IBM 2310 User manual

~~~@ Disk Storage
Field Engineering
Maintenance Manual

Field Engineering
Maintenance Manual
Issued to: ____________ _
Branch Office:
___________ _
Department: ___________ _
Address:
____________ _
If this manual is misplaced, it should
be returned to the above address.
~~~@ Disk Storage

PREFACE
This manual contains preliminary information.
Users of this manual are cautioned that specifications
are subject to change at any time and without prior
notice by IBM. Wiring diagrams (logics) at the en-
gineering change level for a specific machine are
included in each machine shipment.
The scope of this manual is limited to the Disk
Storage Drive. The machine is installed in a stand
alone unit for IBM 1800 Data Acquisition and Control
System, and is an integral part of the storage system
of the IBM 1130 Computing System, physically located
within the IBM 1131 Central Processing Unit.
This information consists of maintenance instruc-
tions which enable the CE to rapidly diagnose equip-
ment malfunctions in the Disk Storage Drive and
perform corrective maintenance to keep the equip-
ment in a state of readiness for the customer. The
CE must have completed prior IBM training for this
equipment, and must be familiar with practical ap-
plications of the maintenance concept and techniques
derived from training.
Alternate procedures are provided in a supple-
ment in the back of this manual for machines with
serial numbers 00001 through 00050.
Content of this manual is divided into seven
chapters.
Chapter 1 contains instructions and procedures for
diagnosing and isolating equipment malfunctions by the
use of service aids and functional checkout procedures.
Chapter 2 describes switches and controls used by
the CE to accomplish checkout and maintenance oper-
ations.
Chapter 3 contains instructions for performing
scheduled maintenance and includes a tabulated sched-
ule for accomplishing periodic maintenance operations.
Chapter 4 provides instructions for service checks,
adjustments, and removal and replacement of com-
ponents.
Chapter 5 provides a listing of power requirements
and power sequencing.
Chapter 6 contains information which enables the
CE to locate components, major assemblies, meters,
gages, etc., which are described by the instructions
contained in the manual.
Chapter 7 consists of a supplement which pro-
vides alternate procedures applicable to machines
with serial numbers 00001 through 00050.
The companion publication, IBM Field Engineer-
ing Manual of Instruction 2310 Disk Storage (Form
227-5985-1) provides information for the theory of
operation, and may be used as a reference to augment
information contained within this manual.
Copies of this and other IBM publ ications can be obtained through IBM Branch Offices.
Comments concerning the contents of this publication may be addressed to:
IBM, Product Publications Department, San Jose, Calif. 95114
© 1965 by International Business Machines
ii

