HP ES3-H Series Installation instructions

MF877-00 Page 1
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category
: Storage
Marketing Name / Model
[List multiple models if applicable.]
HPE Nimble Storage Expansion ES3-HXXXXX
HPE Nimble Storage Expansion AFS3
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by
Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment
(WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
14
Batteries
All types including standard alkaline and lithium
coin or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
2 PSUs, 2 in Each PSU
4
External electrical cables and cords
2 Power Cables, 2 SAS cables
4
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0

MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Item Description Notes
Quantity
of items
included
in product
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Philips Screwdriver
P0,P1,P2
Standard Screwdriver
Medium
Diagonal Cutters
Small,
Medium
Adjustable Wrench
4-6”
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove all the HDDs or SSDs from the front. Pop out the drives from the carriers and shred and dispose of properly
per data protection protocols and contract(s) as applicable. Some customers may require certification of this step.
2. Remove Power Supplies from rear of Unit, disassemble by pulling off plastic tab on ejector, removing 20 screws and
removing the PCBAs. Locate the 2 Electrolytic capacitors per the graphic below and cut or pry them off. Dispose of
properly.
3. Remove the mounting ears from each side of the chassis in the front. Disassemble to remove the small PCBA in each
ear and dispose of properly.
4. Slide the Controllers out the rear of the chassis and remove 3 PCBAs from each controller. Dispose of properly.
5. Remove the screws and the top cover to access the large midplane and the Power distribution board.
6. Remove Screws holding the power distribution board. Cut Cables or remove nuts holding cables to power distribution
board. Dispose of properly
7. Remove the screws from the bottom of the chassis to release the Midplane. Dispose of properly.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 3
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Power Supply
Mounting Ear:

MF877-00 Page 4
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
ES3 Controller
Power Distribution Board and Midplane