Infineon CYSBSYS-RP01 User manual

Preliminary Datasheet Please read the Important Notice and Warnings at the end of this document 002-29368 Rev. *C
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CYSBSYS-RP01
Rapid IoT Connect System on Module
Dual band Wi-Fi and Bluetooth®
Description
CYSBSYS-RP01 Rapid IoT Connect System on Module (SoM) is the easiest way to provide a secure, scalable, and
reliable connection from your device to your cloud. CYSBSYS-RP01 is a pre-certified 802.11ac-friendly dual-band
(2.4 and 5.0 GHz) Wi-Fi and Bluetooth®5.0-compliant combo radio module. The module includes a PSoC®6 MCU
with an Arm®Cortex®-M4F CPU, and Cortex-M0+ CPU, a single-chip radio, on-board crystals, oscillators, chip
antenna, and passive components. CYSBSYS-RP01 provides up to 51 I/Os in a 26.59 x 14.0 x 2.5 mm castellated
surface-mount PCB for easy manufacturing. CYSBSYS-RP01 is the fastest way to deploy a secure and reliable
network of IoT devices.
Features
•Dual-corePSoC
®microcontroller
- 150-MHz Arm®Cortex®-M4F
- 100-MHz Cortex-M0+
- 2048-KB Application flash
- 1024-KB SRAM
•Wi-FiandBluetooth
®5.0 combo radio
- Dual band 2.4 and 5 GHz support
- Simultaneous Wi-Fi and Bluetooth®operation
- 801.11ac-friendly, MCS8 (256-QAM) for 20 MHz channels
- Full IEEE 802.11 a/b/g/n compatibility
-Bluetooth
®5.0 compliant
- 2 Mbps data rate for Bluetooth®Low Energy
• On-board chip antenna
• Certified to FCC, ISED and CE regulations
• 51 programmable GPIOs
• 73-pin 0.8 mm pitch castellated solder pads SMD package
• Industrial temperature range: -20 °C to 70 °C
• Size: 26.59 mm x 14 mm x 2.5 mm (L x W x H)
•Weight:2gm
• Pb-free, Halogen-free and RoHS-compliant

Preliminary Datasheet 2 of 32 002-29368 Rev. *C
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Rapid IoT Connect System on Module
Dual band Wi-Fi and Bluetooth®
Table of contents
Table of contents
Description .......................................................................................................................................1
Features ...........................................................................................................................................1
Table of Contents ..............................................................................................................................2
Overview..........................................................................................................................................4
Functional block diagram ............................................................................................................................................4
PSoC® 6 MCU..................................................................................................................................................................4
Dual-band 802.11ac-friendly Radio with Bluetooth®5.0 ............................................................................................5
Crystal and oscillators ..................................................................................................................................................5
Chip antenna for Wi-Fi and Bluetooth®...................................................................................................................................................... 5
CAPSENSE®external modulation and integration capacitors....................................................................................5
System Connections ..........................................................................................................................6
Power supply connections and recommended external components......................................................................6
External reset (XRES) ....................................................................................................................................................6
Recommended host PCB layout ..................................................................................................................................7
Pin information.................................................................................................................................8
Castellated pads layout................................................................................................................................................8
Castellated pads pin description ...............................................................................................................................10
Electrical specifications ...................................................................................................................17
Absolute maximum ratings ........................................................................................................................................17
Recommended operating conditions........................................................................................................................18
DC specifications ........................................................................................................................................................18
GPIO DC specifications ...............................................................................................................................................18
External ECO specification .........................................................................................................................................18
RF parameters.............................................................................................................................................................19
Wi-Fi radio ...................................................................................................................................................................19
Bluetooth®and Bluetooth®LE....................................................................................................................................19
Power consumption ...................................................................................................................................................20
2.4 GHz WLAN current consumption..........................................................................................................................20
5 GHz WLAN current consumption.............................................................................................................................20
Bluetooth®and Bluetooth®LE current consumption................................................................................................20
Environmental specifications ...........................................................................................................21
RF certification............................................................................................................................................................21
Environmental conditions..........................................................................................................................................21
ESD and EMI protection..............................................................................................................................................21
Regulatory information ...................................................................................................................22
FCC...............................................................................................................................................................................22
FCC NOTICE.................................................................................................................................................................22
CAUTION......................................................................................................................................................................22
LABELING REQUIREMENTS.........................................................................................................................................22
ANTENNA WARNING....................................................................................................................................................22
RF EXPOSURE..............................................................................................................................................................22
ISED .............................................................................................................................................................................23
ISED NOTICE................................................................................................................................................................23
ISED INTERFERENCE STATEMENT FOR CANADA.......................................................................................................23
ISED RADIATION EXPOSURE STATEMENT FOR CANADA...........................................................................................23
LABELING REQUIREMENTS.........................................................................................................................................23
European declaration of conformity .........................................................................................................................24
Packaging.......................................................................................................................................25
Mechanical dimensions....................................................................................................................27
Ordering information ......................................................................................................................28
Part numbering convention.......................................................................................................................................28

Preliminary Datasheet 3 of 32 002-29368 Rev. *C
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Rapid IoT Connect System on Module
Dual band Wi-Fi and Bluetooth®
Table of contents
Acronyms .......................................................................................................................................29
Document conventions ....................................................................................................................30
Revision history ..............................................................................................................................31

