Lenovo ThinkAgile VX7820 User manual

User Guide for
ThinkAgile VX7820 Appliance,
ThinkAgile VX 4-Socke 4U Cer ified Node
Machine Types: 7Z12 and 7Z13

Note
Before using his informa ion and he produc i suppor s, be sure o read and unders and he safe y
informa ion and he safe y ins ruc ions, which are available a :
h p:// hinksys em.lenovofiles.com/help/ opic/safe y_documen a ion/pdf_files.h ml
This equipmen is no sui able for use in loca ions where children are likely o be presen .
In addi ion, be sure ha you are familiar wi h he erms and condi ions of he Lenovo warran y for your server,
which can be found a :
h p://da acen ersuppor .lenovo.com/warran ylookup
First Edition (May 2020)
© Copyright Lenovo 2020.
LIMITED AND RESTRICTED RIGHTS NOTICE: If da a or sof ware is delivered pursuan o a General Services
Adminis ra ion (GSA) con rac , use, reproduc ion, or disclosure is subjec o res ric ions se for h in Con rac No. GS-35F-
05925.

Contents
Sa ety . . . . . . . . . . . . . . . . . . v
Safe y inspec ion checklis . . . . . . . . . . . vi
Chapter 1. Introduction . . . . . . . . . 1
Typical vSAN archi ec ure . . . . . . . . . . . . 1
VX deploymen archi ec ure . . . . . . . . . . . 2
Specifica ions . . . . . . . . . . . . . . . . 3
Configura ions . . . . . . . . . . . . . . . . 8
Configura ion 1. Four-socke Performance . . . 8
Configura ion 2. Four-Socke Upgradable . . . 12
Configura ion 3. Four-Socke Upgradable /
S orage Rich . . . . . . . . . . . . . . 14
Managemen op ions. . . . . . . . . . . . . 17
Lifecycle managemen . . . . . . . . . . . . 18
Recommended procedure for upda ing a
ThinkAgile VX clus er . . . . . . . . . . . 18
Firmware upda es . . . . . . . . . . . . . . 19
Tech Tips . . . . . . . . . . . . . . . . . 22
Securi y advisories . . . . . . . . . . . . . 22
Chapter 2. Server components . . . . 23
Fron view . . . . . . . . . . . . . . . . . 24
Fron opera or panel . . . . . . . . . . . 26
Rear view . . . . . . . . . . . . . . . . . 29
In ernal connec ors . . . . . . . . . . . . . 32
Sys em-board connec ors . . . . . . . . . 32
S orage-board-assembly connec ors . . . . 33
I/O ray connec ors. . . . . . . . . . . . 34
S orage in erposer connec ors . . . . . . . 38
RAID card connec ors . . . . . . . . . . 38
Drive backplane connec ors . . . . . . . . 39
In ernal cable rou ing. . . . . . . . . . . . . 40
Cable rou ing for common componen s . . . 42
Cable rou ing for drives . . . . . . . . . . 45
Par s lis . . . . . . . . . . . . . . . . . . 55
Power cords . . . . . . . . . . . . . . 60
Chapter 3. Network/In rastructure
Planning . . . . . . . . . . . . . . . . 61
Chapter 4. Server setup checklist. . . 63
Server package con en s . . . . . . . . . . . 63
Cable he server . . . . . . . . . . . . . . 64
Power on he server (connec inpu power) . . . . 64
Power off he server (disconnec inpu power) . . . 65
Chapter 5. System con iguration . . . 67
Se he ne work connec ion for he Lenovo XClari y
Con roller . . . . . . . . . . . . . . . . . 67
Managemen op ions. . . . . . . . . . . . . 68
Manage he lifecycle . . . . . . . . . . . . . 68
Upda e he firmware . . . . . . . . . . . . . 68
Configure he firmware . . . . . . . . . . . . 68
Memory configura ion . . . . . . . . . . . . 70
Independen memory mode . . . . . . . . 70
Memory mirroring . . . . . . . . . . . . 70
Memory sparing . . . . . . . . . . . . . 70
Configure DC Persis en Memory Module
(DCPMM) . . . . . . . . . . . . . . . 70
RAID configura ion . . . . . . . . . . . . . 75
Ins all he opera ing sys em . . . . . . . . . . 75
Back up he server configura ion . . . . . . . . 76
Chapter 6. Installing and con iguring
vCSA . . . . . . . . . . . . . . . . . . 77
Using he ThinkAgile Ins aller . . . . . . . . . 77
Downloading and se ing up he ThinkAgile
Ins aller . . . . . . . . . . . . . . . . 77
Running he ThinkAgile Ins aller. . . . . . . 78
Ins alling and configuring vCSA manually . . . . . 81
Adding he ThinkAgile VX7820 Appliance/VX 4U
Cer ified Node o an exis ing vCSA ins ance. . . . 82
Chapter 7. Installing and setting up
Lenovo XClarity Administrator. . . . . 83
Deploying Lenovo XClari y Adminis ra or . . . . . 83
Managing ThinkAgile VX7820 Appliance/VX 4U
Cer ified Node Servers . . . . . . . . . . . . 84
Chapter 8. Installing and setting up
Lenovo XClarity Integrator. . . . . . . 87
Deploying Lenovo XClari y In egra or for VMware
vCen er . . . . . . . . . . . . . . . . . . 87
Chapter 9. Hardware replacement
procedures . . . . . . . . . . . . . . . 89
Ins alla ion Guidelines . . . . . . . . . . . . 89
Sys em reliabili y guidelines . . . . . . . . 90
Handling s a ic-sensi ive devices . . . . . . 91
Adap er replacemen . . . . . . . . . . . . . 91
Remove a PCIe adap er from slo 1 o 4 . . . 92
Remove a PCIe adap er from slo 5 o 8 . . . 93
Remove a LOM adap er from slo 9 . . . . . 95
Remove a PCIe adap er from slo 10 o 15 . . 96
Remove an I/O adap er from slo 16 o 17 . . . 97
Ins all a PCIe adap er in slo 1 o 4. . . . . . 99
© Copyrigh Lenovo 2020 i

