Intel H2000G Series User manual

Intel® Server Products and Solutions
Intel® Server Chassis H2000G
Product Family
Service Guide
Instruction on installation and removal of subassemblies.
Rev 2.2
January 2017

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Intel® Server Chassis H2000G Product Family Service Guide
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Document Revision History
Date
Revision
Changes
January 2015
1.0
Initial release.
December 2015
2.0
Applied new format.
May 2016
2.1
Added H2224XXKR2 and H2224XXLR2.
January 2017
2.11
Added “Caution” safety legend.
January 2017
2.2
Applied new format.

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Disclaimers
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software, or service
activation. Learn more at Intel.com, or from the OEM or retailer.
You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel
products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which
includes subject matter disclosed herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
The products described may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness
for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or
usage in trade.
Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-4725
or by visiting www.intel.com/design/literature.htm.
Intel and the Intel logo are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2017 Intel Corporation. All rights reserved.

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Safety Information
Important Safety Instructions
Read all caution and safety statements in this document before performing any of the instructions. See also
Intel Server Boards and Server Chassis Safety Information at
http://www.intel.com/content/www/us/en/support/boards-and-kits/000007675.html
Wichtige Sicherheitshinweise
Lesen Sie zunächst sämtliche Warnund Sicherheitshinweise in diesem Dokument, bevor Sie eine der
Anweisungen ausführen. Beachten Sie hierzu auch die Sicherheitshinweise zu Intel-Serverplatinen und
Servergehäusen unter http://www.intel.com/content/www/us/en/support/boards-and-kits/000007675.html.
Consignes de sécurité
Lisez attention toutes les consignes de sécurité et les mises en garde indiquées dans ce document avant de
suivre toute instruction. Consultez Intel Server Boards and Server Chassis Safety Information sur le site
http://www.intel.com/content/www/us/en/support/boards-and-kits/000007675.html.
Instrucciones de seguridad importantes
Lea todas las declaraciones de seguridad y precaución de este documento antes de realizar cualquiera de las
instrucciones. Vea Intel Server Boards and Server Chassis Safety Information en
http://www.intel.com/content/www/us/en/support/boards-and-kits/000007675.html.
重要安全指导
在执行任何指令前，请阅读本文档中所有的注意事项及安全声明。或
http://www.intel.com/content/www/us/en/support/boards-and-kits/000007675.html 上的 Intel Server
B oards and Serve r C hassis Sa fety In formation (《Intel服务器主板与服务器机箱安全信息》)

Intel® Server Chassis H2000G Product Family Service Guide
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Warnings
Heed safety instructions: Before working with your server product, whether you are using this guide or any
other resource as a reference, pay close attention to the safety instructions. You must adhere to the
assembly instructions in this guide to ensure and maintain compliance with existing product certifications
and approvals. Use only the described, regulated components specified in this guide. Use of other products /
components will void the UL listing and other regulatory approvals of the product and will most likely result
in noncompliance with product regulations in the region(s) in which the product is sold.
System power on/off: The power button DOES NOT turn off the system AC power. Toremove power from
system, you must unplug the AC power cord from the wall outlet. Make sure theAC power cord is unplugged
before you open the chassis, add, or remove anycomponents.
Hazardous conditions, devices and cables: Hazardous electrical conditions may be presenton power,
telephone, and communication cables. Turn off the server and disconnect the power cord,
telecommunications systems, networks, and modems attached to the server before opening it. Otherwise,
personal injury or equipment damage can result.
Electrostatic discharge (ESD) and ESD protection: ESD can damage disk drives, boards, and other parts. We
recommend that you perform all procedures in this chapter only at an ESD workstation. If one is not
available, provide some ESD protection by wearing an anti-staticwrist strap attached to chassis ground, any
unpainted metal surface on your server when handling parts.
ESD and handling boards: Always handle boards carefully. They can be extremely sensitive to ESD. Hold
boards only by their edges. After removing a board from its protective wrapper or from the server, place the
board component side up on a grounded, static free surface. Use a conductive foam pad if available but not
the board wrapper. Do not slide board over any surface.
Installing or removing jumpers: A jumper is a small plastic encased conductor that slips over two jumper
pins. Some jumpers have a small tab on top that you can grip with your fingertips or with a pair of fine needle
nosed pliers. If your jumpers do not have such a tab, take care when using needle nosed pliers to remove or
install a jumper; grip the narrow sides of the jumper with the pliers, never the wide sides. Gripping the wide
sides can damage the contacts inside the jumper, causing intermittent problems with the function controlled
by that jumper. Take care to grip with, but not squeeze, the pliers or other tool you use to remove a jumper, or
you may bend or break the pins on the board.
Caution: Slide/rail mounted equipment is not to be used as a shelf or a work space.
Intel warranties that this product will perform to its published specifications. However, all computer systems
are inherently subject to unpredictable system behavior under various environmental and other conditions.
This product is not intended to be the sole source for any critical data and the user must maintain a verified
backup. Failure to do so or to comply with other user notices in the product user guide and specification
documents may result in loss of or access todata.