CHAPTER 1 DIAGNOSTIC AIDS • • • • • • • • • • • • • • • • •• 1. 1
1. 1 Diagnostic Techniques .•••••••••••••••••••• 1. 1
1.2 Functional Check. • • • • • • • • • . • • • • • • • • • • • • •• 1. 1
1. 3 Read Malfunctions •••• ; • • • • • • • • • • • • • • • • • •• 1. 1
1.3. 1 Read Circuit Troubleshooting •••••••••• _ ••
1. 4 Write Malfunctions ..•••••••••••••••••••••
1. 4. 1 Write Circuit Troubleshooting .•••••••••••
1.5 Access Malfunctions •••••••••••••••••••••••
1.5. t Access Circuit Malfunction Troubleshooting •••
1. 5. 2 Detent Assembly and Rack Troubleshooting •••
1. 6 Base Plate Component Malfunctions ••••••••••••.
1. 6. 1 Troubleshooting Base Plate Components •.••••
1. 7 Service Aids ••••••••••••••••••••••••••••
1. 7. 1 Track Addressing ••••••••••••••••••.••
1. 7. 2 Disk Formatting Procedure ••••••••••••••
1. 7. 3 Error Retry Procedure •••••••••••••••••
1. 7. 4 Homing the Carriage •••••••• ; •••••••••
1. 7. 5 Errors and Data Retrieva I .••••••••••••••
CHAPTER 2 MAINTENANCE FEATURES .••••••••••••
2. 1 Leading Particulars .•••••••••••••.••••••••
2. 2 CE Disk Cartridge .•••••••••••••••••••••••
2. 3 CE Control Panel •••••••••••••••••••••••••
2.4 CE Switches .•••••••••••••••••••••••••••
2.4. 1 Head Select ~witch ••••••••••••••••••
2.4. 2 Step Mode Switch ••••••••••••••••••••
2.4. 3 Direction Switch •••••••••••••••••••••
1. 1
1.2
1.2
1.4
1.4
1.4
1.6
1.6
1.6
1.6
1.6
1.7
1.7
1.7
2.1
2.1
2.1
2.1
2.1
2.1
2.1
2.2
2. 4. 4 Step Control Switch •••••••••••••••••• 2. 2
2.5 Tools and Test Equipment ••••••••••••••••••• 2.3
2. 5. 1 Standard Tools • • • • • • • • • • • • • • • • • • • • •• 2. 3
2. 5. 2
Special Tools. • • • • • • • • • • • • • • • • • • • • •• 2. 3
2.5.3 Branch Office Tools •.•••••••••••••••• 2.3
CHAPTER 3 SCHEDULED PREVENTIVE MAINTENANCE
PROCEDURES •• ,........................... 3. 1
3. 1 Approach to Scheduled Preventive Maintenance ••••• 3. 1
3. 1. 1
Visual Inspection •••••••••••••••••••• 3. 1
3. 1. 2 Electronic Circuits
.••.•. II •• , • • • • • • • •• 3. 1
3. 1. 3 Mechanical Units ••••••••••••••••••• 3. 1
3, 1. 4 Cleanliness ...•••.• II • • • • • • • • • • • • • •• 3. 1
3. 2 Scheduled Maintenance Procedures 3.1
3. 2. 1 Cleaning Read/Write Heads ••• ,., •• ,.,.. 3, 1
3. 2. 2 Lubrication
of Machine •••••••••••••••• 3. 1
3.2,3 Drive Belt Tension Adjustment •• , • , • , • • • •• 3.4
3. 3 Head and Disk Cartridge Scratch Description ,., •• ,. 3.4
3.3. 1 Particle Damage.to Disk •••••••••••••• , 3.4
3.3.2 Particle Damage to Head •••• ,., •• ,..... 3.4
3.3.3 Non Particle Damage ••••••••••••••••• 3.4
3.3.4 Disk Cartridge and Read/Write Head Damage. •• 3.4
CH-\PTER 4 SERVICE CHECKS, ADJUSTMENTS, AND
REMOVAL PROCEDURES • • • • • • • • • • • • • • • • • • • • • •• 4. 1
4.0 Index of Service Checks, Adjustments and Removals •• 4. 1
4. 1 Drive Motor and Drive Belt •••••••••••••••••• 4. 2
4. 1. 1
Drive Belt Removal and Replacement • • • • • •• 4.2
4. 1. 2 Drive Motor Removal and Replacement. • • • •• 4.2
4. 1.3 Spindle Assembly Removal and Replacement •• 4.2
iii
CONTENTS
4. 2 Cartridge Assembly •••••••••••••••••••••••• 4. 2
4. 2. 1 Cartridge Service Check •••••••••••••••• 4. 2
4. 2. 2 Visual Inspection ••••••••••••••••••••• 4. 3
4. 2. 3 Disk Height and Run Out Check • • • • • • • • • • •• 4. 3
4.2.4 Disk Cartridge Replacement Conditions •••••••
4. 3 Plenum Air Filter •••••••••••••••••••••••••
4. 3. 1 Plenum Filter Flow Test •••••••••••••••••
4.3.2 Plenum Air Filter Removal and Replacement •••
4.4
4.4
4.4
4.4
4.4
4.4
4.4
4.5
4.5
4.5
4.5
4.5
4.9
4.9
4.4 Blower Assembly ., ••••••••••••••••••••••••
4.4. 1 Blower Assembly Removal and Replacement
4.4.2 Blower Wheel Removal and Replacement ••••••
4.4.3 Blower Scroll Removal and Replacement
4.4. 4 Blower Motor Removal and Replacement ••••••
4. 5 Actuator Assembly •••••••••••••••••••••••••
4. 5. 1 Actuator Assembly Removal and Replacement ••
4. 5. 2 Access Adjustments
4. 6 Drive Magnet and Coil •••••••••••••• , •••••••
4. 6. 1 Drive Magnet Removal and Replacement
4.7
4.8
4. 6. 2 Drive Coil Removal and Replacement. • • • • • •• 4. 10
Detent Assembly and Detent Rack • • • • • • • • • • • • • •• 4. 10
4.7. 1 Detent Assembly Removal and Replacement 4. 10
4.7. 2 Detent Assembly Adjustment ••••• , • • • • • • •• 4. 10
4.7.3 Detent Rack Removal and Replacement •••••• 4. 10
4.7.4 Detent Rack Adjustment •••••••••••••••• 4. 12
Head Load Assembly ••••••••••••••••••••••••
4. 8. 1 Head Load Solenoid Removal and Replacement ••
4.8.2 Head Load Assembly Adjustment •••••••••••
4. 8.3 Heads Loaded Switch Removal, Replacement,
4.12
4.12
4.12
and Adjustment ••••••• ,.............. 4. 14
4.9 Head Load Spring Assembly • • • • • • • • • • • • • • • • • •• 4. 14
4.9. 1 Head Load Spring Assembly Removal and
Replacement • • • • • • • • • • • • • • • • • • • • • • •• 4. 14
4. 10 Crash Stops • • • • • • • • • • • • • • • • • • • • • • • • • • • •• 4. 14
4. 10. 1 Front Crash Stop Adjustment ••••••••••••• 4. 14
4. 10. 2 Rear Crash Stop Adjustment. • • • • • • • • • • • •• 4. 14
4. 11 Home Switch. • • • • • • • • • • • • • • • • • • • • • • • • • •• 4. 14
4. 11. 1 Home Switch Removal and Replacement ••••• 4. 14
4.11. 2 Home Switch Adjustment ••••••••••••••• 4.14
4. 12 Tachometer and Tachometer Extension Rod • • • • • • •• 4. 14
4. 12. 1 Tachometer Extension Rod Removal and
Replacement .•••••••••••••• , • • • • • •• 4. 14
4. 12. 2 Tachometer Extension Rod Adjustment
4. 12.3 Tachometer Assembly Removal and
4.15
Replacement .•••••••••••••••••••••• 4. 15
4. 13 Carriage Rail ••••••••••••••••••••••••••• 4. 16
4. 13. 1 Carriage Rail Removal and Replacement. • • •• 4. 16
4. 14 Carriage Preload Bearing Assembly Removal and
Replacement. • • • • • • • • • • • • • • • • • • • • • • • • • •• 4. 16
4. 14. 1 Carriage Preload Bearing Assembly Removal and
Replacement •••.•••.•••.•••
4. 15 Carriage Subassembly •..•••••••..••
4. 15. 1 Carriage Subassembly Removal and
4.16
4.16
Replacement . . • • • • • • . • . • • • • • • . . • 4. 16
4. 16 Read/Write Heads .•••••••••••••••••••• 1. 17
4.16.1 Read/Write Head Service Check .•.•••••••• 4. 17
4.16.2 Read/Write Head Replacement .••.•.••.•• '1.17
4.16.3 Read/Write Head to Base Plate Resistance Chccl< • 4.17

