Hitachi Travelstar C4K60 User manual

K6610170
Rev.2
Dec 22, 2004 - 1 -
OEM Manual
Hard Disk Drive Specifications
Travelstar C4K60-30/20
REV.2
Models: HTC426030G7CE00
HTC426020G7CE10
Caution for Safety
Read Safety descriptions carefully.
Read and recommend drive usage cautions to your end user.
Keep this manual with care.
(Total 144 pages)
H I T A C H I
©2004, Hitachi Global Storage Technologies. All rights reserved.

K6610170
Rev.2
Dec 22, 2004 - 2 -
Rev.1: Nov 19, 2004
Rev.2: Dec 22, 2004

K6610170
Rev.2
Dec 22, 2004 - 3 -
To use this product safely
This manual is for the original purchaser of Travelstar C4K60-30/20 and intendes to provide
information about handling, installation, specifications, principles of operation and interface
command implementation.
To use the product, read safety descriptions below and understand thoroughly.
Keep this manual with care to insure unlimited use.
 General Caution for Safety
The followings are general cautions for safe use of this product.
(Caution before Product Use)
- Please read and follow all instructions and cautions described on “Safety Instructions” (Page 5) and “1.2
General Caution” (Page 12) before attempting to use this product.
- Follow all instructions and cautions indicated throughout this manual and the product. Failure to follow
these instructions and cautions may cause injury, fire and product damage.
 Advise your end user of the safety caution
Read and recommend that your end users read the caution for drive usage in this manual.
 Protect yourself
The safety instructions in this manual were thoroughly considered, but unexpected situations can occur.
Not only follow the instructions on this manual, but also be careful for the safety of yourself.
 Headline of safety caution
Safety instructions and cautions are indicated as the following headline, which consists a word of “Caution”.
The indication and meaning are as follows:
Caution: This symbol indicates that potential danger may exist which may cause slight or
medium grade bodily injury ,if safety instructions are not followed.
Caution: This symbol indicates that potential danger may exist which may cause damage
to the product or to the neighboring property ,if safety instructions are not followed.
 Safety caution in this manual
Followings are the cautions and contents described in this manual.
Items of indicating Caution :
- Safety Instructions Page 5
Items of indicating Caution :
- General Caution Sec. 1.2, Page 12
- Power Supply Requirements Sec.3.1, Page 15
- Data Reliability Sec. 3.2, Page 16
- Mounting HDD Sec. 4.2.1, Page 20
- Attention for HDD Installation Sec. 4.2.3, Page 22
- Packing Sec. 5.1, Page 24
- Handling Sec. 5.2, Page 25

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Rev.2
Dec 22, 2004 - 4 -
To use this product safely (Continued)
 Environmental circumstance
Although this product partially scatters electro-magnetic field into the air, it has been inspected and was
installed under Electro-magnetic regulations of resident areas, such as EMC standard EN55022
(corresponding to FCC part 15 Class B, etc.). However, anything other than this product, such as an
interface cable, is excluded. Therefore, the following cases require a system side improvement for the
electro-magnetic field regulations.
1) Disturbance of operations of other products or equipment in resident area
2) Disturbance caused by other product, such as cabling, to operations of other products or equipment.
Only Hitachi trained persons should change this product Hitachi assumes no responsibility for products
which have been changed by anyone else.
 Safety regulations
This product meets the following safety regulations, but the system side should consider the safety of the
system with this product.
Regulations: - UL1950 Third Edition dated July 28, 1995
- CSA C22.2 N0.950-M95
- IEC60950 A4: 1996
- EN60950 A11: 1992
Warranty and Limited Liability
This product is sold with a limited warranty and specific remedies are available to the original purchaser in
the event the product fails to conform to the limited warranty. Hitachi’s liability may be further limited in
accordance with its sales contact.
In general, Hitachi shall not be responsible for product damages caused by natural disasters, fire, static
discharge, misuse, abuse, neglect, improper handling or installation, unauthorized repair, alteration or
accident. In no event will Hitachi be liable for loss of data stored on product.
HITACHI SHALL NOT BE LIABLE FOR ANY SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES,
EVEN IF INFORMED OF THE POSSIBILITY THEREOF IN ADVANCE.
Please see your sales contract for a complete statement of warranty rights, remedies and limitation of liability.

