HP Z8 G4 Assembly instructions

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Product End-of-Life Disassembly Instructions
Product Category: Workstations
Marketing Name / Model
[List multiple models if applicable.]
HP Z8 G4Workstation
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for
the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code
on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies(PCA)
With a surface greater than 10 sq cm
Yes
5
Batteries All types including standard alkaline and lithium
coin or button style batteries Yes
1
Mercury-containingcomponents
For example, mercuryin lamps, display backlights,
scanner lamps, switches,batteries
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm Includes background illuminated displays with gas discharge lamps
Cathode RayTubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Eldorado1450W PSU
9
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations.
Components and waste containing asbestos
1.0 Items Requiring Selective Treatment

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Components, parts and materials containing
refractoryceramic fibers
Components, parts and materials containing
radioactivesubstances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
ToolDescription
Tool Size (if
applicable)
Screwdriver
T-15/T30/
PH2/PH0/V6
Pliers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove/disengage any security devices that prohibit opening the workstation
2. Disconnect the power cord from the electrical outlet and then from the workstation.
3. Disconnect all peripheral device cables from the workstation.
4. Remove the access panel.(see Figure 1 below)
5. Remove the internal parts.(see Figure 2-4 below)
6. Remove the system fans and brackets. (see Figure 5-19 below)
7. Remove the Slim ODD and cable.(see Figure 20-24 below
8. Remove all the FIO cable from chassis.(see Figure 25-34)
9. Remove all the installed parts from MB.(see Figure 35-36)
10. Remove the CPU cooler.(see figure 37-42)
11. Remove the FIO module.(see fugure 43-55)
12. Remove the HDD bracket.(see figure 56-58)
13. Remove the MB from chassis.(see figure 59-64)
14. Remove the PCIe slot cover.(see figure 65)
15. Remove the PSU.(see figure 66)
16. Remove the right side panel.(see figure 67-70)
17. Remove the PDB out of chassis.(see figure 71-73)
18. Remove the BM SATA cable.(see figure 74-76)
19. Remove the top panel from chassis.(see figure 77-78)
20. Remove the front panel from chassis.(see figure 79-80)
21. Remove the hood sensor bracket and HDD Deco bracket.(see figure 81-82)
22. Remove the front handle pocket.(see figure 83-91)
23. Remove the rear handle pocket.(see figure 92-95)
24. Remove the ODD bracket cover.(see figure 96-100)
25. Remove PSU outside screws.(seefigure 101-102)
26. Remove PSU PCB screws.(see figure 103-104)
27. Cutoff the cable tie inside PSU.(see figure 105-108)
28. Disconnector fan header from PSU PCA. (see figure 109-110)
29. Remove the capacitors over 2.5mm. (see figure 111-112)
30. Remove 2pcs fan from PSU. (see figure 113)

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3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Figure1 Remove the Access Panel Figure2 Remove the PCIe retainer
Figure3 Remove the memory fan duct Figure4 Remove the Personality Module Guide.

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Figure5 Disconnect the PCIe power cable from PCIe fan
guide.
Figure6 Disconnect the front middle chassis fan cable
Figure7 Disconnect the front lower chassis fan cable Figure8 Remove the PCIe fan guide from chassis
Figure9 Remove the front lower chassis fan from fan
guide. Figure10 Remove the front middle chassis fan from fan guide.

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Figure11 All the parts of PCIe fan guide. Figure12 Remove the front upper chassis fan duct.
Figure13 Disconnect the front upper chassis fan cable. Figure14 Remove the front upper chassis fan from duct.

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Figure15 Remove the fan guard from fan. Figure16 Detail parts of front upper chassis fan guide
assembly.
Figure17 Disconnect rear system fan cable from ODD Figure18 Remove the rear system fan cables from hook
Figure19 Remove the fan guard from fan guard. Figure20 Disconnect all the SATA cable from MB.

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Figure21 Disconnect the ODD SATA cable from ODD. Figure22 Disconnect the ODD Power cable from ODD
Figure23 Release the ODD SATA cable from cable clip Figure24 The ODD SATA cable detail.
Figure25 Disconnect the FUI cable from MB. Figure26 Remove the USB3.0 cable from MB.

