HP StorageWorks 2300 - Disk System User manual

hp StorageWorks
disk system 2300
Edition E0902
user’s guide

Notice
© Hewlett-Packard Company, 2002. All rights
reserved.
A6490-96014
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Format Conventions
WARNING Identifies a hazard that can cause
personal injury
Caution Identifies a hazard that can cause
hardware or software damage
Note Identifies significant concepts or
operating instructions
this font - used for all text to be typed
verbatim: all commands, path names, file names,
and directory names also, text displayed on the
screen
<this font> - used for variables used in commands
this font - used for GUI menu options and screen
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Trademark Information
Red Hat is a registered trademark of Red Hat Co.
C.A. UniCenter TNG is a registered trademark of
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Microsoft, Windows NT, and Windows 2000 are
registered trademarks of Microsoft Corporation
HP, HP-UX are registered trademarks of Hewlett-
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3
1Product Description 11
General Description 11
Features 13
Status Indicators 15
Power/Standby Switch 16
High Availability 16
Clustering (NT) 16
Upgradability 16
Environmental Services 17
Hardware Event Monitoring 17
Components 18
Disk Modules and Disk Module Filler Panels 18
BCCs and BCC Filler Panels 19
Power Supply/Fan Module 22
Hardware/Software Requirements 24
Topologies 27
Definitions 33
High availability (HA) 33
Hot-pluggable 33
JBOD 33
LVD 33
PDU and PDRU 33
Ultra160 SCSI 34
2Installation 35
Preparation 36
Electrical Requirements 36
Choosing PDUs 37
contents

4
Installing PDUs 39
Software Requirements 42
Auto-Termination 43
Step 1: Gather Tools 44
Step 2: Unpack the Product 44
Step 3: Install the device 47
Installing the Storage Device into a Rack System/E 47
Installing the storage device into an HP Computer Cabinet 56
Installing the Storage Device into a Rittal-Style Rack 64
Install the Disk System 70
Step 4: Install BCCs 71
Step 5: Set DIP Switches 74
Step 6: Connect SCSI and Power Cables 75
Step 7: Install Disk Modules 78
Step 8: Turn on the Disk System 80
Step 9: Verify Devices on the Host 81
Sample IOSCAN 81
Where do you go from here? 82
3Configuration 83
Viewing a Disk System in IOSCAN 84
Sample IOSCAN 84
Setting DIP Switches 85
Rationale 87
Disk Addressing 88
Disk Slots and Addressing 89
Setting Up the Hardware Event Monitor 90
Aliasing Devices (HP-Qualified Only) 90
Updating Firmware (HP-Qualified Only) 91
Command View SDM 91
Supported Operating Systems 92
Installing CommandView SDM 92
HP TopTools 93
Supported Operating Systems 93
Installing HP TopTools 5.0 93

5
4Troubleshooting 95
Overview 96
Event Notification (HP-UX Systems) 97
HP Command View SDM 100
TopTools 100
Status LEDs 101
Isolating Faults 104
5Removal and Replacement 107
Disk Module 110
Preparation (HP-UX 11.XX) 110
To Determine If a Volume Group or Physical Volume Group Is
Active 111
To Determine If the Physical Volume Is Attached 111
To Replace Attached Physical Volumes 112
To Replace Unattached Physical Volumes 114
NT 114
Windows 2000 115
Tools 115
Procedure 115
BCC 119
Tools 119
Procedure 119
BCC Filler Panel 122
Power Supply 123
Tools 123
Procedure 123
Disk System 125
Tools 125
Procedure 125
Top Cover (HP-Qualified Only) 128
Tools 128
Procedure 128
Midplane (HP-Qualified Only) 130
Tools 130
Procedure 130

6
Deskside Base/External Covers (HP-Qualified Only) 133
Powering Down the Disk System 133
Removing the deskside base and external covers from the disk system 133
Tools 133
Procedure 133
Reinstalling the deskside base and external covers on the disk system. 138
6Reference 141
Product Models 141
Upgrade Products 142
PDU/PDRU Products 143
Replaceable Parts 144
Specifications 145
Dimensions 145
Weight 145
AC Power Input 146
DC Power Output 146
Heat Output 146
Environment 146
Acoustics 147
Safety Certifications 147
EMC Compliance 147
Regulatory Statements 148
A. FCC Statement (For U.S.A. Only) 148
B. IEC Statement (Worldwide) 148
C. Spécification ATI Classe A (France) 148
D. Product Noise Declaration (Germany) 149
E. VCCI Statement (Japan) 150
Harmonics Conformance (Japan) 150
F. BCIQ EMC Statement (Taiwan) 150
G. Declaration of Conformity 151
Product Web Site 152
Related Documents 152

