HBM MX840B User manual

Operating Manual
English
QuantumX

Hottinger Baldwin Messtechnik GmbH
Im Tiefen See 45
D-64239 Darmstadt
Tel. [phone]
Fax [phone]
[email protected]
www.hbm.com
Mat.: 7-2002.3031
DVS: I3031-14.0 HBM: public
09.2016
EHottinger Baldwin Messtechnik GmbH.
Subject to modifications.
All product descriptions are for general information only.
They are not to be understood as a guarantee of quality or
durability.

QuantumXI3031-14.0 HBM: public 3
English
1 Safety instructions 8........................................
2 Electro magnetic conformity 15...............................
3 Markings used 17............................................
3.1 The markings used in this document 17..........................
3.2 Symbols on the device 18......................................
4 Introduction 19..............................................
4.1 About the QuantumX documentation 19.........................
4.2 The QuantumX family 20......................................
4.3 Module overview/transducer technologies 24.....................
4.4 Digitalization and signal path 25................................
4.5 Synchronization 26............................................
5 Software 35.................................................
5.1 MX Assistant 35..............................................
5.2 catman®AP 37...............................................
5.3 LabVIEW® driver / library 38...................................
5.4 Driver for Microsoft® Visual Studio .NET 39......................
5.5 Other drivers 39..............................................
5.6 Firmware update via Ethernet 40................................
6 Mechanical 41...............................................
6.1 Mounting case clips on modules 42.............................
6.2 Connecting housings 45.......................................
6.3 Mounting the housing with CASEFIT 47..........................
6.4 BPX001/BPX002 backplane 47.................................
6.4.1 Connection 49................................................
6.4.2 Backplane BPX001 50.........................................
6.4.3 Backplane BPX002 52.........................................
6.4.4 Mounting the modules 52......................................
6.4.5 Backplane with Ethernet connection 56..........................

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6.4.6 Backplane with IEEE1394b FireWire connection 57...............
6.4.7 System layout with several backplanes 58........................
7 Connecting individual QuantumX modules 59.................
7.1 Connecting the supply voltage 59...............................
7.2 Connection to host PC or data recorder 62.......................
7.2.1 Single Ethernet connection 62..................................
7.2.2 Multiple Ethernet connection with PTP synchronization 63..........
7.2.3 Multiple Ethernet connection and FireWire synchronization 64......
7.2.4 Connecting one or more QuantumX modules to the PC 65.........
7.2.5 Firmware update via Ethernet 73................................
7.2.6 Connection via FireWire (IEEE 1394b) 74........................
7.2.7 Setting up FireWire 1394b on the PC 75.........................
7.2.8 Multiple FireWire connection 77.................................
7.2.9 Layout with data recorder CX22B‐W 78..........................
7.2.10 Output measurement signals to CAN bus (MX840B) 79............
7.2.11 Output measurement signals to CAN bus (MX471B) 79............
7.2.12 Output of signals with standardized voltage in real time (MX878B
or MX879B) 80...............................................
7.2.13 Output signals in real time via EtherCAT® and in parallel
via Ethernet 81...............................................
7.2.14 QuantumX in the FireWire group 82.............................
7.2.15 Optical FireWire connection 85.................................
8 Modules and transducers 87.................................
8.1 General information 87........................................
8.1.1 Shielding design 87...........................................
8.1.2 Active transducer connection 89................................
8.1.3 TEDS 91....................................................
8.1.4 Background calibration / autoadjustment 94......................
8.2 MX840/A/B universal amplifier 96...............................
8.2.1 MX840B pin assignment 98....................................