4. 17 Head-Arm Assembly •••••••••••••••••••••• 4. 17
4.17.1 Head Arm Assembly Adjustment .•••.••••• 4.17
4. 17. 2 Head Arm Assembly Removal and
Replacement .•••••••••••••••.••••• 4. 17
4. 18
Cartridge Receiver • • • • . • • • • • • • • • • • • • • • • •• 4. 19
4. 18. 1
Cartridge Receiver Removal and
Replacement •••• • • • • • • • • • • • • • • • • •• 4. 19
4.
18.2 Cartridge Receiver Adjustment .••••••••. 4. 19
4.
18.3 Cartridge In Place Switch Adjustment •.•••• 4.20
4. 19 Interlocks . • • • • • • • • • • • • • . • • • • • • • • • • • • •• 4.20
4.19.1 Handle and Interlock Adjustment •••••••••• 4.20
4. 20 Sector Transducer .•••••••••••••••••••••• 4. 22
4. 20. 1 Sector Transducer Index Timing Adjustment .• 4. 22
4.20.2 Sector Transducer Removal and
Replacement • • • • • • • • • • • . • • • . . . • . •• 4. 24
4.21 Data Separator. • • • • • • • • • • • • • • • • • • • • • • • •• 4. 24
4. 21. 1
Data Separator Adjustment .•••••••••••• 4. 24
CHAPTER 5 POWER SUPPLY
•••••••• • • • • • • • • • • •. 5. 1
5. 1 Power
Requirements . . • • • • • • • • • • • • • • • • • • • •• 5. 1
S. 1. 1 AC Input Supply Power •••••••••••••.•• 5. 1
5. 1. 2 DC Input Supply Power
•••••••••••••••• 5. 1
5. 2 Power
Sequencing •••••••••••••••••..••.•. 5. 1
5. 2. 1 Power
On Sequence • • • • • • • • • • • • • • • • • •• 5. 1
5.
2. 2 Power Off Sequence •••••••••••••••••. 5. 1
5. 3 Power Line
Interface •••••••••••••••••••••• 5. 1
5. 3. 1 Input Power Lines
to Disk Storage Drive ••.•• , 5. 1
CHAPTER 6 LOCATIONS
•••••••••••••••••••••• ·6.1
6. 1 General............................... 6. 1
CHAPTER 7 SUPPLEMENT FOR ALTERNATE
MAINTENANCE
INSTRUCTIONS. • • • • • • • • • •• • • • • •• 7.1
7.1 Purpose of Supplement .•••••••••••.•••••••• 7.1
7.2 Alternate Maintenance Features ••••••••••••••• 7.1
7. 2. 1 Identification of Machines .••••••••••••• 7. 1
7.2.2 Special Tools ••••••••.••••••••••••• 7.1
7.2.3 Branch Office Tools •.••••••••••.••••• 7. 1
7. 3 Plenum Cover and Filter .••••••••••••• • • • • •• 7. 1
7.3. 1 Plenum Cover Removal and Replacement .••• 7. 1
7.3.2 Plenum Air Filter Removal and Replacement .• 7. 1
7.4 Blower Assembly
7.4. 1 Blower Assembly Removal •••••••••••••• 7.2
7.4.2 Blower Motor Removal and Replacement. • • •• 7.2
7. 5 Actuator Assembly .•••.••••••••••••.•••. " 7. 2
iv
7.5. 1 Actuator Assembly Removal and
Replacement .••••••••••••••••••••••
7. 6 Drive Magnet .••••••••••.•••••••••••••••
7.6. 1 Drive Magnet Removal and Replacement •••••
7.6.2 Drive Magnet Adjustment .•••.••••••••••
7.7 Detent Assembly and Detent Rack •••••••••••.••
7.7. 1 Detent Assembly Removal and Replacement •.
7. 7. 2 Detent Assembly Adjustment .•••••.••••.•
7.7. 3 Detent Rack Removal and Replacement • . •••
7.7.4 Detent Rack Adjustment .••••••••.•••••
7. 8 Head Load Assembly .•••••••••••.•••••••.••
7. 8. 1 Head Load Solenoid Removal and
Replacement ••••••••••••••••••.••••
7. 8. 2 Head Load Assembly Adjustment ••••.•••••
7.9 Head Load Spring Assembly .•••••••••••••••••
7.9. 1 Head Load Spring Assembly Counterbalance
Spring Adjustment . • . • • • • • • • • • • • • • • • • •
7. 10 Crash Stops ••••••••••••••••••••••••••••
7.2
7.3
7.3
7.4
7.4
7.4
7.4
7.5
7.6
7.6
7.6
7.6
7.9,
7.9
7.9
7.10.1 Rear Crash Stop Adjustment ••.••••••••• 7.9'
7. 11 H:>me Switch .•••••••••••••.••••••••••• 7.9
7. 11. 1 Home Switch Removal and Replacement •••• 7.9
7.11. 2 H:>me Switch Adjustment •.•••••••••••• 7.9
7. 12 Tachometer and Tachometer Extension Rod . • • • • •• 7. 10
7. 12. 1
Tachometer Extension Rod Removal .•••••• 7. 10
7. 12. 2
Tachometer Extension Rod Adjustment 7. 10
7.
12.3 Tachometer Assembly Removal and
Replacement .• • • • • • • • • • • • • • • • • • • •• 7. 11
7. 13 Carriage Rail ••••••••••••••••••••••.••• 7. 11
7.13.1 Carriage Rail Removal and Replacement .••• 7.11
7. 14 Carriage Subassembly ••••• • • • • • • • • . • • • • • •• 7. 11
7. 14. 1 Carriage Subassembly Removal and
Replacement ••••••.••••••••••••••• 7. 11
7. 15 Head-Arm Assembly . • • • • • • • • . • • . • • • • • • • •. 7. 12
7. 15. 1
Head-Arm Assembly Adjustment •.••••••• 7. 12
7. 16
Cartridge Receiver • • • • • • . • • • • • • • • • • • • • • .• 7. 13
7.16.1 Cartridge Receiver Removal and
Replacement ..•••••••••••.•.••••.. 7. 13
7. 16.2 Cartridge Receiver Adjustment •••••.•... 7. 13
7. 17 Interlocks • . • • . • • • • • • • . • • • • • • • • • • • • . • •• 7. 15
7. 17. 1
Handle and Interlock Adjustment .••••.•.• 7. 15
7. 18
Sector Transducer. . • . • • • • • • • . • • • . • • • • • • .• 7. 15
7. 18. 1
Sector Transducer Index Timing Adjustment .• 7. 15
INDEX. . • • • • • • • •• • • • • • • • • • • • • • • • • • • • • • • •• I.1

Personal safety cannot be overemphasized. To en-
sure your own safety, make it an every day practice
to follow safety precautions at all times. Become
familiar with and use safety practices outlined in
mM cards, Forms 124-0002 and M04-8401, issued
to all Customer Engineers.
AC Power
The Start and Stop switches on the mM 2310 Disk
Storage Drive do not apply and turn off ac power to
the machine but simply energize and de-energize the
spindle drive motor. Caution must be exercised
when servicing the machine since objects can con-
tact 110/220-volt connections despite the safety
shields and covers provided.
Isopropyl Alcohol
Use only mM approved 91% Isopropyl Alcohol (P/N
2155966) for cleaning of read/write heads. Other
types may cause damage and/or contamination due
to impurities. The 91% isopropyl alsohol solution
is a flammable liquid, therefore, keep only the
quantity needed for impending use in the customer's
office.
Keep the plastic bottle containing isopropyl alco-
hol in the sealed metal container except when in use.
When shipping 91% isopropyl alcohol, comply
with the appropriate regulations (noted on the con-
tainer) for shipment of flammable liquids.
WARNINGS: There are many ways in which the 2310
Disk Storage Drive can be damaged by improper op-
eration or improper servicing techniques. These
are described in the text under the appropriate serv-
icing procedure. The most Significant of these are
listed below.
Disk Cartridge Handling
Cleanliness must be maintained while handling the
disk cartridge. The cartridge door which receives
the read/write heads must never be unlatched and
opened when
the cartridge is out of the machine ex-
cept when using the disk cartridge cleaning fixture
to clean disk. Also, the air valve located on the
bottom surface of the cartridge must never be opened.
Serious damage to disk surfaces could result if
foreign particles are introduced inside the cartridge.
v
SAFETY
Never disassemble a disk cartridge. The disk
cartridge assembly is a permanently encased unit
which cannot be disassembled without damage.
The disk cartridge should never be stacked or
otherwise subjected to top loading. Nor should it be
stored on a protruding object. Handling practices of
this nature could result in deforming the diaphragm
which effects centering of the disk within the car-
tridge housing. Damage to the diaphragm will render
the cartridge unusable and could cause damage to
read/write heads.
Disk Cartridge Insertion into Machine
DC power must always be on before insertion of the
cartridge. The machine is interlocked so that when
dc
power is on, and ac power is turned off, the car-
riage returns to home position. If the cartridge is
inserted without first turning on dc power, the car-
riage could be in some position other than home, and
the cartridge could strike the heads. The machine
contains interlocking switches which prevent this
condition from occurring unless the Customer Engi-
neer violates or overrides the safety function of these
switches.
CE Restricted Tracks on Disk Cartridge
Do not write on the CE disk cartridge at tracks 90
through 110. This band contains prerecorded test
tracks 95, 100, and 105 which will be destroyed. Any
other tracks may be used for test purposes.
Read/Write Heads
Avoid touching the gliding surface of read/write heads.
Acids from the skin can etch and ruin the head.
Do not load leads manually when a cartridge is out
of the machine, when disk is stopped, or when blower
system is not operating. If it becomes necessary to
load heads under these static conditions, a folded IBM
card should be inserted between the heads to protect
gliding surfaces from possible damage. Read/write
heads must be cleaned immediately whenever this is
done.
Machine Operation
Head loading precautions must be observed when oper-
ating the machine. Proper operation of the machine
is to provide ac and dc power to energize the hlower

