GE Multilin MIB User manual

GE Multilin
215 Anderson Avenue
L6E 1B3 Markham, ON -CANADA
T [phone] F [phone]
E [email protected]
Internet: www.GEMultilin.com
Copyright © 2006 GE Multilin
MIB
High Impedance Bus Differential
Relay
Instruction manual
GEK-106426B
GE Multilin
Avda. Pinoa, 10
48170 Zamudio SPAIN
T [phone] F [phone]
E [email protected]
gGE Consumer & Industrial
Multilin

GEK-106426B MIB High Impedance Bus Differntial Relay 1
TABLE OF CONTENTS
1. GETTING STARTED 1.1 INSPECTION CHECKLIST
1.2 ENERVISTA MII SETUP SOFTWARE
1.2.1 SYSTEM REQUIREMENTS ..............................................................................1-4
1.2.2 SAFETY INSTRUCTIONS.................................................................................1-4
1.2.3 INSTALLATION..................................................................................................1-5
1.3 MII RELAY FAMILY HARDWARE
1.3.1 MOUNTING & WIRING....................................................................................1-11
1.3.2 COMMUNICATIONS........................................................................................1-11
1.3.3 FACEPLATE KEYPAD & DISPLAY.................................................................1-11
1.4 USING THE KEYPAD AND DISPLAY
1.4.1 HIERARCHICAL MENUS ................................................................................1-13
2. PRODUCT DESCRIPTION 2.1 SUMMARY
2.1.1 GENERAL OVERVIEW......................................................................................2-1
2.2 INTRO
2.3 ACCESS SECURITY FEATURES
2.4 DIFFERENTIAL UNITS
2.4.1 DIFFERENTIAL UNITS (87-1) (87-2).................................................................2-7
2.5 CALCULATION OF SETTINGS
2.5.1 SETTING OF THE DIFFERENTIAL ELEMENT.................................................2-8
2.5.2 MINIMUM FAULT TO TRIP 87 ..........................................................................2-9
2.6 MULTIPLE SETTING GROUPS
2.7 MEASUREMENT AND SELF-TEST
2.7.1 MEASUREMENT.............................................................................................2-14
2.7.2 SELF-TEST......................................................................................................2-14
2.8 USER INTERFACE
2.8.1 LED TARGETS................................................................................................2-15
2.8.2 KEYPAD AND DISPLAY..................................................................................2-15
2.8.3 COMMUNICATION PORTS.............................................................................2-16
2.8.4 SOFTWARE.....................................................................................................2-16
2.9 ORDERING CODES
2.10 TECHNICAL SPECIFICATIONS.
2.10.1 PROTECTION ELEMENTS.............................................................................2-18
2.10.2 METERING FUNCTIONS................................................................................2-18
2.10.3 INPUTS............................................................................................................2-18
2.10.4 POWER SUPPLY ............................................................................................2-19
2.10.5 OUTPUTS........................................................................................................2-19
2.10.6 COMMUNICATIONS........................................................................................2-20
2.10.7 ENVIRONMENTAL..........................................................................................2-20
2.11 TECHNICAL SPECIFICATIONS FOR HID MODULE
2.11.1 VOLTAGE LIMITERS.......................................................................................2-21
2.11.2 LATCHING RELAY..........................................................................................2-22
2.11.3 ENVIRONMENTAL..........................................................................................2-22
2.11.4 TYPE TESTS & CERTIFICATIONS.................................................................2-22
2.11.5 PRODUCTION TESTS ....................................................................................2-23
2.11.6 APPROVALS ...................................................................................................2-23
3. HARDWARE 3.1 DESCRIPTION
3.2 HIGH IMPEDANCE MODULE DESCRIPTION
3.2.1 MOUNTING........................................................................................................3-2
3.2.2 MECHANICAL DESCRIPTION..........................................................................3-4
3.2.3 REAR DESCRIPTION........................................................................................3-5

