Ikegami HDK-73 User manual

OFF
EXT
POWER
ACTIVE
STANDBY
BS/CCU
HIGH DEFINITION CAMERA SYSTEM
HDK-73
(FA-55)
OPERATION MANUAL

1707 1st Edition (E)
1
OUTLINE
2
NAME and FUNCTION
INSTALLATION and 3
CONNECTION
4
OPERATION
CAMERA SETTINGS and 5
ADJUSTMENT
TROUBLE SHOOTING and 6
MAINTENANCE
7
SPECIFICATIONS
CHANGING INFORMATION
HDK-73
(FA-55)
HIGH DEFINITION CAMERA SYSTEM
OPERATION MANUAL

Copyright © 2012 Ikegami Tsushinki Co., Ltd.
We reserve the copyright on the software we create.
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Ikegami Tsushinki Co., Ltd.

i
HDK-73 1707 VER1 (E)
PRODUCTS CONFORMING TO RoHS DIRECTIVE
PRODUCTS CONFORMING TO RoHS DIRECTIVE
Following products described in this manual are products conforming to RoHS directive.
·HDK-73 Color Camera
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·BSF-55 BaseStation
·OCP-300 OperationControlPanel
·MCP-300 MaintenanceControlPanel
·BSH-300 BaseStationHub
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cadmium, hexavalent chromium, polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) in electrical and
electronic equipment excluding following exemption applications based on the EU directive (Directive2002/95/EC).
* About RoHS Directive
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electronic equipment.
●Applications exempted from RoHS directive compliance
Followings applications are permitted as exemptions from RoHS directive compliance.
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· halophosphate 10mg
·triphosphate with a normal lifetime 5mg
· triphosphate with a long lifetime 8mg
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6. Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminum containing up to 0.4% lead by weight and
as a copper alloy containing up to 4% lead by weight
7. Lead in following items
· Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85% lead)
· Lead in solders for servers, storage and storage array systems
· Lead in solders for network infrastructure equipment for switching, signaling, transmission as well as network management
for telecommunication
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8. Cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to
restrictions on the marketing and use of certain dangerous substances and preparations
9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators
10.Lead used in compliant pin connector systems
11.Lead as a coating material for the thermal conduction module C-ring
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13.Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors
with a lead content of more than 80% and less than 85% by weight
14. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip
Chip packages
15.Decabrominated diphenyl ether (Deca-BDE) in polymeric applications

ii HDK-73 1707 VER1 (E)
M INTEN NCE OF PRODUCTS CONFORMING TO RoHS DIRECTIVE
MAINTENANCE OF PRODUCTS CONFORMING TO RoHS DIRECTIVE
Work with care about followings for maintenance of products conforming to RoHS directive.
1. Identification
- For products conforming to RoHS directive, the letter “E” is appended at the end of the serial number on the label. For models
that the letter cannot be appended to the serial number, the letter “E” will be described in a distinguishable position on the label.
A description example on a main label is shown below.
MODEL HDK-73
SERIALNo. AA123456 E
Label
Product conforming to RoHS directive
· The printed circuit boards of the RoHS compliant products have ether of the following marks with serigraph or label.
A
2. Soldering
Since the melting point of lead-free solder used for the products conforming to RoHS directive is 20 to 45 degrees Celsius higher
than that of conventional solder with lead (Sn-Pb eutectic solder), a high temperature needs to be set to a soldering iron. Taking
allowable temperature limit of the parts and stable work into consideration, use a soldering iron with excellent thermal recovery
characteristics.
· Recommended solder composition is "Sn/3.0Ag/0.5Cu" or equivalent.
· Separate the soldering iron exclusively for RoHS products and the soldering iron for conventional use.
· Set the temperature of the soldering bit to 350 to 370 degrees Celsius.
The temperature may need to be adjusted according to the size of the copper foil land on the print-circuit board and the tip width
of the soldering bit.
· Finish by a lead-free solder looks dull or whitish compared to conventional solder with lead.
· If the customer mixed the lead-solder with the main body wiring or the circuit board, it becomes guarantee off the subject.
Ikegami doesn't guarantee to do the repair work. Because the solder polluted with lead cannot be removed.
3. Parts
Be sure to use parts conforming to RoHS directive.

