Infineon HybridPACK 2 User guide

Application Note AN 2010-08
V2.0, August 2010
HybridPACK™ 2
General Information and Mounting Instruction
IFAG ATV OPEV

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Edition 2010-08-10
Published by
Infineon Technologies AG
59568 Warstein, Germany
© Infineon Technologies AG 2010.
All Rights Reserved.
Attention please!
THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE
IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE
REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR
QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION
NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON
TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND
(INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL
PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN
IN THIS APPLICATION NOTE.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types
in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components
may only be used in life-support devices or systems with the express written approval of Infineon
Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-
support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and
sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other
persons may be endangered.
AN 2010-08
Revision History: date (10-08-10) V2.0, Previous Version: V1.0, November 2009
All Pages: Used new template. , Page 4 and 5: Added Chapter ” Proposal for Designing a Driver Board”
Page 7: Changed name of the JST connector from "09HVD4B-EMGF-SR" to "09HVD6B-EMGF-NR".
Page 9: Added comment ”IFX does not recommend the usage of a silicon gasket for sealing.”
Page 11: Changed drawing “A design example of fluid cooling system”
Page 14: Updated Figure 10
Author: Vase Klandjevski ( IFAG ATV OPEV AE )
We Listen to Your Comments
Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will
help us to continuously improve the quality of this document. Please send your proposal (including a
reference to this document) to: [[e-mail]]

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Table of Contents
1Introduction ...................................................................................................................................4
2Proposal for Designing a Driver Board ......................................................................................4
3Mounting a Driver Board onto the Module .................................................................................6
4Application of the Liquid Cooling System .................................................................................9
5Screws to Mount the Module to the Heat Sink.........................................................................12
6Mounting the Module to the Heat Sink .....................................................................................13
7Connecting the Bus Bars to the Power Terminals ..................................................................14
7.1 Connecting the Power Terminals with Ideal Strain Relief ......................................................15
8Storage and Transport ...............................................................................................................16
9Data Matrix (DMX) Part Marking ................................................................................................17

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1 Introduction
The operation of high power modules results in power losses, which have to be dissipated
via a heat sink so that the maximum permissible temperature specified in the data sheet will
not be exceeded. Therefore, the mounting process of power modules is vital, because it
affects the module’s thermal performance and furthermore its reliability, which is critical for
automotive applications.
This application note gives mounting instructions for HybridPACKTM 2 module with
recommendations how to screw the module, assemble the PCB and mount the module onto
the heat sink.
Please also note that ground straps should be worn while working with the components and
valid ESD safety instructions should be followed at all time, since IGBT modules are
electronic-static sensitive components. In addition, maximum permissible values in the
product datasheet and application notes are absolute limits which generally, even for short
times, may not be exceeded as this may lead to destruction of the component. Moreover, this
application note cannot cover every type of application and condition. Hence, the application
note cannot replace a detailed evaluation and examination by you or your technical divisions
of the suitability for the targeted applications. The application note will, therefore, under no
circumstances become part of any supplier agreed warranty, unless the supply agreement
determines otherwise in writing.
2 Proposal for Designing a Driver Board
Based on the HybridPACK™ 2 dimensions a proposal for designing a driver board can be
offered (see Figure 1). The end-hole diameter for the module solder pin connection should
be 0,0
25,0
35,1 −
+mm should be taken.
PLEASE NOTE: The drawing below offers a proposal for solder pin connection based driver
board and therefore it is not binding. Detailed evaluation and examination by you or your
technical divisions must be done in order to verify the suitability of this proposal.
When designing a driver board which uses connectors (E.g. JST connector type "09HVD6B-
EMGF-NR") the geometry and the footprints of the connector must be taken in to account.

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mm
0,0
25,0
35,1
− +
Figure 1 Proposal for designing a driver board for HybridPACK™ 2 module.

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3 Mounting a Driver Board onto the Module
The driver board could be mounted in two ways: through connectors (strongly
recommended) or alternative directly soldering on the top of the module.
When a driver board or module adapter board (PCB) is soldered directly on top of the
module, the contact joints (=solder connections) between PCB and module auxiliary contacts
should be mechanically relieved as much as possible. Relieve of the contact points is carried
out by mounting the PCB directly onto the module at the eight mounting stand-offs (Figure 2)
using self-tapping (thread forming) screws or similar assembly material. The length of the
used self-tapping screws is depended on the PCB thickness. Example: For mounting a PCB
with 1.6mm thickness a self-trapping screw with 3 mm diameter and 10mm length should be
used for example type Delta PT 30x10 from EJOT.
Position of the mounting
„self-tapping“ screws
Position of the guidance
holes
1
2
3
4
5
6
7
8
Figure 2 PCB mounting stand-off of HybridPACK™ 2 module.
The screws should be mounted in the sequence showed in Figure 2. The initial 1.5mm of the
mounting stand-off serve as guidance only and cannot take any force. The thread in the
plastics will form itself by driving in the screws. Apart from manually driving the screws into
the mounting stand-offs an electronically controlled or at least slowly turning electric
screwdriver (≤300rpm) is a preferred aid (due to the lack of accuracy we do not recommend
the use of pneumatic screwdrivers). The maximum applied force Mmax is 0.9Nm ±10%. The
effective length of the screw thread entering the mounting stand-off should be of a minimum
length of lmin≥6mm and a maximum length of lmax≤9mm giving consideration to the PCB
thickness and the weight of the driver PCB.