Ins all a PCIe adap er in slo 5 o 8. . . . . . 100
Ins all a LOM adap er in slo 9 . . . . . . . 101
Ins all a PCIe adap er in slo 10 o 15. . . . . 102
Ins all an I/O adap er in slo 16 o 17 . . . . . 104
Sys em ba ery (CR2032) replacemen . . . . . . 105
Remove he sys em ba ery . . . . . . . . 105
Ins all he sys em ba ery . . . . . . . . . 107
Sys em board replacemen . . . . . . . . . . 109
Remove a sys em board . . . . . . . . . 109
Ins all a sys em board . . . . . . . . . . 111
Sys em board filler replacemen . . . . . . . . 112
Remove a sys em board filler. . . . . . . . 113
Ins all a sys em board filler. . . . . . . . . 114
Upper/lower compu e ray replacemen . . . . . 115
Remove a compu e ray . . . . . . . . . . 115
Ins all a compu e ray. . . . . . . . . . . 117
Fan replacemen . . . . . . . . . . . . . . 119
Remove a fan . . . . . . . . . . . . . . 119
Ins all he fan . . . . . . . . . . . . . . 120
Fan cage replacemen . . . . . . . . . . . . 121
Remove a fan cage (upper ray) . . . . . . . 121
Remove a fan cage (lower ray) . . . . . . . 123
Ins all a fan cage (upper ray) . . . . . . . . 125
Ins all a fan cage (lower ray) . . . . . . . . 128
Fron bezel replacemen . . . . . . . . . . . 130
Remove he fron bezel . . . . . . . . . . 130
Ins all he fron bezel . . . . . . . . . . . 130
Fron cover replacemen . . . . . . . . . . . 131
Remove he fron cover . . . . . . . . . . 131
Ins all he fron cover . . . . . . . . . . . 132
Fron opera or panel replacemen . . . . . . . . 134
Remove he fron opera or panel . . . . . . 134
Ins all he fron opera or panel . . . . . . . 135
Fron USB/VGA assembly replacemen . . . . . 137
Remove he fron USB/VGA assembly . . . . 137
Ins all he fron USB/VGA assembly . . . . . 138
Hard disk drive backplane replacemen . . . . . 139
Remove a hard disk drive backplane (upper
ray) . . . . . . . . . . . . . . . . . 139
Remove a hard disk drive backplane (lower
ray) . . . . . . . . . . . . . . . . . 141
Ins all a hard disk drive backplane (upper
ray) . . . . . . . . . . . . . . . . . 143
Ins all a hard disk drive backplane (lower
ray) . . . . . . . . . . . . . . . . . 145
Ho -swap drive replacemen . . . . . . . . . . 147
Remove a ho -swap drive . . . . . . . . . 147
Ins all a ho -swap drive . . . . . . . . . . 148
Remove a ho -swap drive filler . . . . . . . 150
Ins all a ho -swap drive filler . . . . . . . . 151
I/O ray replacemen . . . . . . . . . . . . . 152
Remove he I/O ray . . . . . . . . . . . 152
Ins all he I/O ray . . . . . . . . . . . . 154
M.2 backplane replacemen . . . . . . . . . . 163
Remove he M.2 backplane . . . . . . . . 163
Ins all he M.2 backplane . . . . . . . . . 165
M.2 backplane re ainer adjus men . . . . . 166
M.2 drive replacemen . . . . . . . . . . . . 166
Remove an M.2 drive . . . . . . . . . . . 166
Ins all an M.2 drive . . . . . . . . . . . . 167
Memory air baffle replacemen . . . . . . . . . 170
Remove a memory baffle . . . . . . . . . 170
Ins all a memory air baffle . . . . . . . . . 171
Memory module replacemen . . . . . . . . . 173
Remove a memory module . . . . . . . . 173
Ins all a memory module . . . . . . . . . 175
Midplane replacemen . . . . . . . . . . . . 179
Remove a midplane . . . . . . . . . . . 179
Ins all a midplane . . . . . . . . . . . . 181
Power supply replacemen . . . . . . . . . . 183
Remove a power supply. . . . . . . . . . 183
Ins all a power supply. . . . . . . . . . . 185
Remove a power supply filler . . . . . . . . 188
Ins all a power supply filler. . . . . . . . . 189
Processor and hea sink replacemen . . . . . . 190
Remove a processor and hea sink . . . . . 190
Ins all a processor and hea sink . . . . . . 193
RAID/HBA card replacemen . . . . . . . . . . 200
Remove a RAID/HBA card (upper ray) . . . . 200
Remove a RAID/HBA card (lower ray) . . . . 201
Ins all a RAID/HBA card (upper ray) . . . . . 203
Ins all a RAID/HBA card (lower ray) . . . . . 205
RAID flash power module replacemen . . . . . . 207
Remove a RAID flash power module (upper
ray) . . . . . . . . . . . . . . . . . 207
Remove a RAID flash power module (lower
ray) . . . . . . . . . . . . . . . . . 208
Ins all a RAID flash power module (upper
ray) . . . . . . . . . . . . . . . . . 209
Ins all a RAID flash power module (lower
ray) . . . . . . . . . . . . . . . . . 211
Riser replacemen . . . . . . . . . . . . . . 212
Remove he riser for slo 1 o 4 (riser 1) . . . . 212
Remove he riser for slo 10 o 15 (riser 2) . . . 213
Remove he riser bracke for slo 14 o 15
(riser 2) . . . . . . . . . . . . . . . . 215
Remove he riser for slo 16 o 17 (riser 3) . . . 217
Ins all he riser for slo 1 o 4 (riser 1) . . . . . 218
Ins all he riser for slo 10 o 15 (riser 2) . . . . 220
Ins all he riser bracke for slo 14 o 15 (riser
2) . . . . . . . . . . . . . . . . . . 221
Ins all he riser for slo 16 o 17 (riser 3) . . . . 222
ii User Guide for ThinkAgile VX7820 Appliance, ThinkAgile VX 4-Socke 4U Cer ified Node