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8.2.2 MX840B status display 100.....................................
8.3 MX440B universal amplifier 101..................................
8.4 MX410B highly dynamic universal amplifier 103....................
8.4.1 MX410B pin assignment 104....................................
8.4.2 MX410B status display 106.....................................
8.5.1 MX430B pin assignment 108....................................
8.5.2 MX430B status display 109.....................................
8.6.1 MX238B pin assignment 111....................................
8.6.2 MX238B status display 112.....................................
8.7 MX460B frequency amplifier 113.................................
8.7.1 MX460B pin assignment 114....................................
8.7.2 MX460B status display 116.....................................
8.8 MX1609KB and MX1609TB thermocouple amplifier 117............
8.8.1 Thermocouple with TEDS functionality (RFID) 119.................
8.8.2 MX1609 status display 121......................................
8.9 MX471B CAN module 122......................................
8.9.1 General information 122........................................
8.9.2 MX471B pin assignment 124....................................
8.9.3 LEDs status display 125........................................
8.9.4 Receiving CAN messages 126...................................
8.10 MX1601B amplifier 127.........................................
8.10.1 MX1601B pin assignment 128...................................
8.10.2 MX1601B status display 130....................................
8.11 MX1615B amplifier 132.........................................
8.11.1 MX1615B pin assignment 134...................................
8.11.2 MX1615B status display 136....................................
9 Transducer connection 138....................................
9.1 Full bridge, SG 138............................................
9.2 Full bridge, inductive 139.......................................
9.3 Full bridge, piezoresistive 140...................................
9.4 Half bridge, SG 141............................................

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9.5 Half bridge, inductive 142.......................................
9.6 Quarter bridge, SG 143.........................................
9.7 Adapter quarter bridge, SG 144..................................
9.8 Connecting transducers with double shield technique 145...........
9.9 Potentiometric transducers 146..................................
9.10 LVDT transducers 147..........................................
9.11 Current-fed piezoelectric transducer (ICP/IEPE) 148...............
9.12 Electrical voltage 100 mV 150...................................
9.13 DC voltage sources 10 V 151....................................
9.14 DC voltage sources 60 V 152....................................
9.15 Voltage sources up to 300 V (CAT II) 153.........................
9.16 DC current sources 20 mA 154..................................
9.17 DC current sources 20 mA - voltage-fed 155.......................
9.18 Ohmic resistance (e.g. PTC, NTC, KTY, …) 156...................
9.19 Resistance thermometer PT100, PT1000 157......................
9.20 Thermocouples 158............................................
9.21 Frequency, differential, without directional signal 161...............
9.22 Frequency, differential, with directional signal 162..................
9.23 Frequency, single-pole, with directional signal 163..................
9.24 Encoder and pulse encoder, differential 164.......................
9.25 Encoder and pulse encoder, single-pole 165.......................
9.26 Rotary encoder and pulse generator, single pole with static
directional signal 166...........................................
9.27 Absolute value encoder with SSI protocol 167.....................
9.28 Passive inductive encoder (Pickups, Crankshaft sensor) 169........
9.29 Measurement of rotational speed, Crankshaft sensor (digital, TTL) 170
9.30 PWM - Pulse width, pulse duration, period duration 171.............
9.31 PWM - Pulse width, pulse duration, period duration, single-pole 172..
9.32 CAN bus 173..................................................
10 Functions and outputs 175....................................
10.1 MX410B and MX430B 176......................................

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10.2 MX460B 179..................................................
10.3 MX878B 180..................................................
10.4 MX879B Multi‐I/O module 188...................................
10.5 MX471B 194..................................................
11 FAQ 195.....................................................
12 Accessories 199..............................................
12.1 System accessories 209........................................
12.1.1 BPX001 backplane 209.........................................
12.1.3 Housing connection elements 211................................
12.2 Voltage supply 211.............................................
12.2.1 Power pack NTX001 211.......................................
12.2.2 Supply cable 212..............................................
12.3 IEEE1394b FireWire 213........................................
12.3.1 IEEE1394b FireWire cable (module-to-module; IP67) 213...........
12.3.2 Connection cable (PC to module) 213............................
12.3.3 Connection cable (PC to hub) 214................................
12.4 General information 215........................................
12.4.1 Plug kit with TEDS chip 215.....................................
12.4.2 Port saver Sub-HD 15-pin 215...................................
12.4.3 Adapter D-Sub-HD 15-pin to D-Sub 15-pin 216....................
12.5 Accessories for MX840B, MX440B 217...........................
12.5.1 Cold junction for thermocouples 217..............................
12.6 SubHD15 to BNC adapter 218...................................
12.7 SCM-HV accessories 219.......................................
12.8 SCM-SG120/350 quarter bridge adapter 220......................
12.9 MX1609/KB/TB accessories 221.................................
12.9.1 Thermo-connector with integrated RFID chip 221...................
13 Support 222..................................................

