Lenovo ThinkSystem SR250 V2 User manual

ThinkSystem SR250 V2
Maintenance Manual
Machine Types: 7D7Q and 7D7R

Note
Before using this information and the roduct it su orts, be sure to read and understand the safety
information and the safety instructions, which are available at:
htt ://thinksystem.lenovofiles.com/hel /to ic/safety_documentation/ df_files.html
In addition, be sure that you are familiar with the terms and conditions of the Lenovo warranty for your server,
which can be found at:
htt ://datacentersu ort.lenovo.com/warrantylooku
Second Edition (April 2022)
© Copyright Lenovo 2022
LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered ursuant to a General Services
Administration (GSA) contract, use, re roduction, or disclosure is subject to restrictions set forth in Contract No. GS-35F-
05925.

Contents
Contents i
Safety iii
Safety ins ection checklist . . . . . . . . . . . iv
Chapter 1 Introduction 1
S ecifications . . . . . . . . . . . . . . . . 1
Particulate contamination . . . . . . . . . . 5
Firmware u dates . . . . . . . . . . . . . . . 6
Tech Ti s . . . . . . . . . . . . . . . . . 10
Security advisories . . . . . . . . . . . . . 10
Power on the server . . . . . . . . . . . . . 10
Power off the server . . . . . . . . . . . . . 11
Chapter 2 Server components 13
Front view . . . . . . . . . . . . . . . . . 14
Front o erator anel . . . . . . . . . . . 16
Rear view . . . . . . . . . . . . . . . . . 17
System-board switches, jum ers, and buttons. . . 19
System-board LEDs . . . . . . . . . . . 19
System-board connectors . . . . . . . . . 19
System-board jum ers and buttons . . . . . 21
Back lates and back lanes . . . . . . . . . . 22
PCIe riser assembly . . . . . . . . . . . . . 24
Parts list. . . . . . . . . . . . . . . . . . 25
Power cords . . . . . . . . . . . . . . 33
Chapter 3 Internal cable routing 35
Front anel cable routing . . . . . . . . . . . 35
Fan cable routing . . . . . . . . . . . . . . 37
Fixed ower su ly unit cable routing . . . . . . 38
Hot-swa ower su ly unit cable routing . . . . 39
Flash ower module cable routing . . . . . . . 40
Back lane and back late cable routing . . . . . 41
Four 3.5-inch sim le-swa drive cable
routing . . . . . . . . . . . . . . . . 41
Four 3.5-inch hot-swa drive cable routing . . 44
Eight 2.5-inch hot-swa drive cable routing . . 46
Ten 2.5-inch hot-swa drive cable routing. . . 48
Chapter 4 Hardware replacement
procedures 51
Installation Guidelines . . . . . . . . . . . . 51
System reliability guidelines . . . . . . . . 52
Working inside the server with the ower on . . 53
Handling static-sensitive devices . . . . . . 53
2.5-inch back lane re lacement . . . . . . . . 53
Remove the 2.5-inch back lane. . . . . . . 53
Install the 2.5-inch back lane . . . . . . . 54
2.5-inch drive re lacement from 3.5-inch drive
bay. . . . . . . . . . . . . . . . . . . . 55
Remove a 2.5-inch drive from a 3.5-inch drive
bay . . . . . . . . . . . . . . . . . . 56
Install a 2.5-inch drive into a 3.5-inch drive
bay . . . . . . . . . . . . . . . . . . 57
3.5-inch back lane re lacement . . . . . . . . 59
Remove the 3.5-inch back lane. . . . . . . 59
Install the 3.5-inch back lane . . . . . . . 60
3.5-inch back late re lacement . . . . . . . . 61
Remove the 3.5-inch back late . . . . . . . 61
Install the 3.5-inch back late . . . . . . . . 62
Air baffle re lacement . . . . . . . . . . . . 63
Remove the air baffle . . . . . . . . . . . 63
Install the air baffle . . . . . . . . . . . . 64
CMOS battery (CR2032) re lacement . . . . . . 65
Remove the CMOS battery (CR2032) . . . . 65
Install the CMOS battery (CR2032) . . . . . 67
Drive re lacement . . . . . . . . . . . . . . 69
Remove a sim le-swa drive . . . . . . . . 69
Install a sim le-swa drive. . . . . . . . . 70
Remove a hot-swa drive . . . . . . . . . 72
Install a hot-swa drive . . . . . . . . . . 73
Fan re lacement . . . . . . . . . . . . . . 74
Remove a fan . . . . . . . . . . . . . . 75
Install a fan . . . . . . . . . . . . . . . 76
Flash ower module re lacement . . . . . . . . 78
Remove the flash ower module . . . . . . 78
Install the flash ower module . . . . . . . 80
Front o erator anel re lacement. . . . . . . . 81
Remove the front o erator anel (2.5-inch
drive model) . . . . . . . . . . . . . . 81
Install the front o erator anel (2.5-inch drive
model) . . . . . . . . . . . . . . . . 82
Remove the front o erator anel (3.5-inch
drive model) . . . . . . . . . . . . . . 83
Install the front o erator anel (3.5-inch drive
model) . . . . . . . . . . . . . . . . 85
Heat sink re lacement . . . . . . . . . . . . 86
Remove the heat sink. . . . . . . . . . . 86
Install the heat sink. . . . . . . . . . . . 87
Memory module re lacement . . . . . . . . . 89
Remove a memory module . . . . . . . . 89
Install a memory module . . . . . . . . . 91
PCIe ada ter re lacement. . . . . . . . . . . 94
© Co yright Lenovo 2022 i

