Kontron QDS-9400 User manual


USER GUIDE
www.kontron.com
QDS-9400
Doc. User Guide, Rev. 1.1
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
QDS
-9400 - USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this user guide may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee
on the part of Kontron with respect to technical processes described in the user guide or any product characteristics
set out in the user guide. Kontron assumes no responsibility or liability for the use of the described product(s),
conveys no license or title under any patent, copyright or mask work rights to these products and makes no
representations or warranties that these products are free from patent, copyright or mask work right infringement
unless otherwise specified. Applications that are described in this user guide are for illustration purposes only.
Kontron makes no representation or warranty that such application will be suitable for the specified use without
further testing or modification. Kontron expressly informs the user that this user guide only contains a general
description of processes and instructions which may not be applicable in every individual case. In cases of doubt,
please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this user guide is
constantly being updated in line with the technical alterations and improvements made by Kontron to the products
and thus this user guide only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2021 by Kontron S&T AG
Kontron S&T AG
Lise-Meitner-Str. 3-5
86156 Augsburg
Germany
www.kontron.com

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Intended Use
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE
OR RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR
COMMUNICATION SYSTEMS FOR AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE
SUPPORT OR LIFE SUSTAINING APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A
HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE OF
PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR
ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at
your risk. To minimize the risks associated with your products and applications, you should provide adequate design
and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security
related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron
hardware or software components incorporated in your systems) meet all applicable requirements. Unless otherwise
stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities and cannot
therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or for resale as
device in High Risk Applications. All application and safety related information in this document (including application
descriptions, suggested safety measures, suggested Kontron products, and other materials) is provided for reference
only.

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Revision History
Revision Brief Description of Changes Date of Issue Author/
Editor
1.0 Initial Issue 2021-Apr-19 YS
1.1 Update spec table 2021-Jul-19 YS
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about
warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/terms-
and-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order
Terms & Conditions. Visit http://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit
our website CONTACT US.
Customer Support
Find Kontron contacts by visiting: http://www.kontron.com/support.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths into
a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product
expertise coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace of
mind to build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron
training academy, and more visit http://www.kontron.com/support-and-services/services.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
Kontron support. Detail any errors you find. We will correct the errors or problems as soon as possible and post the
revised user guide on our website.

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Symbols
The following symbols may be used in this user guide
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
NOTICE indicates a property damage message.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60
V) when touching
products or parts of products. Failure to observe the
precautions indicated and/or
prescribed by the law may endanger your life/health and/or result in damage to your
material.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive
to static elect
ricity. Care must therefore be taken during all handling operations and
inspections of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
Laser!
This symbol inform of the risk of exposure to laser beam and light emitting devices (LEDs)
from an electrical device. Eye protection per manufacturer notice shall review before
servicing.
This symbol indicates general information about the product and the user guide.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.

QDS-9400 -- User Guide, Rev. 1.1
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For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its
compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life
expectancy of your product can be drastically reduced by improper treatment during unpacking and installation.
Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are
requested to conform with the following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the
product’s main disconnect device.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious
electrical shock hazards can exist during all installation, repair, and maintenance operations
on this product. Therefore, always unplug the power cable and any other cables which
provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first
cable to be connected when performing installation or removal procedures on this product.
Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is
otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not
guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands
or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices,
jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed
on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the
batteries or conductive circuits on the product.

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Lithium Battery Precautions
If your product is equipped with a lithium battery, take the following precautions when replacing the battery.
Danger of explosion if the battery is replaced incorrectly.
Replace only with same or equivalent battery type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.
General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or
modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received
from Kontron Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific
environmental requirements. This also applies to the operational temperature range of the specific board version
that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the
present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship
the product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with
environmental laws, regulations, and other environmentally oriented requirements. For more information regarding
Kontron’s quality and environmental responsibilities, visit http://www.kontron.com/about-kontron/corporate-
responsibility/quality-management.
Disposal and Recycling
Kontron’s products are manufactured to satisfy environmental protection requirements where possible. Many of the
components used are capable of being recycled. Final disposal of this product after its service life must be
accomplished in accordance with applicable country, state, or local laws or regulations.
WEEE Compliance
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:
Reduce waste arising from electrical and electronic equipment (EEE)
Make producers of EEE responsible for the environmental impact of their products, especially when the product
become waste
Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound environmental
disposal of EEE
Improve the environmental performance of all those involved during the lifecycle of EEE
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive
You are encouraged to return our products for proper disposal.