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Table of Contents
1. Preface ........................................................................................................................................................................ 11
1.1 About this Document ...................................................................................................................................................11
1.2 Document Organization ..............................................................................................................................................11
1.3Additional Information and Software....................................................................................................................11
2. Product Features ...................................................................................................................................................... 12
2.1 Product Feature Overview..........................................................................................................................................13
2.2 Server Chassis Components......................................................................................................................................13
2.3 Drive Bays..........................................................................................................................................................................15
2.4 Front Control Panel.......................................................................................................................................................16
2.5 Front Bezel........................................................................................................................................................................16
2.6 Backplane Interposer Board......................................................................................................................................17
2.7 Hot-Swap SAS/SATA Backplane..............................................................................................................................18
2.7.1 3.5" Hot-Swap Backplane ...........................................................................................................................................18
2.7.2 16 x 2.5" Hot-Swap Backplane .................................................................................................................................19
2.7.3 SAS/PCIe* SFF Combo 24 x 2.5" Hot Swap Backplane ..................................................................................20
2.8 Dummy Tray Cover........................................................................................................................................................21
3. Hardware Installations and Upgrades ................................................................................................................. 22
3.1 Before Beginning............................................................................................................................................................22
3.1.1 Tools and Supplies Needed....................................................................................................................................... 22
3.1.2 System Reference ..........................................................................................................................................................22
3.2 Removing and Installing the Front Bezel .............................................................................................................22
3.2.1 Bezel Snap-On Badges ................................................................................................................................................22
3.2.2 Removing the Front Bezel ..........................................................................................................................................23
3.2.3 Installing the Front Bezel............................................................................................................................................24
3.3 Removing and Installing the Power Distribution Module Cover ................................................................24
3.3.1 Removing the Power Distribution Module Cover..............................................................................................24
3.3.2 Installing the Power Distribution Module Cover ...............................................................................................25
3.4 Removing and Installing the Compute Module................................................................................................. 25
3.4.1 Installing the Compute Module................................................................................................................................25
3.4.2 Removing the Compute Module..............................................................................................................................26
3.5 Removing and Installing the Redundant Power Supply Unit.......................................................................27
3.5.1 Removing the Power Supply Unit............................................................................................................................27
3.5.2 Installing the Power Supply Unit ............................................................................................................................. 27
3.6 Installing a Hot-Swap Storage Device ...................................................................................................................27
3.6.1 Installing a 3.5” Hard Disk Drive (HDD) .................................................................................................................28
3.6.2 Installing a 2.5” Solid State Drive (SSD) into a 3.5”Carrier........................................................................... 29
3.6.3 Installing a 2.5” Storage Device (HDD or SSD)...................................................................................................30
3.7 Replacing the 12 x 2.5" Backplane Board ............................................................................................................ 31
3.7.1 Removing the 12 x 2.5" Backplane Board............................................................................................................31
3.7.2 Installing the 2.5" Backplane Board........................................................................................................................32

