Lenovo ThinkSystem SR655 V3 User manual

ThinkSystem SR655 V3
User Guide
Machine Type: 7D9E, 7D9F

Note
Before usin this information and the product it supports, be sure to read and understand the safety
information and the safety instructions, which are available at:
http://thinksystem.lenovofiles.com/help/topic/safety_documentation/pdf_files.html
In addition, be sure that you are familiar with the terms and conditions of the Lenovo warranty for your server,
which can be found at:
http://datacentersupport.lenovo.com/warrantylookup
Second Edition (April 2023)
© Copyright Lenovo 2023
LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered pursuant to a General Services
Administration (GSA) contract, use, reproduction, or disclosure is subject to restrictions set forth in Contract No. GS-35F-
05925.

Contents
Contents i
Safety v
Safety inspection checklist . . . . . . . . . . . vi
Chapter 1 Introduction 1
Features. . . . . . . . . . . . . . . . . . . 1
Tech Tips . . . . . . . . . . . . . . . . . . 2
Security advisories . . . . . . . . . . . . . . 2
Specifications . . . . . . . . . . . . . . . . 2
Technical specifications. . . . . . . . . . . 3
Mechanical specifications . . . . . . . . . . 5
Environmental specifications . . . . . . . . . 6
Mana ement options. . . . . . . . . . . . . . 9
Chapter 2 Server components 13
Front view . . . . . . . . . . . . . . . . . 13
Front I/O module . . . . . . . . . . . . . . 15
Rear view . . . . . . . . . . . . . . . . . 18
Top view . . . . . . . . . . . . . . . . . 19
System-board-assembly layout . . . . . . . . 20
System-board-assembly connectors. . . . . 21
System-board-assembly switch . . . . . . 23
System LEDs and dia nostics display . . . . . . 25
Chapter 3 Parts list 27
Power cords . . . . . . . . . . . . . . . . 29
Chapter 4 Unboxing and setup 31
Server packa e contents . . . . . . . . . . . 31
Identify the server and access the Lenovo XClarity
Controller . . . . . . . . . . . . . . . . . 31
Server setup checklist . . . . . . . . . . . . 32
Chapter 5 Hardware replacement
procedures 35
Installation Guidelines . . . . . . . . . . . . 35
Safety inspection checklist. . . . . . . . . 36
System reliability uidelines . . . . . . . . 37
Workin inside the server with the power on . . 38
Handlin static-sensitive devices . . . . . . 38
Technical rules . . . . . . . . . . . . . . . 38
Memory module installation rules and order . . 39
PCIe slots and PCIe adapters . . . . . . . 40
Thermal rules . . . . . . . . . . . . . . 41
Power on and power off the server . . . . . . . 42
Power on the server . . . . . . . . . . . 42
Power off the server . . . . . . . . . . . 42
Server replacement . . . . . . . . . . . . . 43
Remove the server from rack . . . . . . . . 43
Install the server to rack . . . . . . . . . . 46
Air baffle replacement . . . . . . . . . . . . 50
Remove the air baffle . . . . . . . . . . . 50
Install the air baffle . . . . . . . . . . . . 52
CMOS battery (CR2032) replacement . . . . . . 55
Remove the CMOS battery . . . . . . . . 55
Install the CMOS battery . . . . . . . . . 57
Fan board replacement . . . . . . . . . . . . 59
Remove the fan board . . . . . . . . . . 59
Install the fan board . . . . . . . . . . . 61
Front drive backplane replacement . . . . . . . 62
Remove the front 2.5-inch drive backplane . . 62
Install the front 2.5-inch drive backplane . . . 63
Remove the front 3.5-inch drive backplane . . 66
Install the front 3.5-inch drive backplane . . . 67
Front I/O module replacement . . . . . . . . . 69
Remove the front I/O module . . . . . . . . 69
Install the front I/O module . . . . . . . . . 71
Hot-swap drive replacement . . . . . . . . . . 72
Remove a hot-swap drive . . . . . . . . . 73
Install a hot-swap drive . . . . . . . . . . 74
Intrusion switch replacement . . . . . . . . . 76
Remove the intrusion switch . . . . . . . . 76
Install the intrusion switch . . . . . . . . . 78
MicroSD card replacement . . . . . . . . . . 79
Remove the MicroSD card. . . . . . . . . 79
Install the MicroSD card. . . . . . . . . . 80
Memory module replacement . . . . . . . . . 81
Remove a memory module . . . . . . . . 82
Install a memory module . . . . . . . . . 83
OCP module replacement . . . . . . . . . . . 85
Remove the OCP module . . . . . . . . . 85
Install the OCP module . . . . . . . . . . 87
PCIe adapter and riser assembly replacement . . . 88
Remove a riser assembly . . . . . . . . . 89
Remove a PCIe adapter . . . . . . . . . . 90
Install a PCIe adapter . . . . . . . . . . . 92
Install a riser assembly . . . . . . . . . . 93
Power inverter board (PIB) replacement . . . . . 94
Remove the PIB . . . . . . . . . . . . . 95
Install the PIB . . . . . . . . . . . . . . 96
Power supply unit replacement. . . . . . . . . 97
Safety precautions . . . . . . . . . . . . 97
Remove a power supply unit . . . . . . . . 99
© Copyri ht Lenovo 2023 i

