Intel D40AMP Series User manual

Intel® Server D40AMP
Family
Intel® Server Board D40AMP
Intel® Compute Module D40AMP
Intel® Server System D40AMP
Integration and Service Guide
A guide providing instructions for the installation and
removal of system components and spares.
Rev. 1.2
June 2022
Delivering Breakthrough Data Center System Innovation –Experience What’s Inside!

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Intel® Server D40AMP Family Integration and Service Guide
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Document Revision History
Date
Revision
Changes
November 2021
1.0
Initial release.
March 2022
1.1
•Updated URL in chapter 1.
•Modified assembly procedure in 2.2.1 and 2.2.2.
•Changed SSD insertion procedure in 3.6.3 according to factory recommendations.
June 2022
1.2
•Changed document structure to remove duplications.
•Modified instructions and illustrations for server board, storage backplane, and PDBs
replacement.
•Added instructions for midplane replacement.

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Disclaimers
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software, or service
activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your
system manufacturer or retailer or learn more at intel.com.
You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel
products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which
includes subject matter disclosed herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
The products described may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness
for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or
usage in trade.
This document contains information on products, services and/or processes in development. All information provided here is subject
to change without notice. Contact your Intel representative to obtain the latest Intel product specifications.
Copies of documents that have an order number and are referenced in this document may be obtained by calling 1-800-548-4725
or by visiting www.intel.com/design/literature.htm.
Intel, the Intel logo, Xeon, and Intel Optane are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others.
© Intel Corporation

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Safety Warnings
Heed safety instructions: Before working with your server product, whether you are using this guide or any
other resource as a reference, pay close attention to the safety instructions. You must adhere to the
assembly instructions in this guide to ensure and maintain compliance with existing product certifications
and approvals. Use only the described, regulated components specified in this guide. Use of other
products/components will void the UL listing and other regulatory approvals of the product. It will most
likely result in noncompliance with product regulations in the region(s) in which the product is sold.
System power on/off: The power buttons on the front panel of each module DO NOT turn off the server
chassis AC power. To remove power from the server chassis, you must unplug the AC power cord from the
electrical outlet. Make sure that the AC power cord is unplugged before you open the server chassis.
To service a module, it is not necessary to power down the entire system. Power off only the module
requiring servicing before attempting to remove it from the server chassis.
Hazardous conditions, devices, and cables: Hazardous electrical conditions may be present on power,
telephone, and communication cables. Turn off the module and disconnect all telecommunications systems,
networks, and modems attached to it before removing it from the server chassis. Otherwise, personal injury
or equipment damage can result.
Installing or removing jumpers: A jumper is a small plastic encased conductor that slips over two jumper
pins. Some jumpers have a small tab on top that you can grip with your fingertips or with a pair of fine needle
nosed pliers. If your jumpers do not have such a tab, take care when using needle nosed pliers to remove or
install a jumper; grip the narrow sides of the jumper with the pliers, never the wide sides. Gripping the wide
sides can damage the contacts inside the jumper, causing intermittent problems with the function controlled
by that jumper. Take care to grip with, but not squeeze, the pliers or other tool you use to remove a jumper,
or you may bend or break the pins on the board.
Electrostatic Discharge (ESD)
Electrostatic discharge can cause damage to your computer or the components within it. ESD can occur
without the user feeling a shock while working inside the system chassis or while improperly handling
electronic devices like processors, memory or other storage devices, and add-in cards.
Intel recommends that the following steps be taken when performing any procedures described within this
document or while performing service to any computer system.
•Where available, all system integration and/or service should be performed at a properly equipped
ESD workstation.
•Wear ESD protective gear like a grounded antistatic wrist strap, sole grounders, and/or conductive
shoes.
•Wear an anti-static smock or gown to cover any clothing that may generate an electrostatic charge.
•Remove all jewelry.
•Disconnect all power cables and cords before opening the Server Chassis
•Power down the Module and remove it from the Server Chassis, remove power feed from the Server
Board before performing any integration or service
•Touch any unpainted metal surface of the chassis before performing any integration or service.

