Kontron COMe-cHL6 User manual

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COMe-cHL6
Document Revision 2.0

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» Table of Contents «
1User Information................................................................................................ 5
1.1 Revision History.................................................................................................................................................. 5
1.2 About This Document .......................................................................................................................................... 5
1.3 Copyright Notice ................................................................................................................................................. 5
1.4 Trademarks ......................................................................................................................................................... 5
1.5 Standards ........................................................................................................................................................... 5
1.6 Warranty ............................................................................................................................................................. 6
1.7 Technical Support ............................................................................................................................................... 6
2Introduction....................................................................................................... 7
2.1 Product Description ............................................................................................................................................ 7
2.2 Naming clarification ........................................................................................................................................... 8
2.3 Understanding COM Express® Functionality ....................................................................................................... 8
2.4 COM Express® Documentation ............................................................................................................................ 9
2.5 COM Express® Benefits ....................................................................................................................................... 9
3Product Specification ....................................................................................... 10
3.1 Module definition ............................................................................................................................................. 10
3.2 Functional Specification ....................................................................................................................................11
3.3 Block Diagram.................................................................................................................................................. 18
3.4 Accessories ....................................................................................................................................................... 19
3.5 Electrical Specification..................................................................................................................................... 20
3.5.1 Supply Voltage.................................................................................................................................................. 20
3.5.2 Power Supply Rise Time..................................................................................................................................... 20
3.5.3 Supply Voltage Ripple ....................................................................................................................................... 20
3.5.4 Power Consumption .......................................................................................................................................... 20
3.5.5 ATX Mode .......................................................................................................................................................... 21
3.5.6 Single Supply Mode........................................................................................................................................... 21
3.6 Power Control ................................................................................................................................................... 22
3.7 Environmental Specification ............................................................................................................................. 23
3.7.1 Temperature Specification ................................................................................................................................ 23
3.7.2 Humidity........................................................................................................................................................... 23
3.8 Standards and Certifications ............................................................................................................................. 24
3.9 MTBF ................................................................................................................................................................. 26
3.10 Mechanical Specification .................................................................................................................................. 27
3.11 Module Dimensions........................................................................................................................................... 28
3.12 Thermal Management, Heatspreader and Cooling Solutions ............................................................................. 29
4Features and Interfaces.................................................................................... 30
4.1 S5 Eco Mode...................................................................................................................................................... 30
4.2 LPC.................................................................................................................................................................... 31
4.3 Serial Peripheral Interface (SPI) ....................................................................................................................... 32
4.4 SPI boot............................................................................................................................................................ 32

4
COMe-cHL6 /
4.5 M.A.R.S............................................................................................................................................................. 34
4.6 UART................................................................................................................................................................. 35
4.7 Fast I2C............................................................................................................................................................. 36
4.8 Dual Staged Watchdog Timer............................................................................................................................. 37
4.9 Intel® Fast Flash Standby™ / Rapid Start Technology™ .................................................................................... 38
4.10 Speedstep Technology ...................................................................................................................................... 40
4.11 C-States .............................................................................................................................................................41
4.12 Hyper Threading ............................................................................................................................................... 42
4.13 Intel® Turbo Boost Technology and AVX..................................................................................................................43
4.14 Display Configuration ....................................................................................................................................... 44
4.15 Hybrid Graphics / Multi-monitor ....................................................................................................................... 47
4.16 Intel® vPro™ technology .................................................................................................................................. 48
4.17 ACPI Suspend Modes and Resume Events .......................................................................................................... 49
5System Resources.............................................................................................50
5.1 Interrupt Request (IRQ) Lines ........................................................................................................................... 50
5.2 Memory Area......................................................................................................................................................51
5.3 I/O Address Map ................................................................................................................................................51
5.4 Peripheral Component Interconnect (PCI) Devices........................................................................................... 52
5.5 Internal I2C Bus................................................................................................................................................ 52
5.6 External I2C Bus................................................................................................................................................ 52
5.7 System Management (SM) Bus .......................................................................................................................... 53
6Connectors .......................................................................................................54
6.1 Connector Location........................................................................................................................................... 54
7Pinout List........................................................................................................ 55
7.1 General Signal Description................................................................................................................................ 55
7.2 Connector X1A Row A ........................................................................................................................................ 56
7.3 Connector X1A Row B ........................................................................................................................................ 58
7.4 Connector X1B Row C ........................................................................................................................................ 60
7.5 Connector X1B Row D ........................................................................................................................................ 62
8BIOS Operation.................................................................................................64
8.1 Determining the BIOS Version........................................................................................................................... 64
8.2 BIOS Update ..................................................................................................................................................... 64
8.3 POST Codes ....................................................................................................................................................... 64
8.4 Setup Guide ...................................................................................................................................................... 65
8.5 BIOS Setup........................................................................................................................................................ 66
8.5.1 Main.................................................................................................................................................................. 66
8.5.2 Advanced .......................................................................................................................................................... 72
8.5.3 Security .......................................................................................................................................................... 109
8.5.4 Boot.................................................................................................................................................................111
8.5.5 Exit ..................................................................................................................................................................112