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3.8 Replacing the 16 x 2.5" Backplane Board ............................................................................................................33
3.8.1 Removing the 16 x 2.5" Backplane Board............................................................................................................33
3.8.2 Installing the 16 x 2.5" Backplane Board..............................................................................................................34
3.9 Replacing the SAS/PCIe* SFF Combo 24 x 2.5" Hot Swap Backplane.....................................................35
3.9.1 Removing the SAS/PCIe* SFF Combo 24 x 2.5" Hot Swap Backplane.....................................................35
3.9.2 Installing the SAS/PCIe* SFF Combo 24 x 2.5" Hot Swap Backplane ......................................................36
3.10 Removing and Installing the Power Distribution Module..............................................................................37
3.10.1 Removing the Power Distribution Module...........................................................................................................37
3.10.2 Installing the Power Distribution Module ............................................................................................................38
3.11 Replacing the Power Interposer Board.................................................................................................................38
3.11.1 Removing the Power Interposer Board.................................................................................................................38
3.11.2 Installing the Power Interposer Board ..................................................................................................................39
3.12 Replacing the Front Control Panel Board ............................................................................................................39
3.12.1 Removing the Front Control Panel Board............................................................................................................39
3.12.2 Installing the Front Control Panel Board..............................................................................................................40
Appendix A. Technical Reference............................................................................................................................ 42
A.1. System Environmental Specifications...................................................................................................................42
Appendix B. Regulatory and Compliance Information ....................................................................................... 43
Appendix C. Getting Help.......................................................................................................................................... 44
C.1. Warranty Information...................................................................................................................................................44

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List of Figures
Figure 1. Server chassis overview (H2312XXKR2 SKU).............................................................................................................12
Figure 2. Server chassis rear view.......................................................................................................................................................12
Figure 3. Server chassis components (12 x 3.5” drive bay) .....................................................................................................14
Figure 4. Server chassis components (24 x 2.5” drive bay) .....................................................................................................14
Figure 5. Intel® Server Chassis H2312XXKR2 front view ..........................................................................................................15
Figure 6. Intel® Server Chassis H2216XXKR2 front view ..........................................................................................................15
Figure 7. Intel® Server Chassis H2224XXKR2/H2224XXLR2 front view.............................................................................15
Figure 8. Drive array scheme on the Intel® Server ChassisH2312XXKR2.........................................................................15
Figure 9. Drive array scheme on the Intel® Server ChassisH2216XXKR2.........................................................................15
Figure 10. Drive array scheme on the Intel® Server ChassisH2224XXKR2/ H2224XXLR2........................................16
Figure 11. Location of front panel and LEDs .................................................................................................................................16
Figure 12. Detailed view of front control panel and LEDs........................................................................................................16
Figure 13. Front bezel .............................................................................................................................................................................16
Figure 14. Backplane interposer board (front view) ...................................................................................................................17
Figure 15. Backplane interposer board (back view)....................................................................................................................17
Figure 16. 12 x 3.5" backplane components (frontview) .........................................................................................................18
Figure 17. 12 x 3.5" backplane components (back view)..........................................................................................................18
Figure 18. 16 x 2.5" backplane components (frontview) .........................................................................................................19
Figure 19. 16 x 2.5" backplane components (back view)..........................................................................................................19
Figure 20. 24 x 2.5" backplane components (front view) .........................................................................................................20
Figure 21. 24 x 2.5" backplane components (back view)..........................................................................................................20
Figure 22. Dummy tray cover ............................................................................................................................................................... 21
Figure 23. Installing snap-on badges to the front bezel .......................................................................................................... 22
Figure 24. Removing snap-on badges from the front bezel...................................................................................................23
Figure 25. Removing the front bezel.................................................................................................................................................23
Figure 26. Installing the front bezel ..................................................................................................................................................24
Figure 27. Removing the power distribution module cover ...................................................................................................24
Figure 28. Installing the power distribution module cover ..................................................................................................... 25
Figure 29. Removing the dummy tray cover..................................................................................................................................25
Figure 30. Installing the compute module .....................................................................................................................................26
Figure 31. Removing the compute module....................................................................................................................................26
Figure 32. Restoring the dummy tray cover...................................................................................................................................26
Figure 33. Removing the power supply unit..................................................................................................................................27
Figure 34. Installing the power supply unit....................................................................................................................................27
Figure 35. Installing a 3.5” HDD – removing the carrier............................................................................................................28
Figure 36. Installing a 3.5” HDD – removing the drive blank .................................................................................................. 28
Figure 37. Installing a 3.5” HDD –inserting the HDD .................................................................................................................28
Figure 38. Installing a 3.5” HDD – inserting the carrier assembly.........................................................................................28
Figure 39. Installing a 2.5” SSD into a 3.5” drive blank..............................................................................................................29
Figure 40. Installing a 2.5” HDD or SSD – removing the carrier.............................................................................................30