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Figure27 Disconnect the FUI cable from FIO module. Figure28 Disconnect the USB3.0 cable from FIO module.
Figure29 Unclasp the 2pcs cable clip on chassis. Figure30 Remove the FUI and USB3.0 cable from chassis.
Figure31 Disconnect the Audio Extension cable from MB
Figure32 Disconnect the Audio Extension cable from FIO
Module.

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Figure33 Cutoff the cable tie on front upper chassis fan
duct bracket
Figure34 Remove the Audio Extension cable from chassis.
Figure35 Remove the graphic card from MB Figure36 Remove the memory from MB
Figure37 Disconnect the CPU cooler cable from MB. Figure38 Remove the CPU cooler from MB.

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Figure39 Remove the CPU and carrier from cooler Figure40 Remove the CPU from carrier.
Figure41 Figure38 Remove the fan from CPU cooler Figure42 Detail parts of CPU cooler assembly.
Figure43 Drag out the ODD power cable from ODD bay.
Figure44 Remove FIO module and ODD filer(x2) and slim
ODD from chassis

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Figure45 Loosen the screws(x4) of speaker and release
speaker. Figure46 Disconnect the Speaker cable from FIO module
Figure47 Release the Front Panel Mount cable from clip
Figure48 Disconnect the Front Panel Mount cable from FIO
PCA
Figure49 Release the Front Panel Mount cable by push
out 4 pins fixed in FIO tray. Figure50 Release the Front Panel Mount cable by push out 4 pins fixed in FIO tray.

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Figure51 Loose the 4pcs FIO PCA screws Figure52 Remove the SD Card Reader Carrier
Figure53 Loose the left and right side hooks of FIO panel Figure54 Loose the 2pcs bottom side hooks of FIO panel
Figure55 Details of FIO module Assembly Figure56 Loose the HDD bracket

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Figure57 Remove the 4pcs HDD bracket from chassis. Figure58 Remove the HDD from HDD0 bracket by push out
the HDD bracket.
Figure59 Disconnect the P1 power connector from MB. Figure60 Disconnect the P4 power connector from MB.
Figure61 Disconnect the P2 power connector from MB. Figure62 Disconnect the P3 power connector from MB.

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Figure63 Remove the battery from MB.
Figure64 Push the MB from the rear side to from and
remove the MB out of chassis.
Figure65 Remove the PCIe slot cover(x6) from chassis. Figure66 Remove the PSU from chassis
Figure67 Cut off the cable tie to fix P3 power cable Figure68 Cut off the cable tie to fix BM SATA and Graphics
power cable.

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Figure69 Release 2pcs screws of right side panel. Figure70 Open and remove right side panel
Figure71 Cutoff 5 pcs cable tie to fix power cable. Figure72. Unlock 4pcs screw of PDB.
Figure73 Unlock 4pcs screw of PDB. Figure74 Disconnect the H1 power cable and BM SATA
power cable.

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Figure75 Release the BM STAT connector from
chassis Figure76 The details of BM SATA cable
Figure77 Release 2pcs latch of top panel. Figure78 Remove the top penal from chassis
Figure79 Release 2pcs latch of front panel on bottom
side of chassis. Figure80 Remove the front panel from chassis

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Figure81 Push 2pcs inside latch to release hood sensor
bracket from chassis. Figure82 Push 3pcs inside latch to release HDD Deco bracket from chassis.
Figure83 Unlock the left side screws(2x) front side handle. Figure84 Unlock the right side screws(2x) front side handle.
Figure85 Release 1 latch of front side handle pocket. Figure86 Release other latch of front side handle pocket.

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Figure87 Details of front side handle pocket
Figure88 Remove the left side plastic parts of front side
handle pocket by release 2pcs latches.
Figure89 The details of left side plastic parts of front side
handle pocket.
Figure90 Remove the right side plastic parts of front side
handle pocket release 3pcs latches
Figure91 The details of left side plastic parts of front side
handle pocket.
Figure92 Unlock the left side screw of rear handle pocket

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Figure93 Unlock the right side screw of rear handle pocket Figure94 Release 3pcs latches of rear handle pocket
Figure95 The detail of rear handle pocket Figure96 Unlock bottom side screw of ODD bracket cover

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Figure97 Remove the bottom side spring of ODD
bracketcover
Figure98 Unlock top side screw of ODD bracket
cover
Figure99 Remove the top side spring of ODD
bracketcover
Figure100 The details of ODD bracket cover
Figure 101 Remove 5pcs PSU case screw Figure 102 Remove 2pcs PSU case screw