i
HDK-73 1707 VER1 (E)
PRODUCTS CONFORMING TO RoHS DIRECTIVE
PRODUCTS CONFORMING TO RoHS DIRECTIVE
Following products described in this manual are products conforming to RoHS directive.
·HDK-73 Color Camera
ā9)/+'9)(+'9LHZ¿QGHU
·BSF-55 BaseStation
·OCP-300 OperationControlPanel
·MCP-300 MaintenanceControlPanel
·BSH-300 BaseStationHub
3URGXFWVFRQIRUPLQJWR5R+6GLUHFWLYHLQFOXGHSURGXFWVWKDWGRQRWFRQWDLQVSHFL¿HGKD]DUGRXVVXEVWDQFHVVXFKDVOHDGPHUFXU\
cadmium, hexavalent chromium, polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) in electrical and
electronic equipment excluding following exemption applications based on the EU directive (Directive2002/95/EC).
* About RoHS Directive
7KH5R+6GLUHFWLYHVWDQGVIRUWKH5HVWULFWLRQRIWKH8VHRI&HUWDLQ+D]DUGRXV6XEVWDQFHVLQ(OHFWULFDODQG(OHFWURQLF(TXLSPHQW
DQGLVRQHRIHQYLURQPHQWDOGLUHFWLYHVLQ(XURSH7KLVGLUHFWLYHUHVWULFWVWKHXVHRIVSHFL¿HGKD]DUGRXVVXEVWDQFHVLQHOHFWULFDODQG
electronic equipment.
●Applications exempted from RoHS directive compliance
Followings applications are permitted as exemptions from RoHS directive compliance.
0HUFXU\LQFRPSDFWÀXRUHVFHQWODPSVQRWH[FHHGLQJPJSHUODPS
0HUFXU\LQVWUDLJKWÀXRUHVFHQWODPSVIRUJHQHUDOSXUSRVHVQRWH[FHHGLQJ
· halophosphate 10mg
·triphosphate with a normal lifetime 5mg
· triphosphate with a long lifetime 8mg
0HUFXU\LQVWUDLJKWÀXRUHVFHQWODPSVIRUVSHFLDOSXUSRVHV
0HUFXU\LQRWKHUODPSVQRWVSHFL¿FDOO\PHQWLRQHGLQWKLV$QQH[
/HDGLQWKHJODVVRIFDWKRGHUD\WXEHVHOHFWURQLFFRPSRQHQWVDQGÀXRUHVFHQWWXEHV
6. Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminum containing up to 0.4% lead by weight and
as a copper alloy containing up to 4% lead by weight
7. Lead in following items
· Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85% lead)
· Lead in solders for servers, storage and storage array systems
· Lead in solders for network infrastructure equipment for switching, signaling, transmission as well as network management
for telecommunication
ā/HDGLQHOHFWURQLFFHUDPLFSDUWVHJSLH]RHOHFWURQLFGHYLFHV
8. Cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to
restrictions on the marketing and use of certain dangerous substances and preparations
9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators
10.Lead used in compliant pin connector systems
11.Lead as a coating material for the thermal conduction module C-ring
/HDGDQGFDGPLXPLQRSWLFDODQG¿OWHUJODVV
13.Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors
with a lead content of more than 80% and less than 85% by weight
14. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip
Chip packages
15.Decabrominated diphenyl ether (Deca-BDE) in polymeric applications
