Kontron COMe-m4AL10 User manual


USER GUIDE
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COMe-m4AL10
Doc. User Guide, Rev. 1.1
Doc. ID: 1065-8037

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
COME
-M4AL10 - USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this user guide may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee
on the part of Kontron with respect to technical processes described in the user guide or any product characteristics
set out in the user guide. Kontron assumes no responsibility or liability for the use of the described product(s),
conveys no license or title under any patent, copyright or mask work rights to these products and makes no
representations or warranties that these products are free from patent, copyright or mask work right infringement
unless otherwise specified. Applications that are described in this user guide are for illustration purposes only.
Kontron makes no representation or warranty that such application will be suitable for the specified use without
further testing or modification. Kontron expressly informs the user that this user guide only contains a general
description of processes and instructions which may not be applicable in every individual case. In cases of doubt,
please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this user guide is
constantly being updated in line with the technical alterations and improvements made by Kontron to the products
and thus this user guide only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2019 by Kontron S&T AG
Kontron S&T AG
Lise-Meitner-Str. 3-5
86156 Augsburg
Germany
www.kontron.com

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Intended Use
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE
OR RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR
COMMUNICATION SYSTEMS FOR AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE
SUPPORT OR LIFE SUSTAINING APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A
HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE OF
PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR
ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at
your risk. To minimize the risks associated with your products and applications, you should provide adequate design
and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security
related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron
hardware or software components incorporated in your systems) meet all applicable requirements. Unless otherwise
stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities and cannot
therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or for resale as
device in High Risk Applications. All application and safety related information in this document (including application
descriptions, suggested safety measures, suggested Kontron products, and other materials) is provided for reference
only.

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Revision History
Revision Brief Description of Changes Date of Issue Author/
Editor
1.0 Initial version 2019-Nov-05 CW
1.1 Removed the Power (Max.) from Table 6 2019-Dec-17 CW
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about
warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/terms-
and-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order
Terms & Conditions. Visit http://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit
our website CONTACT US.
Customer Support
Find Kontron contacts by visiting: http://www.kontron.com/support.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths into
a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product
expertise coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace of
mind to build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron
training academy, and more visit http://www.kontron.com/support-and-services/services.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
Kontron support. Detail any errors you find. We will correct the errors or problems as soon as possible and post the
revised user guide on our website.

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Symbols
The following symbols may be used in this user guide
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
NOTICE indicates a property damage message.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60
V) when touching
products or parts of products
. Failure to observe the precautions indicated and/or
prescribed by the law may endanger your life/health and/or result in damage to your
material.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive
to static electricity. Care must therefore be taken during all handling operations and
inspections of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
Laser!
This symbol inform of the risk of exposure to laser beam and light emitting devices (LEDs)
from an electrical device. Eye protection per manufacturer notice shall review before
servicing.
This symbol indicates general information about the product and the user guide.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.

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For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its
compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life
expectancy of your product can be drastically reduced by improper treatment during unpacking and installation.
Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are
requested to conform with the following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the
product’s main disconnect device.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious
electrical shock hazards can exist during all installation, repair, and maintenance operations
on this product. Therefore, always unplug the power cable and any other cables which
provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first
cable to be connected when performing installation or removal procedures on this product.
Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is
otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not
guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands
or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices,
jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed
on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the
batteries or conductive circuits on the product.

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Lithium Battery Precautions
If your product is equipped with a lithium battery, take the following precautions when replacing the battery.
Danger of explosion if the battery is replaced incorrectly.

Replace only with same or equivalent battery type recommended by the manufacturer.

Dispose of used batteries according to the manufacturer’s instructions.
General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or
modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received
from Kontron Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific
environmental requirements. This also applies to the operational temperature range of the specific board version
that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the
present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship
the product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with
environmental laws, regulations, and other environmentally oriented requirements. For more information regarding
Kontron’s quality and environmental responsibilities, visit http://www.kontron.com/about-kontron/corporate-
responsibility/quality-management.
Disposal and Recycling
Kontron’s products are manufactured to satisfy environmental protection requirements where possible. Many of the
components used are capable of being recycled. Final disposal of this product after its service life must be
accomplished in accordance with applicable country, state, or local laws or regulations.
WEEE Compliance
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:

Reduce waste arising from electrical and electronic equipment (EEE)

Make producers of EEE responsible for the environmental impact of their products, especially when the product
become waste

Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound environmental
disposal of EEE

Improve the environmental performance of all those involved during the lifecycle of EEE
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive
You are encouraged to return our products for proper disposal.