iii
HDK-73 1707 VER1 (E)
INFORM TION TO THE USER
INFORMATION TO THE USER
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Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated
in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and
used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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operate the equipment.
2. Declaration of conformity
The CE mark means that the following products will meet and the Standards EN55032, EN-61000-3-2, EN6100-3-3, EN55103-2
E4-E5 (for EMC), EN62368-1 (for LVD).
For European customer.
People’s Republic of China Electronic Industry Standard (SJ/T11364—2006)
Marking Styles for Names and Contents of Toxic or hazardous Substances and Elements
Part Name
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Lead
(Pb)
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
Chromium
(Cr/(VI))
Polybrominated
biphenyls
(PBB)
Polybrominated
diphenyl ethers
(PBDE)
HDK-73 × żżżżż
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requirement in SJ/T11363-2006.
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above the limit requirement in SJ/T11363-2006.

iv HDK-73 1707 VER1 (E)
SFET PRECUTIONS
SAFETY PRECAUTIONS
This manual describes the precautions using various pictorial symbols for you to use the product safely. Please read these
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The following hazard alert symbols are used to indicate the level of impact on the body or property
when you do not follow the precautions.
Indicates that mishandling of the product by ignoring this label may lead to a danger resulting in a
serious injury or death.
Indicates that mishandling of the product by ignoring this label may lead to a danger resulting in an
injury or property damage.
The following symbols are used to indicate the expected injury or hazards when you do not follow
the precautions.
Indicates general cautions on such matters as safe work, procedure, and installation location.
Mishandling may not directly lead to death, injury, or property damage.
Indicates that mishandling may cause an electric shock.
,QGLFDWHVWKDWPLVKDQGOLQJPD\FDXVHD¿UH
Indicates that mishandling may cause injury.
The following symbol is used to indicate other precautions to prevent damage or hazard from
occurring:
Indicates prohibited action.

v
■
Handling Precautions
Regarding the Product
Do not disassemble or modify the product which is not described in this manual. Doing so may
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Regarding the Power
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or electric shock due to a damaged cable.
To inspect or operate on the inside of the equipment, turn off the power and wait for one or two
minutes before starting work. High voltage is present in some modules and connectors of this
product.
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Regarding the Product
Do not lift or hold the camera by the projection parts.
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exposed to unnecessary pressure, which may cause equipment damage.
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table, a tripod, etc.).
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- Extremely high/low temperature
- In direct sunlight for a long time, or near a heater
- High humidity or dusty
- Exposed to water or other liquid
- Strong vibration or shock
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- lightning
- In rain without the rain cover

vi HDK-73 1707 VER1 (E)
SFET PRECUTIONS
Regarding the Product
Be sure to hold the plug and pull when you disconnect the cable.
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Condensation may occur in the CMOS image sensor or other parts.
Do not drop or insert a metal object such as a pin or a foreign object into the equipment.
Do not spread or spill water or other liquid on the equipment.
Do not subject the equipment to a strong shock or vibration.
Doing so may cause damage or malfunction of the equipment.
Since semiconductor pixels are adapted in CMOS image sensor, image burn-in will not occur in
normal operation. When you shoot subjects with an excessive amount of light (e.g. sun, laser beam,
etc.) for a long time, pay attention to temperature rise inside the CMOS sensor.
Before connecting a VTR or accessories, make sure that the camera and equipment to be connected
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Laser beams may damage the CMOS image sensors. If you shoot a scene that includes a laser
beam, be careful not to let a laser beam become directed into the lens of the camera.
Excessive sound pressure from the headset may cause a hearing loss.
Regarding the Power and the Lithium Battery
Use the product in compliance with the rating of the fuse within the product and that within the
Camera Control Unit (BS). Otherwise, a fault can occur.
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When changing or discarding a battery, please contact Ikegami's sales and service centers.
Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to
the instructions.
Regarding the Fiber Connector and the Fiber Optic Cable
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cables, thoroughly check male or female, the diameter, type and manufacturer of connectors.
If the ferrule is dirty, wipe the dirt off with cotton swabs soaked in alcohol.
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$OWKRXJKVDIHW\PHDVXUHVDUHIXOO\WDNHQVXFKDVWKHVDIHW\FLUFXLWWKDWVWRSVWKHSRZHUVXSSO\
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force to bend, twist, or damage the cable, and take great care when handling.