Intel® Server D40AMP Family Integration and Service Guide
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•Hold all circuit boards and other electronic components by their edges only.
•After removing electronic devices from the system or from their protective packaging, place them
component side up on to a grounded anti-static surface or conductive workbench pad. Do not place
electronic devices on to the outside of any protective packaging.
Caution: Slide/rail mounted equipment is not to be used as a shelf or a work space.
Intel warranties that this product will perform to its published specifications. However, all computer systems
are inherently subject to unpredictable system behavior under various environmental and other conditions.
This product is not intended to be the sole source for any critical data and the user must maintain a
verified backup. Failure to do so or to comply with other user notices in the product user guide and
specification documents may result in loss of or access to data.

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Important Safety Certification Standards and Transition Support
Information
The IEC 60950-1 2nd Edition safety standard (Information Technology Equipment) is going through a
replacement phase due to the new IEC 62368-1 3rd Edition safety standard (Audio/Video, Information, and
Communication Technology Equipment).
Intel® server systems identified in this service guide are certified to:
•The new IEC 62368-1 3rd Edition standard for countries that have adopted this new standard.
•The outgoing IEC 60950-1 2nd Edition standard for countries that have not yet adopted the new
standard.
During the global adoption/certification transition phase between the outgoing and new standards, safety
requirement differences between the standards may temporarily dictate restricted usage of Intel® server
system products as follows:
•In countries that have adopted the new IEC 62368-1 3rd Edition standard, no location restrictions
apply beyond the standard intended application use requirements.
•In countries that have not yet adopted the new IEC 62368-1 3rd Edition standard, restricted access
locations are required. Access in these locations is permitted only by technically trained and qualified
personnel who are aware of potential safety hazards.
Note: This requirement applies only to Intel® server system products released in 2019 or later. Legacy Intel®
server system products (released in 2018 or earlier) provide safeguards that require no additional access
restrictions.
Explanation of Temporary Restricted Access Location Measures
The new IEC 62368-1 3rd Edition standard does not consider 240 VA an energy hazard. The outgoing IEC
60950-1 2nd Edition standard does consider 240 VA an energy hazard, therefore Intel® server system
products released in 2019 or later certified to this standard require restricted access locations. Legacy Intel®
server system products (released in 2018 or earlier) were designed with additional safeguards to meet IEC
60950-1 2nd Edition standard 240 VA requirements, so no location restrictions apply beyond the standard
intended application use requirements. After the IEC 60950-1 standard is phased out globally and Intel
server system products are certified to the new IEC 62368-1 standard, the temporarily restricted access
locations will no longer be required.

