HP Compaq dc5100 MT Operating and maintenance manual

Hardware Reference Guide
HP Compaq Business PC
dc5100 Microtower Model
Document Part Number: 376292-002
February 2005
This guide provides basic information for upgrading this computer
model.

© Copyright 2004 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice.
Microsoft, MS-DOS, Windows, and Windows NT are trademarks of Microsoft
Corporation in the U.S. and other countries.
The only warranties for HP products and services are set forth in the express
warranty statements accompanying such products and services. Nothing herein
should be construed as constituting an additional warranty. HP shall not be liable
for technical or editorial errors or omissions contained herein.
This document contains proprietary information that is protected by copyright.
No part of this document may be photocopied, reproduced, or translated to
another language without the prior written consent of Hewlett-Packard
Company.
ÅWARNING: Text set off in this manner indicates that failure to follow
directions could result in bodily harm or loss of life.
ÄCAUTION: Text set off in this manner indicates that failure to follow
directions could result in damage to equipment or loss of information.
Hardware Reference Guide
HP Compaq Business PC
dc5100 Microtower Model
First Edition (November 2004)
Second Edition (February 2005)
Document Part Number: 376292-002

Hardware Reference Guide www.hp.com iii
Contents
1ProductFeatures
Standard Configuration Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
Front Panel Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
Rear Panel Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
Keyboard Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4
Optional HP Modular Keyboard. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–5
Windows Logo Key . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–5
Special Mouse Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–5
Serial Number Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6
2 Hardware Upgrades
Serviceability Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1
Warnings and Cautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1
Removing the Computer Access Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2
Removing the Front Bezel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–3
Installing Additional Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
DIMMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
DDR2-SDRAM DIMMs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
Populating DIMM Sockets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–5
Installing DIMMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–7
Replacing or Upgrading a Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9
Locating Drive Positions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–9
Removing a Drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–10
Replacing a Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–13
Removing or Installing an Expansion Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–18
Reassembling the Computer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–24
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Contents
A Specifications
B Battery Replacement
C Security Lock Provisions
Installing a Security Lock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C–1
Cable Lock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C–1
Padlock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C–2
DElectrostaticDischarge
Preventing Electrostatic Damage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D–1
Grounding Methods. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D–1
E Computer Operating Guidelines, Routine Care and
Shipping Preparation
Computer Operating Guidelines and Routine Care. . . . . . . . . . . . . . . . . . . . . . . . . . . . E–1
Optical Drive Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E–2
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E–2
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E–2
Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E–2
Shipping Preparation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E–3
Index
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Hardware Reference Guide www.hp.com 1–1
1
Product Features
Standard Configuration Features
The HP Compaq Microtower features may vary depending on the
model. For a complete listing of the hardware and software installed
in the computer, run the Diagnostics for Windows utility. Instructions
for using this utility are provided in the Troubleshooting Guide on the
Documentation CD.
Microtower Configuration
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Product Features
Front Panel Components
Drive configuration may vary by model.
Front Panel Components
1Optical Drives (CD-ROM, CD-R/RW,
DVD-ROM, DVD+R/RW, or
CD-RW/DVD Combo Drive)
7Optical Drive Eject Buttons
2Optical Drive Activity Lights 8Power Button
3Diskette Drive (optional) 9Power On Light
4Diskette Drive Activity Light (optional) -Hard Drive Activity Light
5Diskette Eject Button (optional) qHeadphone Jack
6USB (Universal Serial Bus) Ports wMicrophone Connector
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Hardware Reference Guide www.hp.com 1–3
Product Features
Rear Panel Components
Rear Panel Components
1Power Cord Connector 7nRJ-45 Network Connector
2Voltage Select Switch 8lParallel Connector
3bPS/2 Mouse Connector 9cMonitor Connector
4aPS/2 Keyboard Connector -kHeadphone/Line-Out Connector
5oUniversal Serial Bus (USB) qjLine-In Audio Connector
6mSerial Connector* wgMicrophone Connector
✎Arrangement and number of connectors may vary by model.
If a PCI graphics card is installed, the connectors on the card and the system board may be
used at the same time. Some settings may need to be changed in Computer Setup to use both
connectors. For information about Boot Order, refer to the Computer Setup (F10) Utility Guide
on the Documentation CD.
*The header on the system board labeled P52 supports an optional second serial port (part
number 284216-001).
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Product Features
Keyboard Components
1Function Keys Perform special functions depending on the software application
being used.
2Editing Keys Includes the following: Insert, Home, Page Up, Delete, End, and
Page Down.
3Status Lights Indicate the status of the computer and keyboard settings
(Num Lock, Caps Lock, and Scroll Lock).
4Numeric Keys Work like a calculator keypad.
5Arrow Keys Used to navigate through a document or Web site. These keys
allow you to move left, right, up, and down, using the keyboard
instead of the mouse.
6Ctrl Keys Used in combination with another key; its effect depends on the
application software you are using.
7Application Key* Used (like the right mouse button) to open pop-up menus in a
Microsoft Office application. May perform other functions in other
software applications.