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Rev.2
Dec 22, 2004 - 5 -
Safety Instructions
1. The product is not authorized for use in life support devices or systems or other applications that pose a
significant risk of personal injury.
2. Since the drive uses glass media for the disk platter, opening of Metal Head Disk Assembly (HDA) may
cause bodily injury. Warranty void in case of opened HDA or any broken HDA seals. Don’t open the HDA
or break any HDA seals.
3. Dropping of the HDD may cause bodily injury. Handle with care.
4. Do not hit the interface connector pins against other objects. Do not make contact with the interface
connector pins. Contact causes pin dent, electrical discharge distraction or contact failure. Also, pins or
HDA corners may cause bodily injury. Handle with care.
5. Observe Clause 3.3 “Drive Usage Condition Specifications”. Since reliability and product life depends on
usage conditions, please consult our sales or application engineers.
6. Keep usage conditions within specifications (Power Supply, Environment, etc.). If the conditions are not
kept within the specifications, failures may occur.
7. Hot swapping (Power-on swapping) can damage the drive. The drive shall be swapped during Power Off
only.
8. Electro Static Discharge (ESD) can damage the drive. Protect the drive from ESD during handling.
9. Voltage rise time 5 - 100 ms at power on is required for power supply. The power supply voltage must not
be under –0.3V at power off.
10. This product is required over current protection for possible combustion due to circuit or component
failure. Secondary over current protection shall be prepared by the system. The requirement of the
current limitation is max. 10 A for the protection.
11. Improper insertion of connector or wrong jumper setting may cause catastrophic failures. Referring to this
manual prior to the connector insertion or jumper setting can help to insure correct insertion.
12. If a foreign conductive substance (metallic powder, fluid, etc.) adheres to active metal of the drive
(Printed pattern, component lead, etc. on PCBA), it may cause catastrophic failures. Customer should
protect the drive from the above condition.
13. The PCBA side of the drive should be covered with insulation sheet if the active metal of host system
may contact to the PCBA of the drive. If the insulation sheet is not provided for the possible contact of the
live metal, failures may occur.
14. Shock can result in permanent damage to the drive and/or loss of data. Prevent shocks, which is often
incurred by dropping, knocking over, or hitting the drive.
15. To fix the drive, use the size of screws and the torque recommended in this manual. If non-recommended
size screws and torque are used, it may cause catastrophic failures.
16. Do not press top cover. It may cause catastrophic failures. In case of steel plate installation on HDD
cover side, the spacing between HDD cover and steel plate should be kept more than 2 mm. If this
spacing is not kept for the steel plate, it may affect Load/Unload mechanism.
17. Do not push the bottom PCBA of the drive. It may cause catastrophic failures.
Caution
Caution

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Safety Instructions (Continued)
18. Prevent humidity when the drive is packed in a box.
19. Use original packages during drive transportation to protect from any damage.
(Keep some extra packages for the drive transportation)
20. Recorded data on the disk may be lost due to accidents such as disasters, shock damage during
handling or drive failure. To prepare for accidents, back up data. Hitachi does not perform data
recovery.
21. Data may be lost due to unexpected or accidental power loss during write operation.
NOTE TO USERS
While every effort has been made to ensure that the information provided herein is correct please feel free to
notify us in the event of an error or inconsistency.
Hitachi makes no representations or warranties with respect to the contents hereof and specifically disclaims
any implied warranties or merchantability or fitness for any purpose.
Further Hitachi reserves the right to revise this publication and to make changes from time to time in the
content hereof without obligation to notify any person of such revisions or changes.
Caution