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Table of Contents
1. Introduction............................................................................................................................................................... 14
2. System Features Overview..................................................................................................................................... 15
2.1 System Components Identification........................................................................................................................15
2.2 Compute Module Components................................................................................................................................20
2.3 Server Board Features..................................................................................................................................................21
3. System Components Installation / Removal / Replacement.......................................................................... 22
3.1 Installing Chassis into a Rack ....................................................................................................................................23
3.1.1 Installing Rail Kit .............................................................................................................................................................24
3.1.2 Installing Chassis into Rack........................................................................................................................................27
3.1.3 Securing System to Rack.............................................................................................................................................28
3.1.4 Exposing System from Rack ...................................................................................................................................... 28
3.2 Chassis Cover Installation / Removal.....................................................................................................................29
3.2.1 Chassis Front Cover Removal ...................................................................................................................................29
3.2.2 Chassis Front Cover Installation ..............................................................................................................................30
3.2.3 Chassis Back Cover Removal.....................................................................................................................................31
3.2.4 Chassis Back Cover Installation................................................................................................................................32
3.3 Compute Module Removal / Installation .............................................................................................................33
3.3.1 Compute Module Removal ........................................................................................................................................33
3.3.2 Compute Module Installation ...................................................................................................................................34
3.4 Air Duct Removal / Installation.................................................................................................................................35
3.4.1 Air Duct Removal............................................................................................................................................................35
3.4.2 Air Duct Installation.......................................................................................................................................................35
3.5 Processor Installation / Removal............................................................................................................................. 36
3.5.1 Processor Heat Sink Module (PHM) Assembly ..................................................................................................37
3.5.2 PHM Installation .............................................................................................................................................................40
3.5.3 Processor Heat Sink Module (PHM) Removal ....................................................................................................42
3.5.4 PHM Disassembly........................................................................................................................................................... 43
3.6 Memory Module (DIMM) Removal / Installation................................................................................................45
3.6.1 Memory Module Installation .....................................................................................................................................45
3.6.2 Memory Module Removal...........................................................................................................................................46
3.7 PCIe* Add-In Card Removal / Installation............................................................................................................47
3.7.1 Riser Assembly Removal.............................................................................................................................................47
3.7.2 Riser Assembly Installation........................................................................................................................................48
3.7.3 PCIe* Add-In Card Installation..................................................................................................................................49
3.7.4 PCIe* Add-in Card Removal.......................................................................................................................................49
3.8 M.2 SSD Removal / Installation................................................................................................................................50
3.8.1 M.2 SSD Heat Sink Removal ......................................................................................................................................50
3.8.2 M.2 SSD Heat Sink Installation.................................................................................................................................50
3.8.3 M.2 SSD Installation......................................................................................................................................................51

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3.8.4 M.2 SSD Removal...........................................................................................................................................................51
3.9 U.2 SSD Drive Removal, Assembly, and Installation –Chassis VP3U2HAC21W0 Only ...................52
3.9.1 Accessing Drive Bays for Modules 3 and 4.......................................................................................................... 53
3.9.2 2.5” SSD Drive Assembly for 7-mm Drives..........................................................................................................54
3.9.3 2.5” SSD Drive / Drive Blank Removal...................................................................................................................55
3.9.4 2.5” SSD Drive Installation ......................................................................................................................................... 55
3.10 EDSFF SSD Extraction and Installation.................................................................................................................57
3.10.1 EDSFF Drive Extraction................................................................................................................................................57
3.10.2 EDSFF Drive Installation..............................................................................................................................................57
3.11 Intel® Virtual RAID on CPU (Intel® VROC) Upgrade Key Installation/Removal......................................58
3.12 Trusted Platform Module (TPM) Installation/Removal ..................................................................................59
3.12.1 TPM Installation..............................................................................................................................................................59
3.12.2 TPM Removal...................................................................................................................................................................60
3.13 System Battery Replacement....................................................................................................................................61
3.13.1 System Battery Removal............................................................................................................................................. 61
3.13.2 System Battery Installation........................................................................................................................................61
3.14 Server Board Replacement ........................................................................................................................................62
3.14.1 Server Board Removal .................................................................................................................................................62
3.14.2 Server Board Installation ............................................................................................................................................65
3.15 Power Supply Replacement.......................................................................................................................................68
3.16 System Fan Replacement ........................................................................................................................................... 69
3.16.1 Replacing 80-mm System Fans................................................................................................................................69
3.16.2 Replacing 40mm System Fans .................................................................................................................................70
3.17 U.2 Backplane Replacement –Chassis VP3U2HAC21W0 ............................................................................72
3.17.1 U.2 Backplane Removal...............................................................................................................................................72
3.17.2 U.2 Backplane Installation..........................................................................................................................................74
3.18 Power Distribution Boards Replacement.............................................................................................................76
3.18.1 Replacing Primary Power Distribution Board –Chassis VP3U2HAC21W0............................................76
3.18.2 Rear Drive Bay Assembly Removal.........................................................................................................................77
3.18.3 Front Drive Bay Assembly Removal. ......................................................................................................................79
3.18.4 Power Bus Bars and Primary PDB Removal ........................................................................................................81
3.18.5 Primary PDB and Power Bus Bars Installation ...................................................................................................84
3.18.6 Front Drive Bay Assembly Installation ..................................................................................................................86
3.18.7 Rear Drive Bay Assembly Installation....................................................................................................................88
3.18.8 Replacing Secondary Power Distribution Board –Chassis VP3U2HAC21W0......................................91
3.19 Midplane Replacement –Chassis VP3E1HAC21W0 .......................................................................................95
4. System Packaging Assembly Instructions........................................................................................................ 104
Appendix A. Getting Help ........................................................................................................................................ 108
Appendix B. Product Safety –Multi-Language................................................................................................... 109
Appendix C. Additional References ...................................................................................................................... 125
Appendix D. Glossary ............................................................................................................................................... 127