Remove a PCIe ada ter (Riser) . . . . . . . 94
Install a PCIe ada ter (Riser) . . . . . . . . 95
Remove the PCIe ada ter (Slot 3) . . . . . . 97
Install the PCIe ada ter (Slot 3) . . . . . . . 98
PCIe riser assembly re lacement . . . . . . . . 99
Remove the PCIe riser assembly . . . . . . 99
Install the PCIe riser assembly . . . . . . . 101
Power su ly unit re lacement. . . . . . . . . 102
Remove the fixed ower su ly unit . . . . . 102
Install the fixed ower su ly unit . . . . . . 104
Remove a hot-swa ower su ly unit . . . . 105
Install a hot-swa ower su ly unit . . . . . 107
Power distribution board re lacement . . . . . . 109
Remove the ower distribution board . . . . 109
Install the ower distribution board . . . . . 111
Processor re lacement . . . . . . . . . . . . 114
Remove the rocessor . . . . . . . . . . 114
Install the rocessor . . . . . . . . . . . 115
Rack latches re lacement. . . . . . . . . . . 117
Remove the rack latches . . . . . . . . . 117
Install the rack latches . . . . . . . . . . 119
Security bezel re lacement . . . . . . . . . . 121
Remove the security bezel . . . . . . . . . 121
Install the security bezel . . . . . . . . . . 122
System board re lacement (trained technician
only) . . . . . . . . . . . . . . . . . . . 123
Remove the system board . . . . . . . . . 123
Install the system board . . . . . . . . . . 125
U date the machine ty e and serial
number . . . . . . . . . . . . . . . . 128
Enable TPM . . . . . . . . . . . . . . 130
Enable UEFI Secure Boot . . . . . . . . . 132
To cover re lacement . . . . . . . . . . . . 132
Remove the to cover . . . . . . . . . . 132
Install the to cover . . . . . . . . . . . 134
VGA cable re lacement. . . . . . . . . . . . 135
Remove the VGA cable (2.5-inch drive
model) . . . . . . . . . . . . . . . . 135
Install the VGA cable (2.5-inch drive
model) . . . . . . . . . . . . . . . . 136
Remove the VGA cable (3.5-inch drive
model) . . . . . . . . . . . . . . . . 137
Install the VGA cable (3.5-inch drive
model) . . . . . . . . . . . . . . . . 138
Com lete the arts re lacement . . . . . . . . 140
Chapter 5 Problem
determination 141
Event logs . . . . . . . . . . . . . . . . . 141
The front o erator anel and error LEDs . . . . . 143
Power su ly LEDs . . . . . . . . . . . 144
System-board LEDs . . . . . . . . . . . 145
General roblem determination rocedures . . . . 146
Resolving sus ected ower roblems . . . . 146
Resolving sus ected Ethernet controller
roblems . . . . . . . . . . . . . . . 147
Troubleshooting by sym tom . . . . . . . . . 147
Power on and ower off roblems . . . . . . 148
Memory roblems . . . . . . . . . . . . 149
Hard disk drive roblems . . . . . . . . . 150
Monitor and video roblems . . . . . . . . 152
Keyboard, mouse, KVM switch or USB-device
roblems . . . . . . . . . . . . . . . 154
O tional-device roblems . . . . . . . . . 155
Serial-device roblems . . . . . . . . . . 157
Intermittent roblems. . . . . . . . . . . 157
Power roblems . . . . . . . . . . . . . 158
Network roblems . . . . . . . . . . . . 159
Observable roblems. . . . . . . . . . . 159
Software roblems. . . . . . . . . . . . 162
Appendix A Hardware
disassembling for recycle 163
Disassemble the server for chassis recycle . . . . 163
Appendix B Getting help and
technical assistance 165
Before you call . . . . . . . . . . . . . . . 165
Collecting service data . . . . . . . . . . . . 166
Contacting Su ort . . . . . . . . . . . . . 167
Appendix C Notices 169
Trademarks . . . . . . . . . . . . . . . . 170
Im ortant notes . . . . . . . . . . . . . . . 170
Telecommunication regulatory statement. . . . . 170
Electronic emission notices . . . . . . . . . . 171
Taiwan BSMI RoHS declaration . . . . . . . 171
Taiwan im ort and ex ort contact information . . . 171
Index 173
ii ThinkSystem SR250 V2 Maintenance Manual

