HP ProCurve MSM765zl Assembly instructions

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Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP ProCurve MSM765zl Mobility Controller / J9370A
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0

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Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx Screw Drivers
T-6, T-8, T-
10, Box type
Phillips Screw Driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Using the Phillips screw driver, removes the 4 Phillips screw attaching the hard drive to the PCA.
2. Remove the 4 screws that attached the brackets to the hard drive using a T-8 screwdriver.
3. Remove the solder-anchor heatsink (towards right of PCA when looking from front) by releasing the catch from the 2
anchors.
4. Remove the 5 screws that attached the Com-E module onto the PCA using the Boxtype Torx screwdriver. Refer to
pic.1
5. Remove another 1 screw,using the Boxtype Torx screwdriver, as shown in Pic 2 to completely remove the Com-E
module from the PCA.
6. Remove the 4 screws that attached the heatsink onto the PCA using the T-10 Torx screwdriver. Refer to pic. 3
7. Remove the guide pin by using a T-10 Torx screwdriver to remove the 1 screw that attached the guide pin to the PCA.
8. Remove the bulkhead by removing the 5 screws securing the bulkhead onto the PCA. Remove 3 screws using the T-6
screwdriver and another 2 screws (towards right of PCA, when looking from front) using the T-10 screwdriver.
9. Remove two screws and springs on the bulkhead
10. Remove the insert label in the front pocket of the bulkhead
11. Remove the CF card on the PCA.
12.
13.
14.
15.
16.
17.
18.
19.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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