HPE Aruba Instant On 1960 24G 20p Class4 4p Class6 PoE 2XGT 2SFP+ 370W... Assembly instructions

MF877-00 Page 1
Template Revision A
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HPE Aruba Instant On 1960 24G 20p Class4 4p Class6 PoE 2XGT 2SFP+ 370W Switch (JL807A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
3
Batteries
All types including standard alkaline and lithium
coin or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
On PSU PCB Board
3
External electrical cables and cords
Power Cord
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
All manuals and user guides at all-guides.com

MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at MF877-01
Tool Description
Tool Size (if
applicable)
Phillips Screwdriver
P1 ,P2
Diagonal pliers
5”
Socket Screwdriver
5.0mm ,5.5mm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Using a P1 Phillips Screw Driver, remove all 14 screws securing top cover to chassis. Remove Cover. (see 3.2.1)
2. Disconnect Power supply and main board cable connections (2 cables connections in all)
3. Using a P2 Phillips Screw Driver, remove 4 screws to chassis ,remove Power supply(1pcs).(see 3.2.3)
4. Disconnect PoE board and main board cable connections (2 cables connections in all) (see 3.2.4)
5. Using a P2 Phillips Screw Driver, remove 4 screws to chassis ,remove Air baffle(1pcs) (see 3.2.5)
6. Using a Socket Screw Driver (5.5mm), remove all 4 nuts to PoE Board and Disconnect PoE and main board cable connections (2
cables connections in all) (see 3.2.4) (see 3.2.6)
7. Using a Socket Screw Driver (5.0mm), remove all 8 stand-off to chassis.(see 3.2.7)
8. Disconnect Fan and main board 2 cable connections and Using a P2 Phillips Screw Driver, remove 4 screws to chassis, remove
Fan(2pcs) (see 3.2.8)
9. Using a P2 Phillips Screw Driver, remove 15 screws to chassis ,remove main board (1pcs) and light-pipe (1pcs).(see 3.2.9)
10. Cut ac-inlet materials (use Diagonal pliers) and Using a P2 Phillips Screw Driver, remove 1 screws to chassis and Disconnect
ac-inlet cable(see 3.2.10)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.2.1
All manuals and user guides at all-guides.com

MF877-00 Page 3
Template Revision A
HPE instructions for this template are available at MF877-01
3.2.2
3.2.3
All manuals and user guides at all-guides.com

MF877-00 Page 4
Template Revision A
HPE instructions for this template are available at MF877-01
3.2.4
3.2.5
All manuals and user guides at all-guides.com

MF877-00 Page 5
Template Revision A
HPE instructions for this template are available at MF877-01
3.2.6
3.2.7
All manuals and user guides at all-guides.com

MF877-00 Page 6
Template Revision A
HPE instructions for this template are available at MF877-01
3.2.8
3.2.9
All manuals and user guides at all-guides.com

MF877-00 Page 7
Template Revision A
HPE instructions for this template are available at MF877-01
3.2.10
All manuals and user guides at all-guides.com

EL-MF877-00 Page 8
Template Revision A
All manuals and user guides at all-guides.com