COMe-cHL6 / User Information
5
1User Information
1.1 Revision History
Version
Brief Description of Change
Date of Issue
110
Initial version
2.0
Removed ADA-LVDS-DVI 18-bit and 24-bit accessories
Updates SM bus 8-bit address information for the hardware monitor
Included a Revision History table
2017-Aug-10
1.2 About This Document
This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.
1.3 Copyright Notice
Copyright © 2003-2014 Kontron Europe GmbH
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.
1.4 Trademarks
The following lists the trademarks of components used in this board.
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Corp.
» Microsoft is a registered trademark of Microsoft Corp.
» Intel is a registered trademark of Intel Corp.
» All other products and trademarks mentioned in this manual are trademarks of their respective owners.
1.5 Standards
Kontron Europe GmbH is certified to ISO 9000 standards.

6
COMe-cHL6 / User Information
1.6 Warranty
For this Kontron Europe GmbH product warranty for defects in material and workmanship exists as long as the warranty
period, beginning with the date of shipment, lasts. During the warranty period, Kontron Europe GmbH will decide on its
discretion if defective products are to be repaired or replaced.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
Warranty does not apply for defects arising/resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, as well as the operation outside of the product´s environmental specifications and
improper installation and maintenance.
Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.
1.7 Technical Support
Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to make our product easy to use and will help you use our products in your systems.
Please consult our Website at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.

7
COMe-cHL6 / Introduction
2Introduction
2.1 Product Description
Tailored for most robust and maintenance-free system designs in the high performance class of embedded systems
Kontron is extending the usage model of the 4th generation Intel® Core® processor technology to compact and rugged
fanless options with the launch of the Kontron COMe-cHL6 COM Express® compact Computer-on-Modules. The new
modules in the compact form factor (95 x 95 mm) are equipped with the ULT versions of the 4th generation Intel® Core™
i7/i5/i3 & Celeron® processor, formerly codenamed ‘Haswell-U’ . ULT stands for ultra-low TDP which limits the power
consumption of these new Computer-on-Modules down to options that are tailored for fanless and fully enclosed system
designs. The modules also cater for the most robust and maintenance-free system designs in the high performance class
of embedded systems, and consequently help engineers to reduce the systems’ bill of materials as well as the customers’
total cost of ownership.
Application areas can be found in all the performance-hungry but power-restricted, multi-touch multi-display systems
such as HMIs in automation, medical imaging, digital signage and point of sale as well as surveillance and security. The
modules also address the fast-growing, industrial-grade tablet PC market for various industries including logistics, retail
and manufacturing.
The Kontron COMe-cHL6 COM Express® compact Computer-on-Modules with pin-out type 6 are highly scalable to cover a
broad application range from high-end 1.7 GHz dual-core Intel® Core™ i7 processor performance to cost-optimized
Intel® Celeron® designs. With Intel® AVX2 and OpenCL 1.2 they boost floating point performance as well as parallel
processing density. Up to 16 GB of energy-efficient DDR3L RAM (8GB memory down + 8GB SODIMM) satisfy even highest
memory demands. State-of-the-art multi-display designs are enabled by three independent display outputs, executed via
2x DP++ (DisplayPort, HDMI, DVI) and 1x Dual Channel LVDS. Standard interfaces include 4x SATA 6Gbit/s ports, Gigabit
Ethernet, 2x USB 3.0 ports and 8x USB 2.0.Application-specific extensions on the carrier board are connected via 4x PCIe
x1 or 1x PCI x4. An additional PCIe x2 interface is possible with disabled GbE functionality. The wide-range (8.5 - 20V)
power supply and MARS smart battery support simplify mobile and battery-powered designs.

