IEI Technology IOPS-Q67/H61 User manual

IOPS-Q67/H61 Pluggable Module PC
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User Manual
IOPS-Q67/H61 Embedded System
MODEL:
IOPS-Q67/H61
OPS Compliant Pluggable Module PC with Intel
®
Core
i5/Celeron® G530, Intel® Q67/H61 Express Chipset, GbE LAN,
DisplayPort, RS-232, USB 2.0, SDHC Slot, RoHS Compliant
Rev. 1.01 – November 27, 2014

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Revision
Date Version Changes
November 27, 2014 1.01 Updated document format
December 4, 2012 1.00 Initial release

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Copyright
COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to
improve reliability, design and function and does not represent a commitment on the part
of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
TRADEMARKS
All registered trademarks and product names mentioned herein are used for identification
purposes only and may be trademarks and/or registered trademarks of their respective
owners.

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WARNING
This device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and(2) this device must accept any
interference received, including interference that may cause undesired operation.
NOTE: This equipment has been tested and found to comply with the limits for a Class
B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference
to radio communications.
However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
—Consult the dealer or an experienced radio/ TV technician for help.
You are cautioned that any change or modifications to the equipment not expressly
approve by the party responsible for compliance could void your authority to operate
such equipment.
IMPORTANT NOTE:
FCC Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator & your body.

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Table of Contents
1 INTRODUCTION.......................................................................................................... 1
1.1 OVERVIEW.................................................................................................................. 2
1.2 FEATURES................................................................................................................... 2
1.3 MODEL VARIATIONS ................................................................................................... 3
1.4 EXTERNAL OVERVIEW................................................................................................ 3
1.4.1 Front Panel ........................................................................................................ 3
1.4.2 Rear Panel ......................................................................................................... 4
1.4.3 Bottom Panel...................................................................................................... 5
1.5 TECHNICAL SPECIFICATIONS ...................................................................................... 6
1.6 DIMENSIONS............................................................................................................... 8
2 UNPACKING................................................................................................................. 9
2.1ANTI-STATIC PRECAUTIONS...................................................................................... 10
2.2 UNPACKING PRECAUTIONS....................................................................................... 10
2.3 UNPACKING CHECKLIST ............................................................................................11
3 INSTALLATION ......................................................................................................... 12
3.1 INSTALLATION PRECAUTIONS................................................................................... 13
3.1.1 High Surface Temperature ............................................................................... 13
3.2 SD CARD INSTALLATION.......................................................................................... 14
3.3 PLUGGABLE MODULE INSTALLATION....................................................................... 15
3.4 EXTERNAL PERIPHERAL INTERFACE CONNECTION ................................................... 15
3.4.1 Audio Line-out Connector................................................................................ 16
3.4.2 DisplayPort Connector.................................................................................... 16
3.4.3 LAN Connector ................................................................................................ 16
3.4.4 OPS Connector ................................................................................................ 17
3.4.5 RS-232 Serial Port Connector......................................................................... 19
3.4.6 USB 2.0 Connectors......................................................................................... 20
3.5 DRIVER INSTALLATION............................................................................................. 21
4 BIOS SCREENS........................................................................................................... 22