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Table of Contents
Symbols.................................................................................................................................................................................................................6
For Your Safety ...................................................................................................................................................................................................7
High Voltage Safety Instructions ..................................................................................................................................................................7
Special Handling and Unpacking Instruction ............................................................................................................................................7
Lithium Battery Precautions.......................................................................................................................................................................... 8
General Instructions on Usage..................................................................................................................................................................... 8
Quality and Environmental Management................................................................................................................................................ 8
Disposal and Recycling.................................................................................................................................................................................... 8
WEEE Compliance.............................................................................................................................................................................................. 8
Table of Contents...............................................................................................................................................................................................9
List of Tables ......................................................................................................................................................................................................11
List of Figures....................................................................................................................................................................................................12
1/ Introduction .........................................................................................................................................................................................13
1.1. Product Description...................................................................................................................................................................................13
1.2. Product Naming Clarification ................................................................................................................................................................14
1.3. COM Express® Documentation.............................................................................................................................................................14
1.4. COM Express® Functionality .................................................................................................................................................................15
1.5. COM Express® Benefits...........................................................................................................................................................................15
2/ Product Specification .......................................................................................................................................................................16
2.1. Module Variants ........................................................................................................................................................................................16
2.2. Commercial Grade Modules (0°C to +60°C).....................................................................................................................................16
2.3. Industrial Temperature Grade Modules (E2, -40°C to +85°C)...................................................................................................16
2.4. Accessories ................................................................................................................................................................................................17
3/ Functional Specification..................................................................................................................................................................18
3.1. Block Diagram ............................................................................................................................................................................................18
3.2. Processors..................................................................................................................................................................................................19
3.3. Platform Controller Hub (PCH)............................................................................................................................................................20
3.4. System Memory.......................................................................................................................................................................................20
3.5. Digital Display Interfaces (DP/HDMI/DVI) ......................................................................................................................................20
3.6. LVDS.............................................................................................................................................................................................................20
3.7. HD Audio ......................................................................................................................................................................................................21
3.8. PCI Express (PCIE) Lanes [0-3].............................................................................................................................................................21
3.9. USB ................................................................................................................................................................................................................21
3.10. SATA...........................................................................................................................................................................................................22
3.11. Ethernet LAN (option) ........................................................................................................................................................................... 22
3.12. COMe High-speed Serial Interfaces Overview.............................................................................................................................23
3.13. Storage......................................................................................................................................................................................................23
3.14. BIOS/Software Features.....................................................................................................................................................................23
3.15. COMe Specification Features.............................................................................................................................................................24
3.16. Special Features.....................................................................................................................................................................................24
3.17. Optional Features ..................................................................................................................................................................................24
4/ Power Specification .........................................................................................................................................................................25
4.1. Power Supply Specification.................................................................................................................................................................. 25
4.1.1. Power Supply Voltage Rise Time ..................................................................................................................................................... 25
4.1.2. Power Supply Voltage Ripple ........................................................................................................................................................... 25
4.1.3. Power Supply Inrush Current ...........................................................................................................................................................26