8
COMe-cHL6 / Introduction
2.2 Naming clarification
COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.
» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm)
» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm)
» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm)
The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (#) followed by the CPU Name.
2.3 Understanding COM Express®Functionality
All Kontron COM Express® basic and compact modules contain two 220pin connectors; each of it has two rows called Row
A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out type:
Feature
Pin-Out Type 1
Pin-Out Type 10
Pin-Out Type 2
Pin-Out Type 6
HD Audio
1x
1x
1x
1x
Gbit Ethernet
1x
1x
1x
1x
Serial ATA
4x
4x
4x
4x
Parallel ATA
-
-
1x
-
PCI
-
-
1x
-
PCI Express x1
6x
6x
6x
8x
PCI Express x16 (PEG)
-
-
1x
1x
USB Client
1x
1x
-
-
USB 2.0
8x
8x
8x
8x
USB 3.0
-
2x
-
4x
VGA
1x
-
1x
1x
LVDS
Dual Channel
Single Channel
Dual Channel
Dual Channel
DP++ (SDVO/DP/HDMI/DVI)
1x optional
1x
3x shared with PEG
3x
LPC
1x
1x
1x
1x
External SMB
1x
1x
1x
1x
External I2C
1x
1x
1x
1x
GPIO
8x
8x
8x
8x
SDIO shared w/GPIO
1x optional
1x optional
-
1x optional
UART (2-wire COM)
-
2x
-
2x
FAN PWM out
-
1x
-
1x

9
COMe-cHL6 / Introduction
2.4 COM Express® Documentation
This product manual serves as one of three principal references for a COM Express® design. It documents the
specifications and features of COMe-cHL6. Additional references are available at your Kontron Support or at PICMG®:
» The COM Express® Specification defines the COM Express® module form factor, pin-out, and signals. This document
is available at the PICMG® website by filling out the order form.
» The COM Express® Design Guide by PICMG® serves as a general guide for baseboard design, with a focus on
maximum flexibility to accommodate a wide range of COM Express® modules.
2.5 COM Express® Benefits
COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout which carry a specified set of signals. Each COM is based on
the COM Express® specification. This standardization allows designers to create a single-system baseboard that can
accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pin-outs. This flexibility can
differentiate products at various price/performance points, or when designing future proof systems that have a built-in
upgrade path. The modularity of a COM Express® solution also ensures against obsolescence when computer technology
evolves. A properly designed COM Express® baseboard can work with several successive generations of COM Express®
modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.
Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.

COMe-cHL6 / Product Specification
10
3Product Specification
3.1 Module definition
The COM Express® compact sized Computer-on-Module COMe-cHL6 (CHL6) follows pin-out Type 6 and is compatible to
PICMG specification COM.0 Rev 2.1. The COMe-cHL6 based on latest Shark Bay ULT platform is available in different
variants to cover the demand of different performance, price and power:
Commercial grade modules (0°C to 60°C operating)
Product Number
Product Name
Processor
Memory Down
SATA
36014-4000-17-7
COMe-cHL6 i7-4650U 4GB
Intel® Core™ i7-4650U
4GB
4x 6Gb/s
36014-0000-17-7
COMe-cHL6 i7-4650U
Intel® Core™ i7-4650U
-
4x 6Gb/s
36014-4000-19-5
COMe-cHL6 i5-4300U 4GB
Intel® Core™ i5-4300U
4GB
4x 6Gb/s
36014-0000-19-5
COMe-cHL6 i5-4300U
Intel® Core™ i5-4300U
-
4x 6Gb/s
36014-4000-17-3
COMe-cHL6 i3-4010U 4GB
Intel® Core™ i3-4010U
4GB
4x 6Gb/s
36014-0000-17-3
COMe-cHL6 i3-4010U
Intel® Core™ i3-4010U
-
4x 6Gb/s
36014-0000-16-1
COMe-cHL6 2980U
Intel® Celeron 2980U
-
2x 6Gb/s
Extended temperature grade modules (E1, -25°C to 75°C operating)
The COMe-cHL6 is available for extended temperature grade on request. General capability was tested for following
options:
» CPU: all
» Memory: all DDR3L
» VCC: 12V only, no support for Wide-Range Input
Industrial temperature grade modules (XT, -40°C to 85°C operating)
Modules for E2 temperature range are available project based only, please contact your local sales or support for further
details. General capability was tested for following options:
» CPU: all
» Memory: E2 DDR3L memory only (97015-xxxx-16-3) and industrial type memory down
» VCC: 12V only, no support for Wide-Range Input