Preliminary Datasheet 4 of 32 002-29368 Rev. *C
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Rapid IoT Connect System on Module
Dual band Wi-Fi and Bluetooth®
Overview
Overview
Functional block diagram
Figure 1 Functional Block Diagram
CYSBSYS-RP01 provides GPIO of PSoC®6 MCU via castellated solder pads. It has on-board connection between
PSoC®6 MCU and single-chip, ultra-low-power, IEEE 802.11n-compliant, IEEE 802.11ac-friendly Wi-Fi with
integrated Bluetooth®5.0 radio.
CYSBSYS-RP01 has an on-board dual-band chip antenna for Wi-Fi and Bluetooth®. CYSBSYS-RP01 has an
on-board 32-kHz oscillator for the WCO of PSoC®6 MCU and the radio Wi-Fi sleep clock. It has the modulation and
integration capacitors required for capacitive sensing. Furthermore, it has the diplexer and RF switches required
for RF functionality.
CYSBSYS-RP01 is a complete hardware solution designed to be soldered to the applications main board. It
provides a certified system for customers to design their end solutions.
There are five major subsystems:
•PSoC
®6 MCU
• Single-chip, ultra-low-power, IEEE 802.11n-compliant, IEEE 802.11ac-friendly Wi-Fi with Integrated Bluetooth®
5.0 radio
• Crystal and oscillators
• Chip antenna for Wi-Fi and Bluetooth®
•CAPSENSE
®external modulation and integration capacitors and other passives like bypass capacitors and
limiting resistors.
PSoC® 6 MCU
The PSoC®6 MCU product family, based on an ultra-low-power 40-nm platform, is a combination of a microcon-
troller with low-power flash technology and digital programmable logic, high-performance analog-to-digital and
digital-to-analog conversion, low-power comparators, and standard communication and timing peripherals.
Dual‐Band
Radio
PSoC6MCU
32kHz
Oscillator
RF
Matching
Network
SDIO(6I/Os)/UART(4I/Os)/
Control (6I/Os)
54I/Os
XRES
1.8‐3.3V
1.8‐3.3V
1.8V/2.5V
VDDUSB
VDDA,VDDIO1
VDDIO0 3.6V
1.8V
VBAT
VDDIO
SDIO,UART,
Control
2GSP3T
5GSP3T
Diplexer
UMC
Connector
CMOD
CINT
2GTX
2GRX
BT
5GTX
5GRX
2G
5G
ANT
1.8V
VDD_NS,VDDD,
VDDIO2,VBACKUP
Powerand
PSoCIOs
 (0.8mm
castel latedp ads)

Preliminary Datasheet 5 of 32 002-29368 Rev. *C
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Rapid IoT Connect System on Module
Dual band Wi-Fi and Bluetooth®
Overview
Figure 2 Key components
Dual-band 802.11ac-friendly radio with Bluetooth®5.0
This radio is purpose-built for IoT applications. This radio is a 28-nm, ultra-low-power device that integrates a
single-stream, dual band IEEE 802.11n-compliant, IEEE 802.11ac-friendly Wi-Fi sub-system, a Bluetooth®
5.0-compliant Bluetooth®sub-system, and an advanced coexistence engine for maximum combined perfor-
mance. The 28-nm architecture enables dual band 802.11ac-friendly with Bluetooth®5.0 radio to offer
best-in-class power consumption in active and power saving modes. 802.11ac-friendliness enables the radio to
guarantee superior performance in terms of throughput and power consumption compared to 802.11n products
when operating in 802.11ac networks.
Crystal and oscillators
The CYSBSYS-RP01 system has an on-board 32.768-kHz oscillator shared between PSoC® 6 MCU and the radio.
The 32.768-kHz oscillator is used by PSoC®6 MCU for the WCO block for Deep sleep operation for low-power-mode
timing.
Chip antenna for Wi-Fi and Bluetooth®
The system has an ultra-miniature chip antenna that supports 5-GHz and 2.4-GHz bands. The selected antenna
has an efficiency of up to 51% at 2.4 GHz at 48% for 5 GHz. See System connections for optimal placement of the
CYSBSYS-RP01 board, and antenna efficiency details for different host board layouts.
CAPSENSE®external modulation and integration capacitors
To enable CAPSENSE®use cases on end applications, PSoC®6 MCU requires an external CMOD capacitor
(modulator capacitor) for self-capacitance sensing, and CINTA and CINTB (integration capacitors) for mutual
capacitance sensing. These external capacitors are connected between a dedicated GPIO pin and ground.
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Preliminary Datasheet 6 of 32 002-29368 Rev. *C
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Rapid IoT Connect System on Module
Dual band Wi-Fi and Bluetooth®
System connections
System connections
Power supply connections and recommended external components
Figure 3 shows the general requirements for power pins on CYSBSYS-RP01. See the DC Specifications table for
details on the entire range of supported voltage for each power pins.
Figure 3 Board power pad connections
Bypass capacitors must be used from VBAT_WL, VDDD, and VDDA to ground and wherever indicated in the
diagram. Typical practice for systems in this frequency range is to use a capacitor in the 10-µF range. A parallel
smaller capacitor for each domain is provided on the CYSBSYS-RP01 board. Note that these are rules of thumb:
for critical applications, the PCB layout, lead inductance, and the bypass capacitor parasitic should be simulated
to design and obtain optimal bypassing. All capacitors should be ±20%, X5R ceramic or better.
Power supplies and ports correspond as follows:
•P0:VBACKUP
• P5, P6, P7, P8: VDDIO1
• P9, P10: VDDA
• P11, P12, P13: VDDIO0
• P14: VDDUSB
External reset (XRES)
CYSBSYS-RP01 has an integrated power-on reset circuit, which completely resets all circuits to a known power
on state. This action can also be evoked by an external reset signal, forcing it into a power-on reset state. The
XRES signal is an active LOW signal, which is an input to the CYSBSYS-RP01 (ad 49). The CYSBSYS-RP01 module
does not require an external pull-up resistor on the XRES input.
Power
1.8V
1.8V
1.8V~3.3V
3.6V~4.2V
1.8V
GND
1.8V
1.8V~3.3V
1.8V~3.3V
GND
GND
GND
GND
GND
GND
GND
CYSBSYS-RP01
U1A
VBAT_WL1 22
VBAT_WL2 23
VDDIO_WL 25
GND1 1
GND2 2
GND3 3
GND4 4
GND5 5
GND6 6
GND7 14
GND8 24
GND9 37
GND10 51
GND11 59
GND12 73
VDDD
50
VDDA
65
VBACKUP
56
VDDIO0
55
VDDIO1
67
VDDUSB
54
C7
1uF
16V
C6
1uF
16V
C2
10uF
16V
C1
10uF
16V
C3
10uF
16V
C5
1uF
16V
C4
10uF
16V