system and home the carriage. The cartridge
is then inserted, and the receiver handle is
raised to lower the cartridge onto the spindle.
Power is applied to the disk drive motor
and the spindle will come up to speed.
If power is applied to the disk drive
motor without a cartridge present, the
cartridge in place switch can be manually
operated to energize the motor to effect load-
ing of heads; however, a folded mM card
should be inserted between the heads for
protection.
vi
DC Power
The +3 vdc, -3 vdc, and +6 vdc power must be applied
to, and removed from) the machine at the same time to
prevent damage to internal circuits of the 2310 Disk
Storage
Drive. The +48-vdc power must never be ap-
plied without all other dc voltages being present.
Tachometer Cable Removal
Turn off dc power before removing the tachometer
cable. If this is not done, accessing may be uncon-
trolled with resulting damage to the access mechanism.

1.1 DIAGNOSTIC TECHNIQUES
WARNING: Voltage is present on both sides of most
circuit cards. Metal caps of transistors are often a
part of the circuit. Avoid pulling or replacing cards
with the d-c power on, since a resultant short circuit
could damage transistors or other components in the
circuit.
WARNING: A potential of +48 volts is present for
head pick, cartridge lock, access amplifier, and
.voltage
regulator circuits. A potential of +36 volts
is present for write circuits. Exercise care when
probing near SLT cards containing these circuits to
avoid possible shorts which could result in extensive
damage.
Intermittent problems can sometimes be aggravated
by vibration. Tapping the edge of cards with the
plastic handle of a screwdriver in the area suspected
should be sufficient. Use caution because excessive
vibrations can cause a short circuit in adjacent card
components.
Conditions will arise where it is desirable to
jumper in signals or voltages to specific inputs or
outputs to check certain functions. Care should be
taken to ensure that logic blocks are not overloaded
during these checks, as erroneous indications will
result. More important, avoid the use of high volt-
ages which can damage or destroy the transistors.
For the majority of logic block cases, a properly
placed ground will create the effect desired. All
other cases must be treated individually based on
knowledge of the circuits involved.
Special
circuit card diagrams are shown in the
system diagrams. Also shown are input and output
waveforms for most of these cards.
When the electronic gate is opened to check the
positioning of SLT cards, care should be taken to
properly replace the SLT card support before closing
the gate. This support serves to rigidly brace the
outer edges of the cards with the gate housing to
minimize card vibration. The support normally
interferes with the bottom of the electronic gate to
provide a preload on ends of the SLT cards.
227-5984 (9/65)
CHAPTER 1 DIAGNOSTIC AIDS
1. 2 FUNCTIONAL CHECK
The functional check provides for operating the equip-
ment without using signal control circuits of the
Central Processing Unit (CPU). This check verifies
that the drive actuator, carriage access motion,
head
selection, and start/stop equipment functions
will
perform as required.
The CE control panel contains switches which be-
come active only when the CE Interlock signal cable
between system control and the IBM 2310 is discon-
nected. Upon disconnecting this cable from system
control circuits, the disk storage drive is automa-
tically placed in a read select mode to prevent inad-
vertent erasure of recorded data, and to allow the
CE to examine the read circuit and recorded data.
The functional check is to be accomplished as follows:
NOTE: No CE check is provided on the 2310 for
writing information.
1. Remove CE Interlock signal cable.
2. Ensure ac and dc power is available to machine.
3. Install CE cartridge.
4. Energize drive motor.
5. Using CE SWitches, access carriage and select
each head to determine that machine operates
satisfactorily.
1.3 READ MALFUNCTIONS
1. 3. 1 Read Circuit Troubleshooting (Figure 1-1)
All read/write safety circuits in the machine
are coupled with the write lock latch, which becomes
set and produces a write select error signal when
incompatibility exists at gated outputs from read/
write lines. Always check the write driver SLT
card when neither read nor write operations function.
When
the Write-Lock latch becomes set, File
Ready condition is removed from the machine,
and the carriage will access to home position
(track 000) and stop while the disk will continue
to rotate.
1. 1