S orage board assembly replacemen . . . . . . 224
Remove a s orage board assembly . . . . . 224
Ins all a s orage board assembly . . . . . . 225
S orage in erposer replacemen . . . . . . . . 226
Remove a s orage in erposer (upper ray) . . . 226
Remove a s orage in erposer (lower ray) . . . 228
Ins all a s orage in erposer (upper ray) . . . . 229
Ins all a s orage in erposer (lower ray) . . . . 230
S orage ray replacemen . . . . . . . . . . . 232
Remove a s orage ray . . . . . . . . . . 232
Ins all he s orage ray (fully removed) . . . . 234
TCM/TPM adap er replacemen (for Chinese
Mainland only) . . . . . . . . . . . . . . . 235
Remove he TCM/TPM adap er (for Chinese
Mainland only) . . . . . . . . . . . . . 235
Ins all he TCM/TPM adap er (for Chinese
Mainland only) . . . . . . . . . . . . . 236
Upper ray filler replacemen . . . . . . . . . . 237
Remove he upper ray filler . . . . . . . . 237
Ins all he upper ray filler . . . . . . . . . 239
Comple e he par s replacemen . . . . . . . . 240
Chapter 10. Problem
determination . . . . . . . . . . . . . 243
Even logs . . . . . . . . . . . . . . . . . 243
Ligh pa h diagnos ics . . . . . . . . . . . . 245
Power supply LEDs . . . . . . . . . . . 247
Sys em-board LEDs . . . . . . . . . . . 249
General problem de ermina ion procedures . . . . 249
Resolving suspec ed power problems . . . . 250
Resolving suspec ed E herne con roller
problems . . . . . . . . . . . . . . . 250
Troubleshoo ing by symp om . . . . . . . . . 251
Power on and power off problems. . . . . . 251
Processor problems . . . . . . . . . . . 253
Memory problems . . . . . . . . . . . . 253
Hard disk drive problems . . . . . . . . . 255
Moni or and video problems . . . . . . . . 257
Keyboard, mouse, or USB-device
problems . . . . . . . . . . . . . . . 258
Op ional-device problems . . . . . . . . . 259
Serial-device problems . . . . . . . . . . 260
In ermi en problems. . . . . . . . . . . 261
Power problems . . . . . . . . . . . . . 262
Ne work problems . . . . . . . . . . . . 262
Observable problems. . . . . . . . . . . 263
Sof ware problems. . . . . . . . . . . . 265
Appendix A. Hardware
disassembling or recycle . . . . . . . 267
Disassemble he sys em board for recycle . . . . 267
Disassemble he sys em board filler for recycle . . 268
Disassemble he fron cover for recycle . . . . . 268
Appendix B. Getting help and
technical assistance . . . . . . . . . . 271
Before you call . . . . . . . . . . . . . . . 271
Collec ing service da a . . . . . . . . . . . . 272
Con ac ing Suppor . . . . . . . . . . . . . 273
Appendix C. Notices. . . . . . . . . . 275
Trademarks . . . . . . . . . . . . . . . . 276
Impor an no es . . . . . . . . . . . . . . . 276
Par icula e con amina ion . . . . . . . . . . . 276
Telecommunica ion regula ory s a emen . . . . . 277
Elec ronic emission no ices . . . . . . . . . . 277
Taiwan BSMI RoHS declara ion. . . . . . . 278
Taiwan impor and expor con ac informa ion . . . 278
Index . . . . . . . . . . . . . . . . . . 279
© Copyrigh Lenovo 2020 iii