COMe-cHL6 / Product Specification
11
3.2 Functional Specification
Processor
The 22nm Intel® 4th Gen Core™ i7/i5/i3/Celeron® embedded (Haswell-U (ULT)) CPU family with 40x24mm package size
(BGA1168 socket) supports:
» Intel® Turbo Boost Technology 2.01
» Intel® 64
» Intel® Virtualization Technology (VT-x)
» Intel® Virtualization Technology for Directed I/O (VT-d)
» AES New Instructions (AES-NI)
» Intel® Hyper-Threading Technology
» Enhanced Intel SpeedStep® Technology
» Idle States (C-States)
» Intel® Smart Cache
» Thermal Monitoring Technologies
» Intel® Fast Memory Access
» Intel® Flex Memory Access
» Integrated Intel® HD Graphics with Dynamic Frequency
» Configurable Thermal Design Power (cTDP)
» Intel® Rapid Storage Technology
» Intel® Smart Connect Technology
Optional available (with customized BIOS):
» Intel® vPRO™ Technology including:
» Intel® Active Management Technology (AMT)
» Intel® Trusted Execution Technology (TXT)
» Advanced Encryption Standard Instructions (AES-NI)

COMe-cHL6 / Product Specification
12
The integrated Intel® HD Graphics xxxx supports:
» GraphicsTechnology GT2 with 20 Execution Units or GT3 with 40 Execution Units
» Intel® Quick Sync Video
» Intel® InTru™ 3D Technology
» Intel® Wireless Display
» Intel® Flexible Display Interface (Intel® FDI)
» Intel® Clear Video HD Technology
» Intel® Graphics Render C-State RC6
» Intel® Smart 2D Display Technology (S2DDT)
» 3 simultaneous displays (Win7/8 and Linux)
» Hybrid Multi Monitor with 2 internal and 2 external displays
» Video Decode for AVC/H.264/VC-1/MPEG-2
» Video Encode for AVC/H.264/MPEG-2
» Blu-ray Playback
The integrated Intel® HD Graphics supports:
» GraphicsTechnology GT1 with 10 Execution Units
» Dual Display
» Video Decode for AVC/H.264/VC-1/MPEG-2
» Video Encode for AVC/H.264/MPEG-2
» Blu-ray Playback

COMe-cHL6 / Product Specification
13
Intel®
Core™
Core™
Core™
Core™
-
i7-4650U
i5-4300U
i3-4010U
Celeron 2980U
# of Cores
2
2
2
2
# of Threads
4
4
4
2
TDP Core frequency (HFM)
1700MHz
1900MHz
1700MHz
1600MHz
Max Turbo Frequency 1 core
3300MHz
2900MHz
-
-
Max Turbo all cores
2900MHz
2500MHz
-
-
LFM/LPM Frequency
800MHz
800MHz
800MHz
800MHz
Bus/Core Ratio
8 - 17
8 - 19
8 - 17
8 - 16
TjMax
100°C
100°C
100°C
100°C
Thermal Design Power (TDP)
15W
15W
15W
15W
cTDP-Down
11.5W (800MHz)
11.5W (800MHz)
11.5W (800MHz)
-
cTDP-Up
25W (2.3GHz)
25W (2.5GHz)
-
-
Power Limit 2 (PL2 max)
31.25W
31.25W
25W
18.75W
C-States
C0-C10
C0-C10
C0-C10
C0-C3
Smart Cache
4MB
3MB
3MB
2MB
Min Memory Type
DDR3L-1066
DDR3L-1066
DDR3L-1066
DDR3L-1066
Max Memory Type
DDR3L-1600
DDR3L-1600
DDR3L-1600
DDR3L-1600
Max Memory Size
8+4GB
8+4GB
8+4GB
8+4GB
# of Memory Channels
2
2
2
2
Graphics Model
HD5000
HD4400
HD4400
HD
GFX Base Frequency
200MHz
200MHz
200MHz
200MHz
GFX Max Dynamic Frequ.
1100MHz
1100MHz
1000MHz
1000MHz
GFX Technology
GT3 40EU
GT2 20EU
GT2 20EU
GT1 10EU
Quick Sync Video
Yes
Yes
Yes
-
InTru™ 3D
Yes
Yes
Yes
-
Wireless Display
Yes
Yes
Yes
-
Clear Video HD
Yes
Yes
Yes
-
vPRO™ (optional)
Yes
Yes
-
-
TXT (optional)
Yes
Yes
-
-
AES-NI (optional)
Yes
Yes
Yes
-
VT-x
Yes
Yes
Yes
Yes
VT-d
Yes
Yes
Yes
-
PCI Express Graphics x16
-
-
-
-