Preliminary Datasheet 7 of 32 002-29368 Rev. *C
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Rapid IoT Connect System on Module
Dual band Wi-Fi and Bluetooth®
System connections
Recommended host PCB layout
Figure 4 provides details that can be used for the recommended host PCB layout pattern for CYSBSYS-RP01.
Dimensions are in millimeters unless otherwise noted. Pad length of 1.02 mm as shown in Figure 4 is the
minimum recommended host pad length. All dimensions are referenced to the center of the solder pad.
To maximize performance, the host layout should follow these recommendations:
• The ideal placementof the CYSBSYS-RP01 board is in acorner of the host board with the antenna located outside
the edge of the host board. This placement minimizes the additional recommended keep out area stated in
item 3.
• To maximize RF performance, the area immediately around the system antenna should contain a keep out area,
where no grounding or signal traces are contained. This keep out area applies to all layers of the host board.
The recommended dimensions of the host PCB keep out area are shown in Figure 4.
• If fanout of traces are done under the board, care should be taken to fill the used area under the board with
copper plane to avoid any unbalanced surface that may lead to an assembly issue.
• No metal should be located beneath or above the antenna area. Only bare PCB material should be located
beneath the antenna area.
Figure 4 Board land pattern on host PCB (Top view seen on host PCB)
HostLandPattern(ViewfromTop)
RecommendedHostPCBKeepOutArea
Paddimensions
1.20
0.40
LandPattern
SolderMask
SolderPaste
Don tputanymetalobjectsorbatteries(ifapplicable)
aboveorbelowtheyellowregion.
Keepawayanyothermetalsfromclearancearea,
includinggroundplane
FlushtheantennasidePCBedgetohostPCBedge
foroptimalperformance
0.80
14.38
24.13
3.66
2.53
5.06
ANTENNA
AREA
2.53
1.20
1.20
1
0.50
0.60
1.30
15.20
27.79
ANTENNAAREA
1.53
1.53
20.80
12.80
13.18
8.00

Preliminary Datasheet 8 of 32 002-29368 Rev. *C
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Rapid IoT Connect System on Module
Dual band Wi-Fi and Bluetooth®
Pin information
Pin information
Castellated pads layout
Figure 5 Module pad layout
Table 1 Pin information
Pad number Pad name
1GND
2GND
3GND
4GND
5GND
6GND
7P11_7
8P11_3
9P11_5
10 P11_4
11 P11_6
12 P11_2
13 P11_1
14 GND
15 P5_5
16 P6_0
17 P6_1
18 P5_4
19 P5_1
U1
U2
U3
L1
Y2
GND
GND
GND
GND
GND
P0_4
USBDM
P10_3
P6_4
P10_4
P6_5
P10_5
P6_6
P10_6
P6_7
P10_7
P10_2
USBDP
P10_1 P11_0
VDDUSB
VDDIO0
VDDIO1
VBACKUP
VDDD
GND
GND
VDDA
XRES_L
GND
GND
VBAT_WL
VBAT_WL
GND
GND
GND
P11_7
P12_7
P10_0
P11_6
P12_6
P11_5
P11_4
P11_3
P11_2
P8_4
P11_1
P8_3 P8_2 P0_5
P5_7
P8_1
P5_6
P8_0
P5_5
P7_3
P5_4
P7_0
P5_3
P5_2
P6_3
P9_7
P5_1
P9_4
P5_0
P9_3
P9_2
P6_1
P9_1
P6_0
P9_0
P6_2
Y1
J1
A1
U5
L5
VDDIO2

Preliminary Datasheet 9 of 32 002-29368 Rev. *C
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Rapid IoT Connect System on Module
Dual band Wi-Fi and Bluetooth®
Pin information
20 P5_0
21 P5_2
22 VBAT_WL
23 VBAT_WL
24 GND
25 VDDIO_WL
26 P5_7
27 P5_3
28 P5_6
29 P8_4
30 P8_0
31 P8_3
32 P8_2
33 P8_1
34 P7_3
35 P0_4
36 P0_5
37 GND
38 P6_3
39 P6_2
40 P11_0
41 P10_0
42 P10_1
43 P10_2
44 P10_3
45 P10_4
46 P10_7
47 P10_5
48 P10_6
49 XRES_L
50 VDDD
51 GND
52 USBDP
53 USBDM
54 VDDUSB
55 VDDIO0
56 VBACKUP
57 P12_7
58 P12_6
59 GND
Table 1 Pin information
Pad number Pad name