2 MIB High Impedance Bus Differntial Relay GEK-106426B
TABLE OF CONTENTS
3.3 WIRING
3.3.1 TYPICAL WIRING DIAGRAM.............................................................................3-6
3.3.2 CONTROL POWER............................................................................................3-7
3.3.3 AC CURRENT TRANSFORMER INPUTS.........................................................3-8
3.4 HIGH-SPEED OVERCURRENT PROTECTION MODULE
3.4.1 MECHANICAL DESCRIPTION...........................................................................3-9
3.4.2 MOUNTING ........................................................................................................3-9
3.4.3 REAR DESCRIPTION ........................................................................................3-9
3.4.4 CONTACT INPUTS / OUTPUTS.....................................................................3-10
3.4.5 OUTPUT CONTACTS CONFIGURATION.......................................................3-11
3.4.6 OUTPUTS ISOLATION ....................................................................................3-12
3.4.7 RS232 FRONT COMMUNICATIONS PORT....................................................3-15
3.4.8 RS485 COMMUNICATIONS PORT .................................................................3-16
4. COMMUNICATIONS 4.1 ENERVISTA MII SETUP SOFTWARE
4.1.1 OVERVIEW ........................................................................................................4-1
4.1.2 STARTING COMMUNICATION..........................................................................4-2
4.1.3 MAIN SCREEN...................................................................................................4-2
4.2 FILE
4.2.1 NEW ...................................................................................................................4-3
4.2.2 OPEN..................................................................................................................4-3
4.2.3 PROPERTIES.....................................................................................................4-4
4.2.4 GET INFO FROM RELAY ..................................................................................4-4
4.2.5 SEND INFO TO RELAY .....................................................................................4-4
4.2.6 PRINT SETUP....................................................................................................4-5
4.2.7 PRINT PREVIEW ...............................................................................................4-5
4.2.8 PRINT.................................................................................................................4-6
4.2.9 CLOSE................................................................................................................4-6
4.3 SETPOINT
4.3.1 SETTINGS..........................................................................................................4-7
4.3.2 MAIN SETTINGS................................................................................................4-9
4.3.3 ADVANCED SETTINGS.....................................................................................4-9
4.3.4 RELAY CONFIGURATION...............................................................................4-10
4.3.5 LOGIC CONFIGURATION ...............................................................................4-12
4.3.6 CLOCK .............................................................................................................4-13
4.4 ACTUAL
4.4.1 ACTUAL VALUES ............................................................................................4-14
4.4.2 EVENT RECORDER ........................................................................................4-15
4.4.3 WAVEFORM CAPTURE ..................................................................................4-16
4.5 OPERATIONS
4.6 COMMUNICATION
4.6.1 COMPUTER .....................................................................................................4-18
4.6.2 TROUBLESHOOTING......................................................................................4-22
4.6.3 UPGRADE FIRMWARE VERSION..................................................................4-23
4.7 VIEW
4.7.1 TRACES...........................................................................................................4-26
4.7.2 MODBUS MEMORY MAP................................................................................4-27
4.7.3 LANGUAGES ...................................................................................................4-28
5. SETTINGS 5.1 SETTINGS STRUCTURE
5.2 MAIN SETTINGS
5.2.1 PRODUCT SETUP ............................................................................................5-2
5.3 ADVANCED SETTINGS
5.3.1 DIFFERENTIAL ELEMENT 87 1 ........................................................................5-3
5.3.2 DIFFERENTIAL ELEMENT 87 2 ........................................................................5-3
5.3.3 GENERAL ADVANCED......................................................................................5-4
5.3.4 DIFFERENTIAL ELEMENT 87 1 GROUP 2.......................................................5-5