vii
Regarding the Fiber Connector and the Fiber Optic Cable
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connector (plug) and not the cable.
- Do not crush the cable.
- Since there can be various obstacles (such as a corner of a building, glass, rough ground surface)
in places where the cable is connected, do not drag the cable without winding.
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GLDPHWHURIFDEOHVDSSUR[PPIRUDijPPZLGHFDEOH'RQRWIRUFHWRZLQGOHVVWKDQ
VSHFL¿HG)RUFLEOHZLQGLQJFDQEUHDN¿EHUOHDGVZLWKLQWKHFDEOH
Fiber Optic Cable
Radius
Approx. 60mm
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clamp.
Optical Fiber Cable
CAMERA CABLE Clamp
CAMERA CABLE Clamp
(optional)

viii HDK-73 1707 VER1 (E)
SFET PRECUTIONS
■
Environmental Cautions
Regarding the product
When continuously operating the product in a rainy, cold or hot conditions, use a rain cover, cold-
weather cover, and shade cover respectively.
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When shooting in places such as airports, military bases or transmitting stations where magnetic
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foil.
■
Maintenance
Regarding the product
Before performing maintenance on the product, be sure to turn off the power for safety and for
protection against malfunction.
Clean the product using a dry and soft cloth.
If the stain is hard, soak the cloth with water or detergent, wring well and wipe. If you use
detergent, wipe off the detergent with a cloth that is soaked in just water and wrung well.
■
Notice for Use
- When carrying or storing the product, always use a carrying case.
- Before shooting important subjects, take test shots to obtain the desired effect.
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■
Regular Maintenance Recommended
This product includes parts that wear out and have a limited life even in proper use or storage. Therefore, regular maintenance is
recommended to extend the life and safe use of this product for a long time. Please contact Ikegami's sales and service centers for
the regular maintenance and repair of our products.

ix
HDK-73 1707 VER1 (E)
HO TO RE D THE OPER TION M NU
HOW TO READ THE OPERATION MANUAL
This page explains general notes on reading the HDK-73 Operation Manual, and the symbols and notations used in the manual.
■
Notes on the Manual
- This manual is written for readers with a basic knowledge of handling broadcast cameras.
- The contents of this manual are subject to change without notice in the future.
■
Symbols
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CAUTION: Things you have to be careful during operation. Be sure to read.
Note: Supplementary information or guidance
Reference: Sections where related information is available
Term: Explains the meaning of a term you need to know.
■
Notations
The following notations are used in this manual.
This product, camera ,QGLFDWHV+'.,QFOXGLQJ)$
BS Indicates BSF-55 Base Station.
OCP Basically indicates OCP-300 Operation Control Panel.
MCP Basically indicates MCP-300 Maintenance Control Panel.
" " - " " - " " Indicates the items enclosed by double quotes (") are to be
VHOHFWHGDQGFRQ¿UPHGLQWKHRUGHUVKRZQ
■
Illustrations and Displays
The illustrations and displays in the text are provided for explanation and may be slightly different from the actual equipment or
image.
■
Related Manuals
- BSF-55 Base Station Operation Manual
- OCP-300 Operation Control Panel Operation Manual
- MCP-300 Maintenance Control Panel Operation Manual
- BSH-300 Base Station Hub Setup Manual