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4.2. Power Management...............................................................................................................................................................................26
4.2.1. Power Supply Control Settings........................................................................................................................................................26
4.2.2. Power Supply Modes.......................................................................................................................................................................... 27
5/ Thermal Management.....................................................................................................................................................................29
5.1. Heatspreader Plate (HSP) Assembly and Metal Heat Slug ........................................................................................................29
5.2. Active/Passive Cooling Solutions ......................................................................................................................................................29
5.3. Operating with Kontron Heatspreader Plate (HSP) Assembly................................................................................................. 29
5.4. Operating without Kontron Heatspreader Plate (HSP) Assembly.......................................................................................... 29
5.5. Temperature Sensors ............................................................................................................................................................................30
5.6. On-board Fan Connector .......................................................................................................................................................................31
6/ Environmental Specification......................................................................................................................................................... 32
6.1.1. Humidity ...................................................................................................................................................................................................32
7/ Standards and Certifications........................................................................................................................................................33
7.1. MTBF.............................................................................................................................................................................................................34
8/ Mechanical Specification ............................................................................................................................................................... 35
8.1.1. Module Dimensions.............................................................................................................................................................................. 35
8.1.2. Module Height ....................................................................................................................................................................................... 35
8.1.3. Heatspreader and Metal Heat Slug Dimensions........................................................................................................................ 36
9/ Features and Interfaces ................................................................................................................................................................. 37
9.1. ACPI Power States................................................................................................................................................................................... 37
9.2. APPROTECT Security Solution (option) ............................................................................................................................................ 37
9.3. eMMC Flash Memory (option) ............................................................................................................................................................38
9.4. Fast I2C .......................................................................................................................................................................................................38
9.5. GPIO..............................................................................................................................................................................................................38
9.6. Hardware Monitor...................................................................................................................................................................................38
9.7. LPC................................................................................................................................................................................................................39
9.8. Real Time Clock (RTC)............................................................................................................................................................................39
9.9. Serial Peripheral Interface (SPI).........................................................................................................................................................39
9.9.1. SPI boot ....................................................................................................................................................................................................40
9.9.2. Using an External SPI Flash..............................................................................................................................................................40
9.9.3. External SPI Flash Boot on Modules with Intel® Management Engine...............................................................................41
9.10. SpeedStep™ Technology.....................................................................................................................................................................41
9.11. SD Card........................................................................................................................................................................................................41
9.12. Trusted Platform Module (TPM 2.0) ...............................................................................................................................................42
9.13. UART...........................................................................................................................................................................................................42
9.14. Watchdog Timer – Dual stage (WTD).............................................................................................................................................42
9.14.1. Watchdog Timer Signal.....................................................................................................................................................................43
9.15. XDP Debug Port (option) .....................................................................................................................................................................43
10/ System Resources ............................................................................................................................................................................44
10.1. Interrupt Request (IRQ) Lines.............................................................................................................................................................44
10.2. Memory Area...........................................................................................................................................................................................44
10.3. I/O Address Map....................................................................................................................................................................................45
10.4. Peripheral Component Interconnect (PCI) Devices....................................................................................................................46
10.5. I2C Bus.......................................................................................................................................................................................................46
10.6. System Management (SM) Bus ........................................................................................................................................................46
11/ COMe Interface Connector.............................................................................................................................................................48
11.1. Connecting the COMe Interface Connector to the Carrier Board ............................................................................................49
11.2. X1A Signals................................................................................................................................................................................................49
11.3. COMe Interface Connector (X1A ) Pin Assignment.....................................................................................................................50

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11.4. Connector X1A Row A1 - A110 .............................................................................................................................................................50
11.5. Connector X1A Row B1 – B110 .............................................................................................................................................................54
12/ UEFI BIOS..............................................................................................................................................................................................58
12.1. Starting the uEFI BIOS...........................................................................................................................................................................58
12.2. Navigating the uEFI BIOS.....................................................................................................................................................................58
12.3. Getting Help.............................................................................................................................................................................................59
12.4. Setup Menus ...........................................................................................................................................................................................59
12.4.1. Main Setup Menu ................................................................................................................................................................................60
12.4.2. Advanced Setup Menu.......................................................................................................................................................................61
12.4.3. Chipset Setup Menu ..........................................................................................................................................................................68
12.4.4. Security Setup Menu.........................................................................................................................................................................70
12.4.5. Boot Setup Menu................................................................................................................................................................................ 72
12.4.6. Save and Exit Setup Menu............................................................................................................................................................... 73
12.5. The uEFI Shell..........................................................................................................................................................................................74
12.5.1. Entering the uEFI Shell ......................................................................................................................................................................74
12.5.2. Exiting the uEFI Shell.........................................................................................................................................................................74
12.6. uEFI Shell Scripting.................................................................................................................................................................................75
12.6.1. Startup Scripting ..................................................................................................................................................................................75
12.6.2. Create a Startup Script ......................................................................................................................................................................75
12.6.3. Example of Startup Scripts ..............................................................................................................................................................75
12.7. Firmware Update ....................................................................................................................................................................................75
12.7.1. Firmware Updating Procedure ........................................................................................................................................................75
13/ Technical Support..............................................................................................................................................................................77
13.1. Returning Defective Merchandise .....................................................................................................................................................77
14/ Warranty..............................................................................................................................................................................................78
14.1. Limitation/Exemption from Warranty Obligation....................................................................................................................... 78
Appendix A: List of Acronyms..................................................................................................................................................................... 79
About Kontron ...................................................................................................................................................................................................81
List of Tables
Table 1: Type 10 and COMe-m4AL10 Functionality ...............................................................................................................................15
Table 2: Product Number for Commercial Grade Modules (0°C to +60°C operating)................................................................16
Table 3: Product Number for Industrial Grade Modules (-40°C to +85°C operating)................................................................16
Table 4: Accessories........................................................................................................................................................................................17
Table 5: Specification of COMe-m4AL10 Processor Variants............................................................................................................19
Table 6: COMe-m4AL10 Power Supply Voltage Requirements........................................................................................................ 25
Table 7: Power Supply Control Settings ..................................................................................................................................................26
Table 8: ATX Mode Settings......................................................................................................................................................................... 27
Table 9: Single Power Supply Mode Settings.........................................................................................................................................28
Table 10: Heatspreader Temperature Specifications.......................................................................................................................... 29
Table 11: Fan Connector (3-Pin) Pin Assignment ...................................................................................................................................31
Table 12: Electrical Characteristics of the Fan Connector ..................................................................................................................31
Table 13: Temperature Grade Specifications .........................................................................................................................................32
Table 14: Humidity Specification ................................................................................................................................................................32
Table 15: Standards and Certifications..................................................................................................................................................... 33
Table 16: MTBF .................................................................................................................................................................................................34
Table 17: Supported Power States Function........................................................................................................................................... 37
Table 18: Supported BIOS Features ...........................................................................................................................................................39
Table 19: SPI Boot Pin Configuration.........................................................................................................................................................40
Table 20: Supported SPI Boot Flash Types for 8-SOIC Package......................................................................................................40