Safety
Before installing this roduct, read the Safety Information.
Antes de instalar este roduto, leia as Informações de Segurança.
在安装本产品之前，请仔细阅读 Safety Information （安全信息）。
Læs sikkerhedsforskrifterne, før du installerer dette rodukt.
Lees voordat u dit roduct installeert eerst de veiligheidsvoorschriften.
Ennen kuin asennat tämän tuotteen, lue turvaohjeet kohdasta Safety Information.
Avant d'installer ce roduit, lisez les consignes de sécurité.
Vor der Installation dieses Produkts die Sicherheitshinweise lesen.
Prima di installare questo rodotto, leggere le Informazioni sulla Sicurezza.
Les sikkerhetsinformasjonen (Safety Information) før du installerer dette roduktet.
Antes de instalar este roduto, leia as Informações sobre Segurança.
© Co yright Lenovo 2022 iii

Antes de instalar este roducto, lea la información de seguridad.
Läs säkerhetsinformationen innan du installerar den här rodukten.
Safety inspection checklist
Use the information in this section to identify otentially unsafe conditions with your server. As each machine
was designed and built, required safety items were installed to rotect users and service technicians from
injury.
Notes:
1. The roduct is not suitable for use at visual dis lay work laces according to §2 of the Work lace
Regulations.
2. The set-u of the server is made in the server room only.
Attention: This is a Class A roduct. In a domestic environment, this roduct may cause radio interference
in which case the user may be required to take adequate measures.
CAUTION:
This equipment must be installed or serviced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology Lenovo assumes you are qualified in the
servicing of equipment and trained in recognizing hazards energy levels in products Access to the
equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the
authority responsible for the location
Important: Electrical grounding of the server is required for o erator safety and correct system function.
Pro er grounding of the electrical outlet can be verified by a certified electrician.
Use the following checklist to verify that there are no otentially unsafe conditions:
1. Make sure that the ower is off and the ower cord is disconnected.
2. Check the ower cord.
• Make sure that the third-wire ground connector is in good condition. Use a meter to measure third-
wire ground continuity for 0.1 ohm or less between the external ground in and the frame ground.
• Make sure that the ower cord is the correct ty e.
iv ThinkSystem SR250 V2 Maintenance Manual

To view the ower cords that are available for the server:
a. Go to:
htt ://dcsc.lenovo.com/#/
b. Click Preconfigured Model or Configure to order.
c. Enter the machine ty e and model for your server to dis lay the configurator age.
d. Click Power ➙ Power Cables to see all line cords.
• Make sure that the insulation is not frayed or worn.
3. Check for any obvious non-Lenovo alterations. Use good judgment as to the safety of any non-Lenovo
alterations.
4. Check inside the server for any obvious unsafe conditions, such as metal filings, contamination, water or
other liquid, or signs of fire or smoke damage.
5. Check for worn, frayed, or inched cables.
6. Make sure that the ower-su ly cover fasteners (screws or rivets) have not been removed or tam ered
with.
© Co yright Lenovo 2022 v

vi ThinkSystem SR250 V2 Maintenance Manual

Chapter 1 Introduction
The ThinkSystem SR250 V2 server is a 1U rack server designed for high-volume network transaction
rocessing. This high- erformance, multi-core server is ideally suited for networking environments that
require su erior rocessor erformance, in ut/out ut (I/O) flexibility, and high manageability.
Figure 1. SR250 V2
The server comes with a limited warranty. For details about the warranty, see:
htt s://su ort.lenovo.com/us/en/solutions/ht503310
For details about your s ecific warranty, see:
htt ://datacentersu ort.lenovo.com/warrantylooku
Specifications
The following information is a summary of the features and s ecifications of the server. De ending on the
model, some features might not be available, or some s ecifications might not a ly.
Table 1. Server Specifications
Specification Description
Dimensions 1U rack
• Height: 43 mm (1.7 inches)
• Width: 435 mm (17.1 inches)
– With rack handles: 482 mm (18.98 inches)
– Without rack handles: 435 mm (17.1 inches)
• De th: 545 mm (21.5 inches)
Note: The de th is measured from the front mounting flange of the rack to the
rear of the server.
Weight Maximum: 12.3 kg (27.1 lbs)
Processor (de ending on the
model)
This server su orts one of the following Intel® rocessors:
• Xeon® E
• Pentium®
Notes:
1. For a list of su orted rocessors, see htt s://static.lenovo.com/us/en/
server roven/index.shtml.
2. Energy Star Certification is with limited configurations.
© Co yright Lenovo 2022 1

