HPE Altoline 6920 48XG 6QSFP+ Assembly instructions

MF877-00 Page 1
Template Revision A
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HPE Altoline 6920 48XG 6QSFP+ x86 ONIE AC Front-to-Back Switch (JL167A)
HPE Altoline 6920 48XG 6QSFP+ x86 ONIE AC Back-to-Front Switch (JL168A)
HPE Altoline 6921 48SFP+ 6QSFP+ x86 ONIE AC Front-to-Back Switch (JL317A)
HPE Altoline 6921 48SFP+ 6QSFP+ x86 ONIE AC Back-to-Front Switch (JL318A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
5
Batteries
All types including standard alkaline and lithium
coin or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0

MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at MF877-01
Item Description Notes
Quantity
of items
included
in product
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Phillips screwdriver
various sizes
Small adjustable wrench
Needle nose pliers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the chassis lid
1. Using a Phillips screwdriver, remove the screws (qty 20)
2. Slide the lid off the chassis
2. Remove the two power supplies
1. Locate the power supplies at either side of the back of the chassis
2. While pressing the release lever toward the handle, pull the power supply out of the chassis
3. Repeat for the other power supply
3. Remove the five fan assemblies from the back of the chassis
1. Locate the fan assemblies in the middle of the back of the chassis
2. Either by hand or using a Phillips screwdriver, loosen the set screw for each fan assembly
3. Using the fan assembly handle, pull out a fan assembly
4. Repeat for the remaining four fan assemblies
4. Remove the center PCA assembly
1. Using a Phillips screwdriver, remove the two screws at the back corners of the center PCA assembly
2. Using a small adjustable wrench, remove the two nuts at the front corners of the center PCA assembly
3. Slowly remove the center PCA assembly from the chassis, taking into account the connector under the bottom
left corner
5. Remove the two DIMMs from the center PCA assembly
1. Gently spread the retaining levers away from the top DIMM
2. Remove the top DIMM
3. Repeat for the bottom DIMM
6. Remove the heatsink from the center PCA assembly
1. Locate the heatsink fasteners on the underside of the PCA, opposite the heatsink
2. Use needle nose pliers to pinch the heat sink fasteners while removing the heat sinks from the center PCA
assembly
7. Remove the fan assembly PCA
1. Disconnect the ribbon connector and the cable connector next to it from the fan assembly PCA
2. Using a Phillips screwdriver, remove the four screws attaching the fan assembly PCA to the chassis
3. Remove the fan assembly PCA from the chassis
8. Remove the main PCA
1. Disconnect the ribbon connector and the cable connector that were attached to the fan assembly PCA
2. Using a Phillips screwdriver, loosen the four screws holding down the heat sink
3. Remove the heat sink

MF877-00 Page 3
Template Revision A
HPE instructions for this template are available at MF877-01
4. Using a Phillips screwdriver, remove the two screws holding down a power supply connector
5. Repeat step 3.1.7.2 for the other power supply connector
6. Using a small adjustable wrench, remove the four hexagonal studs near the corners of the heat sink
7. Using a small adjustable wrench, remove the two small hexagonal studs that were supporting the front edge of
the middle PCA stack
8. Using a Phillips screwdriver, remove the eight screws holding down the main PCA
1. Remove the sheet metal air flow diverters from both sides of the main PCA
2. Gently remove the main PCA from the chassis (Note: The front left corner will provide resistance as
thermal material is installed under it)
9. Using a Phillips screwdriver, loosen the four screws securing the heat sink to the main PCA
10. Remove the heat sink and its backing hardware from the main PCA
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).