xHDK-73 1707 VER1 (E)
HO TO RE D THE OPER TION M NU
■
Structure of Operation Manual
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The Operation Manual consists of seven chapters. By reading it in sequence, you can smoothly perform a series of steps, from
connection to operation. Furthermore, by combination use of BSF-55 (base station), this product enables not only stand-alone VTR
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manuals such as for the BSF-55.
Chapter 1 OUTLINE
Explains the features and the main operating systems of this product.
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chapter.
Chapter 2 NAME and FUNCTION
Explains the name and function of each part of the Camera.
Chapter 3 INSTALLATION and CONNECTION
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Taking examples of studio shooting, stand-alone shooting, and VTR location shooting, explains
how to connect this product to the peripheral equipment.
Chapter 4 OPERATION
Explains setup before shooting.
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normally.
Chapter 5 CAMERA SETTINGS and ADJUSTMENT
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expressions through the menu window. This chapter explains switch settings, menu settings, and
DIP switch settings on the modules inside of the Camera.
Chapter 6 TROUBLE SHOOTING and MAINTENANCE
When the alarm lamp lights during the operation of this product, read here to know the problem.
This chapter also explains the regular maintenance such as cleaning of connectors and resetting
of breaker.
Chapter 7 SPECIFICATIONS
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CHANGING INFORMATION
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xi
HDK-73 1707 VER1 (E)
CONTENTS
HDK-73
(FA-55)
High Definition Camera System
Operation Manual
PRODUCTS CONFORMING TO RoHS DIRECTIVE . . . i
MAINTENANCE OF PRODUCTS CONFORMING TO
RoHSDIRECTIVE..............................ii
INFORMATIONTOTHEUSER ..................iii
SAFETYPRECAUTIONS.......................iv
HOWTOREADTHEOPERATIONMANUAL.......ix
Chapter 1. OUTLINE
1.1 FeaturesofThisProduct................ 3
Fusion of High Quality CMOS and Superb
ImageProcessingTechniques............ 3
Powerful Support for Various Video
Expressions.......................... 3
Pursuit for Superb Operation and Ease of Use .. 4
Peripheral Equipment Supporting a Wide
RangeofApplications .................. 4
Equipped with Various Interfaces ......... 4
SupportFunctionforCameraSetup ....... 4
1.2 Operating Systems..................... 5
1.3 ConnectionDiagram ................... 9
Chapter 2. NAME and FUNCTION
2.1 Camera and Viewfinder................ 13
CameraRightView ................... 13
CameraLeftView..................... 17
CameraFrontView ................... 19
CameraRearView.................... 21
Viewfinder(VFL200HD)................ 25
2.2 Displays in the Viewfinder.............. 27
LEDIndicator........................ 27
Center Marker, Safety Marker,
FrameMarker........................ 27
ZebraIndicator....................... 27
SideMaskFunction................... 28
DisplayMode........................ 28
ViewfinderDisplay.................... 28
Chapter 3.
INSTALLATION and CONNECTION
3.1 Preparation.......................... 33
PrecautiononProductUse ............. 33
MakesurethePowerSwitchisOFF ...... 33
Connection Examples for Each
OperatingSystem .................... 33
3.2 Camera and Peripheral Installation and
Connection.......................... 39
Mounting/Removing the Camera on/from
theTripod........................... 39
MountingandRemovingtheLens........ 41
Mounting and Removing the Viewfinder ... 43
AttachingaMicrophone................ 45
ConnectingaHeadset................. 46
AttachingtheShoulderBelt............. 46
3.3 PowerConnection.................... 47
PowerSupplyfromACAdapter.......... 47
PowerSupplyfromBS................. 48
3.4 MonitorConnection................... 51
ConnectingCameraandMonitor......... 51
3.5 BSConnection....................... 52
ConnectingCameraandBS ............ 52
Chapter 4. OPERATION
4.1 OperatingProcedures................. 57
4.2 SwitchPositionCheck................. 58
4.3 TurningONPower.................... 60
PowerSupplyfromACAdapter.......... 60
PowerSupplyfromBS................. 60
4.4 ViewfinderAdjustment................. 62
Diopter Adjustment and Screen Adjustment . . 62
DisplayModeCheck .................. 62
4.5 OutputSignalCheck .................. 63
Color-BarSignalCheck................ 63
TestPulse(CALSignal)Check.......... 64
ExternalChartCheck.................. 64
4.6 AutoSetup.......................... 65
AutoWhiteBalance................... 66
AutoBlackBalance ................... 67
4.7 Preparation for Shooting in Particular
Environments........................ 68
Chapter 5.
CAMERA SETTINGS and
ADJUSTMENT
5.1 Settings Using Switches on the Camera . . . 71
AdjustingHeadsetVolume.............. 71
SelectingShutterSpeed ............... 72
Enhancing the Vertical Resolution
(Super-VFunction).....................74
SwitchingtheGAIN ................... 75
Allocating Functions to the P.FUNC Switch .. 76