Table 1. Server Specifications (continued)
Specification Description
Memory See “Memory module installation order” in Setup Guide for detailed information
about memory configuration and setu .
• Slots: 4 memory module slots
• Minimum: 8 GB (1 x 8GB DIMM)
• Maximum: 128 GB (4 x 32 GB DIMM)
• Ty e:
– ThinkSystem 8GB TruDDR4 3200 MHz (1Rx8, 1.2V) ECC UDIMM
– ThinkSystem 16GB TruDDR4 3200 MHz (2Rx8, 1.2V) ECC UDIMM
– ThinkSystem 32GB TruDDR4 3200 MHz (2Rx8, 1.2V) ECC UDIMM
Drive bays (de ending on the
model) • 2.5-inch models:
– Su orts u to eight hot-swa SAS/SATA drive bays.
– Su orts u to ten hot-swa SAS/SATA drive bays.
• 3.5-inch models:
– Su orts u to four sim le-swa SATA drive bays.
– Su orts u to three sim le-swa SATA drive bays and one NVMe drive bay.
– Su orts u to four hot-swa SAS/SATA drive bays.
Note: When all eight storage drives have been installed, and the system has been
set to software RAID mode in the UEFI settings, regardless if the disks are configured
as an array or as se arate disks, drives 6 and 7 cannot be used to install the
Windows o erating system.
M.2 drive (Su ort is lanned
for 4Q/2022)
Su orts u to two SATA M.2 drives of the following drive form factors:
• 42 mm (2242)
• 60 mm (2260)
• 80 mm (2280)
• 110 mm (22110)
Su orts the following M.2 drive ca acity:
• 128 GB
• 240 GB
• 480 GB
• 960 GB (su orted when ambient tem erature is below 30°C)
Note: When M.2 drives have been installed, and the system has been set to
software RAID mode in the UEFI settings, regardless if the disks are configured as an
array or as se arate disks, the M.2 drive cannot be used to install the Windows
o erating system.
2ThinkSystem SR250 V2 Maintenance Manual

Table 1. Server Specifications (continued)
Specification Description
PCIe riser cards and
ex ansion slots
U to two ex ansion slots (de ending on the server configuration):
• Slot 1-2: PCIe Gen4 x16 lane in x16 slot for Riser, the following slots are available
de ending on the riser card installed:
1. X16 PCIe Riser card PCIe Gen4:
– Slot 1: Not available
– Slot 2, PCIe Gen4 x16 in x16 slot, full height
2. X16/X8 PCIe Riser card PCIe Gen4:
– Slot 1, PCIe Gen4 x8 in x8 slot, half-length (o en-end)
– Slot 2, PCIe Gen4 x8 in x16 slot, full-height
• Slot 3 (on-board): PCIe Gen3 x4 lane in x8 slot
Notes:
• GPU ada ters are only su orted on servers with redundant ower su ly.
• When a ThinkSystem Intel E810-DA2 Ethernet Ada ter is installed, the following
ada ters are not su orted:
– Other ThinkSystem Intel Ethernet Ada ters
– ThinkSystem RAID 9350-16i 4GB Flash PCIe 12Gb Ada ter
– ThinkSystem RAID 9350-8i 2GB Flash PCIe 12Gb Ada ter
– ThinkSystem RAID 5350-8i PCIe 12Gb Ada ter
– ThinkSystem 4350-8i SAS/SATA 12Gb HBA
Integrated functions • Lenovo XClarity Controller, which rovides service rocessor control and
monitoring functions, video controller, and remote keyboard, video, mouse, and
remote drive ca abilities.
• Light Path Diagnostics
• Front standard connectors (front of server):
– One USB 2.0 connector with XCC mobile su ort
– One USB 3.2 Gen 1 connector
– One front o erator anel
– One VGA connector (o tional)
• Rear standard connectors (rear of server):
– Two USB 3.2 Gen 2 connectors
– Two Ethernet connectors
– One Lenovo XClarity Controller network connector
– One VGA connector
– One serial connector
– One NMI button
RAID controllers (de ending
on the model) • Hardware RAID: Additional RAID levels su orted when an o tional RAID
controller is installed. The hardware RAID controller su orts RAID levels 0, 1, 5,
and 10.
• Intel VROC SATA RAID (Software RAID): A software RAID controller is integrated
on the system board. The software RAID controller su orts RAID levels 0, 1, 5,
and 10.
• M.2 SATA RAID boot kit (SATA only, su ort is lanned for 4Q/2022)
Cha ter 1.Introduction 3