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4.1 INTRODUCTION......................................................................................................... 23
4.1.1 Starting Setup................................................................................................... 23
4.1.2 Using Setup...................................................................................................... 23
4.1.3 Getting Help..................................................................................................... 24
4.1.4 BIOS Menu Bar................................................................................................ 24
4.2 MAIN........................................................................................................................ 25
4.3ADVANCED............................................................................................................... 26
4.3.1 CPU Configuration.......................................................................................... 27
4.3.1.1 CPU Information....................................................................................... 27
4.3.2 USB Configuration........................................................................................... 29
4.3.3 H/W Monitor.................................................................................................... 30
4.4 CHIPSET ................................................................................................................... 31
4.5 BOOT........................................................................................................................ 34
4.6 SECURITY................................................................................................................. 35
4.7 EXIT......................................................................................................................... 36
5 MAINTENANCE......................................................................................................... 38
5.1 SYSTEM MAINTENANCE OVERVIEW......................................................................... 39
5.2 COMPONENT REPLACEMENT PROCEDURE ................................................................ 39
5.2.1 mSATA Replacement ........................................................................................ 40
5.2.2 SO-DIMM Replacement................................................................................... 42
6 INTERFACE CONNECTORS................................................................................... 44
6.1 PERIPHERAL INTERFACE CONNECTORS..................................................................... 45
6.2 INTERNAL PERIPHERAL CONNECTORS...................................................................... 46
6.2.1 Battery Connector (BT1).................................................................................. 47
6.2.2 Fan Connector (FAN1)..................................................................................... 47
6.2.3 GPIO87 to SIO Connector (SW2).................................................................... 47
6.2.4 Half-Size PCIe Mini Slot (JP1)........................................................................ 48
6.2.5 Full-Size PCIe Mini Slot (JP2)........................................................................ 49
6.2.6 USB DOM Connector (USB2)......................................................................... 50
A SAFETY PRECAUTIONS......................................................................................... 51
A.1 SAFETY PRECAUTIONS ............................................................................................ 52
A.1.1 General Safety Precautions............................................................................. 52
A.1.2 Anti-static Precautions .................................................................................... 53

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A.1.3 Product Disposal............................................................................................. 54
A.2 MAINTENANCE AND CLEANING PRECAUTIONS........................................................ 54
A.2.1 Maintenance and Cleaning.............................................................................. 54
A.2.2 Cleaning Tools................................................................................................. 55
B BIOS MENU OPTIONS............................................................................................. 56
B.1 BIOS CONFIGURATION OPTIONS ............................................................................. 57
C WATCHDOG TIMER ................................................................................................ 58

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List of Figures
Figure 1-1: IOPS-Q67/H61 Series Pluggable Module PC............................................................2
Figure 1-2: Front Panel ..................................................................................................................4
Figure 1-3: Rear Panel....................................................................................................................4
Figure 1-4: Bottom Panel...............................................................................................................5
Figure 1-5: IOPS-Q67/H61 Dimensions (mm)...............................................................................8
Figure 3-1: SDHC Slot Cover Retention Screw..........................................................................14
Figure 3-2: SDHC Card Installation.............................................................................................14
Figure 3-3: Pluggable Module Installation .................................................................................15
Figure 3-4: RJ-45 Ethernet Connector........................................................................................17
Figure 3-5: RJ-45 Serial Port Connector ....................................................................................19
Figure 3-6: RJ-45 Serial Port Connection ..................................................................................20
Figure 5-1: System Cover Retention Screws.............................................................................40
Figure 5-2: PCIe Mini Card Slot Location...................................................................................41
Figure 5-3: mSATA Module Installation......................................................................................41
Figure 5-4: SO-DIMM Access Panel Retention Screw...............................................................42
Figure 5-5: SO-DIMM Removal ....................................................................................................43
Figure 5-6: SO-DIMM Installation................................................................................................43
Figure 6-1: Main Board Layout Diagram (Front Side)...............................................................45
Figure 6-2: Main Board Layout Diagram (Solder Side).............................................................46

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List of Tables
Table 1-1: Model Variations...........................................................................................................3
Table 1-2: Technical Specifications..............................................................................................7
Table 2-1: Package List Contents...............................................................................................11
Table 3-1: LAN Pinouts ................................................................................................................16
Table 3-2: RJ-45 Ethernet Connector LEDs...............................................................................17
Table 3-3: OPS Connector (JAE1) Pinouts ................................................................................18
Table 3-4: Serial Port Pinouts......................................................................................................19
Table 3-5: USB Port Pinouts........................................................................................................20
Table 4-1: BIOS Navigation Keys................................................................................................24
Table 6-1: Peripheral Interface Connectors...............................................................................47
Table 6-2: Battery Connector (BT1) Pinouts..............................................................................47
Table 6-3: Fan Connector (FAN1) Pinouts .................................................................................47
Table 6-4: GPIO87 to SIO Connector (SW2) Pinouts.................................................................47
Table 6-5: Half-Size PCIe Mini Card Slot (JP1) Pinouts............................................................48
Table 6-6: Full-Size PCIe Mini Card Slot (JP2) Pinouts.............................................................49
Table 6-7: USB DOM Connector (USB2) Pinouts ......................................................................50