iv User Guide for ThinkAgile VX7820 Appliance, ThinkAgile VX 4-Socke 4U Cer ified Node

Sa ety
Before ins alling his produc , read he Safe y Informa ion.
An es de ins alar es e produ o, leia as Informações de Segurança.
在安装本产品之前，请仔细阅读 Safe y Informa ion （安全信息）。
Læs sikkerhedsforskrif erne, før du ins allerer de e produk .
Lees voorda u di produc ins alleer eers de veiligheidsvoorschrif en.
Ennen kuin asenna ämän uo een, lue urvaohjee kohdas a Safe y Informa ion.
Avan d'ins aller ce produi , lisez les consignes de sécuri é.
Vor der Ins alla ion dieses Produk s die Sicherhei shinweise lesen.
Prima di ins allare ques o prodo o, leggere le Informazioni sulla Sicurezza.
Les sikkerhe sinformasjonen (Safe y Informa ion) før du ins allerer de e produk e .
An es de ins alar es e produ o, leia as Informações sobre Segurança.
© Copyrigh Lenovo 2020 v

An es de ins alar es e produc o, lea la información de seguridad.
Läs säkerhe sinforma ionen innan du ins allerar den här produk en.
Sa ety inspection checklist
Use he informa ion in his sec ion o iden ify po en ially unsafe condi ions wi h your server. As each machine
was designed and buil , required safe y i ems were ins alled o pro ec users and service echnicians from
injury.
CAUTION:
This equipment must be installed or serviced by trained personnel, as de ined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard or Sa ety o Electronic Equipment within the Field o Audio/Video,
In ormation Technology and Communication Technology. Lenovo assumes you are quali ied in the
servicing o equipment and trained in recognizing hazards energy levels in products. Access to the
equipment is by the use o a tool, lock and key, or other means o security, and is controlled by the
authority responsible or the location.
Important: Elec rical grounding of he server is required for opera or safe y and correc sys em func ion.
Proper grounding of he elec rical ou le can be verified by a cer ified elec rician.
Use he following checklis o verify ha here are no po en ially unsafe condi ions:
1. Make sure ha he power is off and he power cord is disconnec ed.
2. Check he power cord.
• Make sure ha he hird-wire ground connec or is in good condi ion. Use a me er o measure hird-
wire ground con inui y for 0.1 ohm or less be ween he ex ernal ground pin and he frame ground.
• Make sure ha he power cord is he correc ype.
To view he power cords ha are available for he server:
a. Go o:
h p://dcsc.lenovo.com/#/
b. In he Cus omize a Model pane:
1) Click Select Options/Parts or a Model.
2) En er he machine ype and model for your server.
vi User Guide for ThinkAgile VX7820 Appliance, ThinkAgile VX 4-Socke 4U Cer ified Node

c. Click he Power ab o see all line cords.
• Make sure ha he insula ion is no frayed or worn.
3. Check for any obvious non-Lenovo al era ions. Use good judgmen as o he safe y of any non-Lenovo
al era ions.
4. Check inside he server for any obvious unsafe condi ions, such as me al filings, con amina ion, wa er or
o her liquid, or signs of fire or smoke damage.
5. Check for worn, frayed, or pinched cables.
6. Make sure ha he power-supply cover fas eners (screws or rive s) have no been removed or ampered
wi h.
© Copyrigh Lenovo 2020 vii

viii User Guide for ThinkAgile VX7820 Appliance, ThinkAgile VX 4-Socke 4U Cer ified Node