Table 1. Server Specifications (continued)
Specification Description
Video controller (integrated
into Lenovo XClarity
Controller)
Matrox G200
• ASPEED
• SVGA com atible video controller
• Avocent Digital Video Com ression
• 16 MB of video memory (not ex andable)
Note: Maximum video resolution is 1600 x 1200 at 75 Hz.
Fans Four internal system fans (40mm x 28mm)
Power su lies • Su orts one fixed ower su ly: 300W Gold Power Su ly
• Su orts u to two ower su lies for redundancy su ort: 450W Platinum
Power Su ly
O erating System Su orted and certified o erating systems:
• Microsoft Windows Server
• VMware ESXi
• Red Hat Enter rise Linux
• SUSE Linux Enter rise Server
References:
• Com lete list of available o erating systems: htt s://lenovo ress.com/osig.
• OS de loyment instructions: “De loy the o erating system” in Setup Guide.
Acoustical noise emissions
(base configuration)
The server has the following acoustic noise emissions declaration:
• Sound ower level (LWAd):
– Idling: 4.7 Bel (Ty ical), 5.7 Bel (Max)
– O erating: 6.6 Bel (Ty ical), 6.8 Bel (Max)
• Sound ressure level (L Am):
– Idling: 33.1 dBA (Ty ical), 43.3 dBA (Max)
– O erating: 52.6 dBA (Ty ical), 53.6 dBA (Max)
Notes:
• These sound levels were measured in controlled acoustical environments
according to rocedures s ecified by ISO7779 and are re orted in accordance
with ISO 9296, SPL is measured by bystander osition (1m).
• The declared acoustic sound levels are based on the following configurations,
which may change de ending on the configuration or conditions, for exam le M.2
drive, Broadcom 57414 25Gb NIC, Broadcom 57416 10Gb NIC, T1000 etc.
– Ty ical: 1x 80W CPU, 4x 32GB DIMM, 2x HDD or SSD, RAID 5350-8i, 1x 300W
PSU
– Max: 1x 95W CPU, 4x 32GB DIMM, 2x HDD or SSD, 2x 450W PSU
Heat out ut A roximate heat out ut:
• Minimum configuration: 379.08 BTU er hour (111 watts)
• Maximum configuration : 802.5 BTU er hour (235 watts)
4ThinkSystem SR250 V2 Maintenance Manual

Table 1. Server Specifications (continued)
Specification Description
Electrical in ut Sine-wave in ut (50–60 Hz) required
• 300-Watt ower su ly:
100-127 V ac /200-240 V ac, 4/2A
• 450-Watt ower su ly:
100-127 V ac /200-240 V ac, 5.8/2.9A
Environment The ThinkSystem SR250 V2 com lies with ASHRAE class A2 s ecifications. System
erformance may be im acted when o erating tem erature is outside ASHRAE A2
s ecification or fan failed condition.
The ThinkSystem SR250 V2 is su orted in the following environment:
• Air tem erature:
– Server on:
– ASHRAE Class A2: 10°C to 35°C (50°F to 95°F); decrease the maximum
ambient tem erature by 1°C for every 300 m (984 ft) increase in altitude
above 900 m (2,953 ft).
– ASHRAE Class A3: 5°C to 40°C (41°F to 104°F); decrease the maximum
ambient tem erature by 1°C for every 175 m (574 ft) increase in altitude
above 900 m (2,953 ft).
– ASHRAE Class A4: 5°C to 45°C (41°F to 113°F); decrease the maximum
ambient tem erature by 1°C for every 125 m (410 ft) increase in altitude
above 900 m (2,953 ft).
– Sever off: 5°C to 45°C (41°F to 113°F)
– Shi ing/storage: -40 to 60°C (-40 to 140°F)
• Maximum altitude: 3,050 m (10,000 ft)
• Relative Humidity (non-condensing):
– O erating:
– ASHRAE Class A2: 8% to 80%, maximum dew oint : 21°C (70°F)
– ASHRAE Class A3: 8% to 85%, maximum dew oint : 24°C (75°F)
– ASHRAE Class A4: 8% to 90%, maximum dew oint : 24°C (75°F)
– Shi ment/storage: 8% to 90%
• Particulate contamination:
Airborne articulates and reactive gases acting alone or in combination with other
environmental factors such as humidity or tem erature might ose a risk to the
solution. For information about the limits for articulates and gases, see
“Particulate contamination” on age 5.
Particulate contamination
Attention: Airborne articulates (including metal flakes or articles) and reactive gases acting alone or in
combination with other environmental factors such as humidity or tem erature might ose a risk to the
device that is described in this document.
Risks that are osed by the resence of excessive articulate levels or concentrations of harmful gases
include damage that might cause the device to malfunction or cease functioning altogether. This
s ecification sets forth limits for articulates and gases that are intended to avoid such damage. The limits
must not be viewed or used as definitive limits, because numerous other factors, such as tem erature or
Cha ter 1.Introduction 5