COMe-cHL6 / Product Specification
14
Memory
Sockets
1x DDR3L SODIMM, 1x memory down
Memory Type
DDR3L-1600
Maximum Size
1-8GB SODIMM, 2-4GB memory down
Technology
Dual Channel
Chipset
The integrated Intel® Platform Controller Hub LynxPoint-LP supports:
» PCI Express Revision 2.0
» PCI Express Configurations x1, x2, x4
» Intel® Virtualization Technology for Directed I/O (VT-d)
» Intel® Trusted Execution Technology (TXT)
» Intel® vPro Technology (optional)
» Intel® Active Management Technology 9.0 (optional)
» Intel® Anti-Theft Technology
» Intel® Rapid Storage Technology
» Intel® Smart Response Technology
HighSpeed I/O Port Configuration
Internal
Port Usage
COMe
Port1
USB3 #1
USB #0 = USB3.0
Port2
USB3 #2
USB #1 = USB3.0
Port3
PCIe #1 or USB3 #3
PCIe #0
Port4
PCIe #2 or USB3 #4
PCIe #1
Port5
PCIe #3
PCIe #2
Port6
PCIe #4
PCIe #3
Port7
PCIe #5L0
PCIe #4
Port8
PCIe #5L1
PCIe #5 (x2 only with #4)
Port9
PCIe #5L2
Ethernet (PCIe #6 w/o LAN)
Port10
PCIe #5L3
not used (PCIe #7 w/o LAN)
Port11
PCIe #6L0 or SATA6 #3
SATA #3 (6Gbps)
Port12
PCIe #6L1 or SATA6 #2
SATA #2 (6Gbps)
Port13
PCIe #6L2 or SATA6 #1
SATA #1 (6Gbps)
Port14
PCIe #6L3 or SATA6 #0
SATA #0 (6Gbps)
x2 Port PCIe #4 + #5 are only available with Softstrap option (modified Flash descriptor)
which disables onboard LAN (PCIe #5L2)

COMe-cHL6 / Product Specification
15
Graphics Core
The integrated Intel® HD/HD4400/HD5000 (Gen7.5) supports:
Graphics Core Render Clock
GT1/GT2; Base clock: 200 MHz; GT Turbo: up to 1100 MHz
Execution Units / Pixel Pipelines
GT2: 20EU / GT1: 10EU
Max Graphics Memory
1720MB
GFX Memory Bandwidth (GB/s)
25.6
GFX Memory Technology
DVMT
API (DirectX/OpenGL)
11.1 / 4.0 + OCL 1.2
Shader Model
5.0
Hardware accelerated Video
MPEG2, VC-1, AVC, Blu-ray (+3D)
Independent/Simultaneous Displays
3
Display Port
DP 1.2 / eDP 1.3
HDCP support
HDCP 1.4a
Monitor output
CRT max Resolution
TV out:
-
-
LVDS
LVDS Bits/Pixel
1x18/24, 2x18/24 with DP2LVDS
LVDS Bits/Pixel with dithering
-
LVDS max Resolution:
1920x1200
PWM Backlight Control:
YES
Supported Panel Data:
JILI2/JILI3/EDID/DID
Display Interfaces
Discrete Graphics
-
Digital Display Interface DDI1
DP++
Digital Display Interface DDI2
DP++
Digital Display Interface DDI3
-
Maximum Resolution on DDI
HDMI: 4096x2304, DP: 3200x2000
Storage
onboard SSD
-
SD Card support
-
IDE Interface
-
Serial-ATA
4x SATA 6Gb/s
SATA AHCI
AHCI with NCQ, HotPlug, Staggered Spinup, eSATA, PortMultiplier
SATA RAID
0, 1, 5, 10
If SATA AHCI or RAID is disabled in setup, the SATA Interface only supports 3Gb/s transfer
rate and Staggered Spin-Up. To configure a RAID enable RAID support in BIOS Chipset/SATA
settings, connect at least two hard drives and enter the RAID Option ROM by pressing
'CTRL'+'I'