xii HDK-73 1707 VER1 (E)
CONTENTS
ScreenDetailEnhancement(DTL) ....... 77
5.2 SettingsfromtheMenu................ 78
BasicOperationoftheMenu............ 78
Menu Configurationandcontent......... 81
5.3 UsingtheMemoryCard............... 100
Chapter 6.
TROUBLE SHOOTING and
MAINTENANCE
6.1 Alarm Lamp on the OCP or MCP Flashes
ONandOFF........................ 107
6.2 "TEMP!!" or "FAN!!" Appears on the
VFScreen ......................... 108
6.3 InitializingtheSettingsofthisProduct.... 109
6.4 CleaningCameraConnectors...........111
6.5 ResettheBreaker ....................115
6.6 Sensordefectcorrection ...............116
Chapter 7. SPECIFICATIONS
7.1 HDK-73 Specifications.................119
7.2 ExternalDimensionsDiagram...........121
7.3 ExternalConnections................. 125
7.4 SceneFile ......................... 137
CHANGINGINFORMATION....................139

1
OUTLINE

1
OUT INE
3
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possible to create images from natural and delicate to bold and colorful with image effects
meeting the producer’s requirements.
The image for VF (View Finder) is equipped with a new image processing circuit (focus
assist function) and supports the focusing operation of the camera operator.
1.1 Features of This Product
Fusion of High Quality CMOS and Superb Image Processing Techniques
■
2.6 Million pixel 3CMOS
2.6 million pixel 2/3-inch CMOS sensors are employed to achieve superb picture quality
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resolution 1,000 TV lines and S/N ratio of 60dB (typ.) in an HDTV system.
Powerful Support for Various Video Expressions
■
Dockable camera style compliant with Unicam HD Series
Fiber adapters and triax adapter can be easily replaced depending on the operation mode.
■
Focus Assist Function
We installed a new image processing circuit for the image for the VF to support focusing by
the camera operator.
■
Lens Aberration Correction Function
The camera acquires correction data from the corresponding lens and automatically
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Supports current 2/3-inch analog I / F lens and serial I / F lens
With both conventional lenses and serial I / F lenses, it provides the same operational
control,including automatic recognition for serial lenses.
■
Advanced Matrix Function
It is possible to perform the appropriate color conversion under special circumstances, for
example, under monochromatic blue light source such as on a concert stage, for which the
color conversion range was exceeded for the conventional matrix function.
■
HDR (High Dynamic Range) Output Function
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conventional HD cameras.
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Wide Color Gamut (equivalent to ITU-R BT.2020)
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Pursuit for Superb Operation and Ease of Use
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Rotating Camera Cable Connection
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Peripheral Equipment Supporting a Wide Range of Applications
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