manuals.online logo
Brands
  1. Home
  2. •
  3. Brands
  4. •
  5. Gan Systems
  6. •
  7. Motherboard
  8. •
  9. Gan Systems GS66502B-EVBDB User manual

Gan Systems GS66502B-EVBDB User manual

This manual suits for next models

5

Other Gan Systems Motherboard manuals

Gan Systems GSWP100W-EVBPA User manual

Gan Systems

Gan Systems GSWP100W-EVBPA User manual

Gan Systems GS65011-EVBEZ User manual

Gan Systems

Gan Systems GS65011-EVBEZ User manual

Gan Systems GS-EVB-HBDB-IMS User manual

Gan Systems

Gan Systems GS-EVB-HBDB-IMS User manual

Gan Systems GSWP300W-EVBPA User manual

Gan Systems

Gan Systems GSWP300W-EVBPA User manual

Gan Systems GS66508T-EVBHB User manual

Gan Systems

Gan Systems GS66508T-EVBHB User manual

Gan Systems GS61004B-EVBCD User manual

Gan Systems

Gan Systems GS61004B-EVBCD User manual

Gan Systems GS-EVB-DRG-100V7R-GS2 User manual

Gan Systems

Gan Systems GS-EVB-DRG-100V7R-GS2 User manual

Gan Systems GSP665HPMB-EVBIMS2 User manual

Gan Systems

Gan Systems GSP665HPMB-EVBIMS2 User manual

Gan Systems GSWP050W-EVBPA User manual

Gan Systems

Gan Systems GSWP050W-EVBPA User manual

Gan Systems GS66504B-EVBDB GaN E-HEMT User manual

Gan Systems

Gan Systems GS66504B-EVBDB GaN E-HEMT User manual

Popular Motherboard manuals by other brands

Gigabyte MNJ190I-FH user manual

Gigabyte

Gigabyte MNJ190I-FH user manual

Biostar HI-FI-Z87X-3D Setup manual

Biostar

Biostar HI-FI-Z87X-3D Setup manual

Atmel SAM9753PIA-DK user guide

Atmel

Atmel SAM9753PIA-DK user guide

Coapt GEN2 Handbook

Coapt

Coapt GEN2 Handbook

Supero SUPER P4DL6 user manual

Supero

Supero SUPER P4DL6 user manual

Cypress CY3210-PSoCEVAL1 quick start guide

Cypress

Cypress CY3210-PSoCEVAL1 quick start guide

ASROCK B660M-HDV manual

ASROCK

ASROCK B660M-HDV manual

Fujitsu D2831 Short description

Fujitsu

Fujitsu D2831 Short description

Industrial Computers ADE-6050 user manual

Industrial Computers

Industrial Computers ADE-6050 user manual

Asus TUF Z270 MARK 2 manual

Asus

Asus TUF Z270 MARK 2 manual

DFI NB71-BC user manual

DFI

DFI NB71-BC user manual

ASROCK H61 Pro BTC user manual

ASROCK

ASROCK H61 Pro BTC user manual

Norco POS-7893 user manual

Norco

Norco POS-7893 user manual

Intel DG965MS specification

Intel

Intel DG965MS specification

Asus B85M-VIEW PAKER user manual

Asus

Asus B85M-VIEW PAKER user manual

Asus P5G41T-M LX V2 user manual

Asus

Asus P5G41T-M LX V2 user manual

Gigabyte GA-K8VT800-RH user manual

Gigabyte

Gigabyte GA-K8VT800-RH user manual

Gigabyte Z790M AORUS ELITE user manual

Gigabyte

Gigabyte Z790M AORUS ELITE user manual

manuals.online logo
manuals.online logoBrands
  • About & Mission
  • Contact us
  • Privacy Policy
  • Terms and Conditions

Copyright 2025 Manuals.Online. All Rights Reserved.