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Table of Contents
Symbols .......................................................................................................................................................................................................... 6
For Your Safety............................................................................................................................................................................................. 7
High Voltage Safety Instructions .......................................................................................................................................................................7
Special Handling and Unpacking Instruction.................................................................................................................................................7
Lithium Battery Precautions ............................................................................................................................................................................... 8
General Instructions on Usage ................................................................................................................................................................ 8
Quality and Environmental Management ............................................................................................................................................ 8
Disposal and Recycling ......................................................................................................................................................................................... 8
WEEE Compliance ................................................................................................................................................................................................... 8
Table of Contents ........................................................................................................................................................................................ 9
List of Tables............................................................................................................................................................................................... 10
List of Figures ............................................................................................................................................................................................. 10
1/ Introduction ....................................................................................................................................................................................12
2/ Installation Procedures...............................................................................................................................................................13
2.1. Installing the Board........................................................................................................................................................................................13
2.2. Chassis Safety Standards...........................................................................................................................................................................13
2.3. Lithium Battery Replacement ...................................................................................................................................................................14
3/ System Specifications..................................................................................................................................................................15
3.1. Component Main Data ..................................................................................................................................................................................15
3.2. Environmental Conditions ..........................................................................................................................................................................16
3.3. Processor Support ......................................................................................................................................................................................... 17
3.4. System Memory Support ............................................................................................................................................................................ 17
3.5. On-board Graphics Subsystem................................................................................................................................................................. 17
3.6. Power Supply Voltage..................................................................................................................................................................................17
4/ Connector Locations.....................................................................................................................................................................19
4.1. Top Side ..............................................................................................................................................................................................................19
4.2. Connector Panel Side (Rear)......................................................................................................................................................................21
4.3. Connector Panel Side (Front) ................................................................................................................................................................... 22
5/ Connector Definitions ................................................................................................................................................................. 23
6/ I/O-Area Connectors ...................................................................................................................................................................24
6.1. Power Connector (DCIN 12V) .....................................................................................................................................................................24
6.2. HDMI Connector (HDMI) ............................................................................................................................................................................. 25
6.3. Ethernet Connector ...................................................................................................................................................................................... 26
6.4. USB Connectors (I/O Area)........................................................................................................................................................................ 27
6.5. Audio Phone Jack (PHONE) ........................................................................................................................................................................29
6.6. Micro SD Card Cage (TF).............................................................................................................................................................................30
7/ Internal Connectors......................................................................................................................................................................31
7.1. Power Connector.............................................................................................................................................................................................31
7.1.1. Power Input Wafer (DCIN 12V) ................................................................................................................................................................31
7.1.2. RTC Battery Power Input Wafer (RTC) ................................................................................................................................................31
7.2. USB Connectors (Internal) (USB) ............................................................................................................................................................ 32
7.3. Speaker Output Wafer................................................................................................................................................................................. 32
7.4. Microphone Input Wafer (MIC) ................................................................................................................................................................ 33
7.5. UART Wafers (UART0 & UART4).............................................................................................................................................................. 33
7.6. LVDS Panel Connector (2-LVDS) .............................................................................................................................................................34
7.7. Panel Backlight Power Output Wafer (BL)........................................................................................................................................... 35