moisture content of the air, can influence the im act of articulates or environmental corrosives and gaseous
contaminant transfer. In the absence of s ecific limits that are set forth in this document, you must
im lement ractices that maintain articulate and gas levels that are consistent with the rotection of human
health and safety. If Lenovo determines that the levels of articulates or gases in your environment have
caused damage to the device, Lenovo may condition rovision of re air or re lacement of devices or arts
on im lementation of a ro riate remedial measures to mitigate such environmental contamination.
Im lementation of such remedial measures is a customer res onsibility.
Table 2. imits for particulates and gases
Contaminant Limits
Reactive gases Severity level G1 as er ANSI/ISA 71.04-19851:
• The co er reactivity level shall be less than 300 Angstroms er month (Å/month ≈ 0.0039 μg/
cm2-hour weight gain).2
• The silver reactivity level shall be less than 200 Å/month (Å/month ≈ 0.0035 μg/cm2-hour
weight gain).3
• The reactive monitoring of gaseous corrosivity must be conducted a roximately 5 cm (2 in.) in
front of the rack on the air inlet side at one-quarter and three-quarter frame height off the floor
or where the air velocity is much higher.
Airborne
articulates Data centers must meet the cleanliness level of ISO 14644-1 class 8.
For data centers without airside economizer, the ISO 14644-1 class 8 cleanliness might be met by
choosing one of the following filtration methods:
• The room air might be continuously filtered with MERV 8 filters.
• Air entering a data center might be filtered with MERV 11 or referably MERV 13 filters.
For data centers with airside economizers, the choice of filters to achieve ISO class 8 cleanliness
de ends on the s ecific conditions resent at that data center.
• The deliquescent relative humidity of the articulate contamination should be more than 60%
RH.4
• Data centers must be free of zinc whiskers.5
1 ANSI/ISA-71.04-1985. Environmental conditions for process measurement and control systems: Airborne
contaminants. Instrument Society of America, Research Triangle Park, North Carolina, U.S.A.
2 The derivation of the equivalence between the rate of co er corrosion growth in the thickness of the corrosion
roduct in Å/month and the rate of weight gain assumes that Cu2S and Cu2O grow in equal ro ortions.
3 The derivation of the equivalence between the rate of silver corrosion growth in the thickness of the corrosion
roduct in Å/month and the rate of weight gain assumes that Ag2S is the only corrosion roduct.
4 The deliquescent relative humidity of articulate contamination is the relative humidity at which the dust absorbs
enough water to become wet and romote ionic conduction.
5 Surface debris is randomly collected from 10 areas of the data center on a 1.5 cm diameter disk of sticky
electrically conductive ta e on a metal stub. If examination of the sticky ta e in a scanning electron microsco e
reveals no zinc whiskers, the data center is considered free of zinc whiskers.
Firmware updates
Several o tions are available to u date the firmware for the server.
You can use the tools listed here to u date the most current firmware for your server and the devices that are
installed in the server.
• Best ractices related to u dating firmware is available at the following site:
6ThinkSystem SR250 V2 Maintenance Manual

– htt ://lenovo ress.com/LP0656
• The latest firmware can be found at the following site:
– htt s://datacentersu ort.lenovo.com/tw/en/ roducts/servers/thinksystem/sr250/7y51/downloads/driver-
list/
• You can subscribe to roduct notification to stay u to date on firmware u dates:
– htt s://datacentersu ort.lenovo.com/tw/en/solutions/ht509500
UpdateXpress System Packs (UXSPs)
Lenovo ty ically releases firmware in bundles called U dateX ress System Packs (UXSPs). To ensure that all
of the firmware u dates are com atible, you should u date all firmware at the same time. If you are u dating
firmware for both the Lenovo XClarity Controller and UEFI, u date the firmware for Lenovo XClarity Controller
first.
Update method terminology
• In-band update. The installation or u date is erformed using a tool or a lication within an o erating
system that is executing on the server’s core CPU.
• Out-of-band update. The installation or u date is erformed by the Lenovo XClarity Controller collecting
the u date and then directing the u date to the target subsystem or device. Out-of-band u dates have no
de endency on an o erating system executing on the core CPU. However, most out-of-band o erations
do require the server to be in the S0 (Working) ower state.
• On-Target update The installation or u date is initiated from an O erating System executing on the
server’s o erating system.
• Off-Target update The installation or u date is initiated from a com uting device interacting directly with
the server’s Lenovo XClarity Controller.
• UpdateXpress System Packs (UXSPs). UXSPs are bundled u dates designed and tested to rovide the
interde endent level of functionality, erformance, and com atibility. UXSPs are server machine-ty e
s ecific and are built (with firmware and device driver u dates) to su ort s ecific Windows Server, Red
Hat Enter rise Linux (RHEL) and SUSE Linux Enter rise Server (SLES) o erating system distributions.
Machine-ty e-s ecific firmware-only UXSPs are also available.
Firmware updating tools
See the following table to determine the best Lenovo tool to use for installing and setting u the firmware:
Tool Update
Methods
Supported
Core
System
Firmware
Updates
I/O Devices
Firmware
Updates
Graphical
user
interface
Command
line
interface
Supports
UXSPs
Lenovo XClarity
Provisioning Manager
(LXPM)
In-band2
On-Target
√ √
Lenovo XClarity
Controller
(XCC)
Out-of-band
Off-Target
√Selected I/O
devices
√
Lenovo XClarity
Essentials OneCLI
(OneCLI)
In-band
Out-of-band
On-Target
Off-Target
√All I/O
devices
√ √
Cha ter 1.Introduction 7