Chapter 1. Introduction
The ThinkAgile VX7820 Appliance and VX 4U Cer ified Node are high performance 4U rack servers ha
suppor up o four In el Xeon processors. They are en erprise-class servers designed for cus omers requiring
four processors, large amoun s of memory, and numerous I/O connec ions. In addi ion, hey are designed o
simplify vSAN deploymen and managemen for cus omers hrough predefined server configura ions ha are
op imized around specific ypes of workloads. They are preins alled wi h VMware ESXi and conform o bes
prac ices and compliance guidelines for vSAN.
Note: A VMware vSAN clus er requires a minimum of hree servers. The bes prac ice is o use hree or more
servers of he same machine ype and configura ion o provide a balanced and high-performance solu ion.
In addi ion, he servers are designed o u ilize he Lenovo sys em managemen ools o crea e a unified
hardware managemen solu ion for vSAN deploymen s:
• Lenovo XClarity Administrator, which provides firmware compliance func ionali y o ensure ha he
ThinkAgile VX MT 7Z12 and 7Z13 Series servers are running he appropria e level of firmware for Lenovo
XClari y Con roller, UEFI, and PCIe devices.
• Lenovo XClarity Integrator, which provides VMware vCen er plug-in func ionali y so ha ThinkAgile VX
MT 7Z12 and 7Z13 Series servers can be managed direc ly from vCen er.
The ThinkAgile VX MT 7Z12 and 7Z13 Series hardware is based on he SR950 rack server.
Figure 1. ThinkAgile VX7820 Appliance/VX 4U Certified ode
The server comes wi h a limi ed warran y. For de ails abou he warran y, see:
h ps://suppor .lenovo.com/us/en/solu ions/h 503310
For de ails abou your specific warran y, see:
h p://da acen ersuppor .lenovo.com/warran ylookup
Typical vSAN architecture
A ypical vSAN archi ec ure includes hree or more servers ha are implemen ed as a single vSAN clus er.
Each server con ribu es s orage o he vSAN clus er from he local disks on he server:
• Hybrid Clus er – The server provides a combina ion of solid s a e disks (SSDs) for caching and hard disk
drives (HDDs) for s orage capaci y.
• All-Flash Clus er – The server provides SSDs for caching and SSDs for s orage capaci y.
The following figure provides a concep ual view of he vSAN archi ec ure:
© Copyrigh Lenovo 2020 1

The following figure provides a concep ual view of he vSAN archi ec ure:
h ps://s oragehub.vmware.com/ /vmware-vsan/vmware-r-vsan- m-design-and-sizing-guide/
VX deployment architecture
When deploying a ThinkAgile VX MT 7Z12 and 7Z13 Series solu ion, he bes prac ice is o use hree or more
servers of he same machine ype and configura ion o provide a balanced and high-performance solu ion.
The sys ems are connec ed hrough swi ches for managemen and da a:
• A dedica ed managemen ne work is used by he Lenovo XClari y Adminis ra or o communica e wi h he
Lenovo XClari y Con roller (XCC) on each of he ThinkAgile VX7820 Appliance/VX 4U Cer ified Node.
• A redundan 10Gbps E herne ne work is used for VMware vSphere managemen and vSAN da a raffic.
The redundan E herne ne work is implemen ed hrough wo op-of-rack swi ches, such as he Lenovo
ThinkSys em NE1032 RackSwi ch.
For more informa ion abou he Lenovo ThinkSys em NE1032 RackSwi ch, see he following websi e:
h ps://lenovopress.com/lp0605-lenovo- hinksys em-ne1032-rackswi ch
The following figure shows a ypical ThinkAgile VX Series deploymen :
2User Guide for ThinkAgile VX7820 Appliance, ThinkAgile VX 4-Socke 4U Cer ified Node