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Figure 41. Installing a 2.5” HDD or SSD – removing the drive blank...................................................................................30
Figure 42. Installing a 2.5” HDD or SSD – inserting the 2.5” HDD or SSD .........................................................................30
Figure 43. Installing a 2.5” HDD or SSD – inserting the carrier assembly..........................................................................31
Figure 44. Removing the drive cage..................................................................................................................................................31
Figure 45. Removing the 12 x 2.5" backplane board from the drive cage ........................................................................32
Figure 46. Installing the 12 x 2.5" backplane board to the drive cage................................................................................32
Figure 47. Installing the drive cage to the chassis.......................................................................................................................33
Figure 48. Removing the drive cage..................................................................................................................................................33
Figure 49. Removing the 16 x 2.5" backplane board from the drive cage........................................................................34
Figure 50. Installing the 16 x 2.5" backplane board to the drive cage................................................................................34
Figure 51. Installing the drive cage to the chassis.......................................................................................................................35
Figure 52. Removing the drive cage..................................................................................................................................................35
Figure 53. Removing the SAS/PCIe* SFF combo 24 x 2.5" hot swap backplane............................................................36
Figure 54. Installing the SAS/PCIe* SFF Combo 24 x 2.5" hot swap backplane.............................................................36
Figure 55. Installing the drive cage to the chassis.......................................................................................................................37
Figure 56. Removing the power distribution module................................................................................................................37
Figure 56. Installing the power distribution module..................................................................................................................38
Figure 57. Removing the power interposer board ......................................................................................................................38
Figure 58. Installing the power interposer board........................................................................................................................39
Figure 59. Removing the front control panel assembly from the rack handle ...............................................................39
Figure 60. Disconnecting the front panel cable ...........................................................................................................................39
Figure 61. Removing the front control panel board................................................................................................................... 40
Figure 62. Installing the front control panel board.....................................................................................................................40
Figure 63. Connecting the front panel cable.................................................................................................................................40
Figure 64. Installing the front control panel assembly to the rack handle.......................................................................41
List of Tables
Table 1. Reference documents and software................................................................................................................................11
Table 2. Product feature set .................................................................................................................................................................13
Table 3. System environmental limits summary..........................................................................................................................42

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1. Preface
1.1 About this Document
This document is written for system technicians who are responsible for troubleshooting, upgrading, and
repairing the Intel® Server Chassis H2000G product family. This document provides a brief overview of the
features of the Intel® Server Chassis H2000G product family, a list of accessories or other components that
may be needed, troubleshooting information, and instructions on how to add and replace the components on
the Intel® Server Chassis H2000G product family. For the latest revision of this document, visit
http://www.intel.com/support.
1.2 Document Organization
Chapter 2 –Product Features provides a high level overview of the Intel® Server Chassis H2000G product
family including a list of the server chassis features and illustrations identifying the major chassis
components.
Chapter 3 –Hardware Installations and Upgrades provides instructions on adding and replacing the
components. Use this chapter for step-by-step instructions and diagrams for installing or replacing the
components such as the processors, memory, and add-in cards, among other components.
The appendices provide technical specifications, regulatory information, and information on getting
additional help.
1.3 Additional Information and Software
For additional information about this family of products or any of their supported accessories, refer to the
following resources available at http://www.intel.com/support.
Table 1. Reference documents and software
For this information
Use this document or tool
In-depth technical information
Intel® Server Chassis H2000G Product Family Technical Product Specification
Product list and supported spares and accessories
Configuration Guide and Spares/Accessories List
Server configuration and compatibility guidance
Intel® Server Configurator Tool at http://serverconfigurator.intel.com
System power budget guidance
Power Budget Tool at http://www.intel.com/support
Product safety and regulatory information
Intel Server Products –Product Safety and Regulatory Compliance Document

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2. Product Features
This chapter briefly describes the main features of the Intel® Server Chassis H2000G product family. This
includes illustrations of the product, a list of the product features, and diagrams showing the location of
important components and connections.
Figure 1. Server chassis overview (H2312XXKR2 SKU)
Figure 2. Server chassis rear view

