-30
required
required if 2nd CPU is configured
Bank I Spare Spare Spare Spare Spare Spare Spare Spare optional, same type in Channel per CPU
(black sockets)
Bank II Data Data Data Data Data Data Data Data optional, any type
(blue sockets)
Bank III
Data Data Data Data Data Data Data Data
-------- not used
(green sockets)
Bank I R1 Spare Spare Spare Spare Spare Spare Spare Spare
required
(black) R2 Data Data Data Data Data Data Data Data
required if 2nd CPU is configured
Bank II R1 Data Data Data Data Data Data Data Data
(blue) R2 Data Data Data Data Data Data Data Data optional, same type in Channel per CPU
Bank III
R1 Data Data Data Data Data Data Data Data optional, any type
(green) R2 Data Data Data Data Data Data Data Data
-------- not used
Bank I R1 Spare Spare Spare Spare Spare Spare Spare Spare
required
(black) R2 Data Data Data Data Data Data Data Data
R3 Data Data Data Data Data Data Data Data required if 2nd CPU is configured
R4 Data Data Data Data Data Data Data Data
optional, same type in Channel per CPU
Bank II R1 Data Data Data Data Data Data Data Data
(blue) R2 Data Data Data Data Data Data Data Data optional, any type
R3 Data Data Data Data Data Data Data Data
R4 Data Data Data Data Data Data Data Data -------- not used
Bank III
R1 Data Data Data Data Data Data Data Data
(green) R2 Data Data Data Data Data Data Data Data
R3 Data Data Data Data Data Data Data Data
R4 Data Data Data Data Data Data Data Data
Rank Sparing Mode requires identical modules (same capacity and technology) within the same channel.
The available memory for applications will vary depending on configuration. Please refer to the spreadsheet above
"Effective Memory capacity with active Rank Sparing Mode". Population rule for Rank sparing mode is to achieve max.
available memory, e.g. 6 DIMMs will be spread across two channels, each with 3DPC
Channel F
Channel G
Channel H
1st XEON CPU
(4/6/8 Core)
2nd XEON CPU
(4/6/8) Core)
2-Rank Memory modules (RDIMM)
1-Rank Memory modules (RDIMM)
Channel A
Channel B
Channel C
Channel D
Channel E
Channel F
Channel G
Channel H
1st XEON CPU
(4/6/8 Core)
2nd XEON CPU
(4/6/8) Core)
Channel G
Channel H
1st XEON CPU
(4/6/8 Core)
2nd XEON CPU
(4/6/8) Core)
4-Rank Memory modules (LRDIMM)
Channel A
Channel B
Channel C
Channel D
Channel E
Channel A
Channel B
Channel C
Channel D
Channel E
Channel F
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GPRIMERGY BX924 S3 Status: 2013-12-30
Section
XIV iRMC S3, Graphics
Graphic Controller is part of the onboard Management Controller iRMC S3.
Other graphics are not possible.
The iRMC S3 advanced pack is included in the system delivery.
A corresponding license order is not necessary.
Section
XV Mezzanine cards for Dual Socket Server Blade
The Dual Server Blade supports the following optional mezzanine cards.
A Fibre Channel Switch / Pass-Thru blade, an Ethernet LAN Switch / Pass-Thru blade,
respectively an InfiniBand switch is required in the system unit for this functionality.
S26361-F4480-E1 S26361-F4481-E1
PY SAS HBA Mezz Card 6Gb PY SAS RAID Mezz Card 6Gb SAS Mezz. Card
HBA
MegaRAID Only to be used in slot 2
SAS 2.0
SAS 2.0
pluggable on the main board pluggable on the main board
PCIe Gen2 interface
PCIe Gen2 interface
4x SAS links to midplane
4x SAS links to midplane
1x 2x SAS links to internal HDD's
max. 1x per Server Blade max. 1x per Server Blade
S26361-F4481-E30 To connect the SSDs to the
SSD Connection Kit SAS RAID Mezz Card
Riser and Bracket
S26361-F4008-E4 and
max. 1x per Server Blade S26361-F4481-E30
are required
Requires an Ethernet LAN Requires a Fibre Channel Requires an InfiniBand
Switch, IBP or Pass-Thru Switch for each channel. Switch for each Mezz Card.