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OEM Manual ................................................................................................................................................... 1
1.0 General................................................................................................................................................11
1.1. Introduction..........................................................................................................................................11
1.2. General Caution...................................................................................................................................12
2.0 Components ........................................................................................................................................13
3.0 Specification Summary........................................................................................................................14
3.1. Principal Specifications........................................................................................................................14
3.2. Environmental Specifications and Reliability........................................................................................16
3.3. Drive Usage Condition Specifications..................................................................................................17
3.4. Load/Unload Specifications .................................................................................................................18
3.4.1. Normal Load/Unload .....................................................................................................................18
3.4.2. Emergency Unload........................................................................................................................18
3.4.3. Required Power Off Sequence......................................................................................................18
4.0 Installation ...........................................................................................................................................19
4.1. Installation Direction.............................................................................................................................19
4.2. Mounting HDD .....................................................................................................................................20
4.2.1. Mounting HDD with screws ...........................................................................................................20
4.2.2. Single HDD Test Condition ...........................................................................................................21
4.2.3. Attention for HDD Installation........................................................................................................22
4.3. Dimensions..........................................................................................................................................23
5.0 Packing and Handling..........................................................................................................................24
5.1. Packing................................................................................................................................................24
5.2. Handling...............................................................................................................................................25
6.0 Physical Interface................................................................................................................................26
6.1. Power Interface....................................................................................................................................26
6.2. Physical Interface ................................................................................................................................27
6.2.1. Connector......................................................................................................................................27
6.2.2. Connector Specification ................................................................................................................28
6.2.3. Connector Pin Assignment............................................................................................................28
6.2.4. Description of the Interface Signals...............................................................................................29
7.0 Logical Interface ..................................................................................................................................31
7.1. I/O Registers........................................................................................................................................31
7.1.1. Data register..................................................................................................................................31
7.1.2. Error register .................................................................................................................................32
7.1.3. Features Register..........................................................................................................................32
7.1.4. Sector Count Register...................................................................................................................32
7.1.5. LBA Low Register (Sector Number Register)................................................................................33
7.1.6. LBA Mid Register (Cylinder Low Register)....................................................................................33
7.1.7. LBA High Register (Cylinder High Register)..................................................................................33
7.1.8. Device/Head Register ...................................................................................................................33
7.1.9. Status Register..............................................................................................................................34
7.1.10. Command Register .....................................................................................................................35

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7.1.11. Alternate Status Register ............................................................................................................35
7.1.12. Device Control Register ..............................................................................................................35
7.2. General Operations..............................................................................................................................36
7.2.1. 48-bit Addressing Feature Set.......................................................................................................36
7.2.2. Power Management......................................................................................................................37
7.2.3. SMART Feature ............................................................................................................................39
7.2.4. Security Mode Feature..................................................................................................................41
7.2.5. Protected Area Feature.................................................................................................................45
7.2.6. Address Offset Feature (Vendor Specific).....................................................................................46
7.2.7. Device Configuration Overlay Feature ..........................................................................................48
7.2.8. Write Cache and Auto Reallocation...............................................................................................49
7.3. Command Protocol..............................................................................................................................50
7.3.1. PIO Data In Command..................................................................................................................50
7.3.2. PIO Data Out Command...............................................................................................................50
7.3.3. DMA Data In/Out Command .........................................................................................................51
7.3.4. Non-Data Command .....................................................................................................................51
7.3.5. Command BSY Timing..................................................................................................................51
7.4. Command Summary............................................................................................................................52
7.5. Command Descriptions........................................................................................................................55
7.5.1. Check Power Mode [98h, E5h]......................................................................................................55
7.5.2. Device Configuration Identify [B1h, Sub 02h]................................................................................55
7.5.3. Device Configuration Freeze Lock [B1h, Sub 01h]........................................................................57
7.5.4. Device Configuration Restore [B1h, Sub 00h]...............................................................................57
7.5.5. Device Configuration Set [B1h, Sub 03h]......................................................................................58
7.5.6. Execute Device Diagnostic [90h]...................................................................................................62
7.5.7. Flush Cache [E7h].........................................................................................................................63
7.5.8. Flush Cache EXT [EAh] ................................................................................................................63
7.5.9. Format Track [50h] (Vendor Specific)............................................................................................64
7.5.10. Identify Device [ECh]...................................................................................................................64
7.5.11. Idle [97h, E3h].............................................................................................................................72
7.5.12. Idle Immediate [95h,E1h] / Unload Immediate [E1h]...................................................................73
7.5.13. Initialize Device Parameters [91h]...............................................................................................74
7.5.14. Read Buffer [E4h]........................................................................................................................74
7.5.15. Read DMA [C8h, C9h].................................................................................................................75
7.5.16. Read DMA EXT [25h]..................................................................................................................76
7.5.17. Read Log EXT [2Fh]....................................................................................................................77
7.5.18. Read Long [22h, 23h]..................................................................................................................83
7.5.19. Read Multiple [C4h].....................................................................................................................84
7.5.20. Read Multiple EXT [29h] .............................................................................................................85
7.5.21. Read Max Address Command [F8h]...........................................................................................86
7.5.22. Read Max Address EXT Command [27h] ...................................................................................87
7.5.23. Read Sectors [20h, 21h]..............................................................................................................88
7.5.24. Read Sectors EXT [24h]..............................................................................................................88