It will be necessary to turn off power to the
drive motor to reduce disk speed to 30 RPM to re-
set the latch -- then power up the machine to attain
a File Ready status.
WARNING: Do not put scope probes, leads, or jum-
pers of any kind on lines comming directly from
read/write heads. The heads can be damaged and/
or data destroyed by the presence of voltages at
these points.
The
read circuits consists of read/Write heads,
the Preamplifier/Write Driver SLT Card, Read
Amplifier SLT Card, and Data Separator SLT card.
All cards are located in the electronic gate.
The
preamplifier circuit provides a differential
signal input to the
read amplifier of 360 KC (all zero
pattern) and 726 KC (all one's pattern). The output
.
from the read amplifier is single ended, and provides
double frequency data to the data separator SLT card.
The read gate is the only gate required by the read
amplifier.
A CE Test Point and is located on the read am-
plifier for CE use. Input to the amplifier differen-
tiator circuit is measured at the CE Test amplifier,
TP D2 G07. Output of the detector circuit is mea-
sured at pin location n2 B03.
The voltage
at TP D2 G07 should be 1. 5 v mini-
mum to 3. 15 v maximum. This voltage will vary
with respect to the track being read. A higher volt-
age will prevail at the outside track than at the in-
side track because of the difference in disk surface
speed relative to the read/write head.
The following
analysis is to be used to trouble-
shoot read circuits: Oscilloscope display patterns
for read/write circuits are shown in Figure 1-1.
Both Heads in 2310 Fail to Read - Probable causes:
1. Heads not loaded. Check visually.
2.
Carriage at incorrect cylinder to read disk.
Check visually.
3.
DC voltage supplies not at a correct level. This
is an unsafe condition. Check interlock SLT card.
In a read select mode, the write lock latch
should be set.
NOTE: Voltages should be checked at the SLT board.
4. Head not selected, or both heads selected. Check
head
select line (+3 v level for head zero and
ground
level for head one).
5. Data
separator circuit has improper output.
Check
for Read Clock output on C2 D03 and
Read Data output on C2 D05.
6. Read
amplifier has no output. Check for output
signal
at detector circuit on read amplifier SLT
card at location D2 B03.
1.2
7. Read amplifier has no input. Check for pres-
ence of input signal at Amplifier Differential
circuit on read amplifier SLT card at CE Test
Point TP D2 G07.
2310 Reads But
Generates Read Errors - Probable
Causes:
1. Machine
fails to read on a particular head:
a. Head select transistor for this head is in-
operative. Check write driver SLT card
for malfunction of head select transistors.
b. Line noise present in read signal. Check
that head-arm assembly is electrically
isolated from frame ground.
c. Open head diode(s). Replace preamplifier/
write driver card.
d. Disk speed detection output fluctuates. Check
for sector time of 5 ms between pulses.
Possible that speed detector is defective.
e. Data separator circuit defective -- does not
provide Read Clock output
at C2D03 and/or
Read Data output at C2D05. Check data
separator adjustment of 600 nsec single
shot which
gates between clock pulses to
permit data pulses to pass.
f. Head shoe dc resistance relative to base
plate should be 5 ohms or less.
g. Intermittent short between coils, or between
coils and ground of read/write head.
h. Heads improperly aligned to read track.
2. Machine makes frequent read errors on a par-
ticular head.
a. Disk Speed
detector output fluctuates.
Check
for defective speed detector.
b. Weak read signal at head. Check for im-
proper loading of head against disk surface.
Check for defective head. Check for im-
proper force on head-load spring.
c. Head shoe dc
resistance relative to base
plate should be 5 ohms or less.
d. Bad head. Check for presence of read
amplifier output at pin location D2B03.
e. Intermittent open in head diodes. Replace
preamplifier/write driver SLT card.
f. Intermittent head select. Check write driver
SLT card for malfunctionofhead select circuit.
g. Head is out of alignment. Check alignment
of
read/write head with CE track 100.
1.4 WRITE MALFUNCTIONS
1.4. 1 Write Circuit Troubleshooting (Figure 1-1)
NOTE: An
apparent failure to write can be caused
by a write select error condition when the Write Lock

100Y/CM
/'
V.
i!.
~
.r..
.J~
r T
.,
r r
~
.-
.... Iu
1.-
... ..J
....'11
500Y/CM
1\
/~
"
/\
'\
Oo5},lS/CM
L \ \
j
\1
\
~
~
\
'u
Oo5Y/CM
-.
I. 1\.
f \
.J
.,
I
II
\ / \ J ~
I
I/fI1'
(
~
(
~
100Y/CM I
II
I \
Oo2J.!S/CM
I \
-
-)
\
Figure 1-1. Oscilloscope Display of Read/Write Circuits
227-5984 (9/65)
1/
\.
\
.,
"""
E2B08
Write Oscilla-
tor Output Sig-
nal
H2D02
Write Resistor
Peak-to-Peak
Yoltage
D3B07
Read Signal
AT CE TP
(After Differen-
tiation)
C2812
Data Separator
Fed
by Write
Osc
o
TP G13
and
GOO Show-
ing 600nsec Sin-
gle Shot Gating
Data Bit C2B05
1.3

latch becomes set because of a read/write circuit
malfunction. Check for a latched condition in the
read/write safety circuit before investigating the
write driver SLT card or read/write head for
trouble. Refer to section 1. 3. 1 which lists machine
status conditions caused by setting of this latch.
Information to be written is supplied to the 2310 via
the write data line. The writing process is under
complete control of the system control circuits. The
machine is conditioned to write when the Write Gate
line and Write Clock Gate line are at ground level.
The write circuits consists of read/write heads,
Preamplifier/Write Driver SLT card, Write Select
Safety SLT card, and 1.44 Mc Oscillator and Trigger
SLT card. All cards are located in the electronic
gate.
The write amplifier furnishes the write driver
with three lines: Write Gate, Write Data, and a 1.44
MC Oscillator Signal Line. The nominal dc voltage
of
the write signal at the heads is +26 volts.
The following analysis is to be used to trouble-
shoot write circuits:
Both Heads in 2310 Fail to Write - Probable Cause:
1. Heads not loaded. Check visually.
2. Write gate is not at the correct level to allow
write data to enter the machine. The write gate
line should be at ground level for write and
erase circuits to be turned on.
3. Write resistor voltage to read/write head is
insufficient. Peak-to-peak voltage across the
write resistor should be 15 volts.
2310 Generates Write Errors - Probable Causes:
1. Intermittent write driver or write amplifier.
2. Output of write amplifier on write data lines
is incorrect.
3. Write resistor voltage into the head is insuffi
cient. Peak-to-peak voltage across the write
resistor should be 15 volts.
1.5 ACCESS MALFUNCTIONS
1. 5. 1 Access Circuit Malfunction Troubleshooting
The
access circuits contain the Access Amplifier
SLT card, Access Logic SLT card, tachometer as-
sembly, and detent mechanism. These circuits and
components
effect control of detent operation,
duration of drive current, and dynamic braking of
carriage motion.
1.4
Whenever malfunction is suspected in accessing
circuits, the following four adjustments are to be
accomplished according to procedures of Chapter 4:
1. A deadband adjustment is accomplished to mini-
mize carriage oscillations when the carriage is
decelerated to arrive at a new track location.
2. A 10 milli-inch and 20 milli-inch integrator set
adjustment is made to calibrate the trip level for
decelerating and stopping carriage motion within
limits for a single step increment. A separate
adjustment is made for each stepping mode.
3. A 10 ms single shot adjustment provides for
timing of the detent to correctly seat in the rack
after the carriage has been accessed to a new
track location.
4. A dynamic balance adjustment is made to obtain
smooth detent operation for both directions of
carriage travel between track 000 and track 200.
Some of these adjustments are inter-related,
and it will be necessary to perform a complete ad-
justment whenever a single adjustment is disturbed,
or whenever a new SLT card is substituted in the
access circuits during troubleshooting. Oscilloscope
display patterns for access circuits are shown in
Figure 1-2.
1. 5. 2 Detent Assembly and Rack Troubleshooting
No adjustment of the detent assembly is made other
than initially locating the assembly against the rack
and establishing a clearance of 0.006 ( to. 001) inch
between the clapper and pole piece while the electro-
magnet is energized. The CE cartridge can be used
to check odd-even detent operation by comparison of
the signal on track 100 with the signal on track 105 to
determine that spacing between tracks is within
acceptable limits. A check of detent operation is
made as follows:
1. With the CE Cartridge installed, allow 15
minutes for temperature of the cartridge to
stabilize with temperature of the machine.
2. Use the CE switches to access the carriage
to CE track 100 and verify that heads are
aligned properly with this test track. The
even detent
will be engaged at this track
location.
3. Access the carriage to CE track 105 and
verify that heads are still aligned properly
with the test track. The odd detent will be
engaged at this track location.