Visit www.gansystems.com for the latest version of this user’s guide.
This evaluation kit is designed for engineering evaluation in a controlled
lab environment and should be handled by qualified personnel ONLY.
High voltage will be exposed on the board during the test and even brief
contact during operation may result in severe injury or death.
Never leave the board operating unattended. After it is de-energized,
always wait until all capacitors are discharged before touching the board.
This product contains parts that are susceptible to damage by electrostatic
discharge (ESD). Always follow ESD prevention procedures when
handling the product.
The GS665XXX-EVBDB daughter board style evaluation kit consists of two GaN Systems 650V GaN
Enhancement-mode HEMTs (E-HEMTs) and all necessary circuits including half bridge gate drivers,
isolated power supplies and optional heatsink to form a functional half bridge power stage. It allows
users to easily evaluate the GaN E-HEMT performance in any half bridge-based topology, either with the
universal mother board (P/N: GS665MB-EVB) or users’ own system design for quick prototyping.
Serves as a reference design and evaluation tool as well as deployment-ready solution for easy in-
system evaluation.
Vertical mount style with height of 35mm, which fits in majority of 1U design and allows
evaluation of GaN E-HEMT in traditional through-hole type power supply board.
Current shunt position for switching characterization testing
Universal form factor and footprint for all products
The daughter board and universal mother board ordering part numbers are below:
Part Number
GaN E-HEMT P/N:
Description
GS66502B-EVBDB
GS66502B
GaN E-HEMT 650V/7.5A, 200mΩ
GS66504B-EVBDB
GS66504B
GaN E-HEMT 650V/15A, 100mΩ
GS66508B-EVBDB
GS66508B
GaN E-HEMT 650V/30A, 50mΩ
GS66508T-EVBDB
GS66508T
GaN E-HEMT top side cooled 650V/30A, 50mΩ
GS66516T-EVBDB
GS66516T
GaN E-HEMT top side cooled 650V/60A, 25mΩ
GS665MB-EVB
GS665MB-EVB
Universal 650V Mother Board
The daughter board GS665XXX-EVBDB circuit diagram is shown in Figure 1. The control logic inputs on
2x3 pin header J1 are listed below:
Pin
Descriptipon
ENA
Enable input. It is internally pulled up to VCC, a low logic disables all the PWM gate
drive outputs.
VCC
+5V auxillary power supply input for logic circuit and gate driver. On the daughter
board there are 2 isolated 5V to 9V DC/DC power supplies for top and bottom switches.
VDRV
Optional 9V gate drive power input. This pin allows users to supply separate gate drive
power supply. By default VDRV is connected to VCC on the daughter board via a 0 ohm
jumper FB1. If bootstrap mode is used for high side gate drive, connect VDRV to 9V
PWMH
High side PWM logic input for top switch Q1. It is compatible wth 3.3V and 5V
PWML
Low side PWM logic input for bottom switch Q2. It is compatible wth 3.3V and 5V
0V
Logic inputs and gate drive power supply ground return.
The 3 power pins are:
VDC+: Input DC Bus voltage
VSW: Switching node output
VDC-: Input DC bus voltage ground return. Note that control ground 0V is isolated from VDC-.
Si8271 Iso.
Gate Driver Q1
Q2
Si8271 Iso.
Gate Driver
Iso. DC/DC
or Bootstrap
Iso. DC/DC
VDC+
VSW
VDC-
VCC
ENABLE
JP1
C4-10
PWMH
PWML
A. 2x GaN Systems 650V E-HEMT GS66508T(30A/50mΩ) or GS66516T (60A/25 mΩ). The PCB
footprints are universal and compatible for both packages
B. 5V-9V isolated DC/DC gate drive power supply
C. Decoupling capacitors C4-C11
D. Isolated gate driver Silab Si8271
E. Optional current shunt position JP1.
F. Test points for bottom Q2 VGS.
G. Recommended probing positions for Q2 VDS.
H. Holes for temperature monitoring of Q1/Q2
I. M3 mounting screw for heatsink
J. (Optional) RC snubber circuit
This daughter board includes two GaN Systems E-HEMT GS66508T (650V/30A, 50mΩ) or
GS66516T (650V/60A, 25mΩ) in a GaNPx™ Top cooled T type package, . The thermal pad on the
top of device is internally connected to the source. Electrical insulation will be needed for
heatsink attachment. GaNPx™ T package also features dual symmetrical gate for easier
paralleling and PCB layout.
Bipolar gate drive bias with +6V and -3V for turning off is chosen for this design for more robust
gate drive and better noise immunity.
5V-9V isolated DC/DC converters are used for gate drive. 9V is then splited into +6V and -3V bias
by using 6V Zener diode
By default gate drive supply input VDRV is tied to VCC +5V via 0Ωjumper (FB1). Remove FB1 if
separate gate drive input voltage is to be used.
Silab SI8271-GB-IS (3V UVLO) or SI8271–AB-IS (5V UVLO) isolated gate driver can be used for
this design. Both drivers are compatible with 6V/-3V gate drive and has CMTI dv/dt immunity