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7.5.25. Read Verify [40h, 41h].................................................................................................................89
7.5.26. Read Verify Sectors EXT [42h]....................................................................................................90
7.5.27. Recalibrate [1Xh].........................................................................................................................91
7.5.28. Security Disable Password [F6h].................................................................................................91
7.5.29. Security Erase Prepare [F3h]......................................................................................................92
7.5.30. Security Erase Unit [F4h] ............................................................................................................92
7.5.31. Security Freeze Lock [F5h] .........................................................................................................93
7.5.32. Security Set Password [F1h].......................................................................................................94
7.5.33. Security Unlock [F2h]..................................................................................................................95
7.5.34. Seek [7Xh]...................................................................................................................................96
7.5.35. Set Features [EFh]......................................................................................................................97
7.5.36. Set Max Address Command [F9h, Sub 00h]...............................................................................98
7.5.37. Set Max Address EXT Command [37h].....................................................................................100
7.5.38. Set Max Freeze Lock Command [F9h, Sub 04h].......................................................................101
7.5.39. Set Max Lock Command [F9h, Sub 02h]...................................................................................102
7.5.40. Set Max Set Password Command [F9h, Sub 01h]....................................................................102
7.5.41. Set Max Unlock Command [F9h, Sub 03h]...............................................................................103
7.5.42. Set Multiple Mode [C6h]............................................................................................................104
7.5.43. Sleep [99h,E6h].........................................................................................................................104
7.5.44. SMART Disable Operations [B0h, Sub D9h].............................................................................105
7.5.45. SMART Enable/Disable Automatic Off-line [B0h, Sub DBh]......................................................106
7.5.46. SMART Enable/Disable Attribute AUTOSAVE [B0h, Sub D2h].................................................107
7.5.47. SMART Enable Operations [B0h, Sub D8h]..............................................................................108
7.5.48. SMART Execute Off-line Immediate [B0h, Sub D4h] ................................................................109
7.5.49. SMART Read Log Sector [B0h, Sub D5h].................................................................................112
7.5.50. SMART Return Status [B0h, Sub DAh].....................................................................................119
7.5.51. SMART Save Attribute Values [B0h, Sub D3h].........................................................................119
7.5.52. SMART Write Log Sector [B0h, Sub D6h].................................................................................120
7.5.53. Standby [96h, E2h]....................................................................................................................120
7.5.54. Standby Immediate [94h, E0h]..................................................................................................121
7.5.55. Write Buffer [E8h]......................................................................................................................122
7.5.56. Write DMA [CAh, CBh]..............................................................................................................122
7.5.57. Write DMA EXT [35h]................................................................................................................123
7.5.58. Write DMA FUA EXT [3Dh] .......................................................................................................123
7.5.59. Write Log EXT [3Fh]..................................................................................................................124
7.5.60. Write Long [32h, 33h]................................................................................................................125
7.5.61. Write Multiple [C5h]...................................................................................................................125
7.5.62. Write Multiple EXT [39h]............................................................................................................126
7.5.63. Write Multiple FUA EXT [CEh] ..................................................................................................127
7.5.64. Write Sectors [30h, 31h]............................................................................................................128
7.5.65. Write Sectors EXT [34h]............................................................................................................129
8.0 Interface Signal Timing......................................................................................................................130
8.1. Data Transfer Timing.........................................................................................................................130

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8.2. Ultra DMA Data Transfer Timing........................................................................................................133
8.3. Power On and Hardware Reset Timing .............................................................................................143

