Kontron COMe Ref. Carrier-i T6 TMIP User manual


USER GUIDE
www.kontron.com
COMe Ref. Carrier-i T6 TMI
Doc. User Guide Rev. 1.4
Doc. ID: 1059 4224

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
COME REF. CARRIER
-I T6 TMI - USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this user guide may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee
on the part of Kontron with respect to technical processes described in the user guide or any product characteristics
set out in the user guide. Kontron assumes no responsibility or liability for the use of the described product(s),
conveys no license or title under any patent, copyright or mask work rights to these products and makes no
representations or warranties that these products are free from patent, copyright or mask work right infringement
unless otherwise specified. Applications that are described in this user guide are for illustration purposes only.
Kontron makes no representation or warranty that such application will be suitable for the specified use without
further testing or modification. Kontron expressly informs the user that this user guide only contains a general
description of processes and instructions which may not be applicable in every individual case. In cases of doubt,
please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this user guide is
constantly being updated in line with the technical alterations and improvements made by Kontron to the products
and thus this user guide only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2016 by Kontron S&T AG
Kontron S&T AG
Lise-Meitner-Str. 3-5
86156 Augsburg
Germany
www.kontron.com

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Intended Use
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE
OR RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR
COMMUNICATION SYSTEMS FOR AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE
SUPPORT OR LIFE SUSTAINING APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A
HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE OF
PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR
ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at
your risk. To minimize the risks associated with your products and applications, you should provide adequate design
and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security
related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron
hardware or software components incorporated in your systems) meet all applicable requirements. Unless otherwise
stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities and cannot
therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or for resale as
device in High Risk Applications. All application and safety related information in this document (including application
descriptions, suggested safety measures, suggested Kontron products, and other materials) is provided for reference
only.

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Revision History
Revision Brief Description of Changes Date of Issue Author/
Editor
1.0 Initial issue 24-Jun-2016 MB
1.1 Update of table numbers Included 1.4 Accessories 05-Aug-2016 CW
1.2 2.1.1 SPI Flash update
2.3.14 DIP Switch update of Table 16, Poition 6
23-Aug-2017 CW
1.3 2.3.15 Added Power connector (J1) mating
connector information
15-Apr-2019 CW
1.4 Removed the Value and Entry variants and added
the carrier EEPROM address
16-July-2020 CW
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about
warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/terms-
and-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order
Terms & Conditions. Visit http://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit
our website CONTACT US.
Customer Support
Find Kontron contacts by visiting: http://www.kontron.com/support.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths into
a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product
expertise coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace of
mind to build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron
training academy, and more visit http://www.kontron.com/support-and-services/services.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
Kontron support. Detail any errors you find. We will correct the errors or problems as soon as possible and post the
revised user guide on our website.

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Symbols
The following symbols may be used in this user guide
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
NOTICE indicates a property damage message.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60
V) when touching
products or parts of products. Failure to observe the precautio
ns indicated and/or
prescribed by the law may endanger your life/health and/or result in damage to your
material.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive
to static electricity. C
are must therefore be taken during all handling operations and
inspections of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
Laser!
This symbol inform of the risk of exposure to laser beam and light emitting devices (LEDs)
from an electrical device. Eye protection per manufacturer notice shall review before
servicing.
This symbol indicates general information about the product and the user guide.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.

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For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its
compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life
expectancy of your product can be drastically reduced by improper treatment during unpacking and installation.
Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are
requested to conform with the following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the
product’s main disconnect device.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious
electrical shock hazards can exist during all installation, repair, and maintenance operations
on this product. Therefore, always unplug the power cable and any other cables which
provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first
cable to be connected when performing installation or removal procedures on this product.
Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.
Handling and operation of the product is permitted only for trained personnel within a work
place that is access controlled. Follow the “General Safety Instructions for IT Equipment”
supplied with the product.
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is
otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not
guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands
or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices,
jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed
on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the
batteries or conductive circuits on the product.