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Table 21: SDIO Interface Signal Relationship to GPIO..........................................................................................................................42
Table 22: Dual Staged Watchdog Timer- Time-Out Events..............................................................................................................43
Table 23: Interrupt Requests.......................................................................................................................................................................44
Table 24: Designated Memory Location..................................................................................................................................................44
Table 25: Designated I/O Port Address....................................................................................................................................................45
Table 26: I2C Bus Port Address...................................................................................................................................................................46
Table 27: SMBus Address .............................................................................................................................................................................47
Table 28: General Signal Description........................................................................................................................................................49
Table 29: Connector X1A Row A1 to A110 Pin Assignment.................................................................................................................. 50
Table 30: Connector X1A Row B1 to B110 Pin Assignment..................................................................................................................54
Table 31: Navigation Hot Keys Available in the Legend Bar ..............................................................................................................58
Table 32: Main Setup Menu Sub-screens and Functions...................................................................................................................60
Table 33: Advanced Setup menu Sub-screens and Functions..........................................................................................................61
Table 34: Chipset Set > North Bridge Sub-screens and Function ...................................................................................................68
Table 35: Chipset Set> South Bridge Sub-screens and Functions ..................................................................................................69
Table 36: Security Setup Menu Sub-screens and Functions ............................................................................................................ 70
Table 37: Boot Setup Menu Sub-screens and Functions ................................................................................................................... 72
Table 38: Save and Exit Setup Menu Sub-screens and Functions.................................................................................................. 73
Table 39: List of Acronyms........................................................................................................................................................................... 79
List of Figures
Figure 1: COMe-m4AL10 Front Side ............................................................................................................................................................13
Figure 2: Block Diagram COMe-m4AL10 ...................................................................................................................................................18
Figure 3: SoC Temperature Sensor............................................................................................................................................................30
Figure 4: Module Temperature Sensor ....................................................................................................................................................30
Figure 5: Fan Connector 3-Pin......................................................................................................................................................................31
Figure 6: MTBF De-rating Values ...............................................................................................................................................................34
Figure 7: Module Dimensions ...................................................................................................................................................................... 35
Figure 8: Module and Carrier Height ......................................................................................................................................................... 35
Figure 9: Heatspreader and Metal Heat Slug Dimensions................................................................................................................. 36
Figure 10: COMe Interface Connector (X1A) with 220 pins ................................................................................................................48
Figure 11: COMe-m4AL10 Bottom Side......................................................................................................................................................48
Figure 12: Setup menu Selection Bar......................................................................................................................................................... 59
Figure 13: Main Setup Menu Screen ..........................................................................................................................................................60
Figure 14: Advanced Setup Menu Screen..................................................................................................................................................61
Figure 15: Chipset > North Bridge Menu Screen ....................................................................................................................................68
Figure 16: Chipset>South Bridge Menu Initial Screen..........................................................................................................................69
Figure 17: Security Setup Menu Screen ....................................................................................................................................................70
Figure 18: Boot Setup Menu Screen........................................................................................................................................................... 72
Figure 19: Save and Exit Setup Menu Screen.......................................................................................................................................... 73