Speci ications
The following informa ion is a summary of he fea ures and specifica ions of he server. Depending on he
model, some fea ures migh no be available, or some specifica ions migh no apply.
Table 1. Server Specifications
Speci ication Description
Size 4U server
• Heigh : 175.8 mm (6.9 in.)
• Dep h:
– EIA flange o rear: 800.0 mm (31.5 in.)
– Overall: 853.0 mm (33.6 in.)
• Wid h:
– Top cover: 447.0 mm (17.6 in.)
– EIA flange: 483.0 mm (19.0 in.)
Weigh Approxima ely 32.6 kg (71.9 lbs.) o 58.7 kg (129.4 lbs.) depending on your
configura ion.
Processor (depending on he
model)
Suppor s mul i-core In el Xeon processors, wi h in egra ed memory con roller and
Ul ra Pa h In erconnec (UPI)
• Two processors, minimum (expandable up o four).
• Designed for he LGA 3647-0 socke
• Scalable up o 112 cores (wi h four processors ins alled)
For a lis of suppor ed processors, see h p://www.lenovo.com/us/en/serverproven/
and he “Processor Op ions” sec ion of he ThinkAgile VX7820 Appliance/VX 4U
Cer ified Node produc guide on h p://lenovopress.com/.
Note: If 82xx processors are ins alled, 60 mm x 38mm, 19K in ernal ho -swap fans
(01PG490) mus also be ins alled o mee CPU cooling requiremen s a 35°C. If 16K
in ernal ho -swap fans are curren ly ins alled, you mus valida e ha he sys em has
version 2 of he ThinkSys em 2-CPU, 24-DIMM, Compu e Sys em Board (01CV978)
ins alled in each compu e ray before upgrading he fans from 16K o 19K.
Chap er 1.In roduc ion 3

Table 1. Server Specifications (continued)
Speci ication Description
Memory • Minimum: 32 GB
• Maximum:
– 3.1 TB using regis ered DIMMs (RDIMMs) or load reduc ion DIMMs (LRDIMMs)
– 12.3 TB using hree-dimensional-s acking regis ered DIMMs (3DS RDIMMs)
– 18.4 TB using In el® Op aneTM DC persis en memory modules (PMMs)
• Type:
– PC4-21300 (DDR4-2666), opera ing speed depends on processor model and
UEFI se ings
– Single-rank or dual-rank
– Regis ered DIMM (RDIMM), load reduced DIMM (LRDIMM), or hree-
dimensional-s acking regis ered DIMM (3DS RDIMM)
• Slo s: 24 dual inline in each compu e ray (48 DIMMs, maximum)
• Suppor s (depending on he model):
– 16 GB, 32 GB, 64 GB RDIMMs
– 64 GB LRDIMMs
– 64 GB, 128 GB, 256 GB 3DS RDIMMs
– 128 GB, 256 GB, and 512 GB In el® Op aneTM DC persis en memory modules
(DCPMMs)
Drive expansion • Up o six SAS/SATA/NVMe drive backplanes:
• Up o 24 2.5-inch ho -swap drive bays:
– Up o 24 SATA/SAS drives (dependen on ins alled drive backplanes)
– Up o 12 NVMe drives (dependen on ins alled drive backplanes)
See “Configura ions” on page 8 for more de ails.
4User Guide for ThinkAgile VX7820 Appliance, ThinkAgile VX 4-Socke 4U Cer ified Node

Table 1. Server Specifications (continued)
Speci ication Description
Expansion slo s Up o seven een expansion slo s (dependen on server configura ion):
• Slo 1 - 4: PCI Express 3.0 for PCIe riser-card wi h he following slo s available
depending on he riser ins alled:
1. x8/x8/x8/x8 PCIe full-heigh riser ki provides:
– Slo 1: PCI Express 3.0 x8
– Slo 2: PCI Express 3.0 x8
– Slo 3: PCI Express 3.0 x8
– Slo 4: PCI Express 3.0 x8
2. x16/x16 PCIe full-heigh riser ki provides:
– Slo 3: PCI Express 3.0 x16
– Slo 4: PCI Express 3.0 x16
3. x16/x16/x16/x16 PCIe full-heigh riser ki (8-processor sys ems only)
provides:
– Slo 1: PCI Express 3.0 x16
– Slo 2: PCI Express 3.0 x16
– Slo 3: PCI Express 3.0 x16
– Slo 4: PCI Express 3.0 x16
• Slo 5: PCI Express 3.0 x16 (low profile)
• Slo 6: PCI Express 3.0 x16 (low profile)
• Slo 7: PCI Express 3.0 x8 (low profile)
Note: You should no ins all a RAID or Hos Bus Adap er card in his slo .
• Slo 8: ML2 x16 ne work adap er (wi h NC-SI suppor )
• Slo 9: LOM adap er
• Slo 10 - 15: PCI Express 3.0 for PCIe riser-card wi h he following slo s available
depending on he riser-card ins alled:
1. x8/x8/x8/x8 PCIe full-heigh riser ki provides:
– Slo 10: PCI Express 3.0 x8
– Slo 11: PCI Express 3.0 x8
– Slo 12: PCI Express 3.0 x8
– Slo 13: PCI Express 3.0 x8
2. x16/x16 PCIe full-heigh riser ki provides:
– Slo 12: PCI Express 3.0 x16
– Slo 13: PCI Express 3.0 x16
3. x16/x16/x16/x16 PCIe and ML2 x16 full-heigh riser ki (8-processor sys ems
only) provides:
– Slo 10: PCI Express 3.0 x16
– Slo 11: PCI Express 3.0 x16
– Slo 12: PCI Express 3.0 x16
– Slo 13: PCI Express 3.0 x16
– Slo 14: PCI Express 3.0 x16
– Slo 15: ML2 x16 ne work adap er (no NC-SI suppor )
Chap er 1.In roduc ion 5