Blade for each channel.
S26361-F3331-E1 S26361-F3874-E1 S26361-F3992-E2 S26361-F4534-E1
PY Eth Mezz Card 1Gb 4 Port PY FC Mezz Card 8Gb 2 Port PY IB CX2 Mezz Card 40Gb 2 Port PY IB CX3 Mezz Card 56Gb 2 Port
2x Intel Zoar controller
Emulex LPe12002 compatible
Interface to midplane:
Interface to midplane:
4x 10/100/1000 Mbit/s.
pluggable on the main board,
2x 10Gb/s(SDR), 2x 20Gb/s(DDR)
2x 10Gb/s(SDR), 2x 20Gb/s(DDR)
pluggable on the main board, MC-FC82E 2x 40Gb/s(QDR)
2x 40Gb/s(QDR) 2x 56Gb/s(FDR)
four channel 1Gbit/s Dual channel 8Gbit/s Dual channel 40Gbit/s each Dual channel 56Gbit/s each
PCIe x4 Interface PCIe x8 interface PCIe x8 interface
PCIe x8 interface
max. 2x per Server Blade
max. 2x per Server Blade
max. 2x per Server Blade max. 2x per Server Blade
S26361-F3997-E1
PY Eth Mezz Card 10Gb 2 Port
Intel 82599EB LAN Controller
2x 10Gbit/s.
pluggable on the main board,
0 - 2x Dual channel 10Gbit/s
PCIe x8 Interface
iSCSI Boot (planned)
max. 2x per Server Blade
S26361-F3592-E532
PY CNA Mezz Card 10Gb 2 Port
Emulex OCe11102 compatible
pluggable on the main board
MC-CNA112E
Dual channel 10Gbit/s
PCIe x8 Interface
max. 2x per Server Blade
R S T U V
R: see separate BX900 System Unit configurator, sheet "1 GB Ethernet"
S: see separate BX900 System Unit configurator, sheet "10 GB Ethernet"
T: see separate BX900 System Unit configurator, sheet "Fibre Channel"
U: see separate BX900 System Unit configurator, sheet "InfiniBand"
V: see separate BX900 System Unit configurator, sheet "CB SAS"
https://partners.ts.fujitsu.com/com/order-supply/configurators/primergy_config/current/Pages/default.aspx
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PRIMERGY BX924 S3 Status: 2013-12-30
Change Report
Date Order number Changes
2013-10-18 optional USB Comps no longer available
2013-06-19 S26361-F3674-E1 Corrected SAS Speed to 3 Gb/s
2013-05-13 S26361-F3798-E100 2.5" ECO-SATA 1TB HDD added
2013-05-13 S26361-F3747-* 2.5" ECO-SATA HDD removed
2012-10-08 changed product picture
2012-10-02 changed USB info
2012-07-23 SSD with 115W allowed with MMB update
2012-07-23 SSD order codes update
2012-06-28 S26361-F4478-L2 New Y Cable 2 end
2012-04-24 S26361-F4481-E1/E30 SAS RAID Mezz - not yet released for BX924 S3
2012-04-20 Memory voltage / frequency spreadsheet, 3DPC at 1.5V only
2012-03-23 Removed link from SAS HBA Mezz. to SSD Connection Kit.
2012-03-21 Added CPU /SSD limitation
2012-03-21 S26361-F4481-E10 removed iBBU
2012-03-16 Added 1x SATA HDD
2012-03-08 limited special HS ambient 30°C temperature
2012-03-07 S26361-F4582-E64/E32 New SSD Ordercodes
2012-02-29 First release
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