Tool Update
Methods
Supported
Core
System
Firmware
Updates
I/O Devices
Firmware
Updates
Graphical
user
interface
Command
line
interface
Supports
UXSPs
Lenovo XClarity
Essentials
UpdateXpress
(LXCE)
In-band
Out-of-band
On-Target
Off-Target
√All I/O
devices
√ √
Lenovo XClarity
Essentials Bootable
Media Creator
(BoMC)
In-band
Out-of-band
Off-Target
√All I/O
devices
√
(BoMC
a lication)
√
(BoMC
a lication)
√
Lenovo XClarity
Administrator
(LXCA)
In-band1
Out-of-
band2
Off-Target
√All I/O
devices
√ √
Lenovo XClarity
Integrator (LXCI) for
VMware vCenter
Out-of-band
Off-Target
√Selected I/O
devices
√
Lenovo XClarity
Integrator (LXCI) for
Microsoft Windows
Admin Center
In-band
Out-of-band
On-Target
Off-Target
√All I/O
devices
√ √
Lenovo XClarity
Integrator (LXCI) for
Microsoft System
Center Configuration
Manager
In-band
On-Target
√All I/O
devices
√ √
Notes:
1. For I/O firmware u dates.
2. For BMC and UEFI firmware u dates.
• Lenovo XClarity Provisioning Manager
From Lenovo XClarity Provisioning Manager, you can u date the Lenovo XClarity Controller firmware, the
UEFI firmware, and the Lenovo XClarity Provisioning Manager software.
Note: By default, the Lenovo XClarity Provisioning Manager Gra hical User Interface is dis layed when
you start the server and ress the key s ecified in the on-screen instructions. If you have changed that
default to be the text-based system setu , you can bring u the Gra hical User Interface from the text-
based system setu interface.
For additional information about using Lenovo XClarity Provisioning Manager to u date firmware, see:
8ThinkSystem SR250 V2 Maintenance Manual

“Firmware U date” section in the LXPM documentation com atible with your server at htt s://
sysmgt.lenovofiles.com/hel /to ic/lx m_frontend/lx m_ roduct_ age.html
Important: Lenovo XClarity Provisioning Manager (LXPM) su orted version varies by roduct. All
versions of Lenovo XClarity Provisioning Manager are referred to as Lenovo XClarity Provisioning Manager
and LXPM in this document, unless s ecified otherwise. To see the LXPM version su orted by your
server, go to htt s://sysmgt.lenovofiles.com/hel /to ic/lx m_frontend/lx m_ roduct_ age.html.
• Lenovo XClarity Controller
If you need to install a s ecific u date, you can use the Lenovo XClarity Controller interface for a s ecific
server.
Notes:
– To erform an in-band u date through Windows or Linux, the o erating system driver must be installed
and the Ethernet-over-USB (sometimes called LAN over USB) interface must be enabled.
For additional information about configuring Ethernet over USB, see:
“Configuring Ethernet over USB” section in the XCC documentation version com atible with your
server at htt s://sysmgt.lenovofiles.com/hel /to ic/lxcc_frontend/lxcc_overview.html
– If you u date firmware through the Lenovo XClarity Controller, make sure that you have downloaded
and installed the latest device drivers for the o erating system that is running on the server.
For additional information about using Lenovo XClarity Controller to u date firmware, see:
“U dating Server Firmware” section in the XCC documentation com atible with your server at htt s://
sysmgt.lenovofiles.com/hel /to ic/lxcc_frontend/lxcc_overview.html
Important: Lenovo XClarity Controller (XCC) su orted version varies by roduct. All versions of Lenovo
XClarity Controller are referred to as Lenovo XClarity Controller and XCC in this document, unless
s ecified otherwise. To see the XCC version su orted by your server, go to htt s://
sysmgt.lenovofiles.com/hel /to ic/lxcc_frontend/lxcc_overview.html.
• Lenovo XClarity Essentials OneCLI
Lenovo XClarity Essentials OneCLI is a collection of command line a lications that can be used to
manage Lenovo servers.Its u date a lication can be used to u date firmware and device drivers for your
servers. The u date can be erformed within the host o erating system of the server (in-band) or remotely
through the BMC of the server (out-of-band).
For additional information about using Lenovo XClarity Essentials OneCLI to u date firmware, see:
htt ://sysmgt.lenovofiles.com/hel /to ic/toolsctr_cli_lenovo/onecli_c_u date.html
• Lenovo XClarity Essentials UpdateXpress
Lenovo XClarity Essentials U dateX ress rovides most of OneCLI u date functions through a gra hical
user interface (GUI). It can be used to acquire and de loy U dateX ress System Pack (UXSP) u date
ackages and individual u dates. U dateX ress System Packs contain firmware and device driver
u dates for Microsoft Windows and for Linux.
You can obtain Lenovo XClarity Essentials U dateX ress from the following location:
htt s://datacentersu ort.lenovo.com/solutions/lnvo-x ress
• Lenovo XClarity Essentials Bootable Media Creator
You can use Lenovo XClarity Essentials Bootable Media Creator to create bootable media that is suitable
for firmware u dates, VPD u dates, inventory and FFDC collection, advanced system configuration, FoD
Keys management, secure erase, RAID configuration, and diagnostics on su orted servers.
You can obtain Lenovo XClarity Essentials BoMC from the following location:
Cha ter 1.Introduction 9