Table 1. Server Specifications (continued)
Speci ication Description
• Slo 16 - 17: x8/x8 PCIe low-profile riser ki (processor-rich sys ems only)
provides:
– Slo 16: PCI Express 3.0 x8
– Slo 17: PCI Express 3.0 x8
See “Configura ions” on page 8 for more de ails.
In egra ed func ions • Lenovo XClari y Con roller, which provides service processor con rol and
moni oring func ions, video con roller, and remo e keyboard, video, mouse, and
remo e drive capabili ies.
• Ligh -pa h diagnos ics
• S andard connec ors (fron of server):
– DB-15 VGA por
– USB 2.0 por s ( wo):
– USB 2.0 for Lenovo XClari y Con roller managemen
– USB 2.0
• S andard connec ors (rear of server):
– DB-15 VGA por
– DB-9 serial por
– RJ-45 sys em-managemen ne work por . This connec or is dedica ed for
Lenovo XClari y Con roller func ions and runs a 1 gigabi (Gb) speed.
– USB 3.0 por s ( wo)
In ernal SAS HBAs The following RAID op ions are available for his server:
• ThinkSys em 430-8i In ernal SAS HBA
• ThinkSys em 430-16i In ernal SAS HBA
Fans Up o welve (60 mm x 38 mm) in ernal ho -swap sys em fans (dependen on server
configura ion)
• The six upper fans are no ins alled for he four-processor-limi ed server
configura ion.
• Only hree upper fans are ins alled for he s orage-rich configura ion.
Two ypes of fans are suppor ed:
• 60 mm x 38mm, 16K in ernal ho -swap fans (01CX965)
• 60 mm x 38mm, 19K in ernal ho -swap fans (01PG490)
Notes:
• Differen fan ypes canno be mixed wi hin a sys em. All fans mus be ei her 16K
fans or 19K fans.
• Before upgrading fans from 16K o 19K, you mus make sure ha he sys em has
version 2 of he ThinkSys em 2-CPU, 24DIMM, Compu e Sys em Board
(01CV978) ins alled in each compu e ray.
6User Guide for ThinkAgile VX7820 Appliance, ThinkAgile VX 4-Socke 4U Cer ified Node

Table 1. Server Specifications (continued)
Speci ication Description
Power supplies • This server suppor s hree ypes of ho -swap power supply uni s:
– 1100-wa power supply
– inpu vol age 110V, 220V, or 240V ac
– 1600-wa power supply
– inpu vol age 220V or 240V ac
– 2000-wa power supply
– inpu vol age 220V ac
• The power subsys em suppor s balanced N+N redundancy opera ion, where N =
1 or 2.
CAUTION:
1. 240 V dc input (input range: 180-300 V dc) is ONLY supported in Chinese
Mainland.
2. Power supplies with 240 V dc are not hot-swappable. To remove the power
cord, ensure you have turned o the server or disconnected the dc power
sources at the breaker panel.
3. In order or the ThinkSystem products to operate error ree in both a DC or
AC electrical environment, a TN-S earthing system which complies to
60364-1 IEC 2005 standard has to be present or installed.
Minimal configura ion for
debugging • Two processors in processor socke s 1 and 2
• Two DRAM DIMMs in slo 8 and 20
• One power supply in slo 1
• One drive wi h HBA adap er and backplane
• Six sys em fans (fans 1 o 6)
Acous ical noise emissions
(base configura ion) • Sound power, idling: 6.1 bels
• Sound power, opera ing: 6.1 bels
Note: The op ions suppor ed in his server vary in func ion, power consump ion, and
required cooling. Any increase in cooling required by hese op ions will increase he
fan speed and genera ed sound level. The ac ual sound pressure levels measured in
your ins alla ion depend upon a varie y of fac ors, including: he number of racks in
he ins alla ion; he size, ma erials, and configura ion of he room; he noise levels of
o her equipmen ; he room ambien empera ure and barome ric pressure; and he
loca ion of employees in rela ion o he equipmen .
Chap er 1.In roduc ion 7