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1/ Introduction
This user guide describes the COMe-m4AL10 made by Kontron and focuses on describing the COMe-m4AL10’s special
features. New users are recommended to study this user guide before switching on the power.
1.1. Product Description
The COMe-m4AL10 is small form factor COM Express® type 10 Computer-On-Module designed for flexible
implementation within multiple embedded industrial environments. Based on the Intel® Apollo Lake® series of
processors Atom™, Pentium® and Celeron®, with an integrated chipset (SoC) the COMe-m4AL10 combines increased
efficiency and performance with TDP as low as 6 W and no more than 12 W, with Intel’s® extensive HD Graphics
capabilities.
Key COMe-m4AL10 features are:

Intel® Apollo Lake® processors with integrated chipset

Small form factor COM Express® mini type 10 pinout, compatible with the PICMG COM.0 Rev 2.1 spec.

Up to 16 GByte LPDDR4 memory down (non-ECC)

High-speed connectivity 4x PCI Express, 1x 1 Gb Ethernet, 2x USB 3.0/2.0 + 6x USB 2.0, 2x SATA Gen.3

Support for Industrial and commercial temperature grade environments
Figure 1: COMe-m4AL10 Front Side
1SoC
24x memory down
33-pin fan connector
44x mounting points for standoffs
3
1
2
4
4
4
4

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1.2. Product Naming Clarification
COM Express® defines a Computer-On-Module (COM), with all the components necessary for a bootable host computer,
packaged as a super component. The product name for Kontron COM Express® Computer-On-Modules consists of:

Industry standard short form

COMe-

Module form factor

b=basic (125mm x 95mm)

c=compact (95mm x 95mm)

m=mini (84mm x 55mm)

Intel’s processor code name

AL = Apollo Lake

Pinout type

Type 10

Type 7

Type 6

Available temperature variants

Commercial

Extended (E1)

Industrial (E2)

Screened industrial (E2S)

Processor Identifier

Chipset identifier (if chipset assembled)

Memory size

Memory module (#G) / eMMC pseudo SLC memory (#S)
1.3. COM Express® Documentation
The COM Express® specification defines the COM Express® module form factor, pinout and signals. For more
information about the COM Express® specification, visit the PCI Industrial Computer Manufacturers Group (PICMG®)
website.

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1.4. COM Express® Functionality
All Kontron COM Express® mini modules contain one 220-pin connector containing two rows called row A & row B. The
COM Express® mini Computer-On-Module (COM) features the following maximum amount of interfaces according to
the PICMG module pinout type.
Table 1: Type 10 and COMe-m4AL10 Functionality
Feature Type 10 COMe-m4AL10
HD Audio 1x 1x
Gbit Ethernet 1x 1x
Serial ATA Gen3 2x 2x
PCI Express x 1 4x Up to 4x
PCI Express x16 (PEG)
USB Client 1x 1x (Port 7 is dual role Client/Host)
USB 2x USB 3.0/2.0
6x USB 2.0
2x USB 3.0/2.0
6x USB 2.0
LVDS (eDP) 1x single 24-bit channel 1x single 24-bit channel LVDS with eDP overlay option
DP++ (DP/HDMI/DVI) 1x 1x
SPI 1x 1x
LPC 1x 1x
External SMB 1x 1x
I2C 1x 1x (internal)
GPIO or
SDIO
8x
1x optional
8x
1x SD card interface
UART (2-wire COM) 2x 2x
TPM 1x 1x
FAN PWM out 1x 1x
1.5. COM Express® Benefits
COM Express® defines a Computer-On-Module (COM), with all the components necessary for a bootable host computer,
packaged as a highly integrated computer. All Kontron COM Express® modules are very compact and feature a
standardized form factor and a standardized connector layout that carry a specified set of signals. Each COM module is
based on the COM Express® specification. This standardization allows designers to create a single-system carrier board
that can accept present and future COM Express® modules.
The carrier board designer can optimize exactly how each of these functions implements physically. Designers can
place connectors precisely where needed for the application, on a carrier board optimally designed to fit a system’s
packaging.
A single carrier board design can use a range of COM Express® modules with different sizes and pinouts. This flexibility
differentiates products at various price and performance points and provides a built-in upgrade path when designing
future-proof systems. The modularity of a COM Express® solution also ensures against obsolescence when computer
technology evolves. A properly designed COM Express® carrier board can work with several successive generations of
COM Express® modules.
A COM Express® carrier board design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market