Preliminary Datasheet 10 of 32 002-29368 Rev. *C
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Rapid IoT Connect System on Module
Dual band Wi-Fi and Bluetooth®
Pin information
Castellated pads pin description
Figure 6 Castellated pads pinout
60 P9_2
61 P9_7
62 P9_4
63 P9_0
64 P9_3
65 VDDA
66 P9_1
67 VDDIO1
68 P6_4
69 P6_7
70 P6_5
71 P6_6
72 P7_0
73 GND
Table 1 Pin information
Pad number Pad name
MCU IOs
U1B
CYSBSYS-RP01
P0_4
35
P0_5
36
P5_0
20
P5_1
19
P5_2
21
P5_3
27
P5_4
18
P5_5
15
P5_6
28
P5_7
26
P6_0
16
P6_1
17
P6_4
68
P6_5
70
P6_6
71
P6_7
69
P7_0
72
P9_0
63
P9_1
66
P9_2
60
P9_3
64
P9_4
62
P9_7
61
P12_6
58
P12_7
57
XRES_L 49
P10_0 41
P10_1 42
P10_2 43
P10_3 44
P10_4 45
P10_5 47
P10_6 48
P10_7 46
P6_3 38
P6_2 39
P11_0 40
P11_1 13
P11_2 12
P11_3 8
P11_4 10
P11_5 9
P11_6 11
P11_7 7
P7_3 34
P8_0 30
P8_1 33
P8_2 32
P8_3 31
P8_4 29
USBDM 53
USBDP 52

Preliminary Datasheet 11 of 32 002-29368 Rev. *C
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restricted Rapid IoT Connect System on Module Dual band Wi-Fi and Bluetooth®
Pin information
Each port pin has multiple alternate functions. These are defined in the table below. The columns ACT #x and DS #y denote active (System LP/ULP) and
deep sleep mode signals respectively.
Port.
Pin Act #0 Act #1 Act #2 Act #3
DS
#2
DS
#3
Act
#4
Act
#5 Act #6
Act
#7 Act #8
Act
#9
Act
#10
Act
#12
Act
#13
Act
#14
Act
#15 DS #5
DS
#6
P0.4 tcpwm[0]
.line[2]:0
tcpwm[1
].line[2]:0
csd.cs
d_tx:4
csd.csd_
tx_n:4
scb[0].u
art_rts:0
scb[0].spi
_clk:0
peri.tr
_io_ou
tput[0]
:2
P0.5 tcpwm[0]
.line_-
compl[2]:
0
tcpwm[1
].line_-
compl[2]
:0
csd.cs
d_tx:5
csd.csd_
tx_n:5
srss.e
xt_cl
k:1
scb[0].u
art_cts:
0
scb[0].spi
_select0:0
peri.tr
_io_ou
tput[1]
:2
P5.0 tcpwm[0]
.line[4]:0
tcpwm[1
].line[4]:0
csd.cs
d_tx:3
0
csd.csd_
tx_n:30
scb[5].u
art_rx:0
scb[5].
i2c_scl
:0
scb[5].spi
_mosi:0
audios
s[0].clk
_i2s_if:
0
peri.tr
_io_in
put[10]
:0
P5.1 tcpwm[0]
.line_-
compl[4]:
0
tcpwm[1
].line_-
compl[4]
:0
csd.cs
d_tx:3
1
csd.csd_
tx_n:31
scb[5].u
art_tx:0
scb[5].
i2c_sd
a:0
scb[5].spi
_miso:0
audios
s[0].tx
_sck:0
peri.tr
_io_in
put[11]
:0
P5.2 tcpwm[0]
.line[5]:0
tcpwm[1
].line[5]:0
csd.cs
d_tx:3
2
csd.csd_
tx_n:32
scb[5].u
art_rts:0
scb[5].spi
_clk:0
audios
s[0].tx
_ws:0
P5.3 tcpwm[0]
.line_-
compl[5]:
0
tcpwm[1
].line_-
compl[5]
:0
csd.cs
d_tx:3
3
csd.csd_
tx_n:33
scb[5].u
art_cts:
0
scb[5].spi
_select0:0
audios
s[0].tx
_sdo:0
P5.4 tcpwm[0]
.line[6]:0
tcpwm[1
].line[6]:0
csd.cs
d_tx:3
4
csd.csd_
tx_n:34
scb[10].
uart_rx:
0
scb[10
].i2c_s
cl:0
scb[5].spi
_select1:0
audios
s[0].rx
_sck:0
P5.5 tcpwm[0]
.line_-
compl[6]:
0
tcpwm[1
].line_-
compl[6]
:0
csd.cs
d_tx:3
5
csd.csd_
tx_n:35
scb[10].
uart_tx:
0
scb[10
].i2c_s
da:0
scb[5].spi
_select2:0
audios
s[0].rx
_ws:0
P5.6 tcpwm[0]
.line[7]:0
tcpwm[1
].line[7]:0
csd.cs
d_tx:3
6
csd.csd_
tx_n:36
scb[10].
uart_rts:
0
scb[5].spi
_select3:0
audios
s[0].rx
_sdi:0

