HBM MX1615B User manual

Operating Manual
English
QuantumX

Hottinger Baldwin Messtechnik GmbH
Im Tiefen See 45
D-64239 Darmstadt
Tel. [phone]
Fax [phone]
[email protected]
www.hbm.com
Mat.: 7-2002.3031
DVS: A3031-15.0 HBM: public
04.2017
EHottinger Baldwin Messtechnik GmbH.
Subject to modifications.
All product descriptions are for general information only.
They are not to be understood as a guarantee of quality or
durability.

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English
1 Safety instructions 8........................................
2 Electro magnetic conformity 15...............................
3 Markings used 17............................................
3.1 The markings used in this document 17..........................
3.2 Symbols on the device 18......................................
4 Introduction 19..............................................
4.1 About the QuantumX documentation 19.........................
4.2 The QuantumX family 20......................................
4.3 Module overview/transducer technologies 24.....................
4.4 Digitalization and signal path 25................................
4.5 Synchronization 26............................................
5 Software 35.................................................
5.1 MX Assistant 35..............................................
5.2 catman®AP 37...............................................
5.3 LabVIEW® driver / library 39...................................
5.4 Driver for Microsoft® Visual Studio .NET 39......................
5.5 Other drivers 40..............................................
5.6 Firmware update via Ethernet 40................................
6 Mechanical 41...............................................
6.1 Mounting case clips on modules 42.............................
6.2 Connecting housings 45.......................................
6.3 Mounting the housing with CASEFIT 47..........................
6.4 BPX001/BPX002 backplane 47.................................
6.4.1 Connection 49................................................
6.4.2 Backplane BPX001 50.........................................
6.4.3 Backplane BPX002 52.........................................
6.4.4 Mounting the modules 52......................................
6.4.5 Backplane with Ethernet connection 56..........................

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6.4.6 Backplane with IEEE1394b FireWire connection 57...............
6.4.7 System layout with several backplanes 58........................
7 Connecting individual QuantumX modules 59.................
7.1 Connecting the supply voltage 59...............................
7.2 Connection to host PC or data recorder 62.......................
7.2.1 Single Ethernet connection 62..................................
7.2.2 Multiple Ethernet connection with PTP synchronization 63..........
7.2.3 Multiple Ethernet connection and FireWire synchronization 64......
7.2.4 Connecting one or more QuantumX modules to the PC 65.........
7.2.5 Firmware update via Ethernet 73................................
7.2.6 Connection via FireWire (IEEE 1394b) 74........................
7.2.7 Setting up FireWire 1394b on the PC 75.........................
7.2.8 Multiple FireWire connection 77.................................
7.2.9 Layout with data recorder CX22B‐W 78..........................
7.2.10 Output measurement signals to CAN bus (MX840B) 79............
7.2.11 Output measurement signals to CAN bus (MX471B) 79............
7.2.12 Output of signals with standardized voltage in real time (MX878B
or MX879B) 80...............................................
7.2.13 Output signals in real time via EtherCAT® and in parallel via
Ethernet 81..................................................
7.2.14 QuantumX in the FireWire group 82.............................
8 Modules and transducers 84.................................
8.1 General information 84........................................
8.1.1 Shielding design 84...........................................
8.1.2 Active transducer connection 86................................
8.1.3 TEDS 88....................................................
8.1.4 Background calibration / autoadjustment 91......................
8.2 MX840/A/B universal amplifier 93...............................
8.2.1 MX840B pin assignment 95....................................
8.2.2 MX840B status display 97.....................................

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8.3 MX440B universal amplifier 98..................................
8.4 MX410B highly dynamic universal amplifier 100....................
8.4.1 MX410B pin assignment 101....................................
8.4.2 MX410B status display 103.....................................
8.5.1 MX430B pin assignment 105....................................
8.5.2 MX430B status display 106.....................................
8.6.1 MX238B pin assignment 108....................................
8.6.2 MX238B status display 109.....................................
8.7 MX460B frequency amplifier 110.................................
8.7.1 MX460B pin assignment 111....................................
8.7.2 MX460B status display 113.....................................
8.8 MX1609KB and MX1609TB thermocouple amplifier 114............
8.8.1 Thermocouple with TEDS functionality (RFID) 116.................
8.8.2 MX1609 status display 118......................................
8.9 MX471B CAN module 119......................................
8.9.1 General information 119........................................
8.9.2 MX471B pin assignment 121....................................
8.9.3 LEDs status display 122........................................
8.9.4 Receiving CAN messages 123...................................
8.10 MX1601B amplifier 124.........................................
8.10.1 MX1601B pin assignment 124...................................
8.10.2 MX1601B status display 126....................................
8.11 MX1615B amplifier 128.........................................
8.11.1 MX1615B pin assignment 130...................................
8.11.2 MX1615B status display 132....................................
9 Transducer connection 134....................................
9.1 Full bridge, SG 134............................................
9.2 Full bridge, inductive 135.......................................
9.3 Full bridge, piezoresistive 136...................................
9.4 Half bridge, SG 137............................................
9.5 Half bridge, inductive 138.......................................