8Windows Logo
Keys*
Used to open the Start menu in Microsoft Windows. Used in
combination with other keys to perform other functions.
9Alt Keys Used in combination with another key; its effect depends on the
application software you are using.
*Keys available in select geographic regions.
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Hardware Reference Guide www.hp.com 1–5
Product Features
Optional HP Modular Keyboard
If the computer kit includes an HP Modular Keyboard, refer to the
HP Modular Keyboard User Guide on the Documentation CD for
component identification and setup information.
Windows Logo Key
Use the Windows Logo key in combination with other keys to
perform certain functions available in the Windows operating system.
Refer to the “Keyboard Components” section to identify the Windows
Logo key.
Special Mouse Functions
Most software applications support the use of a mouse. The functions
assigned to each mouse button depend on the software applications
you are using.
Windows Logo Key Functions
Windows Logo Key Displays or hides the Start menu.
Windows Logo Key + dDisplays the Desktop.
Windows Logo Key + mMinimizes all open applications.
Shift + Windows Logo Key + m Undoes Minimize All.
Windows Logo Key + eLaunches My Computer.
Windows Logo Key + fLaunches Find Document.
Windows Logo Key + Ctrl + f Launches Find Computer.
Windows Logo Key + F1 Launches Windows Help.
Windows Logo Key + lLocks the computer if you are connected to a
network domain, or allows you to switch users if you
are not connected to a network domain.
Windows Logo Key + rLaunches the Run dialog box.
Windows Logo Key + uLaunches the Utility Manager.
Windows Logo Key + Tab Activates the next Taskbar button.
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Product Features
Serial Number Location
Each computer has a unique serial number and a product ID number
that are located on the top cover of the computer. Keep these numbers
available for use when contacting customer service for assistance.
Serial Number and Product ID Location
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Hardware Reference Guide www.hp.com 2–1
2
Hardware Upgrades
Serviceability Features
The Microtower computer includes features that make it easy to
upgrade and service. No tools are needed for most of the installation
procedures described in this chapter.
Warnings and Cautions
Before performing upgrades be sure to carefully read all of the
applicable instructions, cautions, and warnings in this guide.
ÅWARNING: To reduce the risk of personal injury from electrical shock
and/or hot surfaces, be sure to disconnect the power cord from the wall
outlet and allow the internal system components to cool before touching.
ÅWARNING: To reduce the risk of electrical shock, fire, or damage to the
equipment, do not plug telecommunications/telephone connectors into the
network interface controller (NIC) receptacles.
ÄCAUTION: Static electricity can damage the electrical components of the
computer or optional equipment. Before beginning these procedures,
ensure that you are discharged of static electricity by briefly touching a
grounded metal object. See Appendix D, “Electrostatic Discharge” for
more information.
ÄCAUTION: Before removing the computer cover, ensure that the
computer is turned off and that the power cord is disconnected from the
electrical outlet.
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Hardware Upgrades
Removing the Computer Access Panel
To remove the computer access panel:
1. Turn off the computer properly through the operating system and
turn off any external devices.
2. Disconnect the power cord from the power outlet and the
computer, and disconnect any external devices.
ÄCAUTION: Before removing the computer access panel, ensure that the
computer is turned off and that the power cord is disconnected from the
electrical outlet.
3. Loosen the captive thumbscrew 1that secures the access panel to
the computer chassis.
4. Slide the access panel back 2about 2.5 cm (1 inch), then lift it
off the unit.
✎You may want to lay the computer on its side to install internal parts.
Be sure the side with the access panel and pull grip is facing up.
Removing the Computer Access Panel
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Hardware Reference Guide www.hp.com 2–3
Hardware Upgrades
Removing the Front Bezel
To remove the front bezel:
1. Turn off the computer properly through the operating system and
turn off any external devices.
2. Disconnect the power cord from the power outlet and the
computer, and disconnect any external devices.
3. Remove the computer access panel.
4. To remove the front bezel, press down on all three tabs on the
left side of the bezel 1then rotate the bezel off the chassis 2,
beginning with the left side then the right side.
Removing the Front Bezel
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2–4 www.hp.com Hardware Reference Guide
Hardware Upgrades
Installing Additional Memory
The computer comes with double data rate 2 synchronous dynamic
random access memory (DDR2-SDRAM) dual inline memory
modules (DIMMs).
DIMMs
The memory sockets on the system board can be populated with up to
four industry-standard DIMMs. These memory sockets are populated
with at least one preinstalled DIMM. To achieve the maximum
memory support, you can populate the system board with up to 4GB
of memory configured in a high-performing dual channel mode.
DDR2-SDRAM DIMMs
For proper system operation, the DDR2-SDRAM DIMMs must be:
■industry-standard 240-pin
■unbuffered PC3200 400 MHz-compliant or PC4300
533 MHz-compliant
■1.8 volt DDR2-SDRAM DIMMs
The DDR2-SDRAM DIMMs must also:
■support CAS latency 3, 4, or 5 (CL = 3, CL = 4, or CL = 5) for
DDR2/400 MHz; supports CAS latency 4 or 5 (CL = 4 or CL = 5)
for DDR2/533 MHz
■contain the mandatory JEDEC SPD information
In addition, the computer supports:
■256Mbit, 512Mbit, and 1Gbit non-ECC memory technologies
■single-sided and double-sided DIMMS
■DIMMs constructed with x8 and x16 DDR devices; DIMMs
constructed with x4 SDRAM are not supported
✎The system will not start if you install unsupported DIMMs.