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Lithium Battery Precautions
If your product is equipped with a lithium battery, take the following precautions when replacing the battery.
Danger of explosion if the battery is replaced incorrectly.
Replace only with same or equivalent battery type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.
General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or
modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received
from Kontron Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific
environmental requirements. This also applies to the operational temperature range of the specific board version
that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the
present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship
the product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with
environmental laws, regulations, and other environmentally oriented requirements. For more information regarding
Kontron’s quality and environmental responsibilities, visit http://www.kontron.com/about-kontron/corporate-
responsibility/quality-management.
Disposal and Recycling
Kontron’s products are manufactured to satisfy environmental protection requirements where possible. Many of the
components used are capable of being recycled. Final disposal of this product after its service life must be
accomplished in accordance with applicable country, state, or local laws or regulations.
WEEE Compliance
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:
Reduce waste arising from electrical and electronic equipment (EEE)
Make producers of EEE responsible for the environmental impact of their products, especially when the product
become waste
Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound environmental
disposal of EEE
Improve the environmental performance of all those involved during the lifecycle of EEE
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive
You are encouraged to return our products for proper disposal.

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Table of Contents
Symbols.................................................................................................................................................................................................................6
For Your Safety ...................................................................................................................................................................................................7
High Voltage Safety Instructions ..................................................................................................................................................................7
Special Handling and Unpacking Instruction ............................................................................................................................................7
Lithium Battery Precautions.......................................................................................................................................................................... 8
General Instructions on Usage..................................................................................................................................................................... 8
Quality and Environmental Management................................................................................................................................................ 8
Disposal and Recycling.................................................................................................................................................................................... 8
WEEE Compliance.............................................................................................................................................................................................. 8
Table of Contents...............................................................................................................................................................................................9
List of Tables .....................................................................................................................................................................................................10
List of Figures....................................................................................................................................................................................................10
1/ Introduction ..........................................................................................................................................................................................11
1.1. Carrier Overview..........................................................................................................................................................................................11
1.2. Board Diagrams.........................................................................................................................................................................................12
1.2.1. Functional Block Diagram....................................................................................................................................................................12
1.2.2. Rear Panel ................................................................................................................................................................................................13
1.2.3. Board layout ............................................................................................................................................................................................14
1.2.4. Component Overview...........................................................................................................................................................................15
1.3. Technical Specification............................................................................................................................................................................17
1.4. Accessories .................................................................................................................................................................................................19
1.5. Standards....................................................................................................................................................................................................20
1.6. Releated Publications..............................................................................................................................................................................21
2/ Functional Description.................................................................................................................................................................... 22
2.1. Memory .......................................................................................................................................................................................................22
2.1.1. SPI Flash ...................................................................................................................................................................................................22
2.1.2. Carrier EEPROM.....................................................................................................................................................................................22
2.2. Graphics Inter faces................................................................................................................................................................................23
2.2.1. Digital Display Interfaces................................................................................................................................................................... 23
2.2.2. LVDS/eDP Interface.............................................................................................................................................................................23
2.2.3. PEG Lanes ...............................................................................................................................................................................................24
2.3. System Interfaces ................................................................................................................................................................................... 25
2.3.1. PCI Express Interfaces ........................................................................................................................................................................ 25
2.3.2. SATA Interfaces .................................................................................................................................................................................... 25
2.3.3. M.2 Interface.......................................................................................................................................................................................... 25
2.3.4. Gigabit Ethernet Interfaces .............................................................................................................................................................. 25
2.3.5. USB 2.0 Interfaces................................................................................................................................................................................ 25
2.3.6. USB 3.0.....................................................................................................................................................................................................26
2.3.7. HD Audio Interfaces.............................................................................................................................................................................26
2.3.8. UART Interfaces.................................................................................................................................................................................... 27
2.3.9. GPIO Interfaces ..................................................................................................................................................................................... 27
2.3.10. SIM Interface........................................................................................................................................................................................28
2.3.11. SYS_Signals / Embedded Interfaces............................................................................................................................................28
2.3.12. CPU Fan Interface...............................................................................................................................................................................29
2.3.13. Front Panel Interface ........................................................................................................................................................................29
2.3.14. DIP Switch.............................................................................................................................................................................................30