Install a power supply unit . . . . . . . . . 101
Processor and heat sink replacement (trained
technician only) . . . . . . . . . . . . . . . 103
Remove a heat sink . . . . . . . . . . . 104
Remove a processor . . . . . . . . . . . 107
Install a processor . . . . . . . . . . . . 108
Install a heat sink . . . . . . . . . . . . 109
Rack latches replacement . . . . . . . . . . . 112
Remove the rack latches . . . . . . . . . 112
Install the rack latches . . . . . . . . . . 115
RAID flash power module replacement. . . . . . 117
Remove a RAID flash power module from the
air baffle . . . . . . . . . . . . . . . . 117
Install a RAID flash power module on the air
baffle . . . . . . . . . . . . . . . . . 118
Rearwall bracket replacement . . . . . . . . . 119
Remove a rearwall bracket. . . . . . . . . 120
Install a rearwall bracket. . . . . . . . . . 122
Security bezel replacement . . . . . . . . . . 124
Remove the security bezel . . . . . . . . . 124
Install the security bezel . . . . . . . . . . 125
System board assembly replacement (trained
technician only) . . . . . . . . . . . . . . . 127
Remove the firmware and RoT security
module . . . . . . . . . . . . . . . . 128
Install the firmware and RoT security
module . . . . . . . . . . . . . . . . 130
Remove the system I/O board or processor
board . . . . . . . . . . . . . . . . . 134
Install the system I/O board or processor
board . . . . . . . . . . . . . . . . . 137
System fan replacement . . . . . . . . . . . 141
Remove a system fan. . . . . . . . . . . 142
Install a system fan. . . . . . . . . . . . 143
System fan ca e replacement . . . . . . . . . 146
Remove the system fan ca e . . . . . . . . 146
Install the system fan ca e. . . . . . . . . 147
Top cover replacement . . . . . . . . . . . . 148
Remove the top cover . . . . . . . . . . 148
Install the top cover . . . . . . . . . . . 150
Complete the parts replacement . . . . . . . . 151
Chapter 6 Internal cable routing 153
Identifyin connectors . . . . . . . . . . . . 154
Drive backplane connectors . . . . . . . . 154
Front VGA connector and external dia nostics
connector . . . . . . . . . . . . . . . . . 157
Front I/O module . . . . . . . . . . . . . . 158
Intrusion switch . . . . . . . . . . . . . . . 159
RAID flash power module . . . . . . . . . . . 160
Connections between the processor board and fan
board . . . . . . . . . . . . . . . . . . . 162
Backplanes: server models with 2.5-inch front drive
bays . . . . . . . . . . . . . . . . . . . 163
One 8 x SAS/SATA backplane . . . . . . . 166
One 8 x AnyBay backplane . . . . . . . . 169
Two 8 x SAS/SATA backplanes . . . . . . . 176
One 8 x SAS/SATA and one 8 x AnyBay
backplanes. . . . . . . . . . . . . . . 179
Backplanes: server models with 3.5-inch front
drive bays . . . . . . . . . . . . . . . . . 184
12 x 3.5-inch SAS/SATA backplane . . . . . 186
Chapter 7 System configuration 189
Set the network connection for the Lenovo XClarity
Controller . . . . . . . . . . . . . . . . . 189
Update the firmware . . . . . . . . . . . . . 190
Confi ure the firmware . . . . . . . . . . . . 194
Memory module confi uration . . . . . . . . . 195
RAID confi uration . . . . . . . . . . . . . 195
Deploy the operatin system. . . . . . . . . . 195
Back up the server confi uration . . . . . . . . 196
Chapter 8 Problem
determination 197
Event lo s . . . . . . . . . . . . . . . . . 197
Troubleshootin by system LEDs and dia nostics
display . . . . . . . . . . . . . . . . . . 198
Drive LEDs . . . . . . . . . . . . . . . 198
Front operator panel LEDs . . . . . . . . . 199
External dia nostics handset . . . . . . . . 200
XCC system mana ement port LEDs. . . . . 206
Power supply LEDs . . . . . . . . . . . 207
System-board-assembly LEDs . . . . . . . 209
LEDs on the firmware and RoT security
module . . . . . . . . . . . . . . . . 211
General problem determination procedures . . . . 212
Resolvin suspected power problems . . . . 213
Resolvin suspected Ethernet controller
problems . . . . . . . . . . . . . . . 213
Troubleshootin by symptom . . . . . . . . . 215
Fan board problems . . . . . . . . . . . 215
Hard disk drive problems . . . . . . . . . 215
Intermittent problems. . . . . . . . . . . 217
Keyboard, mouse, KVM switch or USB-device
problems . . . . . . . . . . . . . . . 219
Memory problems . . . . . . . . . . . . 220
Monitor and video problems . . . . . . . . 221
Observable problems. . . . . . . . . . . 223
Optional-device problems . . . . . . . . . 226
Performance problems . . . . . . . . . . 227
Power on and power off problems . . . . . . 228
Power supply and PIB problems . . . . . . 229
Software problems. . . . . . . . . . . . 230
ii ThinkSystem SR655 V3 User Guide

