
Reassembling Semi-Micro Flow Cell . . . 4-9
Cleaning Preparative Flow Cell . . . . . . 4-10
Removing Preparative Flow Cell . . . . . 4-10
Disassembling Preparative Flow Cell . . . 4-10
Cleaning Parts of Preparative Flow Cell . 4-11
Reassembling Preparative Flow Cell . . . 4-11
Cleaning High-Pressure Flow Cell . . . . . 4-12
Removing High-Pressure Flow Cell . . . . 4-12
Disassembling High-Pressure Flow Cell . . 4-12
Cleaning Parts of High-Pressure Flow Cell 4-13
Reassembling High-Pressure Flow Cell . . 4-13
5. Supplementary Information
Warranty Statement . . . . . . . . . . . . 5-1
All Analytical Products . . . . . . . . . 5-1
Limitation of Warranty . . . . . . . . . 5-2
Limitation of Remedies and Liability . . . 5-3
Responsibilities of the Customer . . . . . 5-3
Responsibilities of Hewlett-P ackard . . . 5-4
Safety Information . . . . . . . . . . . . 5-5
General . . . . . . . . . . . . . . . . 5-5
Operation . . . . . . . . . . . . . . . 5-5
Safety Symbols . . . . . . . . . . . . . 5-6
Solvent Information . . . . . . . . . . . . 5-9
Flow Cell . . . . . . . . . . . . . . . . 5-9
Solvents . . . . . . . . . . . . . . . . 5-9
Use of Solvents . . . . . . . . . . . . . . 5-10
Important . . . . . . . . . . . . . . . 5-11
Acids.................. 5-11
Bases . . . . . . . . . . . . . . . . . 5-11
Salts.................. 5-11
Organic Solvents . . . . . . . . . . . . 5-12
BuÀer Solutions . . . . . . . . . . . . 5-12
Degassing Solvents . . . . . . . . . . . 5-15
Radio Interference . . . . . . . . . . . . 5-16
Manufacturer's Declaration . . . . . . . 5-16
Hersteller- bescheinigung . . . . . . . . 5-16
Sound Emission . . . . . . . . . . . . . . 5-17
Manufacturer's Declaration . . . . . . . 5-17
Hersteller- bescheinigung . . . . . . . . 5-17
Declaration of Conformity . . . . . . . . . 5-18
Contents-3
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