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List of BIOS Menus
BIOS Menu 1: Main.......................................................................................................................25
BIOS Menu 2: Advanced..............................................................................................................26
BIOS Menu 3: CPU Configuration...............................................................................................27
BIOS Menu 4: CPU Configuration...............................................................................................28
BIOS Menu 5: USB Configuration...............................................................................................29
BIOS Menu 6: H/W Monitor..........................................................................................................30
BIOS Menu 7: Chipset..................................................................................................................31
BIOS Menu 8: Boot.......................................................................................................................34
BIOS Menu 9: Security.................................................................................................................35
BIOS Menu 10:Exit........................................................................................................................36

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Chapter
1
1 Introduction

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1.1 Overview
Figure 1-1: IOPS-Q67/H61 Series Pluggable Module PC
The IOPS-Q67/H61 series is a pluggable module PC with 2nd-generation Intel® Core™ i5
or Intel® Celeron® dual-core processor and Intel® Q67 or H61 Express Chipset. The
IOPS-Q67/H61 is preinstalled 4 GB of DDR3 SO-DIMM and can accommodate up to 8 GB
of DDR3 memory. Storage in the system is handled by the preinstalled 32 GB mSATA
module and the SDHC card slot on the front panel.
The IOPS-Q67/H61 includes a DisplayPort output interface supporting up to 2560 x 1600
resolutions. Other slots and connectors include half-size PCIe Mini card slot, RS-232,
Gigabit Ethernet, USB 2.0 ports and audio out.
The IOPS-Q67-i5 model with Intel® Corei5 processor also supports Intel® AMT 7.0
that make maintenance a lot easier for system integrators.
1.2 Features
The IOPS-Q67/H61 has the following features
Intel® Open Pluggable Specification (OPS) compliant
LGA1155 Intel® Core™ i5, or Celeron® G530 CPU supported
Intel® HD Graphics with full HD video decoding capability
One 32 GB mSATA module preinstalled
One SDHC card supported
One GbE LAN for high speed network applications
One DisplayPort connector
Two USB 2.0 ports

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One RS-232 RJ-45 serial port
One audio line-out jack
RoHS compliant design
1.3 Model Variations
There are two models in the IOPS-Q67/H61 series. Both models are preinstalled with
4 GB of DDR3 memory and a 32 GB mSATA module. The model variations are listed in
62Table 1-1 below.
LGA1155 CPU Express Chipset
IOPS-Q67-i5-4GB 2.70GHz Intel® Corei5-2390T Intel® Q67
IOPS-H61-C-4GB 2.40GHz Intel® Celeron® G530 Intel® H61
Table 1-1: Model Variations
1.4 External Overview
1.4.1 Front Panel
The IOPS-Q67/H61 front panel provides access to the following external I/O connectors:
1 x Audio line-out jack
1 x DisplayPort connector
1 x GbE RJ-45 connector
1 x RS-232 RJ-45 serial port
2 x USB 2.0 port connectors
1 x SDHC slot
1 x Storage device LED indicator
1 x USB LED indicator
1 x Status LED indicator (Blinking: booting; Solid: complete booting)
1 x Power button
1 x Reset button
An overview of the front panel is shown in 62Figure 1-2 below.