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2.1 Product Feature Overview
Table 2 summarizes the features of the product family.
Table 2. Product feature set
Feature
Description
Dimensions
(D x W x H)
H2312XXKR2
30.35 x 17.24 x 3.42 inches (771 x 438 x 86.9 mm)
H2216XXKR2
28.86 x 17.24 x 3.42 inches (733 x 438 x 86.9 mm)
H2224XXKR2
28.86 x 17.24 x 3.42 inches (733 x 438 x 86.9 mm)
H2224XXLR2
28.86 x 17.24 x 3.42 inches (733 x 438 x 86.9 mm)
Package dimensions
984 x 578 x 266 mm
Net weight
(package weight)
H2312XXKR2
21.5 kg (29.5 kg)
H2216XXKR2
20.5 kg (28.4 kg)
H2224XXKR2
20.6 kg (28.8 kg)
H2224XXLR2
20.6 kg (28.8 kg)
Compute module support
Intel® Compute Module HNS2600KP Product Family
Intel® Compute Module HNS2600TP Product Family
System fans
(1) –internal power supply fan for each installed power supply unit
(3) –fans for each compute module
Power supply options
1600 W AC Common Redundant Power Supply (CRPS), 80 PLUS* Platinum with
PFC (Power Factor Correction), supporting CRPS configuration
Storage bay options
H2312XXKR2
12x 3.5-inch SATA/SAS drive bays
H2216XXKR2
16x 2.5-inch SATA/SAS drive bays
H2224XXKR2
24x 2.5-inch SAS drive bays (8 x PCIe* SFF)
H2224XXLR2
24x 2.5-inch SAS drive bays (8 x PCIe* SFF)
2.2 Server Chassis Components
This section helps identify the components of the product. The Quick Reference Label provided on the
chassis cover can also assist in identifying the components.
The Intel® Server Chassis H2000G product family supports four compute modules in the chassis. Figure 3
and Figure 4 show the whole chassis view with the power distribution module cover removed.
Note: The blank compute module bay must be covered by a dummy traycover. When removed, keep the
dummy tray cover properly for future use. For more information on the dummy cover, see section 2.8.
Note: The compute module bay in the chassis requires either a compute module being installed and
powered up or a dummy tray cover installed to maintain proper thermal environment for the other running
compute modules in the same chassis. In case of a compute module failure, remove the failed compute
module, and replace with a dummy tray cover until the new compute module is installed.

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Figure 3. Server chassis components (12 x 3.5” drive bay)
Figure 4. Server chassis components (24 x 2.5” drive bay)
A–Front control panels
B–Drive bays
C–Power distribution modules
D–Power supply modules
E–Hot swap backplane (attached to
the drive cage)
A–Front control panels
B–Drive bays
C–Power interposer board (H2224KR2 only)
D–Power distribution module
E–Power supply modules
F–Hot swap backplane (attached to the drive cage)

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2.3 Drive Bays
Figure 5. Intel® Server Chassis H2312XXKR2 front view
Figure 6. Intel® Server Chassis H2216XXKR2 front view
Figure 7. Intel® Server Chassis H2224XXKR2/H2224XXLR2 front view
Each compute module has a dedicated drive array based on the backplane controller design. Figure 8, Figure
9, and Figure 10 show the schemes for the drive arrays corresponding to the compute modules.
Figure 8. Drive array scheme on the Intel® Server ChassisH2312XXKR2
Figure 9. Drive array scheme on the Intel® Server ChassisH2216XXKR2

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Figure 10. Drive array scheme on the Intel® Server ChassisH2224XXKR2/ H2224XXLR2
2.4 Front Control Panel
The server chassis contains two sets of control panels on the left and right rack handles. Each control panel
contains two sets of control buttons and LEDs for each compute module. Figure 11 and Figure 12 show the
locations and detailed view of the controlpanels.
Figure 11. Location of front control panel and LEDs
Figure 12. Detailed view of front control panel and LEDs
2.5 Front Bezel
The front bezel is available as an optional accessory for the server chassis. For information on removing and
installing the front bezel, see section 3.2.
Figure 13. Front bezel

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2.6 Backplane Interposer Board
The backplane interposer board (BIB) is only used in 24 x 2.5” drive chassis as the interposer between the
backplane and the power docking board to connect the power and miscellaneous signals from the
backplane to the compute modules.
Figure 14. Backplane interposer board (front view)
Figure 15. Backplane interposer board (back view)
A–80-pin miscellaneous signal connector
(to backplane)
B–Power mate pin hole (to backplane)
C–Power mate pin hole (to backplane)
D
–Power mate pin hole (to backplane)
E–Power mate pin hole (to backplane)
A–Power edge connector (to top compute module power docking board)
B–40-pin miscellaneous signal connector (to top compute module power docking board)
C–Front panel connector
D
–40-pin miscellaneous signal connector (to bottom) compute module power docking board)
E–Power edge connector (to bottom compute module power docking board)
F–Front panel connector