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7.8. GPIO Wafer (GPIO).........................................................................................................................................................................................36
7.9. AD Key Output Wafer (ADKEY) ................................................................................................................................................................. 36
7.10. IR Wafer (IR) .................................................................................................................................................................................................. 37
7.11. RGB LED Wafer (RGB) ................................................................................................................................................................................. 37
7.12. eDP Panel Connector (EDP) (Optional)................................................................................................................................................38
7.13. Switches and Jumpers ...............................................................................................................................................................................39
7.13.1. Panel Power Selection for LVDS (3V3 5V 12V) ............................................................................................................................... 39
7.13.2. Panel Power Selection for Optional MIPI (3V3 5V 12V) (Optional)........................................................................................40
About Kontron .........................................................................................................................................................................................................41
List of Tables
Table 1: Component Main Data .........................................................................................................................................................................15
Table 2: Environmental Conditions .................................................................................................................................................................16
Table 3: Processor Support ................................................................................................................................................................................17
Table 4: Dual-displays Configurations ..........................................................................................................................................................17
Table 5: Supply Voltages .....................................................................................................................................................................................18
Table 6: Jumper List...............................................................................................................................................................................................19
Table 7: Top Side Internal Connector Pin Assignment............................................................................................................................20
Table 8: Connector Panel Side Connector List (Rear) ..............................................................................................................................21
Table 9: Connector Panel Side Connector List (Front)............................................................................................................................ 22
Table 10: Pin Assignment DC Jack (DCIN 12V) .............................................................................................................................................24
Table 11: Pin Assignment HDMI Connector (HDMI)................................................................................................................................... 25
Table 12: Pin Assignment Ethernet Connector........................................................................................................................................... 26
Table 13: Pin Assignment USB 3.0 / USB 2.0 Connectors (USB 3.0)................................................................................................... 27
Table 14: Pin Assignment USB 2.0 Connectors (HOST USB) ................................................................................................................. 27
Table 15: Pin Assignment Audio Phone Jack (PHONE).............................................................................................................................29
Table 16: Pin Assignment Micro SD Card Cage (TF)..................................................................................................................................30
Table 17: Pin Assignment (DCIN 12V)...............................................................................................................................................................31
Table 18: Pin Assignment (RTC) ........................................................................................................................................................................31
Table 19: Pin Assignment (USB)....................................................................................................................................................................... 32
Table 20: Pin Assignment................................................................................................................................................................................... 32
Table 21: Pin Assignment (MIC)........................................................................................................................................................................ 33
Table 22: Pin Assignment (UART0, UART4)................................................................................................................................................. 33
Table 23: Pin Assignment (2-LVDS) ...............................................................................................................................................................34
Table 24: Pin Assignment (BL) ......................................................................................................................................................................... 35
Table 25: Pin Assignment (GPIO)..................................................................................................................................................................... 36
Table 26: Pin Assignment (ADKEY)................................................................................................................................................................. 36
Table 27: Pin Assignment (IR)........................................................................................................................................................................... 37
Table 28: Pin Assignment (RGB)...................................................................................................................................................................... 37
Table 29: Pin Assignment (EDP) ......................................................................................................................................................................38
Table 30: Pin Assignment Panel Power Selection for LVDS (3V3 5V 12V)....................................................................................... 39
Table 31: Pin Assignment Panel Power Selection for Optional MIPI (3V3 5V 12V) .......................................................................40
List of Figures
Figure 1: Top Side....................................................................................................................................................................................................19
Figure 2: Connector Panel Side (Rear)............................................................................................................................................................21
Figure 3: Connector Panel Side (Front)......................................................................................................................................................... 22
Figure 4: DC Jack (DCIN 12V) ..............................................................................................................................................................................24
Figure 5: HDMI Connector (HDMI) ................................................................................................................................................................... 25
Figure 6: Ethernet Connector............................................................................................................................................................................ 26
Figure 7: USB 3.0 Connectors (USB 3.0)........................................................................................................................................................ 27
Figure 8: USB 2.0 Connectors (HOST USB)................................................................................................................................................... 27