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Figure 1-2: Front Panel
1.4.2 Rear Panel
The rear panel of the IOPS-Q67/H61 contains an OPS compliant JAE connector which
can connected with OPS displays. An overview of the rear panel is shown in 62Figure 1-3.
Figure 1-3: Rear Panel

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1.4.3 Bottom Panel
WARNING:
Never remove the SO-DIMM access panel from the chassis while power is
still being fed into the system. Before removing the SO-DIMM access
panel, make sure the system has been turned off and all power connectors
unplugged.
The bottom panel of the IOPS-Q67/H61 contains a removable cover to access the
SO-DIMM.
Figure 1-4: Bottom Panel

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1.5 Technical Specifications
The specifications for the Intel based embedded systems are listed below.
IOPS-Q67-i5-4GB IOPS-H61-C-4GB
CPU 2.70GHz Intel® Corei5-2390T
dual-core CPU (3M cache)
2.40GHz Intel® Celeron® G530
dual-core CPU (2M cache)
System Chipset Intel® Q67 Express Chipset Intel® H61 Express Chipset
System Memory One 1333 MHz 4 GB DDR3 SDRAM SO-DIMM preinstalled
(system max. 8 GB)
Graphics Intel® HD Graphics
Max. Output Resolution OPS display panel: 1920 x 1200
DisplayPort: 2560 x 1600
Ethernet One Intel® 82579LM GbE controller
Display One DisplayPort 1.1 connector
Serial Port One RS-232 RJ-45 serial port
USB Two USB 2.0 ports
Audio One audio out (5.1 channel Realtek ALC662 HD Audio codec)
Storage One 32 GB mSATA module preinstalled
One SDHC card slot on the front panel
Expansion Slot One PCIe Mini half-size slot
Intel® AMT Supported Not supported
Buttons One power button
One reset button
Chassis Construction Aluminum Alloy
Power Input 12V DC ~ 19 V DC

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Power Consumption 12 V @ 3.83 A (Intel® Celeron® G530 with 4 GB DDR3 memory)
Operating Temperature 0ºC ~ 45ºC
Storage Temperature -10 ºC ~ 55ºC
Color Black
Supported OS Windows 7 or Windows Embedded Standard 7
Dimensions (W x D x H) 200 mm x 171 mm x 30 mm
EMC FCC Class A, CE, LVD
Compatible Display
Models
NEC: X461S (46”)
TVS: DS-42 (42”)
Philips: BDL-4245E (42”)
Mitsubishi: MDT551S (55”)
eJump: PX420CHN-OPS (42”)
Table 1-2: Technical Specifications

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1.6 Dimensions
The physical dimensions of the IOPS-Q67/H61 embedded systems are shown in 62Figure
1-5.
Height: 30.00 mm
Width: 200.00 mm
Length: 171.00 mm
Figure 1-5: IOPS-Q67/H61 Dimensions (mm)

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Chapter
2
2 Unpacking

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2.1 Anti-static Precautions
WARNING:
Failure to take ESD precautions during installation may result in
permanent damage to the IOPS-Q67/H61 and severe injury to the
user.
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the IOPS-Q67/H61. Dry climates are especially susceptible to ESD. It is
therefore critical that whenever the IOPS-Q67/H61 or any other electrical component is
handled, the following anti-static precautions are strictly adhered to.
Wear an anti-static wristband: Wearing a simple anti-static wristband can
help to prevent ESD from damaging the board.
Self-grounding: Before handling the board, touch any grounded conducting
material. During the time the board is handled, frequently touch any
conducting materials that are connected to the ground.
Use an anti-static pad: When configuring the IOPS-Q67/H61, place it on an
anti-static pad. This reduces the possibility of ESD damaging the
IOPS-Q67/H61.
2.2 Unpacking Precautions
When the IOPS-Q67/H61 is unpacked, please do the following:
Follow the anti-static precautions outlined in Section 2.1.
Make sure the packing box is facing upwards so the IOPS-Q67/H61 does not
fall out of the box.
Make sure all the components shown in Section 2.3 are present.