HP B132L+ How to use

Service Handbook
B Class
Model B132L/B132L+/B160L/B180L
HP Part No. A4190-90041
Edition E1097
Printed in U.S.A.

ii
Hewlett-Packard Co. 1997
Printing History
First Printing: October 1997
UNIX is a registered trademark in the United States and other
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ited.
NOTICE
The information contained in this document is subject to change
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HEWLETT-PACKARD MAKES NO WARRANTY OF ANY
KIND WITH REGARD TO THIS MATERIAL INCLUDING
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tained herein or for incidental or consequential damages in con-
nection with the furnishing, performance or use of this material.
Hewlett-Packard assumes no responsibility for the use or reliabil-
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10 9 8 7 6 5 4 3 2 1

Safety and Regulatory Statements
iii
Safety and Regulatory Statements
This section contains safety and regulatory statements
pertaining to your B132L/B132L+/B160L/B180L
workstation. It provides information on the following
topics:
• Special video configuration statements
• Emissions regulations
• Emissions regulations compliance
• Datacom users statement
• Acoustics
• Electrostatic discharge (ESD) precautions
• Safety statement
• Laser safety statements
• Warnings and cautions

Special Video Configuration Statements
iv
Special Video Configuration Statements
The following statements apply only to those applica-
tions which include a cable connected to the S-Video
connector on the A4248A card. No modification to the
regulatory statements is necessary for applications
which include cables connected to other connectors on
the card but not to the S-Video connector.
For EN55022 or CISPR 22 Applications:
WARNING: This is a Class A product. In a domestic environment
this product may cause radio interference in which
case the user may be required to take adequate
measures.
For FCC Applications:
NOTICE: This equipment has been tested and found to
comply with the limits for a Class A digital device,
pursuant to part 15 of the FCC rules. These limits
are designed to provide reasonable protection
against harmful interference when the equipment
is operated in a commercial environment. This
equipment generates, uses, and can radiate radio
frequency energy and, if not installed and used in
accordance with the instruction manual, may cause
harmful interference to radio communications.
Operation of this equipment in a residential area is
likely to cause harmful interference in which case
the user will be required to correct the interference
at his own expense.

Emissions Regulations
v
Emissions Regulations
Federal Communications Commission (FCC)
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules and the Canadian Depart-
ment of Communications. These limits are designed to
provide reasonable protection against harmful interfer-
ence in a residential installation. This equipment gen-
erates, uses, and can radiate radio frequency energy
and, if not installed and used in accordance with the
instructions, may cause harmful interference to radio
communications. However, there is no guarantee that
interference will not occur in a particular installation.
If this equipment does cause harmful interference to
radio or television reception (determined by turning
the equipment off and on), you can correct the interfer-
ence by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the
receiver.
• Connect the equipment into an outlet on a circuit differ-
ent from that to which the receiver is connected.
• Ask the dealer or an experienced radio/television techni-
cian for help.
Hewlett-Packard’s system certification tests were con-
ducted with HP-supported peripheral devices and HP
shielded cables, such as those you receive with your
computer. Changes or modifications not expressly
approved by Hewlett-Packard could void the user’s
authority to operate the equipment.

Emissions Regulations
vi
Operation of this device is subject to the following
conditions:
• This device may not cause harmful interference.
• This device must accept interference received, including
interference that may cause undesired operation.
• Cablesusedwiththisdevicemustbeproperlyshieldedto
comply with the requirements of the FCC.
VCCI Class 2 ITE

Emissions Regulations Compliance
vii
Emissions Regulations Compliance
Any third-party I/O device installed in HP system(s)
must be in accordance with the requirements set forth
in the preceding Emissions Regulations statements. In
the event that a third-party noncompliant I/O device is
installed, the customer assumes all responsibility and
liability arising therefrom.
Acoustics
Regulation On Noise Declaration
For Machines -3. GSGV7
Lpa <70dB Lpa<70dB
operator position am Arbeitsplatz
normal operation nomaler Betrieb
per ISO 7779 nach DIN 45635 T.19