2.0V/C
M
1~'A
20j.lS/CM V
20V/CM
!-,-,-
'"""'-i.
2.0MS/CM
1.OV/CM
..1-
~
~
l.
,
2.0MS/CM
Figure 1-2. Oscilloscope Display of Access Circuits
227-5984 (9/65)
i--
K3D09
Transducer
Drive Coil
Output Vol-
tage
G2B04
Detent Coil
Voltage
F3B09
Access Bridge
2-ohm
Feed-
Back Voltage
F2B09
Tach Signal
Voltage
1.5

NOTE: It may be necessary and is permissable to
apply a slight pressure against the front or rear of the
carriage to check head alignment at this track location.
4. Verify that the same head alignment signal
pattern is displayed at both track locations
(100 and 105). A discrepancy in signal patterns
denotes that the spacing between detents is not
within allowable limits.
1.6 BASE PLATE COMPONENT MALFUNCTIONS
1. 6. 1
Troubleshooting Base Plate Components
The following procedure is to be used to check com-
ponents of the base plate.
1. Remove cover by removing two retaining screws
located on cartridge-guide posts and lift cover
from the machine.
2. Check Sector transducer signal lines for good
connections. Check to determine that slots in
sector ring and transducer are free from build up
of foreign obstructions.
3. Check for 0 to 5-ohm resistance when measured
between the dc gate ground and the base plate.
4. Check spindle and drive belt for proper tension.
5. Check detent mechanism to determine that even
detent is fully engaged at home position (track
000) and that odd detent is not engaged but is
evenly aligned with crest of detent rack.
6. Check detent rack for cleanliness.
7. Check head-load mechanism for non-binding
movement.
S. Check read/write head flexure springs for tight-
ness, and check head-load spring for proper
contact with heads while heads are loaded manu-
ally on an IBM card.
1. 7 SERVICE AIDS
These instructions provide for diagnosing machine
malfunctions which interface with programming of
the CPU. A Symptom Index (Figure 1-3) lists the
applicable service Aids associated with machine
failures of this type.
1. 7. 1 Track Addressing
Since the 2310 does not provide any carriage position
information to the using system except in the Home
position, hardware or programming errors in car-
riage positioning or head selection are not directly
detectable. Therefore, it is imperative that the
using system record address information on the disk
either as part of the data field or in a separate
address field along with each data record. This
1.6
Symptom Index
Problem Cause
C. E. M. Reference
Figure
1-3. Sympton Index of Service Aids
address must provide verification of the position of
the selected information.
1. 7. 2 Disk Formatting Procedure
Disk defects on new or used 2315 Disk Cartridges
can effect data recording, causing loss of useable
tracks, because of the high density recording of the
disk cartridge. Using systems should therefore program
storage capacities based on 200 data tracks, allowing
three spare tracks to ensure that the stated capacities
are maintained for the life of the cartridge. Whenever
a 2315 Disk Cartridge is used in a 2310 installation,
a customer utility program employing the following
procedure is used to locate the defects, flag the tracks
in error, and identify the alternate track locations.
The procedure to be used is as follows:
1. Starting with ~ead 0, track 000, the pattern
11100101 must be written and verified by a read
operation.

2. Then the pattern 00010011 must be written and
verified again.
3. If successful, the formatting procedure should
be continued. However, if an error repeats
itself ten times on either pattern, the track must
be flagged and an alternate track address written.
4. To ensure that the alternate track is alright for
use, it should be formatted immediately before
continuing with the subsequent disk cartridge
tracks. Use spare tracks in locations 200-202
for alternate tracks.
1. 7. 3 Error Retry Procedure
The IBM programming systems supporting the 2310,
provide for a ten-retry procedure to be utilized on
any failure of access or write. A fifty retry pro-
cedure must be used for read errors. In addition,
an automatic track flagging procedure must be
established in the file programs if errors occur dur-
ing a write operation. In order to protect against
machine read/write malfunctions as opposed to its
defects, this formatting procedure should first skip
to the alternate track to record this data. If errors
occur at this new alternate track, the procedure
should stop and request attention of the C. E. If,
however, the recording at the alternate track occurs
without error, the old track should be flagged, the
alternate address recorded and the program should
continue.
1.7.4 Homing the Carriage
When initializing the carriage to the Home position
from an unknown location, the carriage must be de-
cremented in single track steps. By testing for
227 -5984 (9/65)
Home after each step, the program can determine
when Track 000 has been reached. This can be
accomplished by providing an access command to
move the carriage 203 tracks, or more in a reverse
direction so that carriage will access to home and
stop. This will present an Access Home communi-
cation signal to the using system.
1.7.5 Errors and Data Retrieval
A sporadic increase in random errors can sometimes
be corrected by cleaning the heads and disk cartridge
using the scheduled maintenance procedure. A solid
error during a customer program, caused by failure
to read a record from the file properly, need not
mean the loss of that data to the customer. If the
trouble is pinpointed in the head disk area:
1. Thoroughly clean the heads using the scheduled
maintenance procedure. Clean the disk using
the Branch Office cleaning fixture and then try
to read the data.
2. If the data cannot be read, examine the disk
surface at the point in question for a comet trail
and an imbedded particle. An attempt can be
made to dislodge the particle by "scrubbing" the
spot with lint-free tissue and a cleaning tool.
Do not use any other method as serious disk
damage can result.
3. Temporary replacement of the head may be tried,
but make certain that the new head will not be
damaged.
4. If all else fails, it may be possible to read
the affected area on a scope trace as a final
resort to recover the data.
1.7