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2.3.15. Power Supply and Management...................................................................................................................................................30
2.3.16. RTC ...........................................................................................................................................................................................................31
3/ Technical Support.............................................................................................................................................................................32
3.1. Returning Defective Merchandise ......................................................................................................................................................32
4/ Warranty ..............................................................................................................................................................................................33
4.1. Limitation/Exemption from Warranty Obligation ........................................................................................................................ 33
Appendix: List of Acronyms ........................................................................................................................................................................34
About Kontron .................................................................................................................................................................................................. 35
List of Tables
Table 1: COMe Ref. Carrier-i T6 TMIP Features........................................................................................................................................11
Table 2: Component Overview .....................................................................................................................................................................15
Table 3: COMe Ref. Carrier-i T6 TMIP Main Specifications .................................................................................................................17
Table 4: COMe Ref. Carrier-i T6 TMIP Accessories................................................................................................................................19
Table 5: Standards ..........................................................................................................................................................................................20
Table 6: Related Publications.......................................................................................................................................................................21
Table 7: LVDS/JILI Connector J8 Pinout....................................................................................................................................................23
Table 8: USB 3.0/2.0 Pin Header J7 Pinout ......................................................................................................................................26
Table 9: Front Panel HD Audio Header J22 Pinout................................................................................................................................26
Table 10: S/PDIF header J23.Pinout........................................................................................................................................................... 27
Table 11: Pin Headers J30 (COM1/SER0) and J29 (COM2/SER1) Pinouts ....................................................................................... 27
Table 12: GPIO Pin Header J32 Pinout .................................................................................................................................................... 27
Table 13: SYS_Signals / Embedded Interfaces Header (J31) Pinout ...............................................................................................28
Table 14: PWM Fan Connector J4 Pinout .................................................................................................................................................29
Table 15: Front Panel Connector (J27) Pinout.........................................................................................................................................29
Table 16: DIP Switch SW1 Functionality....................................................................................................................................................30
Table 17: Power Connector J1 Pinout..........................................................................................................................................................31
Table 18: List of Acronyms (Example)......................................................................................................................................................34
List of Figures
Figure 1: COMe Ref. Carrier-i T6 TMIP Functional Block Diagram ...................................................................................................12
Figure 2: COMe Ref. Carrier-i T6 TMIP Rear Panel.................................................................................................................................13
Figure 3: COMe Ref. Carrier-i T6 TMIP Layout - Top View ..................................................................................................................14
Figure 4: COMe Ref. Carrier-i T6 TMIP Layout - Bottom View...........................................................................................................15

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1/ Introduction
1.1. Carrier Overview
The COMe Reference Carrier-i Type 6 Thin-MiniITX is a COM Express® pinout Type 6, Thin-mITX form factor-compliant
reference carrier designed to accommodate a basic/compact Type 6 COM Express® Computer-on-Module compliant
with the PICMG COM.0 specification Rev 2.1.
COMe Ref. Carrier-i T6 TMIP refers to the COMe Reference Carrier-i Type 6 Thin-MiniITX
Professional (P/N 38115-0000-00-0).
The following table lists the COMe Ref. Carrier-i T6 TMIP features.
Table 1: COMe Ref. Carrier-i T6 TMIP Features
Feature COMe Ref. Carrier-I T6 TMIP (P/N 38115-0000-00-0)
SPI BIOS Socket 
Carrier EEPROM 
DDI1 - DP++ 
DDI2 - mDP++ 
DDI3 - mDP++ 
LVDS 
mPCIe0 
mPCIe1 / mSATA 
GBLan0 (Module) 
GBLan1 (Carrier) 
SATA0 (top) 
SATA3 (bottom) 
M.2 
USB 2.0 / 3.0 I/O 
USB 3.0 Pin Header 
HDA Codec 
Line-In/Out 
FP Audio 
S/PDIF 
SER0/1 
GPIO 
SIM 
System Signals 
System Panel 
CPU Fan 
RTC Connector 
Goldcap 2.5F 
12V Input 
8.5 - 30V Input 
Rubber Feet 