7
Figure 1 Disk System - Racked Views 14
Figure 2 Disk System Deskside Views 15
Figure 3 Disk Module 19
Figure 4 BCC 20
Figure 5 BCC Filler Panel 21
Figure 6 Power Supply/Fan Module 22
Figure 7 Basic Configuration - Single Host, Single Disk System 28
Figure 8 Single Host, Split Bus Configuration 29
Figure 9 Single Host PV-Links Configuration 30
Figure 10 Two Host Non-High Availability Configuration 31
Figure 11 Two Host High Availability Configuration 32
Figure 12 PDRU Placement in 1.6-Meter Rack 40
Figure 13 PDRU Placement in a 2.0-Meter Rack 41
Figure 14 Host Bus Adapter HP A5149A 43
Figure 15 Disk System Accessories 45
Figure 16 Disk System ContentsDisk System Contents 46
Figure 17 HP Rack System/E Rail Kit Contents 48
Figure 18 HP Rack System/E Installation Overview 49
Figure 19 Locating the site for the device installation in a System/E
Rack 51
Figure 20 Installing clipnuts for an HP Rack System/E 51
Figure 21 Installing rails in an HP Rack System/E 52
Figure 22 Installing the enclosure clipnut
53
Figure 23 Installing the storage device in the Rack System/E 54
Figure 24 Installing enclosure rail clamps in an HP Rack
System/E 55
Figure 25 HP Computer Cabinet Rail Kit Contents 56
Figure 26 HP Computer Cabinet Installation Overview 57
Figure 27 Locating the site for the device installation in an HP
Computer Cabinet 58
Figure 28 Installing rail clip nuts in the HP Computer Cabinet 59
Figure 29 Installing rails in the HP Computer Cabinet 60
figures

8
Figure 30 Installing enclosure retention clipnuts in an HP Computer
Cabinet 61
Figure 31 Installing the storage device in an HP Computer Cabinet 62
Figure 32 Installing a filler panel in an HP Computer Cabinet 63
Figure 33 Rittal-Style Rail Kit Contents 64
Figure 34 Rail Alignment 65
Figure 35 Front Screw Installation 66
Figure 36 Rear Slide Extension 67
Figure 37 Center Nut Tightening 67
Figure 38 Installing a Disk System into the Rittal-Style Rack 68
Figure 39 Moving a Disk System Retention Bracket 69
Figure 40 Bolting the Disk System to the Front Column of the Rack 69
Figure 41 BCC Installation 72
Figure 42 BCC Filler Panel 73
Figure 43 BCC DIP Switches 74
Figure 44 Wiring Scheme for 1.6-Meter Rack 76
Figure 45 Wiring Scheme for 2.0-Meter Rack 77
Figure 46 Disk Module Installation 78
Figure 47 On/Off Switch and System LEDs 80
Figure 48 DIP Switches 86
Figure 49 Disk Module Slots and SCSI Addresses 89
Figure 50 Sample Hardware Event Notification 99
Figure 51 LED Status Indicators 101
Figure 52 Disk System Field Replaceable Units (FRUs) 108
Figure 53 Disk Module Removal 117
Figure 54 BCC Removal and Replacement 120
Figure 55 BCC DIP Switches 121
Figure 56 BCC Filler Panel Installation 122
Figure 57 Power Supply Removal and Replacement 124
Figure 58 Disk System Removal and Replacement 126
Figure 59 Top Cover Assembly 129
Figure 60 Midplane Assembly 132
Figure 61 End Cap Removal and Replacement 134
Figure 62 Base Removal and Replacement 135
Figure 63 Base Removal from Chassis 136
Figure 64 Removal from Cover 137
Figure 65 Installing Disk System into Cover 138
Figure 66 Installing Base to Cover and Chassis 139
Figure 67 End Cap Replacement 140