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Hardware Reference Guide www.hp.com 2–5
Hardware Upgrades
Populating DIMM Sockets
The system will automatically operate in single channel mode, dual
channel Asymmetric mode, or a higher-performing dual channel
Interleaved mode, depending on how the DIMMs are installed.
■The system will operate in single channel mode if the DIMM
sockets are populated in one channel only.
■The system will operate in dual channel Asymmetric mode if the
total memory capacity of the DIMMs in Channel A is not equal to
the total memory capacity of the DIMMs in Channel B.
■The system will operate in a higher-performing dual channel
Interleaved mode if the total memory capacity of the DIMMs in
Channel A is equal to the total memory capacity of the DIMMs in
Channel B. However, the technology and device width can vary
between the channels. For example, if Channel A is populated
with two 256MB DIMMS and Channel B is populated with one
512MB DIMM, the system will operate in Interleaved mode.
■In any mode, the maximum operational speed is determined by
the slowest DIMM in the system. For example, if the system is
populated with a DIMM that is 400 MHz and a second DIMM
that is 533 MHz, the system will run at the slower of the two
speeds.
There are four DIMM sockets on the system board, with two sockets
per channel. The sockets are labeled XMM1, XMM2, XMM3, and
XMM4. Sockets XMM1 and XMM2 operate in memory channel A.
Sockets XMM3 and XMM4 operate in memory channel B.
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Hardware Upgrades
DIMM Socket Locations
Item Description Socket Color
1DIMM socket XMM1, Channel A Black
2DIMM socket XMM2, Channel A White
3DIMM socket XMM3, Channel B Black
4DIMM socket XMM4, Channel B White
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Hardware Reference Guide www.hp.com 2–7
Hardware Upgrades
Installing DIMMs
ÄCAUTION: The memory module sockets have gold metal contacts. When
upgrading the memory, it is important to use memory modules with gold
metal contacts to prevent corrosion and/or oxidation resulting from having
incompatible metals in contact with each other.
ÄCAUTION: Static electricity can damage the electronic components of
the computer or optional cards. Before beginning these procedures,
ensure that you are discharged of static electricity by briefly touching a
grounded metal object. For more informations, refer to Appendix D,
“Electrostatic Discharge.”
ÄCAUTION: When handling a memory module, be careful not to touch
any of the contacts. Doing so may damage the module.
1. Turn off the computer properly through the operating system and
turn off any external devices.
2. Disconnect the power cord from the power outlet and disconnect
any external devices.
3. Remove the computer access panel.
4. Locate the memory module sockets on the system board.
ÅWARNING: To reduce risk of personal injury from hot surfaces, allow
the internal system components to cool before touching.
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Hardware Upgrades
5. Open both latches of the memory module socket 1, and insert the
memory module into the socket 2.
Installing a DIMM
✎A memory module can be installed in only one way. Match the notch
on the module with the tab on the memory socket.
✎For maximum performance, poplulate the sockets so that the memory
capacity of Channel A is equal to the memory capacity of Channel B.
For example, if you have one preinstalled DIMM in socket XMM1
and are adding a second DIMM, it is recommended that you install a
DIMM of equal memory capacity into the XMM3 or XMM4 socket.
6. Push the module down into the socket, ensuring that the module
is fully inserted and properly seated. Make sure the latches are in
the closed position 3.
7. Repeat steps 5 and 6 to install any additional modules.
8. Replace the access panel.
The computer should automatically recognize the additional memory
the next time you turn on the computer.
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Hardware Reference Guide www.hp.com 2–9
Hardware Upgrades
Replacing or Upgrading a Drive
The computer supports up to six drives that may be installed in
various configurations.
This section describes the procedure for replacing or upgrading the
storage drives. A Torx screwdriver is needed to replace the guide
screws on a drive.
ÄCAUTION: Make sure you back up your personal files on the hard drive
to an external storage device, such as a CD, before removing the hard
drive. Failure to do so will result in data loss. After replacing the primary
hard drive, you will need to run the Restore Plus! CD to load the HP
factory-installed files.
Locating Drive Positions
Drive Positions
1Two 5.25-inch, half-height bays for optional drives
2Two standard 3.5-inch, one-third height bays (1.44-MB
diskette drive shown)
3 Two internal 3.5-inch, one-third height bays for hard drives
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Hardware Upgrades
Removing a Drive
1. Turn off the computer properly through the operating system and
turn off any external devices. Disconnect the power cord from the
power outlet and disconnect any external devices.
2. Remove the access panel and front bezel.
3. Disconnect the power and data cables from the back of the drive,
as indicated in the following illustrations.
Disconnecting the Optical Drive Cables
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