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1.2. Board Diagrams
The following diagrams provide additional information concerning board functionality and component layout.
1.2.1. Functional Block Diagram
Figure 1: COMe Ref. Carrier-i T6 TMIP Functional Block Diagram

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1.2.2. Rear Panel
Figure 2: COMe Ref. Carrier-i T6 TMIP Rear Panel
1
Voltage Input
2USB 2.0
3USB 3.0/2.0
4DP
5
mDP
6LAN
7Audio Line-in
8Audio Line-out
2
1
4
3
7
6
5 8

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1.2.3. Board layout
Figure 3: COMe Ref. Carrier-i T6 TMIP Layout - Top View

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Figure 4: COMe Ref. Carrier-i T6 TMIP Layout - Bottom View
1.2.4. Component Overview
Table 2: Component Overview
Component Decsription
C35 Goldcap
D35 Status LED: SUS_S3
D36 Status LED: SUS_S4
D37 Status LED: SUS_S5
D38 Status LED: V12_S5
D39 Status LED: V5.0_V3.3_PGOOD
J1 Power connector (8.5V – 30V input voltage)
J4 PWM fan connector
J5 SATA plug connector (with power connector)
J6 DC jack (12V only)
J7 USB 3.0/2.0 pin header
J8 LVDS / JILI connector
J9 Mini DisplayPort++ connector (eDP option)

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Component Decsription
J10 USB 2.0 double-stack connector
J11 USB 3.0/2.0 double-stack connector
J12 DisplayPort++ connector (DDI1)
J13 Mini PCIe card latch (full-size) / mSATA socket
J14 COMe connector (Row A and B)
J15 COMe connector (Row C and D)
J16 Mini DisplayPort++ connector (DDI3)
J17 Mini DisplayPort++ connector (DDI2)
J18 RJ45 Ethernet connector
J19 SPI BIOS socket
J20 RJ45 Ethernet connector
J21 Mini PCIe card slot (full-size) / mSATA socket
J22 Front panel HD audio header
J23 S/PDIF Header
J24 Mini PCIe card slot (half-size)
J25 Rear panel line-in connector
J26 Rear panel SPK / line-out connector
J27 Front panel connector
J28 Mini PCIe card latch (half-size)
J29 COM port pin header (COM2/SER1)
J30 COM port pin header (COM1/SER0)
J31 SYS_Signals / embedded interfaces pin header
J32 GPIO pin header
J33 SATA receptacle connector (with power connector)
J34 M.2 socket
J35 SIM card slot
J36 CMOS battery connector
SW1 DIP switch
U2 Redriver IC for SATA interfacing (SATA#0)
U3 Redriver IC for SATA interfacing (SATA#0)
U5 Redriver IC for DP interfacing (DDI1)
U6 Redriver IC for SATA interfacing (SATA#3)
U7 Redriver IC for DP interfacing (DDI3)
U8 Redriver IC for SATA interfacing (SATA#3)
U9 Redriver IC for DP interfacing (DDI2)
U10 Redriver IC for SATA interfacing (SATA#1)
U11 Redriver IC for SATA interfacing (SATA#1)
U13 HD Audio Codec IDT / Tempo Semi 92HD73C
U29 Intel® Ethernet Controller I210-IT
U30 Carrier EEPROM (FRUPROM)
U41 Redriver IC for SATA interfacing (SATA#2)
U42 Redriver IC for SATA interfacing (SATA#2)