9
Table 1 Inrush (Surge) Current and Duration 36
Table 2 Maximum Operating Current 36
Table 3 Recommended PDU/PDRUs for Multiple Disk Systems in
HP Computer Cabinets 38
Table 4 Recommended PDU/PDRUs for Multiple Disk Systems in
HP System/E Racks 38
Table 5 Disk System Accessories 44
Table 6 Disk System Contents 46
Table 7 Rail Positions for Sequential Disk Systems 50
Table 8 DIP Switch Settings 85
Table 9 DIP Switch Usage 87
Table 10 Disk and BCC SCSI Addresses for Full and Split Bus
Modes 88
Table 11 LED Functions 102
Table 12 Troubleshooting Table 104
Table 13 JBOD Enclosure Field Replaceable Units 109
Table 14 Upgrade Products 142
Table 15 PDU/PDRU Products 143
Table 16 Replacement and Exchange Part Numbers 144
Table 17 Product Weights 145
tables

10

Product Description 11
Product Description
General Description
Hewlett-Packard’s StorageWorks Disk System 2300 (referred to in this guide as
the disk system) is a high-availability Ultra160 SCSI storage product. Dual SCSI
ports on dual bus controllers provide LVD connections to the host. Fourteen slots
accept high-speed, high-capacity LVD SCSI disks connected to an LVD
midplane. Maximum data throughput is 160 Mbytes/sec. Thirteen disk systems
fill a 2-meter System/E rack. Filled with 18-Gbyte disks, the 2-meter Rack
System/E yields 3.3 Terabytes of storage; with 36-Gbyte disks, 6.6 Terabytes of
storage and with 73-Gbyte disks, 13.3 Terabytes.
Modular and redundant components are easy to upgrade and maintain. Disks,
power supply/fan modules, and bus control cards (BCCs) are replaceable parts
that plug into individual slots in the front and back of the disk system. Redundant
power supply/fan modules, and BCCs can be removed and replaced without
interrupting storage operations. Disks also can be replaced with the system on
and with only the affected file systems taken off-line. Hewlett-Packard technical
support is optional for these procedures.
Special electronics and HP-UX software enable remote monitoring and
diagnostics. Sensors on the BCCs monitor the disk system environment,
including temperature, voltage, fan speed, and component status. Hewlett-
Packard’s Command View SDM reports any changes in environmental status to
user-defined locations. Standard HP-UX diagnostic utilities also report
environmental data for enhanced troubleshooting.
1

12 Product Description
HP Command View SDM (Software Device Manager) software is designed to
provide storage management for HP disk systems. This software, available on the
HP Command View SDM CD-ROM, provides simple, yet sophisticated device
management tools for the disk system. HP Command View SDM is supported on
the following:
■HP-UX 11.00 (see Support Plus web site for the required patches)
■HP-UX 11.11 (see Support Plus web site for the required patches)
■Windows NT 4.0 (Service Pack 6a or greater)
■Windows 2000 (Service Pack 1 or greater)
■Linux Red Hat 7.2
HP TopTools is a web-based, device management tool that enables administrators
and MIS managers to use a web browser to obtain information about devices on
their network. It provides specific management to the following HP products:
■HP Vectra and Brio Desktops
■HP Kayak and Visualize Workstations
■HP Omnibook Notebooks
■HP Netservers
■HP Procurve and AdvanceStack networking devices
■HP LaserJet and JetDirect products
■HP Jornada PC Companions
■HP StorageWorks products
■HP Network Attached Storage (NAS) products
■HP-UX systems with EMS
■Windows systems

Product Description 13
Product Description
Features
The disk system occupies 3 EIA units in a standard 19-inch rack. Disk drives
mount in the front of the system. Redundant power supplies, and BCCs mount in
the back. See Figure 1 and Figure 2 below. For disk slots and SCSI addressing,
see Figure 49.

14 Product Description

Product Description 15
Product Description
Status Indicators
LEDs on the disk system enable you to detect and replace failed components and
so prevent or minimize users’ downtime. For additional information about LEDs,
see Chapter 4, Troubleshooting.
On the front of the disk system, a pair of LEDs indicates the status of the disk
system, and an LED for each slot shows disk I/O activity:
■The system power LED (B in Figure 1) indicates that power is on or off.
■The system fault LED (C in Figure 1) indicates whether or not a fault has
occurred anywhere in the disk system.
■At the bottom of each disk module, the left LED (F in Figure 1) indicates the
presence of I/O activity on the disk.
■The second LED on each disk module (E in Figure 1) can be flashed to help a
customer engineer (CE) locate the disk for physical inspection or removal.
■The second LED is also used as a fault indicator for that specific disk module.
LEDs (I and K in Figure 2) on the back of the disk system indicate the status of
replaceable components and the SCSI bus: See Chapter 4, Troubleshooting, for
specific LED information.