2.1 LEADING PARTICULARS
Maintenance features of the mM 2310 Disk Storage
Drive include switches and controls which permit
the CE to check and monitor operating character-
istics of the machine in a read select mode during
maintenance.
A CE disk cartridge is used by the Customer
Engineer for radial alignment of read/write heads,
and circumferential adjustment of the sector trans-
ducer.
Special tools are available at the branch-office
level to properly service the machine and its com-
ponents. A special Disk Cartridge Cleaning Fixture
is used to clean read/write surfaces of the disk.
A Disk Run Out Fixture is used to measure vertical
deflection of disk surfaces 0
2.2 CE DISK CARTRIDGE
The CE disk cartridge (P /N 2200001) can be identi-
fied by its red access door. (Customer disk car-
tridges are white all over.) The CE disk cartridge
has three pre-recorded tracks on each side of the
disk. These tracks are used for head-alignment
tracking adjustment (track 100) and sector index
timing adjustments (track 095). The third track,
which checks detent spacing (track 105), is provided
for future use and is not to be used for maintenance
purposes. Care must be taken not to damage the
pre-recordings contained on these tracks. Allowance
is made for protection of CE tracks by avoidirg the
use of tracks 90 through 110. Any other tracks may
be used by the CE for read/write maintenance
applications.
The alignment of read/write heads is accom-
plished by using CE Track 100 which consists of two
tracks. One of the tracks is written outboard from
track 100, and the other is written inboard from
track 100 so that eccentricity is built into the track.
The two tracks are written with a clock pattern of
all zeros at a frequency of 720 KC. Read/write
heads are adjusted to read equal amplitudes of the
two eccentric tracks. (Section 4. 17.1)
227 -5984 (9/65)
CHAPTER 2 MAINTENANCE FEATURES
The index timing is adjusted by the use of CE
track 095. A burst of bits and an index pulse is
recorded on this track. The sector transducer is
. positioned radially about the spindle so that a time
delay of 30 (±5) fJ.sec exists between the reference
burst for an all-bits pattern and presentation of the
index pulse.
2.3 CE CONTROL PANEL
A CE control panel located on back of the equipment
(Figure 2-1) is provided to permit limited operation
of the disk storage drive independent of the using
system, except for power input. The CE switches
located on the panel are normally inoperative and be-
come active only when the CE Interlock signal cable
between the using system and the disk storage drive
is disconnected.
Disconnecting this cable, places the machine in
a Read Select mode. The CE can examine the read
circuit and recorded data without the possibility of
erasing recorded information.
2.4 CE SWITCHES
Four CE switches are provided on the CE panel;
Head Select switch, Step Mode switch, Direction
switch, and Step Control switch. No CE control is
provided on the 2310 for writing information.
2. 4. 1 Head Select Switch
The Head Select switch controls the selection of heads
so that the CE may examine read Signals originating
from either head. This switch determines which of
the two heads is in use, and is particularly useful
when aligning heads to a CE cartridge. The switch
has two positions, labeled 0 and 1, which correspond
with the upper and lower read/write head.
2.4.2 Step Mode Switch
The Step Mode switch controls the actuator stepping
mode by determining the distance to be traversed by
2.1

Electronic
Gate
SW5 SW6
10 MIL
SW7 SW8
OUT CONT
eee~
I 0 20 MIL IN I
Head Select Step Mode Direction
"'.- ..
.'.' .
Figure 2-1. CE Panel and Switches
the carriage for each step of the actuator. The
switch has two positions, labeled 10 MIL and 20 MIL,
which
correspond with the distance to be displaced
by the carriage (10 or 20 milli-inches) each time
the Step Control switch is actuated.
2.4.3 Direction Switch
The Direction switch controls the direction of car-
riage motion by causing the carriage to move in a
forward or reverse direction while it is being actu-
ated. The switch has two positions labeled IN and
OUT. The In position causes the carriage to move
forward toward the center of the data disk when the
Step Control switch is actuated. The Out position
causes the carriage to move, in r~verse, away from
center of the data disk each time the Step Control
switch is actuated.
2.2
FRONT Base
Plate
~
~~
~/
:~
CE Panel
& Switches
""." .
2.4.4 Step Control Switch
The Step Control switch initiates carriage motion by
providing an access drive pulse to access circuits to
effect movement of the carriage. This switch has
three positions; continuous step, single step, and
neutral. Labeling on the switch, CaNT and SING,
correspond with the continuous or single stepping
movement.
When the switch is positioned for a continuous
step movement, the actuator is caused to step con-
tinuously at a 15 ms rate in a forward or reverse
direction as determined by the position of the Direc-
tion switch. The actuator steps in increments of 10
or 20 milli -inch steps as determined by the position
of the Step Mode switch. The actuator continues this
stepping cycle until the carriage strikes the mechani-
cal limits of travel where the detent continues to

operate without carriage motion, or until the Step
Control switch is removed from the Continuous step
position.
When the switch is positioned for a single step
movement, the actuator will move one step each
time the switch is operated. The switch is spring
loaded so that it will return to the neutral position
when released. The direction of carriage travel,
and 10 or 20 milli-inch step increment is determined
by the respective positions of the Direction and Step
Mode
switches.
2.5 TOOLS AND TEST EQUIPMENT
2. 5. 1 Standard Tools
To properly service the equipment, the CE requires
the foliowing tools:
Small CE Tool Kit ........ (PIN 451558)
SLT Tool Kit ..•.... (Not available 9/65)
CE Oscilloscope, Type 561S
with Indicator Unit ....... (PIN 451647)
The following oscilloscope attachments are required:
Plug-in Dual Trace
Plug-in Time Base
2.5. 2 Special Tools and Supplies
(P IN 451648)
(P IN 451651)
The following special tools are required to service
the equipment and are available in the shipping group
for systems which use the disk storage drive.
Feeler Gage, non-magnetic
(0.005 inch) ....... . .
(PIN 2200007)
Feeler Gage, non-magnetic
(0.007 inch) ....... . • (PIN 2200057)
727 -!)<)H-! (!J/I;:;)
Lint Free Tissue . . . . .
SLT Board Jumper Wires
Alcohol, 91% Isopropyl,
• (PIN 2162567)
• (PIN 353796)
Pint Container . . . . . •
(PIN 2155966)
Head Alignment Oscilloscope
Adapter •..••..• • (PiN 2200052)
2.5.3 Branch Office Tools
The following is a list of tools and supplies which are
normally located in the Branch Office. These tools
can be obtained when needed.
CE Disk Cartridge.
Cleaning Paddles
(PIN 2200001)
(PiN 2108474)
Disk Cleaning Fixture (PIN 2200008)
The disk cartridge clean~ng fixture provides for
cleaning the disk while it is encased within the car-
tridge. The operator unlatches the cartridge door
and inserts the cartridge into the fixture so that
cleaning pads span the data surfaces as disk is
positioned on the spindle. The spindle can be
rotated manually while cleaning solution is
applied to the disk data surfaces. This fixture
is used for unscheduled maintenance.
Disk Run Out Gage (PIN 2200050)*
The disk run out gage (Figure 2-2) enables the CE
to determine the extent of warpage present in a
disk by measuring the amount of vertical deflec-
tion present at the outer edge of the disk. This
gage is mounted on the base plate, adjacent to
the head-arm assemblies, so that the disk can be
manually rotated between the gap established by
adjustable lips of the gage. A knurled adjusting
screw on the gage permits adjusting the gap size
to determine runout. Procedures for using the
gage are described in Chapter 4•
-"Alternate procedures ar~ contallled III Chapter 7 for machines with
serial number.; 00001 throu<:h 00050.
2.3