GEK-106426B MIB High Impedance Bus Differntial Relay 3
TABLE OF CONTENTS
5.3.5 DIFFERENTIAL ELEMENT 87 2 GROUP 2 ......................................................5-5
5.3.6 EVENTS AND OSCILLOGRAPHY MASKS.......................................................5-6
5.3.7 OSCILLOGRAPHY MASKS...............................................................................5-7
5.4 TIME SYNCHRONIZATION
6. I/0 CONFIGURATION 6.1 INPUT CONFIGURATION
6.1.1 DESCRIPTION OF INPUTS ..............................................................................6-1
6.1.2 INPUT ELEMENTS............................................................................................6-4
6.2 OUTPUTS AND LEDS CONFIGURATION
6.2.1 DESCRIPTION OF OUTPUTS AND LEDS .......................................................6-5
6.2.2 OUTPUT AND LED ELEMENTS .......................................................................6-6
7. KEYPAD AND DISPLAY 7.1 DESCRIPTION
7.2 FACEPLATE KEYPAD
7.3 ALPHANUMERIC DISPLAY AND LEDS
7.3.1 DISPLAY............................................................................................................7-3
7.3.2 LEDS..................................................................................................................7-4
7.4 OPERATIONS
7.4.1 ONE KEY OPERATION AND LAST TRIP DATA...............................................7-6
7.4.2 HMI PASSWORD...............................................................................................7-6
8. RELAY COMMISSIONING 8.1 VISUAL INSPECTION
8.2 COMMENTS ON THE TEST EQUIPMENT
8.3 RELAY SETTING
8.4 WIRING AND NECESSARY EQUIPMENT
8.5 TARGET LEDS
8.6 POWER SUPPLY TEST
8.7 COMMUNICATIONS
8.8 RELAY SETTING
8.9 CONTACT INPUTS
8.10 CONTACT OUTPUTS
8.11 RELAY METERING
8.11.1 CURRENT METERING....................................................................................8-11
8.12 DIFFERENTIAL UNIT LEVEL 1 (F87 1)
8.13 DIFFERENTIAL UNIT LEVEL 2 (F87 2)
8.14 TIME SYNCHRONIZATION
8.15 ACCEPTANCE TEST FOR HIGH IMPEDANCE MODULE
8.15.1 WIRING AND NECESSARY EQUIPMENT......................................................8-15
8.15.2 CONTINUITY...................................................................................................8-15
8.15.3 ISOLATION TEST ...........................................................................................8-15
8.15.4 MEASURES.....................................................................................................8-15
8.15.5 LATCHING RELAY..........................................................................................8-16
8.16 USER SETTINGS
8.16.1 MAIN SETTINGS.............................................................................................8-17
8.16.2 ADVANCED SETTINGS..................................................................................8-17

4 MIB High Impedance Bus Differntial Relay GEK-106426B
TABLE OF CONTENTS
8.17 ADVANCED SETTINGS
9. INSTALLATION AND
MAINTENANCE 9.1 INSTALLATION
9.2 GROUND CONNECTION AND DISTURBANCES SUPPRESSION
9.3 MAINTENANCE
9.4 CLEANING INSTRUCTIONS
A. MODBUS A.1 READING VALUES
A.2 COMMAND EXECUTION
A.2.1 COMMAND STRUCTURE................................................................................10-4
A.2.2 EXAMPLE.........................................................................................................10-6
A.3 SYNCHRONIZATION
A.4 WRITING SETTINGS
A.4.1 FRAME STRUCTURE......................................................................................10-9
A.4.2 SETTING CHANGE CONFIRMATION...........................................................10-10
A.4.3 EXAMPLE OF SETTING CHANGE................................................................10-11
A.5 EVENTS
A.5.1 FRAME STRUCTURE....................................................................................10-14
A.6 OSCILLOGRAPHY
A.7 ERRORS
A.8 USED FORMATS
B. MODEM CONNECTION B.1 HAYES MODEM
B.2 V.25BIS MODEM
B.3 SAMPLES OF SETTINGS FOR PARTICULAR MODEMS
B.3.1 SPORTSTER FLASH X2 MODEM (HAYES)....................................................11-4
B.3.2 ZOOM PKT14.4................................................................................................11-5
B.3.3 MODEM SATELSA MGD-2400-DHE (V.25BIS)...............................................11-6
C. HARMONIC FILTERING C.1 GENERAL PRINCIPLE OF OPERATION
C.2 DIGITAL FILTER
C.3 MEASURE AT FREQUENCIES BELOW THE RATED FREQUENCY
(FREQUENCY TRACKING)

GEK-106426B MIB High Impedance Bus Differntial Relay 1-1
1 GETTING STARTED
1
1 GETTING STARTED
To help ensure years of trouble free operation, please read through the following chapter for information to help guide you
through the initial installation procedures of your new relay.
CAUTION: THE OPERATOR OF THIS INSTRUMENT IS ADVISED THAT IF THE EQUIPMENT IS USED IN A MANNER
NOT SPECIFIED IN THIS MANUAL, THE PROTECTION PROVIDED BY THE EQUIPMENT MAY BE IMPAIRED
INSTALLATION MUST BE ACCORDING TO THE NATIONAL ELECTRIC CODE OF THE APPROPRIATE COUNTRY

1-2 MIB High Impedance Bus Differntial Relay GEK-106426B
1.1 INSPECTION CHECKLIST 1 GETTING STARTED
11.1INSPECTION CHECKLIST
Open the relay packaging and inspect the relay for physical damage.
Check the label at the side of the relay and check that the relay model is the same model ordered.
Figure 1–1: RELAY IDENTIFICATION LABEL ) (MIB???)
Ensure that the mounting screws have been included with the relay.
For product information, instruction manual updates, and the latest software updates, please visit the GE Multilin Home
Page (www.GEindustrial.com/multilin).