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1.3. Technical Specification
Table 3: COMe Ref. Carrier-i T6 TMIP Main Specifications
Features Specification
CPU Processor & Chipset Via COMe basic/compact Type 6 module
Memory System Memory Via COMe basic/compact Type 6 module
Flash Memory One SPI BIOS socket for SPI flash ICs with up to 16 MB flash memory
EEPROM EEPROM with 32 kbit on the carrier (FRUPROM)
Graphical
Interfaces
Digital Display
Interfaces
Three digital display interfaces (DDI):
DDI1: DisplayPort++ connector from COMe DDI1 with redriver IC, J12
DDI2: Mini DisplayPort++ connector from COMe DDI2 with redriver IC, J17
DDI3: Mini DisplayPort++ connector from COMe DDI3 with redriver IC, J16
LVDS LVDS / JILI connector (24-bit, dual-channel LVDS), J8
Embedded
DisplayPort
Mini DisplayPort++ connector via eDP (optional, instead of LVDS), J9
PEG Four PEG lanes (PEG#[0-3]) used for the M.2 interface
System
Interfaces
PCI Express Three PCIe interfaces:
PCIe#0 for Mini PCIe 2.0 half-size card slot connected to the SIM card
slot, J24
PCIe#1 for Mini PCIe 2.0 full-size card slot muxed with SATA#1 (mSATA)
and connected to the SIM card slot, J21
PCIe#2 for the onboard Gigabit Ethernet controller
SATA Four SATA 6 Gb/s interfaces:
SATA#0 via the 22-pin SATA plug connector (with redriver ICs), J5
SATA#1 for the mSATA socket / Mini PCIe full-
size card slot (with redriver
ICs), J21
SATA#2 muxed with PEG#0 for the M.2 interface (with redriver ICs)
 SATA#3 via the 22-pin SATA receptacle connector (with redriver ICs), J33
M.2 M.2 socket via PEG#[0-3] and SATA#2 (muxed with PEG#0), J34
Ethernet Two Gigabit Ethernet interfaces:
GbE#0 on RJ45 connector, J18, via COMe basic/compact Type 6 module
GbE#1 on RJ45 connector, J20, via the onboard GbE controller (Intel®
Ethernet Controller I210-IT)
USB 2.0 Eight USB 2.0 interfaces:
Two USB 2.0 interfaces (USB#[0;1]) for USB 3.0/2.0 double-stack
connector, J11
Two USB 2.0 interfaces (USB#[2;3]) for USB 3.0/2.0 pin header, J7
Two USB 2.0 interfaces (USB#[4;5]) for USB 2.0 double-stack connector,
J10
One USB 2.0 interface (USB#6) for PCIe#0 (Mini PCIe half-size interface)
One USB 2.0 interface (USB#7) for PCIe#1 (Mini PCIe full-size/mSATA
interface)
USB 3.0 Four USB 3.0 interfaces:
Two USB 3.0 interfaces (USB_SS#[0;1]) for USB 3.0/2.0 double-stack
connector, J11
Two USB 3.0 interfaces (USB_SS#[2;3]) for USB 3.0/2.0 pin header, J7

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Features Specification
System
Interfaces
HD Audio Four HD Audio interfaces:
Rear panel line-in connector, J25
Rear panel SPK/line-out connector, J26
Front panel HD audio header, J22
S/PDIF header, J23
UART Two RS-232 COM ports (RX/TX only) via pin headers:
J30 (COM1/SER0)
J29 (COM2/SER1)
GPIO Four GPIs and four GPOs via the 10-pin GPIO pin header, J32
SIM SIM card slot connected to both Mini PCIe interfaces, J35
I2C I2C interface via 15-pin SYS_Signals / embedded interfaces pin header, J31
SMBus SMBus interface via 15-pin SYS_Signals / embedded interfaces pin header, J31
LID/SLEEP LID/SLEEP signals via 15-pin SYS_Signals / embedded interfaces pin header, J31
CPU Fan One 4-pin PWM fan connector, J4
LEDs Two status LEDs available via the front panel connector, J27:
Power LED
 HDD Activity LED
Switch Dip Switch One 8-position DIP switch
SW1, for board configuration
System
Interfaces
Power Supply Power input 1: 12V only
Power input 2: 8.5V - 30V wide input range
Power / Reset
Button
Available via the front panel connector, J27
RTC 2-pin connector for external CMOS battery, J36
Goldcap for RTC backup, C35
General BIOS Via COMe basic/compact Type 6 module
Temperature Range Operational: -40°C to +85°C Storage: -40°C to +85°C
Note: When additional components are installed, refer to their operational
specifications as this will influence the operational and storage temperature of
the COMe Ref. Carrier-i T6 TMIP
Climatic Humidity 93% RH at 40 °C, non-condensing (acc. to IEC 60068-2-78)
Form Factor COM Express® carrier, pinout Type 6, Thin-mITX form factor
Dimensions 170 mm x 170 mm (mITX)
Max. component height:
Top side: 16.2 mm
Bottom side: 5.4 mm