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2.7 Hot-Swap SAS/SATA Backplane
The hot-swap SAS/SATA backplane serves as an interface between the mother board and the drives. The
following diagrams show the location for each connector found on the backplane.
2.7.1 3.5" Hot-Swap Backplane
Figure 16. 12 x 3.5" backplane components (frontview)
Figure 17. 12 x 3.5" backplane components (back view)
A–SATA/SAS connectors for node 1
B–SATA/SAS connectors for node 2
C–SATA/SAS connectors for node 3
D–SATA/SAS connectors for node 4
A–2-blade compute module power connector for node 4
B–2x40-pin bridge board connector for node 4
C–2x9-pin power supply input connector
D
–2x9-pin power supply input connector
E–2x7-pin power control cable connector
F–2-blade compute module power connector for node 3
G
–2x40-pin bridge board connector for node 3
H–2x40-pin bridge board connector for node 1
I–20-pin front panel cable connector for nodes 1 and 3
J–2-blade compute module power connector for node 1
K–2x9-pin power supply input connector
L–2x9-pin power supply input connector
M
–2x40-pin bridge board connector for node 2
N–2-blade compute module power connector for node 2
O–20-pin front panel cable connector for nodes 2 and 4

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2.7.2 16 x 2.5" Hot-Swap Backplane
Figure 18. 16 x 2.5" backplane components (frontview)
Figure 19. 16 x 2.5" backplane components (back view)
A–SATA/SAS connectors for node 1
B–SATA/SAS connectors for node 2
C–SATA/SAS connectors for node 3
D–SATA/SAS connectors for node 4
A–2-blade compute module power connector for node 4
B–2x40-pin bridge board connector for node 4
C–2x9-pin power supply input connector
D
–2x7-pin power supply input connector
E–2x9-pin power control cable connector
F–2-blade compute module power connector for node 3
G
–2x40-pin bridge board connector for node 3
H–2x40-pin bridge board connector for node 1
I–20-pin front panel cable connector for nodes 1 and 3
J–2-blade compute module power connector for node 1
K–2x9-pin power supply input connector
L–2x9-pin power supply input connector
M
–2x40-pin bridge board connector for node 2
N–2-blade compute module power connector for node 2
O–20-pin front panel cable connector for nodes 2 and 4

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2.7.3 SAS/PCIe* SFF Combo 24 x 2.5" Hot Swap Backplane
Figure 20. 24 x 2.5" backplane components (front view)
Figure 21. 24 x 2.5" backplane components (back view)
A–SAS 0-3 SFF-8680 connectors (compute module 1)
B–SAS 4-5/PCIe* SFF 0-1 SFF 8639 connectors (compute module 1)
C–SAS 6-9 SFF-8680 connectors (compute module 3)
D
–SAS 10-11/PCIe* SFF 2-3 SFF-8639 connectors (compute module 3)
E–SAS 12-15 SFF-8680 connectors (compute module 2)
F–SAS 16-17/PCIe* SFF 4-5 SFF-8639 connectors (compute module 2)
G
–SAS 18-21 SFF-8680 connectors (compute module 4)
H–SAS 22-23/PCIe* SFF 6-7 SFF-8639 connectors (compute module 4)
A–Power mate pin (to BIB)
B–Power mate pin (to BIB)
C–80-pin miscellaneous signal connector (to BIB)
D
–100-pin bridge board connector
E–2x7-pin power control cable connector (to PDB)
F–2x4 pin P5V power cable connector (to PIB)
G
–Power mate pin (to BIB)
H
–Power mate pin (to BIB)
I–100-pin bridge board connector
J–100-pin bridge board connector
K–Power mate pin (to BIB)
L–Power mate pin (to BIB)
M
–12 V power connector (to PIB)
N
–12 V power connector (to PIB)
O
–12 V power connector (to PIB)
P–12 V power connector (to PIB)
Q
–100-pin bridge board connector
R–Power mate pin (to BIB)
S–Power mate pin (to BIB)