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2/ Product Specification
2.1. Module Variants
The COMe-m4AL10 is available in different processor, memory and temperature variants to cover demands in
performance, price and power. The following tables list the module variants for the commercial and industrial
temperature grades.
2.2. Commercial Grade Modules (0°C to +60°C)
Table 2: Product Number for Commercial Grade Modules (0°C to +60°C operating)
Product Number Product Name Description
34010-0204-11-2 COMe-m4AL10 N3350E 2G/4S COM Express® mini pin-out type 10 with Intel® Celeron®
N3350E, 2GB LPDDR4-2133 memory down, 4GB eMMC
pSLC, commercial temperature
34010-0416-11-4 COMe-m4AL10 N4200E 4G/16S COM Express® mini pin-out type 10 with Intel®
Pentium® N4200E, 4GB LPDDR4-2400 memory down,
16GB eMMC pSLC, commercial temperature
2.3. Industrial Temperature Grade Modules (E2, -40°C to +85°C)
Table 3: Product Number for Industrial Grade Modules (-40°C to +85°C operating)
Product Number Product Name Description
34011-0200-13-5 COMe-m4AL10 E2 E3930 2G COM Express® mini pin-out type 10 Computer-on-
Module with Intel® Atom™x5 E3930, 2GB LPDDR4-2133
memory down, industrial temperature
34011-0408-13-5 COMe-m4AL10 E2 E3930 4G/8S COM Express® mini pin-out type 10 with Intel®
Atom™x5 E3930, 4GB LPDDR4-2133 memory down,
8GB pSLC eMMC, industrial temperature
34011-0400-16-5 COMe-m4AL10 E2 E3940 4G COM Express® mini pin-out type 10 with Intel®
Atom™x5 E3940, 4GB LPDDR4-2133 memory down,
industrial temperature
34011-0416-16-5 COMe-m4AL10 E2 E3940 4G/16S COM Express® mini pin-out type 10 with Intel®
Atom™x5 E3940, 4GB LPDDR4-2133 memory down,
16GB eMMC pSLC, industrial temperature
34011-0832-16-7 COMe-m4AL10 E2 E3950 8G/32S COM Express® mini pin-out type 10 with Intel®
Atom™x7 E3950, 8GB LPDDR4-2400 memory down,
32GB eMMC pSLC, industrial temperature

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2.4. Accessories
Accessories are either product specific, COMe-type 10 specific, or general COMe accessories. For more information,
contact your local Kontron Sales Representative or Kontron Inside Sales.
Table 4: Accessories
Part Number Heatspreader Description
34101-0000-00-2 COMe Eval Carrier2 T10 COM Express® Evaluation Carrier Type 10
34105-0000-00-x COMe Ref.Carrier-i T10 TNIx COM Express® Reference Carrier Type 10 for
industrial temperature (Note x= Professional -0 /
Value -1 / Entry -2)
34009-0000-99-2 HSP COMe-m(4)AL10 (E2) Slim
Thread
Slim line heatspreader 6.5mm for
COMe-m(4)AL10 commercial and E2, threaded
mounting holes
34009-0000-99-3 HSP COMe-m(4)AL10 (E2) Slim
Through
Heatspreader for COMe-m(4)AL10 commercial and
E2, threaded mounting holes
34009-0000-99-0 HSP COMe-m(4)AL10 (E2) Thread Heatspreader for COMe-m(4)AL10 commercial and
E2, through holes
34009-0000-99-1 HSP COMe-m(4)AL10 (E2) Through Heatspreader for COMe-m(4)AL10 commercial and
E2, through holes
34099-0000-99-0 COMe mini Active Uni Cooler COM Express® mini Universal Active Cooler for
Heatspreader Mounting (for CPUs <10W)
34099-0000-99-1 COMe mini Passive Uni Cooler COM Express® mini Universal Passive Cooler for
Heatspreader Mounting
34099-0000-99-3 COMe mini Passive Uni Cooler Slim
Top Mount
COM Express® mini Universal Passive Cooler Slim for
Heatspreader Top Mounting

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3/ Functional Specification
3.1. Block Diagram
Figure 2: Block Diagram COMe-m4AL10