GEK-106426B MIB High Impedance Bus Differntial Relay 1-3
1 GETTING STARTED 1.1 INSPECTION CHECKLIST
1
Note: If there is any physical damage detected on the relay, or any of the contents listed are missing, please
contact GE Multilin immediately at:
EUROPE, MIDDLE EAST AND AFRICA:
GE MULTILIN
Av. Pinoa, 10
48170 Zamudio, Vizcaya (SPAIN)
Tel.: [phone], Fax: [phone]
E-mail: [email protected]
AMERICA, ASIA AND AUSTRALIA:
GE MULTILIN
215, Anderson Avenue
L6E 1B3 Markham, ON (CANADA)
Tel.: [phone], Fax: [phone]
E-mail: [email protected]
The information provided herein does not intend to cover all details of variations of the equipment nor does it take
into account the circumstances that may be present in your installation, operating or maintenance activities.
Should you wish to receive additional information, or for any particular problem that cannot be solved by referring
to the information contained herein, please contact GENERAL ELECTRIC MULTILIN.

1-4 MIB High Impedance Bus Differntial Relay GEK-106426B
1.2 ENERVISTA MII SETUP SOFTWARE 1 GETTING STARTED
11.2ENERVISTA MII SETUP SOFTWARE 1.2.1 SYSTEM REQUIREMENTS
The ENERVISTA MII SETUP software interface is the preferred method to edit settings and view actual values because the
PC monitor can display more information in a simple comprehensible format.
The following minimum requirements must be met for the ENERVISTA MII SETUP software to properly operate on a PC:
• Pentium® class or higher processor (Pentium® II 300 MHz or higher recommended)
• Windows® NT 4.0 (Service Pack 3 or higher), Windows® 2000, Windows® XP
• Internet Explorer® 5.0 or higher
• 64 MB of RAM (128 MB recommended)
• 40 MB of available space on system drive and 40 MB of available space on installation drive
• RS232C serial and Ethernet port for communications to the relay
1.2.2 SAFETY INSTRUCTIONS
The ground screw shown in the following figure must be correctly grounded.
Figure 1–2: GROUNDING SCREWS LOCATION
If you want to communicate with the relay using a computer through the front serial port, please ensure that the computer
is grounded to the same ground as the relay.
In case of using a portable computer, it is recommended to not have it connected to its power supply, as in many cases
they are not correctly grounded either due to the power supply itself or to the connector cables used. Powering the
portable PC with its internal battery drastically decreases the possibility of producing permanent damage to the computer
or the relay. Beware of the possibility of losing communication in firmware change processes
This is required not only for personal protection, but also for avoiding a voltage difference between the relay
serial port and the computer port, which could produce permanent damage to the computer or the relay.
GE Multilin will not be responsible for any damage in the relay or connected equipment whenever this elemental
safety rule is not followed.
In case of a firmware flashing process, due to the risk of losing communication, GE Multilin will not be
responsible in case of a communication failure if the relay and PC are not grounded to the same point.

GEK-106426B MIB High Impedance Bus Differntial Relay 1-5
1 GETTING STARTED 1.2 ENERVISTA MII SETUP SOFTWARE
1
1.2.3 INSTALLATION
After ensuring the minimum requirements for using EnerVista MII Setup are met (see previous section), use the following
procedure to install the EnerVista MII Setup from the enclosed GE EnerVista CD.
1. Insert the GE EnerVista CD into your CD-ROM drive.
2. Click the Install Now button and follow the installation instructions to install the no-charge EnerVista software.
3. When installation is complete, start the EnerVista Launchpad application.
4. Click the IED Setup section of the Launch Pad window.
Figure 1–3:
5. In the EnerVista Launch Pad window, click the Add Product button and select the relay from the Install Software
window as shown below. Select the “Web” option to ensure the most recent software release, or select “CD” if you do
not have a web connection, then click the Add Now button to list software items for the corresponding relay model.