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The HybridPACK™ 2 offers two guidance holes marked on the Figure 2 with the colour blue.
These guidance holes offer assistance by mounting the PCB on the module and allow
automated assembly.
To avoid damage or splitting of the stand-off, straight insertion of the screw into the stand-off
has to be observed during assembly (Figure 3).
A. Correctly assembled B. Incorrectly positioned screw
Figure 3 (A) Correctly assembled screw into the mounting stand-off.
(B) Incorrectly positioned screw into the mounting stand-off.
The recommended screws and torques are based on laboratory tests. Depending on screws
and tools used, it may be necessary to adapt the assembly process accordingly.
After mounting the PCB the solder process (manual soldering, selective soldering or wave
soldering) may begin. When adhering to this sequence of assembly, the mechanical strain to
the solder points can be minimised.
During the entire soldering process care needs to be taken that neither a too high soldering
temperature nor a too long process time at the auxiliary pins overheats the plastic case and
thus deforms it.
According to IEC 68 section 2, a maximum solder temperature of T=260°C for a maximum
process time of tmax≤10s has to be observed during the solder process.
Further information regarding solder processes can be referred to the application note
AN2005-06 “Soldering Econo und Easy modules”.
Instead of directly soldering, the PCB could also be mounted onto the module through
connectors. Such electrical connection between PCB and module can use every connector
which is designed for a pin cross-section of 0,64 x 0,64 mm, especially JST connector type
"09HVD6B-EMGF-NR". The module auxiliary terminals (pin connectors) are designed
especially for fitting to the JST connectors (surface and dimensions).
PCB
Modul
screw
PCB
Modul
screw
PCB
Modul
screw
PCB
Modul
screw
Modul
screw

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Figure 4 Technical drawing of the HybridPACKTM 2 auxiliary terminals (pin connectors).
The picture above shows the dimension and the structure of the auxiliary terminals. Due to
the specific requirements of the JST connector the auxiliary terminals have the following
properties:
•The auxiliary terminals are made of 63% IACS (International Annealed Copper
Standard) copper material,
•Auxiliary terminals have gold (Au) surface with nickel (Ni) under plating,
•The tensile strength of the auxiliary terminals has to be equal or exceed 530MPa,

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4 Application of the Liquid Cooling System
The power loss occurring in the module has to be dissipated in order not to exceed the
maximum permissible temperature specified in the datasheet during switching (Tvj_op = 150
°C) in operation. Therefore, the design of cooling system/heat sink is of great importance to
achieve good performance.
HybridPACKTM 2 differs from other power modules because of pin-fin array on the base plate,
which makes liquid cooling very effective in sense of thermal performance. The base plate is
made of copper (Cu) material with nickel (Ni) plating. The pin fin structure is suitable for
cooling fluids like water/ethylenglycol mixture.
PLEASE NOTE: During the mounting process damages of the nickel plating and mechanical
deformation of the pin fin structure should be strictly avoided.
As shown in the figure below the pin-fin array is on the module base plate to get maximum
heat exchange effect. An O-ring sealing type (202 x 64.2 x 3 )mm e.g. from company
Trelleborg (part number DRYD001590E768U) should be utilized on the heat sink in order to
confirm waterproof of the fluid cooling system. Such O-ring is held in a groove, which
surrounds the tray that holds the pin fin array, and this groove should be restricted to the
region on the heat sink that corresponds to the region around the pin fin structure see the
drawings below. With in this region there should be no contamination, scratches or other
base plate damages.
PLEASE NOTE: IFX does not recommend the usage of a silicon gasket or other sealing
methods. The usage of sealing methods different then O-ring may cause damage on
HybridPACK™ 2 module.
Figure 5 Technical drawing of HybridPACKTM 2 bottom side.

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Figure 6 “X”- section Detail drawing of the HybridPACKTM 2 bottom side. The
sealing surface corresponds to the O-ring holding groove.
The suggested dimension of the tray holding the pin fin array is depicted in Figure 7a with
specified tolerances.
The contact surfaces between the base plate of the module and the surface of the heat sink
have to be free of degradation and contamination and should be cleaned with a fresh, lint
free cloth.
PLEASE NOTE: No thermal grease is needed for mounting the HybridPACKTM 2 on the
cooler.
The contact surface of the heat sink should not exceed the following values referenced to a
length of L=100mm:
Surface flatness ≤50µm
Surface roughness Rz ≤10µm
Surface roughness at the sealing surface Ra ≤1.6µm
The heat sink has to be of sufficient stiffness for the assembly and the subsequent transport
in order not to exert additional straining or pulling forces to the base plate of the module.
During the entire assembly process the heat sink has to be handled twist free.
An example of fluid cooling system design could be referred to datasheet of HybridPACKTM 2
and Figure 7. This cooling system is designed for O-ring sealing from Trelleborg with part
number DRYD001590E768U.