Electrostatic Discharge (ESD) Precautions
viii
Electrostatic Discharge (ESD)
Precautions
Electrostatic charges can damage the integrated cir-
cuits on printed circuit boards. To prevent such dam-
age from occurring, observe the following precautions
during board unpacking and installation:
• Stand on a static-free mat.
• Wear a static strap to ensure that any accumulated elec-
trostatic charge is discharged from your body to ground.
• Connect all equipment together, including the static-free
mat, static strap, routing nodes, and peripheral units.
• Keepuninstalledprintedcircuitboardsintheirprotective
antistatic bags.
• Handle printed circuit boards by their edges, once you
have removed them from their protective antistatic bags.
Safety Statement
This equipment conforms to the following safety stan-
dards:
• UL 1950
• CSA 950
• IEC 950
• EN 60950

Laser Safety Statement (U.S.A. Only)
ix
Laser Safety Statement (U.S.A. Only)
The CD ROM mass-storage system is certified as a
Class-1 laser product under the U.S. Department of
Health and Human Services (DHHS) Radiation Per-
formance Standard according to the Radiation Control
for Health and Safety Act of 1968.
This means that the mass-storage system does not pro-
duce hazardous laser radiation. Because laser light
emitted inside the mass-storage system is completely
confined within protective housings and external cov-
ers, the laser beam cannot escape from the machine
during any phase of user operation.

Warnings and Cautions
x
Warnings and Cautions

Contents
xi
1 Product Information
Product Description 3
System Unit Front Panel Controls and LEDs 6
System Power Switch 7
Power LED 7
System LEDs 7
Audio Controls 8
Removable Storage Devices 9
System Unit Rear Panel Connectors 10
Security Loop 11
Audio Connectors 11
Keyboard Connectors 14
PS/2 Keyboard and Mouse Connectors 14
HP Parallel I/O Connector 14
802.3 Network Connectors 14
Serial I/O Connectors 15
SCSI Connectors 16
TOC Button 16
Power Cord Connector 16
Monitors 17
Keyboard 17
Pointing Devices 17
Operating System Overview 18
Important Information You Need to Note 19
LANIC ID 19
IP Address and Subnetwork Mask Information 20

Contents
xii
Networking Overview 21
Mail 21
telnet 21
rlogin 22
ftp 22
rcp 23
NFS 23
2 Environmental/Installation/PM
Environmental Specifications 27
Installation 29
Preventive Maintenance 29
3 Configuration
Workstation Configurations 33
FRU Configurations 34
Internal Storage Configurations 34
Allowable Memory Configurations 43
Monitor-Type Selection 45
Graphics Configuration Consideration 46
Special Video Configuration Statements 46
For EN55022 or CISPR 22 Applications: 46
For FCC Applications: 46
Graphics Paths 47
Graphics Configuration Restrictions 48

Contents
xiii
4 Troubleshooting
Getting Ready to Troubleshoot 51
Dealing with a Boot Failure 56
Searching for Bootable Media 58
Stable Storage 59
Boot Command Notations 59
Supported Boot Paths 59
ISL Environment 60
Selftest Failures 61
Chassis Codes 63
Running System Verification Tests 77
Running ODE-Based Diagnostics 79
Dealing with HPMC
(Uncorrectable Error) 81
HPMC Caused by a Multi-Bit Memory
Parity Error 83
Interpreting the Table 84
Determining the Faulty SIMM Pair 85
HPMC Caused by a Data Cache Parity Error 90
Changing the Console to External Terminal 91
5 Field Replaceable Units
Exchange and Nonexchange Part Numbers 95
FRU Removal and Replacement 102
Main Tray Assembly 105

Contents
xiv
Removing Memory Modules 106
Installing Memory Modules 109
Second Level Cache Boards 112
Storage Tray Assembly 114
Storage Tray Cover 117
Disk Filler Panel 118
CD-ROM Drive or DDS Tape Drive 119
3.5-Inch Floppy Disk Drive 121
Hard Disk Drive 124
Removing EISA, GSC, and PCI Option Boards 126
CPU Board Assembly 128
Determining LAN ID 129
Removing the CPU Board 130
Optional EGRAM Module 131
System Fans and Speaker 133
Battery 135
Power Supply 136
Fast Wide SCSI Controller 138
Backplane 139
6 Diagrams and Pinouts
System Power 145
System Block Diagrams 172
7 Reference
Installation Manual 177
Service Manuals 177