Safety instructions
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1 Safety instructions
Notice
The safety instructions described here also apply to the
power pack NTX001 and the active backplane BPX001
and BPX002.
Appropriate use
A module with connected transducers is to be used
exclusively for measurement tasks and Test tasks. Use
for any purpose other than the above is deemed to be
non-designated, inappropriate use.
In the interests of safety, the module should only be
operated as described in the Operating Manuals. It is
also essential to comply with the legal and safety
requirements for the application concerned during use.
The same applies to the use of accessories.
Before commissioning the module for the first time, you
must first run a project planning and risk analysis that
takes into account all the safety aspects of automation
technology. This particularly concerns personal and
machine protection.
Additional safety precautions must be taken in plants
where malfunctions could cause major damage, loss of
data or even personal injury. In the event of a fault, these
precautions establish safe operating conditions.
This can be done, for example, by mechanical
interlocking, error signaling, limit value switches, etc.

Safety instructions
QuantumXI3031-14.0 HBM: public 9
Notice
The module must not be connected directly to a power
supply system. The supply voltage must be 10 V … 30 V
(DC).
General dangers of failing to follow the safety
instructions
Every module is a state of the art device and as such is
failsafe. The module may give rise to residual dangers if
it is inappropriately installed and operated by untrained
personnel. Any person instructed to carry out installation,
commissioning, maintenance or repair of the modules
must have read and understood the Operating Manuals
and in particular the technical safety instructions.
The scope of supply and performance of the modules
only covers a small area of measurement technology. In
addition, equipment planners, installers and operators
should plan, implement and respond to the safety
engineering considerations of measurement technology
in such a way as to minimize residual dangers. On-site
regulations must be complied with at all times. There
must be reference to the residual dangers connected
with measurement technology. After making settings and
carrying out activities that are password-protected, you
must make sure that any controls that may be connected
remain in safe condition until the switching performance
of the module has been tested.

Safety instructions
10 I3031-14.0 HBM: public QuantumX
Conditions on site
For modules in the housing with degree of protection
IP20:
SProtect the modules from dirt and moisture or the ef
fects of weather such as rain, snow, etc.
SThe permissible relative humidity at 31 oC is 80%
(non-condensing); linear reduction to 50% at 40 oC.
SMake sure that the side ventilation openings are not
covered.
For all modules:
SDo not expose the modules to direct sunlight.
SPlease observe the permissible maximum ambient
temperatures stated in the specifications.
SEnsure there is adequate ventilation for installation in
the BPX001 backplane.
Maintenance and cleaning
The modules are maintenance-free. Please note the
following points when cleaning the housing:
SBefore cleaning, disconnect all connections.
SClean the housing with a soft, slightly damp (not wet!)
cloth. Never use solvent as this could damage the
labeling or the housing.
SWhen cleaning, ensure that no liquid gets into the
module or connections.
Outputs
Particular attention must be paid to safety when using the
digital, analog or CAN bus outputs of a module. Ensure

Safety instructions
QuantumXI3031-14.0 HBM: public 11
that status or control signals cannot initiate any actions
that may pose a danger to persons or the environment.
Product liability
In the following cases, the protection provided for the
device may be adversely affected. Liability for device
functionality then passes to the operator:
SThe device is not used in accordance with the operat
ing manual.
SThe device is used outside the field of application de
scribed in this section.
SThe operator makes unauthorized changes to the
device.
Warning signs and danger symbols
Important instructions for your safety are specifically
identified. It is essential to follow these instructions in
order to prevent accidents and damage to property.
Safety instructions are structured as follows:
WARNING
Type of danger
Consequences of non-compliance
Averting the danger
SWarning sign: draws attention to the danger
SSignal word: indicates the severity of the danger
(see table below)
SType of danger: identifies the type or source of the
danger