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Figure 9: USB 2.0 High Speed Cable................................................................................................................................................................ 27
Figure 10: USB 3.0 High Speed Cable..............................................................................................................................................................28
Figure 11: Audio Phone Jack (PHONE).............................................................................................................................................................29
Figure 12: Micro SD Card Cage (TF).................................................................................................................................................................30
Figure 13: Power Input Wafer (DCIN 12V)......................................................................................................................................................31
Figure 14: RTC Battery Power Input Wafer (RTC).......................................................................................................................................31
Figure 15: USB 2.0 Pin Header (USB)............................................................................................................................................................... 32
Figure 16: Speaker Output Wafer..................................................................................................................................................................... 32
Figure 17: Microphone Input Wafer (MIC) .................................................................................................................................................... 33
Figure 18: UART Wafers (UART0, UART4) .................................................................................................................................................... 33
Figure 19: LVDS Panel Connector (2-LVDS) .................................................................................................................................................34
Figure 20: Backlight Power Output Wafer (BL).......................................................................................................................................... 35
Figure 21: GPIO Wafer (GPIO).............................................................................................................................................................................36
Figure 22: AD Key Output Wafer (ADKEY) .................................................................................................................................................... 36
Figure 23: IR Wafer (IR) ....................................................................................................................................................................................... 37
Figure 24: RGB LED Wafer (RGB) ..................................................................................................................................................................... 37
Figure 25: eDP Panel Connector (EDP)..........................................................................................................................................................38
Figure 26: Jumper Connector ............................................................................................................................................................................ 39
Figure 27: Panel Power Selection for LVDS (3V3 5V 12V).......................................................................................................................39
Figure 28: Panel Power Selection for Optional MIPI (3V3 5V 12V)......................................................................................................40

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1/ Introduction
This user guide describe the QDS-9400 board made by Kontron. This board will also be denoted QDS-9400 within this
user guide.
Use of this user guide implies a basic knowledge of PC-AT hardware and software. This user guide focuses on
describing the QDS-9400 board's special features and is not intended to be a standard PC-AT textbook.
New users are recommended to study the short installation procedure stated in the following chapter before
switching on the power.
All configuration and setup of the CPU board is either carried out automatically or manually by the user via the BIOS
setup menus.
Latest revision of this user guide, datasheet, thermal simulations, BSP's (Board Support Packages), mechanical
drawings (2D and 3D) can de download from Kontron's Web Page.

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2/ Installation Procedures
2.1. Installing the Board
ESD Sensitive Device!
Electrostatic discharge (ESD) can damage equipment and impair electrical circuitry.
Wear ESD-protective clothing and shoes
Wear an ESD-preventive wrist strap attached to a good earth ground
Check the resistance value of the wrist strap periodically (1 MΩ to 10 MΩ)
Transport and store the board in its antistatic bag
Handle the board at an approved ESD workstation
Handle the board only by the edges
To get the board running follow these steps. If the board shipped from KONTRON already has components like RAM
and CPU cooler mounted, then skip the relevant steps below.
1. Turn off the PSU (Power Supply Unit)
Turn off PSU (Power Supply Unit) completely (no mains power connected to the PSU) or
leave the Power Connectors unconnected while configuring the board. Otherwise,
components (RAM, LAN cards etc.) might get damaged. Make sure to use +12 V DC single
supply only with suitable cable kit and PS-ON# active.
The power supply unit shall comply with the requirements as defined in IEC 62368-1
according Clause 6.2.2 to power source category PS2 "Limited Power Source".
2. Connecting interfaces
Insert all external cables for hard disk, keyboard etc. A monitor must be connected in order to change Setup
settings.
3. Connect and turn on PSU
Connect PSU to the board by the +12 V DC jack or 2.54 mm pitch 1x6-pin wafer connector, and then the board will
boot up.
4. Mounting the board in chassis
When mounting the board to chassis etc. please note that the board contains
components on both sides of the PCB that can easily be damaged if board is handled
without reasonable care. A damaged component can result in malfunction or no function
at all.
When fixing the board on a chassis, it is recommended to use screws with an integrated washer and a diameter of > 7
mm. Do not use washers with teeth, as they can damage the PCB and cause short circuits.
2.2. Chassis Safety Standards
Before installing the QDS-9400 in the chassis, users must evaluate the end product to ensure compliance with the
requirements of the IEC60950-1 safety standard:
The board must be installed in a suitable mechanical, electrical and fire enclosure.
The system, in its enclosure, must be evaluated for temperature and airflow considerations.