16 Product Description
Power/Standby Switch
Located at the upper right corner of the front of the disk system, the power switch
(D in Figure 1) interrupts DC power from the power supplies to the BCCs and
other internal components. Input AC power to the power supplies is controlled by
the power cords and the AC source.
High Availability
High availability is a general term describing computer systems that are designed
to minimize planned and unplanned downtime. The disk system supports current
systems’ high availability requirements through the following features:
■Hot-pluggable, high-capacity, high-speed disks
■Redundant, hot-pluggable, user-replaceable power supplies and BCCs
■Online firmware upgrades
■Hardware event monitoring and real-time error reporting
Clustering (NT)
The HP Disk System 2300 is Microsoft® Cluster certified for a variety of
solutions. For specific information about supported configurations, see the
Hewlett-Packard Company or Microsoft web pages:
http://hp.com
http://microsoft.com
Upgradability
You can increase disk system storage capacity by:
■Replacing disk drives with higher-capacity disk drives
■Adding disks in unused slots
None of these actions require shutting down the product, but some may require
the use of system utilities to manage file systems.
Upgrade BCC and disk firmware using an on-line download function. See
Chapter 3, Updating Firmware.

Product Description 17
Product Description
Environmental Services
Environmental services circuitry monitors the following elements:
■Fan rotation
■Power supply output
■Power supply status (fan status)
■Disk drive status, presence
■BCC status
■Temperature
■Self-test results
Each BCC reports the status of all elements in the disk system, even if the BCC
does not have direct access to the element.
Additionally, the EEPROM on each BCC stores 2 Kbytes of configuration
information and user-defined data, including the manufacturer serial number, and
product number.
Hardware Event Monitoring
A hardware event monitor monitors the disk system and reports changes in
environmental status to Hewlett-Packard’s Event Monitoring System (EMS) for
HP-UX. Hardware event monitoring is an important tool for implementing high
availability. Using hardware event monitors, you can virtually eliminate
undetected hardware failures that interrupt system operation or cause data loss.
The EMS Hardware Monitors User’s Guide is available in Adobe®Acrobat®
format on the HP document web site, http://www.docs.hp.com/hpux/systems/.

18 Product Description
Components
User-replaceable components enable high availability and easy maintenance.
This section describes the following components:
■Disks and disk fillers
■BCCs and BCC fillers
■Power supply/fan modules
Disk Modules and Disk Module Filler Panels
Disk modules, shown in Figure 3, contain 3.5-inch Low Profile Ultra 3 LVD
disks.
The disk module’s components are protected by a metal grill on the disk
module’s bottom side.
WARNING Disks require careful handling and ESD precautions.
The plastic parts of the disk are safe to touch:
■Extractor handle (A in Figure 3)
■Latch tab (B)
You may also safely touch the top and bottom of the disk module without
damaging the disk module.
A metal grill protects exposed circuits against damage when the disk module is
laid circuit-side down on a flat surface.
The initial disk options for this product are 18-GByte, 36-GByte, and 73-Gbyte
10 K RPM disk drives. 18-GByte and 36-GByte 15 K RPM disk drives are also
supported. A label on the disk carrier shows the storage capacity and rotational
speed of the installed disk. Obtain information about the latest disk options from
HP sales representatives.
Caution Fillers must be installed in unused slots in order to maintain even
cooling for the installed disk modules.

Product Description 19
Product Description
BCCs and BCC Filler Panels
BCCs (Bus Control Cards) plug into two slots in the back of the disk system.
Each BCC connects to both LVD (low voltage differential) buses inside the disk
system. In full bus mode (DIP switch 1 set to “|”), both BCCs have access to all
installed disks. The two SCSI buses are bridged. If either BCC fails and LVM
primary and alternate paths are defined, data can be accessed through the other
BCC. In split bus mode (DIP switch 1 set to “0”), the left BCC (as viewed from
the rear of the disk system), is on the high numbered bank (with disk slots 8, 9,
10, 11,12, 13, and 14) and the right BCC is on the low numbered bank (with disk
slots 0, 1, 2, 3,4, 5, and 6) of disk slots. See Figure 1.
Two SCSI ports (B in Figure 4) on each BCC provide dual LVD connections to
the same or separate hosts. If a host is connected to one of the BCC ports, an
LVD terminator must be connected to the other port on that BCC.

20 Product Description
Other features of the BCC are:
■LEDs (C) indicating BCC status and bus configuration
■DIP switches (D) on the rear panel:
1 Bus Mode (full or split bus)
2 Monitor Mode (SAF-TE or SES)
■Locking thumbscrews (E)
■Cam levers (F)