Table 1. Server Specifications (continued)
Speci ication Description
Hea ou pu Approxima e hea ou pu :
• Minimum configura ion: 935 BTU, 275 W (in BTU per hour and wa s)
– Minimum configura ion of wo microprocessors, wo memory modules, one M.2
adap er, and no PCIe adap ers.
• Maximum configura ion: 21837 BTU, 6400 W (in BTU per hour and wa s)
– Maximum configura ion wi h four 1600-wa power supplies configured for non-
redundan opera ion under maximum loading.
Environmen • Air empera ure:
– Server on: 5° o 45°C (41° o 113°F); al i ude: 0 o 3050 m (10,006 f ) dera e
maximum dry bulb empera ure 1°C (33°F) per 125 m (410 f ) above 950 m
(3,117 f ). Maximum ra e of change 20°C (68°F) per hour
– Server off: 5° o 45°C (41° o 113°F)
– Shipmen : -40°C o 60°C (-40°F o 140°F)
• Humidi y range (noncondensing):
– Server on: Minimum = higher (more mois ure) of -12°C (10°F) dew poin and 8%
o 90% rela ive humidi y; maximum dew poin : 24°C (75°F)
– Server off: 8% o 90% rela ive humidi y; maximum dew poin : 27°C (80°F)
– Shipmen : 5% o 100%
Notes:
• Airborne par icula es and reac ive gases ac ing alone or in combina ion wi h o her
environmen al fac ors such as humidi y or empera ure migh pose a risk o he
server. For informa ion abou he limi s for par icula es and gases, see Par icula e
con amina ion.
• ASHRAE compliance informa ion (see he “Opera ing Environmen ” sec ion of
ThinkAgile VX7820 Appliance/VX 4U Cer ified Node produc guide on h p://
lenovopress.com/ for specific ASHRAE compliance levels for each server
configura ion):
– The server is designed for hermal compliance in ASHRAE A4 ambien
environmen s. Cer ain processor and adap er configura ions will limi produc
environmen al suppor o ASHRAE A2 ambien condi ions.
– If 82xx processors are ins alled, 60 mm x 38mm, 19K in ernal ho -swap fans
(01PG490) mus also be ins alled o mee CPU cooling requiremen s a 35°C.
– 205W processors used in an eigh -socke configura ion migh experience a
sligh drop in performance under ex reme workloads when he ambien
empera ure is above 30°C.
– NVMe devices are suppor ed up o an ambien empera ure of 35°C.
Con igurations
The ThinkAgile VX7820 Appliance/VX 4U Cer ified Node is available in several configura ions.
Con iguration 1. Four-socket Per ormance
The highes -performing four-socke server, a he lowes cos when up o 12 drives is enough and wi hou
he need for a simple upgrade.
8User Guide for ThinkAgile VX7820 Appliance, ThinkAgile VX 4-Socke 4U Cer ified Node

Figure 2. Four-socket performance configuration
This four-socke configura ion suppor s he following combina ions:
• Two processors (1, 2) suppor :
– 12 drives (bay 0-11) wi h wo NVMe enabled (bay 8, 10)
– Ex ension slo s
• Three processors (1, 2, 4)
• Four processors (1, 2, 3, 4)
• Suppor s 2, 3 or 4 processors (if using 5100 Series processors, 4 processors mus be selec ed)
• 4 socke s configured in mesh opology for bes performance
• 12 drive bays, 6 of which suppor NVMe drives (4 NVMe wi h 3 processors and 2 NVMe wi h 2 processors)
• 15 rear PCIe slo s wi h 4 processors (10 rear slo s wi h 3 processors, 6 rear slo s wi h 2 processors)
• Filler ins alled in he upper ray area
Processor con igurations
This configura ion suppor s 2, or 4 processors.
• 2-processor configura ion. Processors are ins alled in loca ion 1 and 2.
• 3-processor configura ion. Processors are ins alled in loca ions 1, 2, and 4.
• 4-processor configura ion. Processors are ins alled in loca ions 1, 2, 3, and 4.
Chap er 1.In roduc ion 9

Figure 3. Processor numbering (viewed from the front of the server)
PCIe slot connectivity
The following able shows he processor o PCIe slo connec ivi y:
PCIe
slot Slot location Description
1 Riser 1 41
No connec ed for 2x16. Slo s 1 and 2 are no connec ed if he 2x16 riser is used in
riser slo 1
2 41
No connec ed for 2x16. Slo s 1 and 2 are no connec ed if he 2x16 riser is used in
riser slo 1
3 41
4 41
5I/O ray 2
6 2
7 1
8 (ML2) 1
9 (LOM) 1 (PCH)
10 Riser 2 32
11 32
12 32
13 32
14 No connec ed.
15 (ML2) No connec ed.
16 2x8 Riser 32
17 1
M.2 I/O ray 1 (PCH)
S orage
adap er
Upper ray No connec ed.
10 User Guide for ThinkAgile VX7820 Appliance, ThinkAgile VX 4-Socke 4U Cer ified Node