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The board must be powered by a CSA or UL approved power supply that limits the maximum input current.
For interfaces having a power pin such as external power or fan, ensure that the connectors and wires are
suitably rated. All connections from and to the product shall be with SELV circuits only.
Wires have suitable rating to withstand the maximum available power.
The peripheral device enclosure fulfils the IEC60950-1 fire protecting requirements.
2.3. Lithium Battery Replacement
If replacing the lithium battery follow the replacement precautions stated in the notification below:
Danger of explosion if the lithium battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the manufacturer
Dispose of used batteries according to the manufacturer's instructions
VORSICHT! Explosionsgefahr bei unsachgemäßem Austausch der Batterie.
Ersatz nur durch denselben oder einen vom Hersteller empfohlenen gleichwertigen Typ
Entsorgung gebrauchter Batterien nach Angaben des Herstellers
ATTENTION! Risque d'explosion avec l'échange inadéquat de la batterie.
Remplacement seulement par le même ou un type équivalent recommandé par le
producteur
L'évacuation des batteries usagées conformément à des indications du fabricant
PRECAUCION! Peligro de explosión si la batería se sustituye incorrectamente.
Sustituya solamente por el mismo o tipo equivalente recomendado por el fabricante
Disponga las baterías usadas según las instrucciones del fabricante
ADVARSEL! Lithiumbatteri -- Eksplosionsfare ved fejlagtig håndtering.
Udskiftning må kun ske med batteri af samme fabrikat og type
Levér det brugte batteri tilbage til leverandøren
ADVARSEL! Eksplosjonsfare ved feilaktig skifte av batteri.
Benytt samme batteritype eller en tilsvarende type anbefalt av apparatfabrikanten
Brukte batterier kasseres i henhold til fabrikantens instruksjoner
VARNING! Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en ekvivalent typ som rekommenderas av
apparattillverkaren
Kassera använt batteri enligt fabrikantens instruktion
VAROITUS! Paristo voi räjähtää, jos se on virheellisesti asennettu.
Vaihda paristo ainoastaan lalteval- mistajan suosittelemaan tyyppiln
Hävitä käytetty paristo valmistajan ohjeiden mukaisesti

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3/ System Specifications
3.1. Component Main Data
The table below summarizes the features of the QDS-9400 board.
Table 1: Component Main Data
System
Processor

Rockchip RK3399 (64-bit Dual Core ARM® Cortex®-A72 + Quad Core Cortex®-A53 up to
2.0 GHz)
Memory

4 GByte DDR3 memory (2 GByte by request)
Video
Display Interface

1x HDMI 2.0 (on rear, w/ CEC support)

1x LVDS (by header)

1x eDP (by header, optional)

1x V-by-One (by header, optional)
Camera Input
Interface

1x MIPI CSI (by header, optional)
Multiple Display

Dual
Audio
Audio Interface

2x Speaker-out (by header)

1x Line-out (1x 3.5 mm Jack on rear)

1x Mic-in (by header)
Network Connection
Ethernet

1x GbE LAN (RJ45 on rear)
Wireless

Wi-Fi (IEEE 802.11 b/g/n)

Bluetooth (V 2.1 + EDR / V 3.0 / V 3.0 + HS / V 4.0)
Peripheral Connection
USB

2x USB 3.0 (Type A on rear)

4x USB 2.0 (1x Type A on rear, 3x by header)
Serial Port

2x UART (by header, alternative to RS232, default)

2x RS232 (by header, Tx & Rx only, alternative to UART, optional)
Other I/Os

4-bit GPIO (by header)
Storage & Expansion
Storage &
Expansion

16 GByte eMMC (default, 8 GByte or NAND Flash by request)

1x Micro SD Cage (on rear, support up to 64 GByte)
Power
Input Voltage

DC 12 V
Connector

DC Jack (on rear)

1x6-pin pitch 2.54 mm Wafer
Firmware
Watchdog

Programmable WDT to generate system reset event

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System
Real Time Clock

SoC integrated RTC
System Control & Monitoring
Front Panel Header

1x ADB Button (on front)

1x IR (by header)
Cooling
Cooling Method

Passive
Software
OS Support

Android 7.1
Mechanical
Dimension (L x W)

146 mm x 80 mm / 5.75" x 3.15"
3.2. Environmental Conditions
The QDS-9400 is compliant with the following environmental conditions. It is the customer's responsibility to provide
sufficient airflow around each of the components to keep them within the allowed temperature range.
Table 2: Environmental Conditions
Operating Temperature