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3.2. Processors
The Intel® Apollo Lake® series of processors Atom™, Pentium® and Celeron® use the 14 nm process technology, with a
compact 24 mm x 31 mm package size, FCBGA 1296.
The processors variants support the following technologies:

Intel® 64 Architecture

Idle States

Intel® Virtualization Technology (VT-x) and Virtualization Technology for Directed I/O (VT-d)

Secure Boot

Enhanced Intel Speedstep® Technology

Thermal Monitoring Technologies

Intel® HD Audio Technology

Intel® Identity Protection Technology

Intel® AES New Instructions

Secure Key
The following table lists the processor specifications compatible with the COMe-m4AL10.
Table 5: Specification of COMe-m4AL10 Processor Variants
Intel® Atom™ Atom® Atom™ Pentium® Celeron®
x7 E3950 x5 E3940 x5 E3930 N4200 N3350
# of Cores 4 4 2 4 2
# of Threads 4 4 2 4 2
Processor Base
Frequency
1.6 GHz 1.6 GHz 1.3 GHz 1.1 GHz 1.1 GHz
Burst Frequency 2 GHz 1.8 GHz 1.8 GHz 2.5 GHz 2.4 GHz
GPU EU# 18 12 12 18 12
Thermal Design
Power (TDP)
12 W 9.5 W 6.5 W 6 W 6 W
Memory Types LPDDR4-
2133/2400
LPDDR4-2133 LPDDR4-2133 LPDDR4-
2133/2400
LPDDR4-
2133/2400
Max. #
Memory Channels
2 2 2 2 2
Max. Memory
Size
8 GB 8 GB 8 GB 8 GB 8 GB
Max. Memory
Bandwidth
25.60 GB/s 25.60 GB/s 25.60 GB/s 29.86 GB/s 29.86 GB/s
ECC Memory Supported Supported Supported Not supported Not supported
Graphics HD Graphics
505
HD Graphics
500
HD Graphics
500
HD Graphics
505
HD Graphics
500
PCIe Express
Configurations
4 x1
2 x1 + 1 x2
2 x2
1 x4
4 x1
2 x1 + 1 x2
2 x2
1 x4
4 x1
2 x1 + 1 x2
2 x2
1 x4
4 x1
2 x1 + 1 x2
2 x2
1 x4
4 x1
2 x1 + 1 x2
2 x2
1 x4
Max. # PCIe Lanes 4 4 4 4 4

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3.3. Platform Controller Hub (PCH)
The Intel® Apollo Lake® series of processors Atom™, Pentium® and Celeron® are a System on Chip (SoC) solution,
including an integrated PCH.
3.4. System Memory
The COMe-m4AL10 supports LPDDR4 memory down with up to four (x32) channels, with a capacity of up to
16 GByte. The maximum data transfer rate is 2400 MT/s for industrial and commercial temperature graded variants.
The following table lists specific system memory features:
Memory Down 4GB, 8GB and 16 GB – LPDDR4
Peak Bandwidth 38.4 GB/s
3.5. Digital Display Interfaces (DP/HDMI/DVI)
The Digital Display Interface (DDI0) supports dual-mode Display Port (DP) 1.2 (++). The dual-mode DP supports two
independent displays on DDIO and the use of DP to HDMI or DP to DVI-D passive adapters. In total, a maximum of three
independent displays are possible if including LVDS.
The following table lists the maximum display resolution of the supported DDIO.
Display Interfaces Maximum Resolution
DP 1.2 (++) 4096 x 2160 @ 60 Hz
HDMI 1.4 3840 x 2160 @ 30 Hz
DVI-D 3840 x 2160 @ 30 Hz
It is recommended to use a DP-to-HDMI or DP-to-DVI passive adapter that is compliant to
the VESA DP Dual-Mode standard only. If adapters are used with FET level shifter for DDC
translation, display detection issues may occur
At 4K resolution, to increase link margin a DP redriver on the carrier is recommended.
3.6. LVDS
The LVDS channel supports a 24-bit LVDS panel. The eDP to LVDS bridge is only necessary for LVDS support and can be
removed if LVDS signals are optionally overlaid with eDP signals.
The following table lists the LVDS features.
LVD Channels 1x
LVDS Bits/Pixel 24-bit color
LVDS/eDP Maximum Resolution 4096 x 2160 @ 60Hz
PWM Backlight Control Supported
Supported Flat Panels EDID / JILI / DisplayID