HP HC270cr Installation instructions

Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP HC270cr Display
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
IF BD, OSD key BD, Lync key BD, BLS BD
4
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps Panel
1
Cathode Ray Tubes (CRT)
No
0
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Power BD only (C805)
1
External electrical cables and cords
DP, USB A-B, USB C-C, HDMI, VGA Cable, Power
cord
6
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.

Tool Description
Tool Size (if
applicable)
Description #1 SCREW DRIVER(PHILLIPS HEAD)
#0
Description #2 SCREW DRIVER(PHILLIPS HEAD)
#1
Description #3 SCREW DRIVER(PHILLIPS HEAD)
#2
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove Cable From Display Head.
2. Push the release button
3. Remove Stand Base From Display Head. Remove Mid cover From Display Head
4. Release four screws
5. Remove Rear Cover from the bottom side.
6. Peel off the two mylars at the bottom side of R/C.
7. Peel off four pcs Logo in R/C.
8. Remove bottom lots of EMI Al tape and top black EMI tape and two speakers
9. Release six screws and five cable connectors
10. Uplift Chassis then unlock the cable above shows, and we get two ASSY as right picture show
11. Release five screws for PCB fix and five screws for Connector fix
12. Take off PCB and unlock all the cables
13. Take away thermal pads and take off heatsink after release screws, get all the parts as right picture show.
14. Release four screws around Panel then Panel can be taken apart from Middle Frame.
15. Release five screws and peel off two little PCBs. Disassemble the top slider ASSY.
16. Release four side screws and one piece EMI mylar
17. Peel off four Rubbers on the front side and one PCB on rear side
18. Release three screws in VESA and four screws in Base
19. Release three screws and two springs
20. Release ten screws and peer off two rubbers
21. Release around screws and take off plastic
22. Panel disassemble
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

HP HC270cr Disassembly Process
▪Tonny Hu
▪Mechanical Engineer
▪Jan-30-2018

2
External Electric Cables Dissecting Process
1.Remove Cable From Display Head.

3
Remove Stand Base From Display Head
3.Remove Stand Base From Display Head.2. Push the release button

4
5.Remove Rear Cover from the bottom side.
Remove Rear Cover From Display Head
4.Release four screws
6.Peel off the two mylars at the bottom
side of R/C. 7.Peel off four pcs Logo in R/C.

5
Remove Bracket from Display Head
8.Remove bottom lots of EMI Al tape and top
black EMI tape and two speakers
9. Release six screws and five cable
connectors
10. Uplift Chassis then unlock the cable above shows, and
we get two ASSY as right picture show

6
Disassemble Chassis ASSY
11. Release five screws for PCB fix and five
screws for Connector fix 12. Take off PCB and unlock all the cables

7
13. Take away thermal pads and take off heatsink
after release screws, get all the parts as right picture show.
Disassemble Metal ASSY

8
Disassemble Panel and Middle Frame
14. Release four screws around Panel then Panel can
be taken apart from Middle Frame.

9
Disassemble Middle Frame ASSY
15. Release five screws and peel off two little PCBs.
Disassemble the top slider ASSY.

10
Disassemble Panel Bracket
16. Release four side screws and one piece EMI mylar

11
Disassemble Panel accessory
17. Peel off four Rubbers on the front side and one PCB on rear side

12
Disassemble Stand ASSY
18. Release three screws in VESA and four screws in Base

13
Disassemble Stand ASSY
19. Release three screws and two springs

14
Disassemble Stand ASSY
20. Release ten screws and peer off two rubbers

15
Disassemble Stand ASSY
21. Release around screws and take off plastic

16
Disassemble Panel ASSY