Safety instructions
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SConsequences:describes the consequences of non-
compliance
SDefense: indicates how the danger can be avoided/
bypassed.
Danger classes as per ANSI
Warning sign, signal word Meaning
WARNING This marking warns of a potentially dangerous situ
ation in which failure to comply with safety require
ments may result in death or serious physical injury.
CAUTION This marking warns of a potentially dangerous situ
ation in which failure to comply with safety require
ments may result in slight or moderate physical injury.
Note This marking draws your attention to a situation in
which failure to comply with safety requirements may
lead to damage to property.
Working safely
The supply connection, as well as the signal and sensor
leads, must be installed in such a way that
electromagnetic interference does not adversely affect
device functionality (HBM recommendation: "Greenline
shielding design", downloadable from the Internet at
http://www.hbm.com/Greenline).
Automation equipment and devices must be covered
over in such a way that adequate protection or locking
against unintentional actuation is provided (e.g. access
checks, password protection, etc.).
When devices are working in a network, these networks
must be designed in such a way that malfunctions in
individual nodes can be detected and shut down.
Safety precautions must be taken both in terms of
hardware and software, so that a line break or other

Safety instructions
QuantumXI3031-14.0 HBM: public 13
interruptions to signal transmission, e.g. via the bus
interfaces, do not cause undefined states or loss of data
in the automation device.
Error messages should only be acknowledged once the
cause of the error is removed and no further danger
exists.
Conversions and modifications
The module must not be modified from the design or
safety engineering point of view except with our express
agreement. Any modification shall exclude all liability on
our part for any resultant damage.
In particular, any repair or soldering work on
motherboards (exchanging components) is prohibited.
When exchanging complete modules, use only original
parts from HBM.
The module is delivered from the factory with a fixed
hardware and software configuration. Changes can only
be made within the possibilities documented in the
manuals.
Qualified personnel
Important
This device is only to be installed and used by qualified
personnel strictly in accordance with the specifications
and with the safety rules and regulations which follow.
Qualified persons means persons entrusted with the
installation, fitting, commissioning and operation of the
product who possess the appropriate qualifications for
their function. This module is only to be installed and

Safety instructions
14 I3031-14.0 HBM: public QuantumX
used by qualified personnel, strictly in accordance with
the specifications and the safety rules and regulations.
This includes people who meet at least one of the three
following requirements:
SKnowledge of the safety concepts of automation tech
nology is a requirement and as project personnel, you
must be familiar with these concepts.
SAs automation plant operating personnel, you have
been instructed how to handle the machinery and are
familiar with the operation of the modules and techno
logies described in this documentation.
SAs commissioning engineers or service engineers,
you have successfully completed the training to qual
ify you to repair the automation systems. You are also
authorized to activate, ground and label circuits and
equipment in accordance with safety engineering
standards.
It is also essential to comply with the legal and safety
requirements for the application concerned during use.
The same applies to the use of accessories.

Electro magnetic conformity
QuantumXI3031-14.0 HBM: public 15
2 Electro magnetic conformity
Additional information about the relevant EMC standards
EN 61326-1 / EN61326-2-x.
These standards define emissions limits and immunity
requirements for different environments.
Emissions requirements are defined for the following en
vironments:
- Industrial (Class A) or
- Residential / Laboratory (Class B).
The standard refers to CISPR 11:2009+A1:2010.
Immunity requirements are defined for the following envi
ronments:
- Controlled electro-magnetic (lowest requirements)
- Basic or
- Industrial (highest requirements).
The modules listed in the declaration of conformity com
ply with the requirements for the following environments:
Emissions: Class A
Immunity: Industrial environment
The QuantumX series and its modules are intended for
use in an industrial environment. When used in
residential or commercial environments, additional ar
rangements may be required to limit electro-magnetic
emissions.
An example is voltage supply of the modules by battery.
In this case please wrap the power supply cable

Electro magnetic conformity
16 I3031-14.0 HBM: public QuantumX
(KAB271-3) around the inductive coil included in the
package four times.
ODU plug
When the NTX001 power supply from HBM is used, the
system complies with Emissions: Class B without the
necessity to carry out the meaasure described above.