Preliminary Datasheet 12 of 32 002-29368 Rev. *C
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restricted Rapid IoT Connect System on Module Dual band Wi-Fi and Bluetooth®
Pin information
P5.7 tcpwm[0]
.line_-
compl[7]:
0
tcpwm[1
].line_-
compl[7]
:0
csd.cs
d_tx:3
7
csd.csd_
tx_n:37
scb[10].
uart_cts
:0
scb[3].spi
_select3:0
P6.0 tcpwm[0]
.line[0]:1
tcpwm[1
].line[8]:0
csd.cs
d_tx:3
8
csd.csd_
tx_n:38
scb[8]
.i2c_s
cl:0
scb[3].u
art_rx:0
scb[3].
i2c_scl
:0
scb[3].spi
_mosi:0
cpuss.f
ault_o
ut[0]
scb[8
].spi_
mosi:
0
P6.1 tcpwm[0]
.line_-
compl[0]:
1
tcpwm[1
].line_-
compl[8]
:0
csd.cs
d_tx:3
9
csd.csd_
tx_n:39
scb[8]
.i2c_s
da:0
scb[3].u
art_tx:0
scb[3].
i2c_sd
a:0
scb[3].spi
_miso:0
cpuss.f
ault_o
ut[1]
scb[8
].spi_
miso:
0
P6.2 tcpwm[0]
.line[1]:1
tcpwm[1
].line[9]:0
csd.cs
d_tx:4
0
csd.csd_
tx_n:40
scb[3].u
art_rts:0
scb[3].spi
_clk:0
scb[8
].spi_
clk:0
P6.3 tcpwm[0]
.line_-
compl[1]:
1
tcpwm[1
].line_-
compl[9]
:0
csd.cs
d_tx:4
1
csd.csd_
tx_n:41
scb[3].u
art_cts:
0
scb[3].spi
_select0:0
scb[8
].spi_
selec
t0:0
P6.4 tcpwm[0]
.line[2]:1
tcpwm[1
].line[10]:
0
csd.cs
d_tx:4
2
csd.csd_
tx_n:42
scb[8]
.i2c_s
cl:1
scb[6].u
art_rx:2
scb[6].
i2c_scl
:2
scb[6].spi
_mosi:2
peri.tr
_io_in
put[12]
:0
peri.tr
_io_ou
tput[0]
:1
cpuss.
swj_s
wo_td
o
scb[8
].spi_
mosi:
1
P6.5 tcpwm[0]
.line_-
compl[2]:
1
tcpwm[1
].line_-
compl[10
]:0
csd.cs
d_tx:4
3
csd.csd_
tx_n:43
scb[8]
.i2c_s
da:1
scb[6].u
art_tx:2
scb[6].
i2c_sd
a:2
scb[6].spi
_miso:2
peri.tr
_io_in
put[13]
:0
peri.tr
_io_ou
tput[1]
:1
cpuss.
swj_s
wdoe_
tdi
scb[8
].spi_
miso:
1
P6.6 tcpwm[0]
.line[3]:1
tcpwm[1
].line[11]:
0
csd.cs
d_tx:4
4
csd.csd_
tx_n:44
scb[6].u
art_rts:2
scb[6].spi
_clk:2
cpuss.
swj_s
wdio_t
ms
scb[8
].spi_
clk:1
P6.7 tcpwm[0]
.line_-
compl[3]:
1
tcpwm[1
].line_-
compl[11
]:0
csd.cs
d_tx:4
5
csd.csd_
tx_n:45
scb[6].u
art_cts:
2
scb[6].spi
_select0:2
cpuss.
swj_s
wclk_t
clk
scb[8
].spi_
selec
t0:1
Port.
Pin Act #0 Act #1 Act #2 Act #3
DS
#2
DS
#3
Act
#4
Act
#5 Act #6
Act
#7 Act #8
Act
#9
Act
#10
Act
#12
Act
#13
Act
#14
Act
#15 DS #5
DS
#6

Preliminary Datasheet 13 of 32 002-29368 Rev. *C
2021-08-02
restricted Rapid IoT Connect System on Module Dual band Wi-Fi and Bluetooth®
Pin information
P7.0 tcpwm[0]
.line[4]:1
tcpwm[1
].line[12]:
0
csd.cs
d_tx:4
6
csd.csd_
tx_n:46
scb[4].u
art_rx:1
scb[4].
i2c_scl
:1
scb[4].spi
_mosi:1
peri.tr
_io_in
put[14]
:0
cpuss.t
race_-
clock
P7.3 tcpwm[0]
.line_-
compl[5]:
1
tcpwm[1
].line_-
compl[13
]:0
csd.cs
d_tx:4
9
csd.csd_
tx_n:49
scb[4].u
art_cts:
1
scb[4].spi
_select0:1
P8.0 tcpwm[0]
.line[0]:2
tcpwm[1
].line[16]:
0
csd.cs
d_tx:5
4
csd.csd_
tx_n:54
scb[4].u
art_rx:0
scb[4].
i2c_scl
:0
scb[4].spi
_mosi:0
peri.tr
_io_in
put[16]
:0
P8.1 tcpwm[0]
.line_-
compl[0]:
2
tcpwm[1
].line_-
compl[16
]:0
csd.cs
d_tx:5
5
csd.csd_
tx_n:55
scb[4].u
art_tx:0
scb[4].
i2c_sd
a:0
scb[4].spi
_miso:0
peri.tr
_io_in
put[17]
:0
P8.2 tcpwm[0]
.line[1]:2
tcpwm[1
].line[17]:
0
csd.cs
d_tx:5
6
csd.csd_
tx_n:56
lpcom
p.dsi_
comp
0:0
scb[4].u
art_rts:0
scb[4].spi
_clk:0
P8.3 tcpwm[0]
.line_-
compl[1]:
2
tcpwm[1
].line_-
compl[17
]:0
csd.cs
d_tx:5
7
csd.csd_
tx_n:57
lpcom
p.dsi_
comp
1:0
scb[4].u
art_cts:
0
scb[4].spi
_select0:0
P8.4 tcpwm[0]
.line[2]:2
tcpwm[1
].line[18]:
0
csd.cs
d_tx:5
8
csd.csd_
tx_n:58
scb[11].
uart_rx:
0
scb[11
].i2c_s
cl:0
scb[4].spi
_select1:0
P9.0 tcpwm[0]
.line[4]:2
tcpwm[1
].line[20]:
0
csd.cs
d_tx:6
2
csd.csd_
tx_n:62
scb[2].u
art_rx:0
scb[2].
i2c_scl
:0
scb[2].spi
_mosi:0
audios
s[0].clk
_i2s_if:
1
peri.tr
_io_in
put[18]
:0
cpus
s.tra
ce_d
ata[
3]:0
Port.
Pin Act #0 Act #1 Act #2 Act #3
DS
#2
DS
#3
Act
#4
Act
#5 Act #6
Act
#7 Act #8
Act
#9
Act
#10
Act
#12
Act
#13
Act
#14
Act
#15 DS #5
DS
#6