0 °C ~ 60 °C / 32 °F ~ 140 °F
Storage Temperature

-20 °C ~ 65 °C / -4 °F ~ 149 °F
Humidity

10 % ~ 90 %

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3.3. Processor Support
The QDS-9400 is designed to support Rockchip RK3399 processor based on ARM® big.LITTLE architecture with ARM®
Cortex®-A72 (big) and Cortex®-A53 (LITTLE). The BGA CPU is remounted from factory. Kontron has defined the board
versions as listed in the following table, so far all based on Embedded CPUs. Other versions are expected at a later
date.
Table 3: Processor Support
Name Core # Speed Turbo Embedded Cache Socket TDP Tj
RK3399 6 1.50 GHz 2.00 GHz Yes 1.5M FCBGA828 7 W 125 °C
Sufficient cooling must be applied to the CPU in order to remove the effect as listed as TDP (Thermal Design Power) in
above table. The sufficient cooling is also depending on the worst case maximum ambient operating temperature and
the actual worst case load of processor.
3.4. System Memory Support
The QDS-9400 supports a single DDR3 memory down configuration with a capacity of up to 4GB. The following list
describes specific system memory features:
4 GByte DDR3 memory down (default)
2 GByte DDR3 memory down (by request)
Single channel, 1866 MT/s
Non-ECC support
3.5. On-board Graphics Subsystem
The QDS-9400 has a Mali-T864 Graphics Processing Unit integrated onto the processor for high quality graphics
capabilities. The QDS-9400 supports dual displays pipes.
Dual displays can be used simultaneously and be used to implement independent or cloned display configuration.
Table 4: Dual-displays Configurations
Display 1 Display 2 Max. Resolution (Px) at 60 Hz
Display 1 Display 2
LVDS HDMI 2.0 1920 x 1080 4096 x 2160
3.6. Power Supply Voltage
In order to ensure safe operation of the board, the input power supply must monitor the supply voltage and shut
down if the supply is out of range -- refer to the actual power supply specification. Please note, in order to keep the
power consumption to a minimal level, boards do not implement a guaranteed minimum load. The QDS-9400 board
must be powered through the DC jack or 2.54 mm pitch 1x6-pin wafer connector from a DC 12 V power supply.
The requirements to the supply voltages are as follows:

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Table 5: Supply Voltages
Supply Min. Max. Note
+12 V 11.4 V 12.6 V Should be ±5 % tolerance

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4/ Connector Locations
4.1. Top Side
Figure 1: Top Side
Table 6: Jumper List
Item Designation Description See Chapter
1 3V3 5V 12V Panel Power Selection for LVDS 7.13.1
2 3V3 5V 12V Panel Power Selection for Optional MIPI 7.13.2
1
7
6
2
3
5
8
4
9
10
11
12
13
14
15
16
17
18
19
20
21
22

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Table 7: Top Side Internal Connector Pin Assignment
Item Designation Description See Chapter
3 DCIN 12V DC 12 V Power Input Wafer 7.1.1
4 RTC RTC Battery Power Input Wafer 7.1.2
5 BL Panel Backlight Power Output Wafer 7.7
6 2-LVDS 6/8-bit, 1/2-channel LVDS Panel Connector 7.6
7 - Speaker Output Wafer 7.3
8 MIC Microphone Input Wafer 7.4
9 UART4 UART4 Wafer 7.5
10 UART0 UART0 Wafer 7.5
11 RGB RGB LED Wafer 7.11
12 ADKEY AD Key Output Wafer 7.9
13 USB USB Host Pin Header 7.2
14 USB USB Host Pin Header 7.2
15 USB USB Host Pin Header 7.2
16 IR IR Wafer 7.10
17 GPIO GPIO Wafer 7.8
18 EDP eDP Panel Connector (optional) 7.12
19 2-MIPI MIPI Camera Input Connector (optional) -
20 - V-By-One Panel Connector (optional) -
21 5G/BT 5 GHz Wi-Fi / Bluetooth Antenna -
22 2.4G 2.4 GHz Wi-Fi / Bluetooth Antenna -