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1.4. Accessories
The following accessories are available for the COMe Ref. Carrier-i T6 TMIP.
Table 4: COMe Ref. Carrier-i T6 TMIP Accessories
Part Number Part Name Decsription
96006-0000-00-2 COMe Post T6 NFCB POST Code / Debug card
38019-0000-00-0 ADA-COMe-Height-Dual EERC height adapter
38017-0000-00-5 COMe Mount Kit 5 mm 1 set Mounting Kit for 1 module including screws for 5 mm
connectors
38017-0100-00-5 COMe Mount Kit 5 mm 100 sets Mounting Kit for 100 modules including screws for 5 mm
connectors
38017-0000-00-0 COMe Mount Kit 8 mm 1 set Mounting Kit for 1 module including screws for 8 mm
connectors
38017-0100-00-0 COMe Mount Kit 8 mm 100 sets Mounting Kit for 100 modules including screws for 8 mm
connectors
9-5000-0352 ADA-LVDS_DVI 18 bit 18 bit LVDS to DVI converter
9-5000-0353 ADA-LVDS_DVI 24 bit 24 bit LVDS to DVI converter
96006-0000-00-8 ADA-DP-LVDS DP to LVDS adapter
96082-0000-00-0 KAB-ADAPT-DP-DVI DP to DVI adapter cable
96083-0000-00-0 KAB-ADAPT-DP-VGA DP to VGA adapter cable
96084-0000-00-0 KAB-ADAPT-DP-HDMI DP to HDMI adapter cable

COMe Ref. Carrier-i T6 TMI - User Guide Rev. 1.4
www.kontron.com // 20
1.5. Standards
This product complies with the requirements of the following standards.
Table 5: Standards
Type Aspect Standard Comment
CE Emission EN61000-6-3, EN55022
Electrical Safety Directive 2014/35/EU Low Voltage Directive (LVD)
EN60950-1
Product Safety Directive 2001/95/EC General Product Safety Directive
EMC Directive 2014/30/EU Electromagnetic Compatibility
Environmental Climatic Humidity IEC60068-2-78 [1]
WEEE Directive 2002/96/EC Waste electrical and electronic
equipment
RoHS 2 Directive 2011/65/EU Restriction of the use of certain
hazardous substances in electrical
and electronic equipment
Environmental Vibration (Sinusoidal) IEC60068-2-6 Test parameters:
9-150 (Hz) frequency range 1 (g)
acceleration
1 (oct/min) sweep rate 10
cycles/axis
3 axes
Single Shock IEC60068-2-27 Test parameters:
15 (g) acceleration
11 (ms) shock duration half sine
3 number of shocks per direction
(total: 18)
6 directions
5 (s) recovery time
[1]Customers desiring to perform further environmental testing of the COMe Ref. Carrier-i T6 TMIP must contact
Kontron for assistance prior to performing any such testing.
Boards without conformal coating must not be exposed to a change of temperature that can lead to condensation, as
it may cause irreversible damage especially when the board is powered up again.
Kontron does not accept any responsibility for damage to products resulting from destructive environmental testing.