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List of Figures
Figure 1. Compute Module Identification –Back View..............................................................................................................15
Figure 2. Front Components Identification –Systems Configured with Chassis VP3U2HAC21W0 ......................15
Figure 3. Storage Drive Bays Identification –Systems Configured with Chassis VP3U2HAC21W0 ......................16
Figure 4. Front Components Identification –Systems Configured with Chassis VP3E1HAC21W0.......................16
Figure 5. Chassis Front Panel Features............................................................................................................................................17
Figure 6. Server Chassis Component Identification –VP3U2HAC21W0 Chassis ..........................................................18
Figure 7. Server Chassis Component Identification –VP3E1HAC21W0 ...........................................................................19
Figure 8. 1U Compute Module External I/O Feature Identification......................................................................................20
Figure 9. Compute Module Control Panel Features ...................................................................................................................20
Figure 10. I/O Breakout Cable Connector Identification ..........................................................................................................20
Figure 11. Compute Module Component Identification...........................................................................................................21
Figure 12. Intel® Server Board D40AMP1SB Feature Identification.....................................................................................21
Figure 13. System Directional Reference........................................................................................................................................22
Figure 14. Rail Kit - Inner Rail Removal............................................................................................................................................24
Figure 15. Rail Kit –Re-position Middle Rail..................................................................................................................................24
Figure 16. Rail Kit –Attaching Inner Rail to Chassis.................................................................................................................... 25
Figure 17. Rail Kit - Installing Rail to Mounting Posts................................................................................................................26
Figure 18. Installing Chassis into Rack............................................................................................................................................. 27
Figure 19. Securing Chassis in Rack ..................................................................................................................................................28
Figure 20. Exposing Chassis from Rack ...........................................................................................................................................28
Figure 21. Removing Front Cover Screws.......................................................................................................................................29
Figure 22. Removing Front Cover.......................................................................................................................................................29
Figure 23. Installing Front Cover ........................................................................................................................................................30
Figure 24. Removing Back Cover Screws ........................................................................................................................................31
Figure 25. Removing Chassis Back Cover .......................................................................................................................................31
Figure 26. Installing Chassis Back Cover .........................................................................................................................................32
Figure 27. Installing Back Cover Screws..........................................................................................................................................32
Figure 28. Removing Compute Module...........................................................................................................................................33
Figure 29. Installing Compute Module.............................................................................................................................................34
Figure 30. Removing Air Duct...............................................................................................................................................................35
Figure 31. Installing Air Duct ................................................................................................................................................................35
Figure 32. 1U Heat Sinks........................................................................................................................................................................36
Figure 33. 1U Heat Sinks Installed in Module ...............................................................................................................................36
Figure 34. Processor Components and Processor Socket Reference Diagram..............................................................37
Figure 35. Installing Processor Carrier Clip onto Processor –Part 1...................................................................................38
Figure 36. Installing Processor Carrier Clip onto Processor –Part 2...................................................................................38
Figure 37. Handling Heat Sink .............................................................................................................................................................39
Figure 38. Pin 1 Indicator of Processor Carrier Clip....................................................................................................................39
Figure 39. Socket Protective Cover Removal ................................................................................................................................40