Preliminary Datasheet 14 of 32 002-29368 Rev. *C
2021-08-02
restricted Rapid IoT Connect System on Module Dual band Wi-Fi and Bluetooth®
Pin information
P9.1 tcpwm[0]
.line_-
compl[4]:
2
tcpwm[1
].line_-
compl[20
]:0
csd.cs
d_tx:6
3
csd.csd_
tx_n:63
scb[2].u
art_tx:0
scb[2].
i2c_sd
a:0
scb[2].spi
_miso:0
audios
s[0].tx
_sck:1
peri.tr
_io_in
put[19]
:0
cpus
s.tra
ce_d
ata[
2]:0
P9.2 tcpwm[0]
.line[5]:2
tcpwm[1
].line[21]:
0
csd.cs
d_tx:6
4
csd.csd_
tx_n:64
scb[2].u
art_rts:0
scb[2].spi
_clk:0
audios
s[0].tx
_ws:1
cpus
s.tra
ce_d
ata[
1]:0
P9.3 tcpwm[0]
.line_-
compl[5]:
2
tcpwm[1
].line_-
compl[21
]:0
csd.cs
d_tx:6
5
csd.csd_
tx_n:65
scb[2].u
art_cts:
0
scb[2].spi
_select0:0
audios
s[0].tx
_sdo:1
cpus
s.tra
ce_d
ata[
0]:0
P9.4 tcpwm[0]
.line[7]:5
tcpwm[1
].line[0]:2
csd.cs
d_tx:6
6
csd.csd_
tx_n:66
scb[2].spi
_select1:0
audios
s[0].rx
_sck:1
P9.7 tcpwm[0]
.line_-
compl[0]:
6
tcpwm[1
].line_-
compl[1]
:2
csd.cs
d_tx:6
9
csd.csd_
tx_n:69
P10.0 tcpwm[0]
.line[6]:2
tcpwm[1
].line[22]:
0
csd.cs
d_tx:7
0
csd.csd_
tx_n:70
scb[1].u
art_rx:1
scb[1].
i2c_scl
:1
scb[1].spi
_mosi:1
peri.tr
_io_in
put[20]
:0
cpus
s.tra
ce_d
ata[
3]:1
P10.1 tcpwm[0]
.line_-
compl[6]:
2
tcpwm[1
].line_-
compl[22
]:0
csd.cs
d_tx:7
1
csd.csd_
tx_n:71
scb[1].u
art_tx:1
scb[1].
i2c_sd
a:1
scb[1].spi
_miso:1
peri.tr
_io_in
put[21]
:0
cpus
s.tra
ce_d
ata[
2]:1
Port.
Pin Act #0 Act #1 Act #2 Act #3
DS
#2
DS
#3
Act
#4
Act
#5 Act #6
Act
#7 Act #8
Act
#9
Act
#10
Act
#12
Act
#13
Act
#14
Act
#15 DS #5
DS
#6

Preliminary Datasheet 15 of 32 002-29368 Rev. *C
2021-08-02
restricted Rapid IoT Connect System on Module Dual band Wi-Fi and Bluetooth®
Pin information
P10.2 tcpwm[0]
.line[7]:2
tcpwm[1
].line[23]:
0
csd.cs
d_tx:7
2
csd.csd_
tx_n:72
scb[1].u
art_rts:1
scb[1].spi
_clk:1
cpus
s.tra
ce_d
ata[
1]:1
P10.3 tcpwm[0]
.line_-
compl[7]:
2
tcpwm[1
].line_-
compl[23
]:0
csd.cs
d_tx:7
3
csd.csd_
tx_n:73
scb[1].u
art_cts:
1
scb[1].spi
_select0:1
cpus
s.tra
ce_d
ata[
0]:1
P10.4 tcpwm[0]
.line[0]:3
tcpwm[1
].line[0]:1
csd.cs
d_tx:7
4
csd.csd_
tx_n:74
scb[1].spi
_select1:1
audio
ss[0].
pdm_
clk:0
P10.5 tcpwm[0]
.line_-
compl[0]:
3
tcpwm[1
].line_-
compl[0]
:1
csd.cs
d_tx:7
5
csd.csd_
tx_n:75
scb[1].spi
_select2:1
audio
ss[0].
pdm_
data:
0
P10.6 tcpwm[0]
.line[1]:6
tcpwm[1
].line[2]:2
csd.cs
d_tx:7
6
csd.csd_
tx_n:76
scb[1].spi
_select3:1
P10.7 tcpwm[0]
.line_-
compl[1]:
6
tcpwm[1
].line_-
compl[2]
:2
csd.cs
d_tx:7
7
csd.csd_
tx_n:77
P11.0 tcpwm[0]
.line[1]:3
tcpwm[1
].line[1]:1
csd.cs
d_tx:7
8
csd.csd_
tx_n:78
smif.s
pi_se-
lect2
scb[5].u
art_rx:1
scb[5].
i2c_scl
:1
scb[5].spi
_mosi:1
audios
s[1].clk
_i2s_if:
1
peri.tr
_io_in
put[22]
:0
P11.1 tcpwm[0]
.line_-
compl[1]:
3
tcpwm[1
].line_-
compl[1]
:1
csd.cs
d_tx:7
9
csd.csd_
tx_n:79
smif.s
pi_se-
lect1
scb[5].u
art_tx:1
scb[5].
i2c_sd
a:1
scb[5].spi
_miso:1
audios
s[1].tx
_sck:1
peri.tr
_io_in
put[23]
:0
Port.
Pin Act #0 Act #1 Act #2 Act #3
DS
#2
DS
#3
Act
#4
Act
#5 Act #6
Act
#7 Act #8
Act
#9
Act
#10
Act
#12
Act
#13
Act
#14
Act
#15 DS #5
DS
#6