Markings used
QuantumXI3031-14.0 HBM: public 17
3 Markings used
3.1 The markings used in this document
Important instructions for your safety are specifically
identified. It is essential to follow these instructions, in
order to prevent damage.
Symbol Meaning
Note This marking draws your attention to a situation in
which failure to comply with safety requirements may
lead to damage to property.
CAUTION This marking warns of a potentially dangerous situ
ation in which failure to comply with safety require
ments may result in slight or moderate physical injury.
Important
This marking draws your attention to important in
formation about the product or about handling the
product.
Tip
This marking indicates application tips or other in
formation that is useful to you.
Device -> New Bold text indicates menu items, as well as dialog and
window titles in the user interfaces. Arrows between
menu items indicate the sequence in which the
menus and sub-menus are opened.
Sampling rate, 500 Bold text in italics indicates inputs and input fields in
the user interfaces.
Emphasis
See …
Italics are used to emphasize and highlight text and
identify references to sections, diagrams, or external
documents and files.

Markings used
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3.2 Symbols on the device
CE marking
CE marking enables the manufacturer to guarantee that
the product complies with the requirements of the
relevant EC directives (the Declaration of Conformity can
be found on the HBM website (www.hbm.com) under
HBMdoc).
Statutory waste disposal mark
In accordance with national and local environmental
protection and material recovery and recycling
regulations, old devices that can no longer be used must
be disposed of separately and not with normal household
garbage.
Electrostatically sensitive components
Components marked with this symbol can be damaged
beyond repair by electrostatic discharge. Please observe
the handling instructions for components exposed to the
risk of electrostatic discharge.

Introduction
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4 Introduction
4.1 About the QuantumX documentation
The QuantumX family documentation consists of
Sa printed quick start guide for initial start-up
Sthe data sheets in PDF format
SThis operating manual in PDF format
Sthe operating manual for the EtherCAT®1) / Ethernet
gateway CX27 in PDF format
Sthe operating manual for data recorder CX22B-W and
CX22B data recorders
Sthe operating manual for the MX403B and MX809B
modules for safe measurement at high potential
Sthe operating instructions for the Signal Conditioning
Modules (SCM)
- High-voltage signal conditioned SCM-HV
(300 V CAT II)
- Quarter bridge adapter SCM-SG-120 / -350 for
connecting SGs individually
Sthe product descriptions for accessories
Sa comprehensive online help with index and easy
search options which is available after the installation
of a software package (e.g. QuantumX Assistant, cat
man®EASY). Information about module and channel
configuration can also be found here.
These documents can be found
Son the QuantumX system CD supplied with the device
1) EtherCAT® is a registered brand and patented technology, licensed by Beckhoff Automation
GmbH, Germany

Introduction
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SAfter installation of the QuantumX Assistant on the
hard drive of your PC, which can be reached through
the Windows start menu
SUp-to date versions are always available from our In
ternet site at www.hbm.com/hbmdoc
4.2 The QuantumX family
The QuantumX family is a modular measurement system
for universal applications. The modules can be individu
ally combined and intelligently connected according to
the measurement task. Distributed operation makes it
possible to position individual modules close to the meas
uring points, resulting in short sensor lines.
The QuantumX family consists of the following
modules:
SMX840B Universal amplifier
The module has 8 universal inputs and supports more
than 15 transducer technologies.
SMX440B Universal amplifier
Like the MX840B, but with 4 inputs (connections 5-8
of MX840B, without CAN).
SMX410B Highly dynamic universal amplifier
The module has 4 universal inputs and supports com
monly used transducer technologies (at a sampling
rate of up to 96,000 measured values per channel per
second).
SMX430B QuantumX precision bridge measurement
module. The module has 4 inputs and supports full
bridge SG-based transducers with an accuracy class
of 100 ppm.