COMe-cHL6 / Product Specification
16
Connectivity
USB 2.0
8x USB 2.0
USB 3.0
2x USB 3.0
USB Client
-
PCI
-
PCI External Masters
-
PCI Express
4x PCIe x1 Gen2
Max PCI Express
8x PCIe w/o LAN
PCI Express x2/x4 configuration
YES (Softstrap option)
Ethernet
10/100/1000 Mbit
Ethernet controller
Intel® i218-LM (Clarkville)
PCI Express Configuration
By default, the COMe-cHL6 supports x1 PCIexpress lane configuration only (Configuration 0). Following x2/x4
configurations are available via Management Engine Softstrap Options with a customized Flash Descriptor.
COMe PCIe
Port #0
Port #1
Port #2
Port #3
Port #4
Port #5 Port #6
Port #7
Configuration0
x1
x1
x1
x1
-
-
-
-
Configuration1
x1
x1
x1
x1
x1
-
-
-
Configuration2
x2
x1
x1
-
-
-
-
Configuration3
x2
x2
x2
-
-
Configuration4
x2
x1
x1
x2
-
-
Configuration5
x4
x4
Ethernet
The Intel® i218-LM (Clarkville) ethernet supports:
» Jumbo Frames - 9K
» MACsec IEEE 802.1 AE
» Time Sync Protocol Indicator
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
» IEEE1588
Due to internal chipset configuration the LynxPoint-LP only supports up to 4 USB Hubs
Configuration0 is default setting. Other configurations are available via modified
FlashDescriptor with customized BIOS versions. For configurations 2 to 5 the onboard
Ethernet will be disabled.

COMe-cHL6 / Product Specification
17
Misc Interfaces and Features
Supported BIOS Size/Type
16MB SPI
Audio
HD Audio + DisplayPort dual stream
Onboard Hardware Monitor
Nuvoton NCT7802Y
Trusted Platform Module
Atmel AT97SC3204
Miscellaneous
2x UART / PWM FAN / optional eDP
Kontron Features
External I2C Bus
Fast I2C, MultiMaster capable
Smart Battery (M.A.R.S.) support
YES
Embedded API
KEAPI3
Custom BIOS Settings / Flash Backup
YES
Watchdog support
Dual Staged
Additional features
» All solid capacitors (POSCAP). No tantalum capacitors used.
» Optimized RTC Battery monitoring to secure highest longevity
» Real fast I2C with transfer rates up to 40kB/s.
» Discharge logic on all onboard voltages for highest reliability
Power Features
Singly Supply Support
YES
Supply Voltage
8.5V - 20V
ACPI
ACPI 4.0
S-States
S0, S3, S4, S5
S5 Eco Mode
YES
Misc Power Management
cTDP @ i7/i5/i3
Power Consumption and Performance
Full Load Power Consumption
14 - 30W
Kontron Performance Index
41000 - 65269
Kontron Performance/Watt
2009 - 2997
*Measured Values. Please note the maximum Power Consumption with activated Turbo Mode in chapter Turbo 2.0
Detailed Power Consumption measurements in all states and benchmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer
Section.

COMe-cHL6 / Product Specification
18
3.3 Block Diagram
Standard
component
Connector Option
Gen7.5
iGFX
Intel® 4th Generation Core
ULT (U-Series) i7/i5/i3/Celeron
With integrated LP-PCH
xHCI
GBE MAC
EHCI1
DP++
eDP x2
SPD
(USB3.0)
SPD
(USB2.0)
(USB 2.0)
FAN1
JTAG
GBLan
Intel®
I218LM
HWM
DDR3L SODIMM
eDP2LVDS
NXP3460
TPM
HWM
NCT7802
SPI
BIOS Flash
S5eco
LPC2I2C
Watchdog
GPIO Buffer
UART
Embedded Controller
(CPLD EPM1270)
Power sequencing
VCC
VBAT
5VSB VCC