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1.0 General
1.1. Introduction
The Travelstar C4K60-30/20 disk drives reach high capacities in a 1.8 type form factor by applying the latest
high-density recording technology.
Capacity
Product name Model name (Formatted) Height Interface
Travelstar C4K60-30 HTC426030G7CE00 30.005 GB 7.0 mm ATA-6(IDE)
Travelstar C4K60-20 HTC426020G7CE10 20.003 GB 7.0 mm ATA-6(IDE)
[Features]
- GMR Head
- ID-less Format
- ME2PRML Read Channel
- Data Transfer Rate
(Host-Device)
-16.6 MB/sec: PIO mode-4/Multiword DMA mode-2
- 100 MB/sec: Ultra DMA mode-5
(Device-Buffer)
- 18.4 to 34.0 MB/s(30GB), 15.9 to 29.7 MB/sec(20GB)
- CDR (Constant Density Recording)
- On-the-fly ECC Correction
- Buffer: 2MB
- Read-ahead Cache/Write Cache
- Auto Read Reassign/Auto Write Reassign
- SMART
- Average Access Time 15 ms
- Embedded Sector Servo
- FDB(Fluid Dynamics Bearing) Motor
- Rotary Actuator
- Load/Unload Mechanism
- 46 grams
- Low Power Consumption: 0.25W at Idle mode, 0.08W at Standby mode
- Advanced Power Management(APM)
- Non-operating Shock: 11,760m/S2(1200G, 1ms, half-sine wave)
- Operating Shock: 4,900m/S2(500G, 2ms, half-sine wave)
[Identify Device Information for Setup]
Table 1.1 Identify Device information (Addressing)
Product name
(Model name) Word 1 Number of CYL. Word 3 Number of HD Word 6 Number of SPT Word 60 – 61 *1
Word 100 - 103
Total LBA
HTC426030G7CE00 16383 *2
(3FFFh) 16
(0010h) 63 (3Fh) 58,605,120 (037E3E40h)
HTC426020G7CE10 16383 *2
(3FFFh) 16
(0010h) 63 (3Fh) 39,070,080 (02542980h)
*1:Words 60-61 reflect the total number of user addressable sectors in LBA mode.
*2 : Maximum capacity in CHS mode is 8,455MB.

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1.2. General Caution
Adhere to the following cautions.
(a) Warranty void if Metal Head Disk Assembly (HDA) is opened, or any HDA seal/label is broken.
(b) Hot swapping (Power on) damages the drive. The drive should be swapped during Power Off only.
(c) Shock can result in permanent damage to the drive and/or loss of data.
Prevent shocks often incurred by dropping, knocking over, or hitting the drive.
(Dropping) (Knocking over)
(Hitting) (Hitting)
Figure 1.1
Caution
PREVENT SHOCKS
Caution

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2.0 Components
Travelstar C4K60-30/20 Disk Drive
Figure 2.1 Overview of Travelstar C4K60-30/20 (7.0mm height)

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3.0 Specification Summary
3.1. Principal Specifications
Table 3.1 Principal Specifications
Specifications
No. Item Travelstar
C4K60-30 Travelstar C4K60-20 Units
Model name HTC426030G7CE00 HTC426020G7CE10
1 Capacity per drive (Formatted) 30.005 20.003 GB
Capacity per sector 512 Bytes
Disks 1 1
Heads 2 2
2 Seek time Average 15 *1 ms
(Nominal Full stroke 26 *1 ms
value) Track to track 3 ms
3 Average latency 7.1 ms
Disk rotational speed 4,200 RPM
4 Recording density (Max.) 32.8 (832) 28.1 (713) Mbpm(kBPI)
Track density 4.65 (118.0) 4.13 (105.0) Mtpm(kTPI)
Recording method ME2PRML, ID-Less format
5 Interface ATA-6(IDE)
Data transfer rate (Disk-Buffer) 18.4 – 34.0 15.9 – 29.7 MB/sec
Data transfer rate (Host-Buffer) Max. 16.6 MB/sec
(PIO mode 4/ Multiword DMA mode 2)
Max. 100 (Ultra DMA mode 5) MB/sec
Buffer size 2,048 kB
6 Power on - Ready *2 5 (Typical) *3 sec
Sleep/Standby - Ready *2 3 (Typical) *3 sec
7 Dimensions (W×H×D) 70×7.0×54 mm
Weight (Approximate value) 46 grams
8 DC Power Requirements *4
- Start up (Max.) *5
- Idle (Ave.) *6
- Active Idle (Ave.) *7
- Seek (Ave.) *8
- Read/Write (Ave.) *9
- Standby (Ave.)
- Sleep (Ave.)
+3.3 v±5%, Ripple noise 100mvp-p
1.4
0.25
0.45
1.1
1.0/1.1
0.08
0.07
W