up to 200V/ns. It has separated source and sink drive outputs which eliminates the need for
additional diode.
GaN E-HEMT switching speed and slew rate can be directly controlled by the gate resistors. By
default the turn-on Rgate (R6/R12) is 10Ωand Rg_off (R7/R14) is 2Ω. User can adjust the values
of gate resistors to fine tune the turn-on and off speed.
FB1/FB2 are footprints for optional ferrite bead. By default they are populated with 0Ωjumpers.
If gate oscillation is observed, it is recommended to replace them with ferrite bead with Z=10-
20Ω@100MHz.
RS1/CS1 and RS2/CS2 are place holders to allow user to experiement with RC snubber circuit (not
installed). At high frequency operation the power dissipation for RS1/RS2 needs to be closely watched
and CS1/CS2 should be sized correctly. It is recommended to start with 33-47pF and 10-20Ω.
PS2
PES1-S5-S9-M
GND
1
VIN
2+VO 5
0V 4
NC
8
0V
VDRV
C14
4.7uF
C0805
VDDL_+6V
C15
4.7uF
C0805
GNDL
C16
4.7uF
C0805
R9
3.3K
LED2
LED-0603
U4
SI8271GB-IS
VI
1
VDDI
2
GNDI
3
EN
4GNDA 5
VO- 6
VO+ 7
VDD 8
PWML
DZ2
6.2V
SOD323-AC
AC
R16
1K
VEEL GNDL
C21
4.7uF
C0805
GNDL
C22
1uF GNDL
VEEL
JP1
CON-JMP-CSHUNT
R10
3.3K
R11
10R
PWML_IN
PGND
Q2S
Q2A
GS66508T
1
2
4
3
Q2B
GS66516T
1
2
43
ENABLE
Q2G2
R13
3.3K
Q2G
FB3
0R
R12
10R
R14
2R
Q2_GOUTQ2_VO+
RS2
10R
R1206
Q2_VO-
C17
1uF CS2
200p
C1206
DNP
DNP
VDDL_+6V
C18
1uF
0V
VCC_+5V
The board provides an optional current shunt position JP1 between the source of Q2 and power
ground return. This allows drain current measurement for switching characterization test such as
Eon/Eoff measurement.
The JP1 footprint is compatible with T&M Research SDN series coaxial current shunt
(recommended P/N: SDN-414-10, 2GHz B/W, 0.1Ω)
If current shunt is not used JP1 must be shorted. JP1 affects the power loop inductance and its
inductance should be kept as low as possible. Use a copper foil or jumper with low inductance.
1. When measuring VSW with current shunt, ensure all channel probe grounds and current shunt
BNC output case are all referenced to the source end of Q2 before the current shunt. The
recommended setup of probes is shown as below.
2. The output of coaxial current shunt can be connected to oscilloscope via 50Ωtermination
impedance to reduce the ringing.
3. The measured current is inverted and can be scaled by using: Id=Vid/Rsense.
Current
Shunt
Q2 Source VDC-
1. GS66508T or GS66516T has a thermal pad at the top side for improved heat dissipation. Instead
of relying on PCB for cooling, the heat can be transferred to heatsink directly from the top
reducing the total thermal resistnace.
2. A heatsink can be mounted to the board using a M3 screw with lock washer and nylon insulated
bushing. Thermal Interface Material (TIM) is needed to provide electrical insulation and
conformance to the thermal pad surface. The daughter board evaluation kit supplies with a
35x35mm heatsink with M3 tapped hole, and other heatsinks can also be used to fit users’ system
design.
3. Care should be taken during the assembly of heatsink to avoid PCB bending and mechanical
stress to the GaN E-HEMT. We recommend to limit the torque of M3 mounting screw to <1 in-lb
(0.1Nm) for GS66508T and <2 in-lb (0.2Nm) for GS66516T, which translates to about ~50psi
pressure on each device.
4. To measure device case temperature, use IR camera or install thermocouple to monitor the
temperature through two drilled holes from the top side as shown below:
VGL
VSL
VSW
BNC case
To oscilloscope
probe input (use
50Ω termination)
BNC tip
VDS
VGS
ID
°
5. The TIM we use on this assembly is Berguist®SilPad 1500ST, the measured total thermal
resistance can be found in Figure 9. Compared to bottom cooled design, T package eliminates the
PCB thermal resistance and significantly improve the thermal performance. Theraml grease is
typically not needed on the assembly. If thermal grease is to be applied, use non-conductive and
non-capacitive type thermal grease.
6. Forced air cooling is recommended for power testing.
GaNPX T GaNPX T
FR4 PCB
Heatsink
M3 Screw
Lock Washter
Insulated bushing
TIM
GaN Systems provides a universal 650V mother board (ordering part number: GS665MB-EVB, sold
separately) that can be used as the basic evaluation platform for all the daughter boards.
The universal 650V mother board evaluation kit includes following items:
1. Mother board GS665MB-EVB
2. 12VDC Fan
The board can be powered by 9-12V on J1. On-board voltage regulator creates to 5V for daughter board
and control logic circuits. J3 is used for external 12VDC fan.
12V INPUT
(+)5V Power Supply
CIN
VSW
PWM control & dead
time circuit
Daughter Board
Probing point for VSW
For Ext.
12VDC Fan
Airflow direction
Optional Cout
VDC- VOUT
VDC-
VDC+