Preliminary Datasheet 16 of 32 002-29368 Rev. *C
2021-08-02
restricted Rapid IoT Connect System on Module Dual band Wi-Fi and Bluetooth®
Pin information
P11.2 tcpwm[0]
.line[2]:3
tcpwm[1
].line[2]:1
csd.cs
d_tx:8
0
csd.csd_
tx_n:80
smif.s
pi_se-
lect0
scb[5].u
art_rts:1
scb[5].spi
_clk:1
audios
s[1].tx
_ws:1
P11.3 tcpwm[0]
.line_-
compl[2]:
3
tcpwm[1
].line_-
compl[2]
:1
csd.cs
d_tx:8
1
csd.csd_
tx_n:81
smif.s
pi_dat
a3
scb[5].u
art_cts:
1
scb[5].spi
_select0:1
audios
s[1].tx
_sdo:1
peri.tr
_io_ou
tput[0]
:0
P11.4 tcpwm[0]
.line[3]:3
tcpwm[1
].line[3]:1
csd.cs
d_tx:8
2
csd.csd_
tx_n:82
smif.s
pi_dat
a2
scb[5].spi
_select1:1
audios
s[1].rx
_sck:1
peri.tr
_io_ou
tput[1]
:0
P11.5 tcpwm[0]
.line_-
compl[3]:
3
tcpwm[1
].line_-
compl[3]
:1
csd.cs
d_tx:8
3
csd.csd_
tx_n:83
smif.s
pi_dat
a1
scb[5].spi
_select2:1
audios
s[1].rx
_ws:1
P11.6 csd.cs
d_tx:8
4
csd.csd_
tx_n:84
smif.s
pi_dat
a0
scb[5].spi
_select3:1
audios
s[1].rx
_sdi:1
P11.7 smif.s
pi_clk
P12.6 tcpwm[0]
.line[7]:3
tcpwm[1
].line[7]:1
csd.cs
d_tx:9
1
csd.csd_
tx_n:91
scb[6].spi
_select3:0
sdhc[1
].card_
if_pwr
_en
P12.7 tcpwm[0]
.line_-
compl[7]:
3
tcpwm[1
].line_-
compl[7]
:1
csd.cs
d_tx:9
2
csd.csd_
tx_n:92
sdhc[1
].io_vo
lt_sel
P14.1
P14.0
Port.
Pin Act #0 Act #1 Act #2 Act #3
DS
#2
DS
#3
Act
#4
Act
#5 Act #6
Act
#7 Act #8
Act
#9
Act
#10
Act
#12
Act
#13
Act
#14
Act
#15 DS #5
DS
#6

Preliminary Datasheet 17 of 32 002-29368 Rev. *C
2021-08-02
restricted
Rapid IoT Connect System on Module
Dual band Wi-Fi and Bluetooth®
Electrical specifications
Electrical specifications
Absolute maximum ratings
Usage above the absolute maximum conditions listed in above table may cause permanent damage to the
device. Exposure to absolute maximum conditions for extended periods of time may affect device reliability. The
maximum storage temperature is 150 °C in compliance with JEDEC Standard JESD22-A103, High temperature
storage life.
When used below absolute maximum conditions but above normal operating conditions, the device may not
operate to specification.
Table 2 Absolute maximum ratings
Parameter Description Min Max Units
VBAT_WL DC supply voltage for dual-band 802.11ac-friendly radio with
Bluetooth®5.0, VBAT and PA driver supply
-0.5 +5.0 V
VDDIO_WL DC supply voltage for digital I/O -0.5 +2.20 V
VDDD, VBACKUP,
VDDIO0
Internal regulator and Port 1 GPIO supply for PSoC®6 MCU
Backup power and GPIO Port 0 supply when present
GPIO supply for Ports 11 to 13 when present /
Supply for eFuse programming
-0.5
-0.5
+2.20
+2.62
V
V
VDDA, VDDIO1,
VDDUSB
Analog power supply voltage for PSoC®6 MCU
GPIO supply for Ports 5 to 8 when present
Supply for Port 14 (USB or GPIO) when present
-0.5 +4 V
ESD_HBM Human body model contact discharge per JEDEC EID/JESD22-A114 2200 - V
ESD_CDM Charged device model contact discharge per JEDEC EIA/JESD22-C101 500 8000 V

Preliminary Datasheet 18 of 32 002-29368 Rev. *C
2021-08-02
restricted
Rapid IoT Connect System on Module
Dual band Wi-Fi and Bluetooth®
Electrical specifications
Recommended operating conditions
DC specifications
GPIO DC specifications
External ECO specification
Table 3 DC specifications
Parameter Description Min Typ Max Units
Details /
conditions
VBAT_WL DC supply voltage for dual-band
802.11ac-friendly radio with Bluetooth®5.0,
VBAT and PA driver supply
3.6 3.6 4.2 V
VDDIO_WL DC supply voltage for digital I/O 1.62 1.8 1.98 V
VDDD, VBACKUP,
VDDIO0
Internal regulator and Port 1 GPIO supply
for PSoC®6 MCU
Backup power and GPIO Port 0 supply when
present GPIO supply for Ports 11 to 13 when
present / supply for eFuse Programming
1.7
2.38
1.8
2.5
1.9
2.62
V
V
VDDD and VDDIO0
must be ≤to
VDDIO_WL.
Min. VBACKUP is
1.4 V in Backup
Mode.
VDDA, VDDIO1, Analog power supply voltage for PSoC®6
MCU
GPIO supply for ports 5 to 8 when present
1.8 3.3 3.3 V VDDIO_1 must be
≥to VDDA.
VDDUSB Supply for Port 14 (USB or GPIO) when
present
1.8 3.3 3.3 VMin supply is
2.85 V for USB
Table 4 GPIO DC specifications
Parameter Description Min Max Units
Details /
conditions
VIH Input voltage HIGH threshold 0.7 * VDD - V CMOS input
VIL Input voltage LOW threshold 0.3 * VDD VCMOS input
VOH Output voltage HIGH level VDD – 0.5 V IOH = 8 mA
VOL Output voltage LOW level 0.4 V IOL = 8 mA
ITOT_GPIO Maximum total source or sink chip current 200 mA
Table 5 External PSoC®6 MCU ECO specifications
Parameter Description Min Typ Max Units
F_MHz Crystal frequency range for PSoC®6 MCU 433 33 MHz
Load capacitance Crystal parallel load capacitance - - 18 pF
Drive Level - - 100 µW
Accuracy (±ppm) Frequency stability -20 +20 ppm
ESR Equivalent series resistance 50 200 Ω