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*1 :Average time of seek is calculated under the following condition. (Read/Write ratio: Read only)
Average of 10,000 random seeks, Voltage 3.3V, Temperature 25°C.
Full stroke time of seek is calculated under the following condition.
Average of 1,000 full stroke seeks, Voltage 3.3V, Temperature 25°C.
This maximum time is not included the seek time by seek retry.
*2 :Periodically, during start up, the drive may perform a spin up retry operation. When this operation occurs,
the start up sound will change slightly and the ready timing will also be altered from typical time.
*3 :Power on to Ready time could take up to 10 seconds in case of spin up retries under certain
conditions of the voltage specifications(Table 3.1) and environmental specifications(Table 3.2).
*4 :For DC power input, the average current is measured at the connector of the PCBA of this drive and in
the nominal condition in which the power voltage and the temperature are 3.3V and 25°C, respectively.
The DC power input has to be burst free (common mode). The average current may have some
tolerance after power-on. The current measurement is recommended at 5 minutes later after power-on.
Voltage rise time 5 - 100 ms at power on is required for power supply. The power
supply voltage must not be under –0.3V at power off.
This product is required over current protection for possible combustion due to
circuit or component failure. Secondary over current protection shall be prepared
by the system. The requirement of the current limitation is max. 10 A for the
protection.
*5 :10ms averaged peak. For more information, refer to Section 6.1.
*6 :This value is at Low Power Idle mode. The heads are unloaded.
*7 :Power mode automatically enters to Active Idle mode after Read/Write operation.
*8 : Measured during random seek at the rate of three seeks per 100 msec.
*9 :Measured while reading or writing 16 sectors of data located on the same track.
Caution
Caution

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3.2. Environmental Specifications and Reliability
Table 3.2 Environmental Specification and Reliability
No. Item Specification
Travelstar
C4K60-30 Travelstar C4K60-20
Model name HTC426030G7CE00 HTC426020G7CE10
1 Ambient *1 Operational 5 to 60°C
temperature Non-operational -40 to 70°C
Temperature gradient Max. 20°C /hour
2 Relative humidity Operational 5 to 90 %
Non-operational 5 to 95 %
Maximum wet Operational 29°C (without condensation)
bulb Non-operational
40°C (without condensation) *2
3 Vibration Operational 1.0mm p-p or less (5 - 22Hz)
9.8 m/s2(1.0G) or less m/s2(22 – 500Hz)
Non-operational 5mm p-p or less (5 – 22Hz)
49m/s2(5G) or less (22 – 500Hz)
4 Shock *5 Operational 4,900m/s2(500G) or less (2 ms, half sine wave)
Non-operational
11,760m/s2(1200G) or less (1 ms, half sine wave)
5 Atmospheric condition Without corrosive vapors, salt or organic-metal
compound.(ex. organic silicon, organic tin)
Idle Typical 1.6 Bels6 Acoustic-noise
*3 seek Typical 2.2 Bels
7 Height Operational 3,000m or less
(Altitude) Non-operational 12,000m or less
Height gradient Max. 300m/min.(3.1kpa/min.)
8
(*4) Data reliability
(with retries and ECC) Less than 1 non-recoverable error in 10 E 13 bits read
9 External magnetic field 1,500 micro Tesla (DC) or less
*1: Ambient temperature should be measured at point 10 mm away from the nameplate of the drive. If the
maximum operational ambient temperature cannot be measured at a point 10 mm away from the
nameplate, a substitution method is stipulated in the table below.
Ambient
temperature Temperature at cover (Point A)
60°C 65°C
5°C 5°C
*2: In case of the maximum wet bulb 40°C , the drive should be
packed in HDD package box with ESD bag and desiccant.
Please see specification 5.1 Packing for reference.
If the drive is not packed in the HDD package box with ESD
bag and desiccant, maximum wet bulb 29°C is applied.
Measurement point
(Point A)