COMe-cHL6 / Product Specification
19
3.4 Accessories
Product specific accessories
Product Number
Heatspreader and Cooling Solutions
Comment
36014-0000-99-0
HSP COMe-cHL6 thread
For all CPUs and temperature grades
36014-0000-99-1
HSP COMe-cHL6 through
For all CPUs and temperature grades
General accessories
Part Number
COMe pin-out Type 6 compatible
accessories
Project Code
Comment
38114-0000-00-0
COM Express® Reference Carrier Type 6
ADAS
mITX Carrier with 8mm COMe connector
38106-0000-00-0
COM Express® Eval Carrier Type 6
Topanga Canyon
ATX Carrier with 5mm COMe connector
96007-0000-00-3
ADA-PCIe-DP
APDP
PCIe x16 to DP Adapter for Evaluation Carrier
96007-0000-00-7
ADA-Type6-DP3
DVO6
(sandwich) Adapter Card for 3x DisplayPort
96006-0000-00-2
COMe POST T6
NFCB
POST Code / Debug Card
38019-0000-00-0
ADA-COMe-Height-dual
EERC
Height Adapter
38106-0000-00-S
COMe Eval Starterkit T6
Topanga Canyon
Starterkit with COMe Evaluation Carrier T6
38114-0000-00-S
COMe Ref. Starterkit T6
ADAS
Starterkit with COMe Reference Carrier T6
Part Number
Mounting
Comment
38017-0000-00-5
COMe Mount KIT 5mm 1set
Mounting Kit for 1 module including screws for 5mm connectors
38017-0100-00-5
COMe Mount KIT 5mm 100sets
Mounting Kit for 100 modules including screws for 5mm connectors
38017-0000-00-0
COMe Mount KIT 8mm 1set
Mounting Kit for 1 module including screws for 8mm connectors
38017-0100-00-0
COMe Mount Kit 8mm 100sets
Mounting Kit for 100 modules including screws for 8mm connectors
Part Number
Cooling Solutions
Comment
36099-0000-99-0
COMe Active Uni Cooler
for CPUs up to 20W TDP, to be mounted on HSP
36099-0000-99-1
COMe Passive Uni Cooler
for CPUs up to 10W TDP, to be mounted on HSP
Part Number
Display Adapter
Comment
96006-0000-00-8
ADA-DP-LVDS
DP to LVDS adapter
96082-0000-00-0
KAB-ADAPT-DP-DVI
DP to DVI adapter cable
96083-0000-00-0
KAB-ADAPT-DP-VGA
DP to VGA adapter cable
96084-0000-00-0
KAB-ADAPT-DP-HDMI
DP to HDMI adapter cable
Part Number
Cables
Comment
96079-0000-00-0
KAB-HSP 200mm
Cable adapter to connect FAN to module (COMe basic/compact)
96079-0000-00-2
KAB-HSP 40mm
Cable adapter to connect FAN to module (COMe basic/compact)
Part Number
Miscellaneous Comment
18029-0000-00-0
MARS Smart Battery Kit
Starterkit Kontron Mobile Application platform for Rechargeable Systems
Part Number
DDR3L SODIMM, commercial temperature grade
97015-1024-16-1
DDR3L-1600 SODIMM 1GB
97015-2048-16-1
DDR3L-1600 SODIMM 2GB
97015-4096-16-1
DDR3L-1600 SODIMM 4GB
97015-8192-16-1
DDR3L-1600 SODIMM 8GB
Part Number
DDR3L SODIMM, industrial temperature grade
97015-1024-16-3
DDR3L-1600 SODIMM 1GB E2
97015-2048-16-3
DDR3L-1600 SODIMM 2GB E2
97015-4096-16-3
DDR3L-1600 SODIMM 4GB E2
97015-8192-16-3
DDR3L-1600 SODIMM 8GB E2

COMe-cHL6 / Product Specification
20
3.5 Electrical Specification
3.5.1 Supply Voltage
Following supply voltage is specified at the COM Express® connector:
VCC:
8.5V - 20V
Standby:
5V DC +/- 5%
RTC:
2.5V - 3.47V
3.5.2 Power Supply Rise Time
» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point
following the ATX specification
3.5.3 Supply Voltage Ripple
» Maximum 100 mV peak to peak 0 –20 MHz
3.5.4 Power Consumption
The maximum Power Consumption of the different COMe-cHL6 variants is 14 - 30W (100% CPU load on all cores; 90°C CPU
temperature). Further information with detailed measurements are available in Application Note KEMAP054 available on
EMD Customer Section. Information there is available after registration.
- 5V Standby voltage is not mandatory for operation.
- Extended Temperature (E1) variants are validated for 12V supply only