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9.6 Quarter bridge, SG 139.........................................
9.7 Adapter quarter bridge, SG 140..................................
9.8 Connecting transducers with double shield technique 141...........
9.9 Potentiometric transducers 142..................................
9.10 LVDT transducers 143..........................................
9.11 Current-fed piezoelectric transducer (ICP/IEPE) 144...............
9.12 Electrical voltage 100 mV 146...................................
9.13 DC voltage sources 10 V 147....................................
9.14 DC voltage sources 60 V 148....................................
9.15 Voltage sources up to 300 V (CAT II) 149.........................
9.16 DC current sources 20 mA 150..................................
9.17 DC current sources 20 mA - voltage-fed 151.......................
9.18 Ohmic resistance (e.g. PTC, NTC, KTY, …) 152...................
9.19 Resistance thermometer PT100, PT1000 153......................
9.20 Thermocouples 154............................................
9.21 Frequency, differential, without directional signal 157...............
9.22 Frequency, differential, with directional signal 158..................
9.23 Frequency, single-pole, with directional signal 159..................
9.24 Encoder and pulse encoder, differential 160.......................
9.25 Encoder and pulse encoder, single-pole 161.......................
9.26 Rotary encoder and pulse generator, single pole with static
directional signal 162...........................................
9.27 Absolute value encoder with SSI protocol 163.....................
9.28 Passive inductive encoder (Pickups, Crankshaft sensor) 165........
9.29 Measurement of rotational speed, Crankshaft sensor (digital, TTL) 166
9.30 PWM - Pulse width, pulse duration, period duration 167.............
9.31 PWM - Pulse width, pulse duration, period duration, single-pole 168..
9.32 CAN bus 169..................................................
10 Functions and outputs 171....................................
10.1 Amplifier with analog outputs 172................................
10.2 MX460B 175..................................................

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10.3 MX878B 176..................................................
10.4 MX879B Multi‐I/O module 184...................................
10.5 MX471B 190..................................................
11 FAQ 191.....................................................
12 Accessories 195..............................................
12.1 System accessories 205........................................
12.1.1 BPX001 backplane 205.........................................
12.1.3 Housing connection elements 207................................
12.2 Voltage supply 207.............................................
12.2.1 Power pack NTX001 207.......................................
12.2.2 Supply cable 208..............................................
12.3 IEEE1394b FireWire 209........................................
12.3.1 IEEE1394b FireWire cable (module-to-module; IP67) 209...........
12.3.2 Connection cable (PC to module) 209............................
12.3.3 Connection cable (PC to hub) 210................................
12.4 General information 211........................................
12.4.1 Plug kit with TEDS chip 211.....................................
12.4.2 Port saver Sub-HD 15-pin 211...................................
12.4.3 Adapter D-Sub-HD 15-pin to D-Sub 15-pin 212....................
12.5 Accessories for MX840B, MX440B 213...........................
12.5.1 Cold junction for thermocouples 213..............................
12.6 SubHD15 to BNC adapter 214...................................
12.7 SCM-HV accessories 215.......................................
12.8 SCM-SG120/350 quarter bridge adapter 216......................
12.9 MX1609/KB/TB accessories 217.................................
12.9.1 Thermo-connector with integrated RFID chip 217...................
13 Support 218..................................................

Safety instructions
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1 Safety instructions
Notice
The safety instructions described here also apply to the
power pack NTX001 and the active backplane BPX001
and BPX002.
Appropriate use
A module with connected transducers is to be used
exclusively for measurement tasks and Test tasks. Use
for any purpose other than the above is deemed to be
non-designated, inappropriate use.
In the interests of safety, the module should only be
operated as described in the Operating Manuals. It is
also essential to comply with the legal and safety
requirements for the application concerned during use.
The same applies to the use of accessories.
Before commissioning the module for the first time, you
must first run a project planning and risk analysis that
takes into account all the safety aspects of automation
technology. This particularly concerns personal and
machine protection.
Additional safety precautions must be taken in plants
where malfunctions could cause major damage, loss of
data or even personal injury. In the event of a fault, these
precautions establish safe operating conditions.
This can be done, for example, by mechanical
interlocking, error signaling, limit value switches, etc.

Safety instructions
QuantumXA3031-15.0 HBM: public 9
Notice
The module must not be connected directly to a power
supply system. The supply voltage must be 10 V … 30 V
(DC).
General dangers of failing to follow the safety
instructions
Every module is a state of the art device and as such is
failsafe. The module may give rise to residual dangers if
it is inappropriately installed and operated by untrained
personnel. Any person instructed to carry out installation,
commissioning, maintenance or repair of the modules
must have read and understood the Operating Manuals
and in particular the technical safety instructions.
The scope of supply and performance of the modules
only covers a small area of measurement technology. In
addition, equipment planners, installers and operators
should plan, implement and respond to the safety
engineering considerations of measurement technology
in such a way as to minimize residual dangers. On-site
regulations must be complied with at all times. There
must be reference to the residual dangers connected
with measurement technology. After making settings and
carrying out activities that are password-protected, you
must make sure that any controls that may be connected
remain in safe condition until the switching performance
of the module has been tested.

Safety instructions
10 A3031-15.0 HBM: public QuantumX
Conditions on site
For modules in the housing with degree of protection
IP20:
SProtect the modules from dirt and moisture or the ef
fects of weather such as rain, snow, etc.
SThe permissible relative humidity at 31 oC is 80%
(non-condensing); linear reduction to 50% at 40 oC.
SMake sure that the side ventilation openings are not
covered.
For all modules:
SDo not expose the modules to direct sunlight.
SPlease observe the permissible maximum ambient
temperatures stated in the specifications.
SEnsure there is adequate ventilation for installation in
the BPX001 backplane.
Maintenance and cleaning
The modules are maintenance-free. Please note the
following points when cleaning the housing:
SBefore cleaning, disconnect all connections.
SClean the housing with a soft, slightly damp (not wet!)
cloth. Never use solvent as this could damage the
labeling or the housing.
SWhen cleaning, ensure that no liquid gets into the
module or connections.
Outputs
Particular attention must be paid to safety when using the
digital, analog or CAN bus outputs of a module. Ensure