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*3 : 3.0 Bels are the maximum sound power levels with A-weighted. This value is specified at product
shipment, except during power on, load, unload or power down. Clicking noise of magnet latch operation
occurs at loading and unloading operation of the magnetic heads. Also, the clicking noise of the magnet
latch occurs at emergency unloading operations. Measurements are to be taken in accordance with ISO
7779. At seek mode, randomly select a cylinder and seek operation of the actuator with a delay time at
each cylinder. Seek rate for the drive can be calculated as shown below.
Seek rate = 0.4/(average access time + average latency) = 0.4/(average access time + 60/RPM/2)
*4 : Data reliability is not to be used to compromise the host system data backup.
*5 :These shock specifications are defined for each axis. For non-operating rotational shock, the
specification is 50K radian/sec2or less (2 ms, half sine wave).
3.3. Drive Usage Condition Specifications
The drive is designed for usage under the following conditions. Since reliability and product life depends on
usage conditions, please consult our sales representatives or application engineers if the drive may be
operated outside these conditions.
-Power on hours (POH) : Less than 333 hours/month
POH includes Sleep and Standby modes. The heads are unloaded during Power
off, Standby, Sleep or Low Power Idle modes. The spindle motor is stopped
during Standby and Sleep modes. This drive is not designed or intended to be
used for 24/7 applications. Continuous motor spinning should be limited to 48
hours period. In case of continuous POH condition, the transition to Standby
mode or Sleep mode must occur at least once every 48 hours period.
-Operating (Seek/Write : Less than 20% of POH
Read operations)
-Motor Start/Stop Count : Max. 300,000 times. This number includes Standby, Sleep and power-on/off
count.
-Environment : Within environmental specifications given in Table 3.2
-Power Requirement : Within DC power requirement specifications given in Table 3.1 “Principal
Specifications”
-Drive Grounding : Drive frame should be grounded to system ground with four screws electrically.
Grounding noise should be less than 500mVp-p. The grounding noise
should be measured between electrical ground and system frame ground
without the drive. Grounding AC current (measuring between two of side
mounting holes) should be less than 50 mAp-p (Frequency Range: less than
12MHz). The grounding current should be measured through 50 ohm resistor.
-External Magnetic Field : Within specifications given in Table 3.2
-Mounting : Mount with recommended screws and regular torque.
-Physical/Electrical Interface: ATA-6
-Handling : Do not add Electrical Static Discharge, and Vibration and Shock to the drive.
Do not press top cover and bottom PCBA surface of the drive.
Caution

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3.4. Load/Unload Specifications
Load /Unload is a mechanism to load/unload the heads on the disk surfaces.
3.4.1. Normal Load/Unload
Normal load/unload operations are limited to maximum 600,000 times during HDD life. The normal unload
operation is performed by the following commands.
- Standby
- Standby Immediate
- Sleep
Also, the normal unload is automatically performed by control software, during Idle mode. The above normal
unload time does not include an emergency unload as explained in Sec. 3.4.2.
3.4.2. Emergency Unload
The emergency unload is occurred by unexpected power down, and is limited to maximum 20,000 times
during HDD life. Since normal unload can not be performed by the software control after power off, the
heads are unloaded by a hardware control. The maximum number of emergency unload is defined
separately.
3.4.3. Required Power Off Sequence
To operate the load/unload normally, the following BIOS sequence is required by Host system before power
off.
[Sequence #1]: Execute one of following commands.
- Standby
- Standby Immediate
- Sleep
Note: Such as Soft Reset, Flush Cache command or Check Power Mode command does not
unload the heads.
[Sequence #2]: Check the Status Register, and wait the command complete.
Note: The head is unload by the sequence #1 command, and the command completion
normally takes about 1sec. Considering the error retries, BIOS timer should be set to
over 30 sec by the Host side.
[Sequence #3]: Power off the drive
Above sequence is required for the Host system at Power off, Suspend and Hibernation operations.

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4.0 Installation
4.1. Installation Direction
The Travelstar C4K60-30/20 can be installed in the 6 directions as shown below.
Figure 4.1 Installation

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4.2. Mounting HDD
4.2.1. Mounting HDD with screws
Mount the HDD with the screws according to the following instruction to optimize the
performance.
(a) Mount the HDD with M2.0 screws. Take care not to add any distorting force to the HDD when mounting.
Using 4 screws holes, secure the HDD.
(b) Use screws with the following specifications when the HDD is mounted.
i) M2.0 (screw engagement of 2.3mm max.)
ii) The torque for fixing the screws is 2.5±0.5kgcm(2.2±0.4 lb. inch)
(c) Consider an appropriate cooling to keep the temperature of center of HDD top cover less than 65°C.
(d) The inertia of the chassis around the Z-axis of the gravity center of the device must be more than
3 X 10-4 kg m2.
Note) In case of general Sub-Notebook PC(Weight: 1.7kg), the inertia of the chassis around the Z-axis of
the gravity center of the device is greater than 100 X 10-4 kg m2. Therefore, the required inertia level
has no problem with the general electronic equipment.
Figure 4.2 Mounting the HDD
Caution