htt s://datacentersu ort.lenovo.com/solutions/lnvo-bomc
• Lenovo XClarity Administrator
If you are managing multi le servers using the Lenovo XClarity Administrator, you can u date firmware for
all managed servers through that interface. Firmware management is sim lified by assigning firmware-
com liance olicies to managed end oints. When you create and assign a com liance olicy to managed
end oints, Lenovo XClarity Administrator monitors changes to the inventory for those end oints and flags
any end oints that are out of com liance.
For additional information about using Lenovo XClarity Administrator to u date firmware, see:
htt ://sysmgt.lenovofiles.com/hel /to ic/com.lenovo.lxca.doc/u date_fw.html
• Lenovo XClarity Integrator offerings
Lenovo XClarity Integrator offerings can integrate management features of Lenovo XClarity Administrator
and your server with software used in a certain de loyment infrastructure, such as VMware vCenter,
Microsoft Admin Center, or Microsoft System Center.
For additional information about using Lenovo XClarity Integrator to u date firmware, see:
htt s://sysmgt.lenovofiles.com/hel /to ic/lxci/lxci_ roduct_ age.html
Tech Tips
Lenovo continually u dates the su ort website with the latest ti s and techniques that you can use to solve
issues that your server might encounter. These Tech Ti s (also called retain ti s or service bulletins) rovide
rocedures to work around issues or solve roblems related to the o eration of your server.
To find the Tech Ti s available for your server:
1. Go to htt ://datacentersu ort.lenovo.com and navigate to the su ort age for your server.
2. Click on the documentation icon from the navigation ane.
3. Click Documentation Type ➙ Solution from the dro -down menu.
Follow the on-screen instructions to choose the category for the roblem that you are having.
Security advisories
Lenovo is committed to develo ing roducts and services that adhere to the highest security standards in
order to rotect our customers and their data. When otential vulnerabilities are re orted, it is the
res onsibility of the Lenovo Product Security Incident Res onse Team (PSIRT) to investigate and rovide
information to our customers so they may ut mitigation lans in lace as we work toward roviding
solutions.
The list of current advisories is available at the following site:
htt s://datacentersu ort.lenovo.com/ roduct_security/home
Power on the server
After the server erforms a short self-test ( ower status LED flashes quickly) when connected to in ut ower,
it enters a standby state ( ower status LED flashes once er second).
The server can be turned on ( ower LED on) in any of the following ways:
• You can ress the ower button.
10 ThinkSystem SR250 V2 Maintenance Manual

• The server can restart automatically after a ower interru tion.
• The server can res ond to remote ower-on requests sent to the Lenovo XClarity Controller.
For information about owering off the server, see “Power off the server” on age 11.
Power off the server
The server remains in a standby state when it is connected to a ower source, allowing the Lenovo XClarity
Controller to res ond to remote ower-on requests. To remove all ower from the server ( ower status LED
off), you must disconnect all ower cables.
To lace the server in a standby state ( ower status LED flashes once er second):
Note: The Lenovo XClarity Controller can lace the server in a standby state as an automatic res onse to a
critical system failure.
• Start an orderly shutdown using the o erating system (if su orted by your o erating system).
• Press the ower button to start an orderly shutdown (if su orted by your o erating system).
• Press and hold the ower button for more than 4 seconds to force a shutdown.
When in a standby state, the server can res ond to remote ower-on requests sent to the Lenovo XClarity
Controller. For information about owering on the server, see “Power on the server” on age 10.
Cha ter 1.Introduction 11

12 ThinkSystem SR250 V2 Maintenance Manual