Stationary
Lip
Figure 2-2. Disk Run Out Gage
2.4
Adjustable
Lip
Gage Lips
~
Height
....... ____ Adjustment
Screw
'------

CHAPTER 3 SCHEDULED PREVENTIVE MAINTENANCE PROCEDURES
3.1 APPROACH TO SCHEDULED PREVENTIVE
MAINTENANCE
The prime objective of any maintenance ability is to
provide maximum machine availability to the cus-
to~er. Ev~ry preventive maintenance operation
should assist in realizing this objective. Unless a
preventive maintenance operation cuts machine down-
time, it is unnecessary.
3. 1. 1 Visual Inspection
Visual inspection is the first step to every preven-
tive maintenance operation. Always look for cor-
rOSion, dirt, wear, cracks, binds, and loose con-
nections in wiring and on hardware. Alertness in
notiCing these items may minimize machine down
time later.
3.1. 2 Electronic Circuits
Diagnostic programs and pulse checking are the two
basic tools used in preventive maintenance of elec-
tronic circuits. All of these are effective in locating
potential and intermittent troubles. These items are
also excellent troubleshooting tools.
3. 1.3 Mechanical Units
The three basic preventive maintenance steps per-
formed on every mechanical or electromechanical
machine are clean, lubricate, and inspect. Remem-·
ber, do not do more than recommended preventive
maintenance on equipment that is operating satis-
factorily.
3.1. 4 Cleanliness
Cleanliness cannot be overemphasized in maintairiing
the mM 2310 Disk Storage Drive.
When the heads are "flying" a clearance of ap-
prOximately 125 to 150 microinches exists between
the
heads and the surfaces of the disk. Vepy small
particles of dust can accumulate and become trapped
between the heads and the disk~ The accumulated
dust can cause the disk surface to become 'scored,
and this condition can result in an unusaple track or
in head damage.
Do not allow oil to accumulate anywhere on the
machine. Oil accumulates dust and dirt. Do not
227-5984 (9/65)
operate the machine with the top cover removed un-
~ess analysis cannot be performed in any other man-
ner. If the machine must run with the cover off,
replace customer's cartridge with a CE cartridge to
avoid damage to customer data.
3.2 SCHEDULED MAINTENANCE PROCEDURES
,Details of scheduled maintenance operations are
listed in Figure 3-1. During normal scheduled main-
tenance, perform only those operations listed on the
chart for that particular maintenance period. The
2310 Disk Storage Drive scheduled maintenance period
is defined by its time interval of use by the customer.
Details on adjustments and service checks are found
in the Operation column of Figure 3-1. Observe all
safety practices.
3.2.1 Cleaning Read/Write Heads
1. Wrap a lint-free wiper (P /N 2162567) around a
paddle and dampen with 91% isopropyl alcohol
(PIN 2155966)
NOTE: Paddle is made by folding an mM card
four to five times lengthwise.
2. Use a second paddle to support the back of a read!
write head, and thoroughly wipe the face of each
read/write head with the lint-free wiper dampened
with alcohol. Use the dental mirror to inspect
the head surface. Be very careful that all dirt is
cleaned off. Any extraneous material which is
not cleaned off will damage the disks. Finally,
wipe head with dry wiper.
. WARNING: Do not touch the face of the read/write
head With fingers. Acids emitted from skin can etch
and ruin a head. Do not leave any residue on face of
the read/write head. Do not blow on heads. Mois-
ture 'will rust and contaminate the heads.
3.2.2 Lubrication of Machine
Scheduled lubrication requirements for the 2310 are
described in Figures 3-1 and 3-2. Specified lubri-
cants are to be applied according to instructions
contained in these charts. .
3.1

conE LOCATION *FREQ OPERATION
U R OPERATION
Read/Write Heads Clean; Inspect:
Clean and inspect read/write heads for scratches and build up
af axide. See Section 3.3.2.
Inspect head leads for damage.
Carriage rail
Clean; Lubricate:
Clean carriage rail with lint-free tissue and 91% Isopropyl alcahol.
Apply a thin film of IBM #6 oil. Remove excess with lint-free
tissue.
Preload Bearing 4
Clean:
3
Clean outer race of the Preload Bearing by holding a dry lint-free
tissue against it while moving the carriage back and forth.
Deh;!nt Rack Clean; Lubricate:
Clean detent Rack with IBM Brush (P/N·1018992).' Place one drop
of IBM #9 Oil in three equally_spaced places an the rack. '
Access the carriage fram track 000 to 199 and back three or four
times. Wipe excess
ail from detent rack.
Spindle Assemblt
Clean:
(Magnetic Chuc )
Clean each pole piece of the Magnetic Chuck with lint-free tissue
dampened with 91% lospropyl
Alcohol.
Air Filter Replace Filter.
Electronics Duct Disconnect
head plug leads from heads and loosen binding head
screw on top of electronics gate. Swing gate door downward and
remove air filter from left side,of gate.
Head Load Cam ' Lubricate:
Apply a Iight film of
IBM #22 grease on wear points of Head Laad Cam
surface.
Head Load Lubricate:
Spring Support Apply
one drop of IBM ±9 oil at four points of Head Load Spring
Pivots Support Pivots.
Spindle Lubricate:
Center Cone Apply a light film of
IBM #22 grease on cone surface.
Wipe off
any excess
grease.
Drive Magnet
Inspect; Clean if necessary:
and Voice Coil
Remove actuator motor (Drive Magnet) and inspect for contamination;
Motor Flux
Gop
especially for metal particles. If cleaning is necessary, place a
piece of masking tape on a paddle with adhesive side exposed, and
wipe
each side of flux gap.
5 Base
Plate
12
Clean the voice coil with dry lint-free tissue.
Casting
and
Inspect; Clean:
Clean as necessary.
Covers Inspect for cleanliness and loose parts.
Air
Filter
Test; Replace if necessary:
Plenum Chamber Test plenum chamber
air flow as outlined in Section 4.3.1. Replace
air fi Iter if necessary.
Drive Belt
Check; Adjust
Tension Loosen
three motor mounting screws and allow the belt tension spring
to position
the motor to obtain the required belt tension. Tighten the
screws progressively to prevent changing the position of the plate,
**Drive Motor Lubricate:
Apply
IBM #6 oil to fill oil cups on each end of motor shaft.
Read/write heads
Check:
Check read/write head alignment using CE disk Cartridge track 100
according to procedures of Sect ian 4.17.1
Sector Pulse
Check:
Timing
Check sector pulse timing using CE disk Cartridge track 095 according
to procedures of Section 4.20.1
* The preventive maintenance Frequency is determined by machine usage rates computed at
176 hrs-per-month an a single shift basi
**
Lubric~tian is ta be accamplished on 50-cycle, 208/220-volt motors only.
Figure 3 -1. Preventive Maintenance Schedule
3.2