Contents
xv
Reference Manuals 177
8 Service Notes
9 Boot Console Interface
Accessing the Boot Console Interface 183
Booting Your Workstation 185
Searching for Bootable Media 187
Resetting Your Workstation 189
Displaying and Setting Paths 190
Displaying and Setting the Monitor Type 193
The Monitor Command 193
Displaying the Current Monitor Configuration 195
Setting the Monitor Type 197
Setting the Monitor Type at Power On 199
Changing the Console to External Terminal 200
Displaying the Current Memory Configuration 201
Setting the Auto Boot and Auto Search Flags 203
Displaying and Setting the Fastboot Mode 205
Displaying the LAN Station Address 206

Contents
xvi
Configure and Display LAN Settings (B132L+/B180L
Only) 207
Displaying System Information 209
Displaying PIM Information 210
Stable Storage 211
ISL Environment 212
Invoking ISL from the Boot Console Interface 212
ISL User Commands 213
Updating System Firmware with ODE 215

Contents
xvii
Figures
System Unit Front Panel Controls 6
System Unit Rear Panel Connectors 10
Disk Tray Positions 34
Early Model CD-ROM Drive
SCSI Address/Jumper Settings 37
Later Model CD-ROM Drive
SCSI Address/Jumper Settings 38
Early Model DDS-DC Tape Drive
SCSI Address/Jumper Settings 39
Later Model DDS-DC Tape Drive
SCSI Address/Jumper Settings 40
DDS-2 Tape Drive SCSI Address/Jumper Settings 41
DDS Drive Switch Settings for Data Compression Oper-
ation Mode 42
Memory Connectors 44
Power On Troubleshooting 52
Selftests Troubleshooting 53
HP-UX Compatible Mode Troubleshooting 54
HP-UX Compatible Mode Troubleshooting
(Continued) 55
B132L/B132L+/B160L/B180L Major Components 95
Main Tray FRUs 96

Contents
xviii
Figures
Storage Tray FRUs 97
Removing the Floor Stand 103
Removing the Main Tray Assembly 105
Memory Module Location 106
Removing the Memory Retainer 107
Removing a Memory Module 108
Memory Module Location 109
Removing the Memory Retainer 110
Installing Memory Modules 111
Cache Boards Location 112
Removing Second Level Cache Boards 113
Removing the Memory Retainer 114
Disconnecting the Storage Tray Assembly 115
Removing the Storage Tray Assembly 116
Removing the Storage Tray Cover 117
Removing a Disk Filler Panel 118
Removing a CD-ROM Drive or DDS Tape Drive 119
Disconnecting the Floppy Drive Cable 121
Removing the Floppy Disk Carrier 122

Contents
xix
Figures
Removing the Floppy Disk Drive 123
Removing a Hard Disk Drive 125
Removing an EISA, GSC, or PCI Option Board 126
Installing an Option Slot Blank Plate 127
Removing the CPU Board 130
Removing the Optional EGRAM Module 131
Disconnecting the Fan and Speaker Connectors 133
Removing the System Fans and Speaker 134
Removing the Battery 135
Removing the Option Board Support Bracket 136
Removing the Power Supply 137
Removing the FW SCSI Controller 138
Disconnecting the Speaker and Fan Connectors 140
Removing the Backplane 141
System Unit Functional Block Diagram (B132L/B160L)
173
System Unit Functional Block Diagram (B132L+/
B180L) 174

Contents
xx
Tables
Audio Electrical Specifications 13
Serial I/O Pins 15
Sample LANSCAN COMMAND TABLE 20
Environmental Specifications 27
Storage Configurations 35
Default SCSI IDs 36
LED Error Codes 61
PIM_INFO Action Table 82
Multi-Bit Memory Parity Error 83
Memory Address Ranges 85
Example Table 87
Processor Module Error (Data Cache Parity) 90
Exchange Parts FRU List 98
Nonexchange Parts FRU List 100
Backplane to System Board Connector 145
Backplane PCI Connector 147
FWSCSI Board Backplane Connector 148
Backplane EISA Slot Connector (Rows F, B, E, and A)
149