Preliminary Datasheet 19 of 32 002-29368 Rev. *C
2021-08-02
restricted
Rapid IoT Connect System on Module
Dual band Wi-Fi and Bluetooth®
Electrical specifications
RF parameters
Wi-Fi radio
Bluetooth®and Bluetooth®LE
Table 6 2.4 GHz parameters
Parameter Condition Min Typ Max Unit
Operating Frequency range - 4900 - 5845 MHz
Transmit Power 11n, MCS7 17 17.5 18 dBm
11a OFDM 18 18.5 18.8 dBm
Receiver Sensitivity 11a, 6 Mbps - -92 - dBm
11a, 54 Mbps - -75 - dBm
11n, HT20, MCS0 - -92 - dBm
11n, HT20, MCS7 - -76 - dBm
11n, HT20, MCS8 - -71 - dBm
Table 7 5 GHz parameters
Parameter Condition Min Typ Max Unit
Operating Frequency range -2400 -2500 MHz
Transmit Power 11n, MCS7 16 17.5 18 dBm
11b DSSS 17 18 18.7 dBm
Receiver Sensitivity 11b, 1 Mbps - -97 - dBm
11b, 11 Mbps - -89 - dBm
11g, 6 Mbps - -94 - dBm
11g, 54 Mbps - -77 - dBm
11n, HT20, MCS0 - -94 - dBm
11n, HT20, MCS7 - -77 - dBm
Table 8 Bluetooth®and Bluetooth®LE
Parameter Condition Min Typ Max Unit
Operating Frequency range - 2402 - 2480 MHz
Transmit Power Bluetooth®- 10.8 11.8 dBm
Bluetooth®LE - 6.5 7.5 dBm

Preliminary Datasheet 20 of 32 002-29368 Rev. *C
2021-08-02
restricted
Rapid IoT Connect System on Module
Dual band Wi-Fi and Bluetooth®
Electrical specifications
Power consumption
2.4 GHz WLAN current consumption
5 GHz WLAN current consumption
Bluetooth®and Bluetooth®LE current consumption
Table 9 2.4 GHz WLAN current consumption
Mode
VBAT_WL = 3.6V, VDDIO_WL, VDDD, VDDIO0 = 1.8V, VDDIO1, VDDA,
VDD_USB = 3.3V, TA= 25°C
Sleep modes VBAT_WL, μAVDDIO_WL, μAVDDD, μAVDDA, μA
Radio OFF [1] [1] [1] [1]
Sleep Current [1] [1] [1] [1]
Active RX modes VBAT_WL, mA VDDIO_WL, mA VDDD, mA VDDA, mA
Continuous RX MCS7 HT20 1SS [1] [1] [1] [1]
Active TX modes VBAT_WL, mA VDDIO_WL, mA VDDD, mA VDDA, mA
Continuous TX MCS7 HT20 1SS [1] [1] [1] [1]
Active RX modes VBAT_WL, mA VDDIO_WL, mA VDDD, mA VDDA, mA
Continuous RX MCS7 HT20 1SS [1] [1] [1] [1]
Active TX modes VBAT_WL, mA VDDIO_WL, mA VDDD, mA VDDA, mA
Continuous TX MCS7 HT20 1SS [1] [1] [1] [1]
Table 10 5 GHz WLAN current consumption
Mode
VBAT_WL = 3.6V, VDDIO_WL, VDDD, VDDIO0 = 1.8V, VDDIO1, VDDA,
VDD_USB = 3.3V, TA= 25°C
Sleep modes VBAT_WL, μAVDDIO_WL, μAVDDD, μAVDDA, μA
Radio OFF [1] [1] [1] [1]
Sleep Current [1] [1] [1] [1]
Active RX modes VBAT_WL, mA VDDIO_WL, mA VDDD, mA VDDA, mA
Continuous RX MCS7 HT20 1SS [1] [1] [1] [1]
Active TX modes VBAT_WL, mA VDDIO_WL, mA VDDD, mA VDDA, mA
Continuous TX MCS7 HT20 1SS [1] [1] [1] [1]
Table 11 Bluetooth®and Bluetooth®current consumption
Operating Mode
VBAT_WL = 3.6V, VDDIO_WL, VDDD, VDDIO0 = 1.8V,VDDIO1, VDDA, VDD_USB = 3.3V,
TA= 25°C
VBAT_WL, mA VDDIO_WL, mA VDDD, mA VDDA, mA
Radio OFF [1] [1] [1] [1]
Sleep current [1] [1] [1] [1]
Transmit 100% On [1] [1] [1] [1]
Receive 100% On [1] [1] [1] [1]
Note
1. This information is being collected and will be updated in the next revision.