Appendix A Hardware
disassembling for recycle 231
Disassemble the system board assembly for
recycle . . . . . . . . . . . . . . . . . . 231
Appendix B Getting help and
technical assistance 235
Before you call . . . . . . . . . . . . . . . 235
Collectin service data . . . . . . . . . . . . 236
Contactin Support . . . . . . . . . . . . . 237
Appendix C Documents and
supports 239
Documents download . . . . . . . . . . . . 239
Support websites . . . . . . . . . . . . . . 239
Appendix D Notices 241
Trademarks . . . . . . . . . . . . . . . . 242
Important notes . . . . . . . . . . . . . . . 242
Electronic emission notices . . . . . . . . . . 242
Taiwan Re ion BSMI RoHS declaration . . . . . 243
Taiwan Re ion import and export contact
information . . . . . . . . . . . . . . . . 243
© Copyri ht Lenovo 2023 iii

iv ThinkSystem SR655 V3 User Guide

Safety
Before installin this product, read the Safety Information.
Antes de instalar este produto, leia as Informações de Se urança.
在安装本产品之前，请仔细阅读 Safety Information （安全信息）。
Læs sikkerhedsforskrifterne, før du installerer dette produkt.
Lees voordat u dit product installeert eerst de veili heidsvoorschriften.
Ennen kuin asennat tämän tuotteen, lue turvaohjeet kohdasta Safety Information.
Avant d'installer ce produit, lisez les consi nes de sécurité.
Vor der Installation dieses Produkts die Sicherheitshinweise lesen.
Prima di installare questo prodotto, le ere le Informazioni sulla Sicurezza.
Les sikkerhetsinformasjonen (Safety Information) før du installerer dette produktet.
Antes de instalar este produto, leia as Informações sobre Se urança.
© Copyri ht Lenovo 2023 v

Antes de instalar este producto, lea la información de se uridad.
Läs säkerhetsinformationen innan du installerar den här produkten.
Safety inspection checklist
Use the information in this section to identify potentially unsafe conditions with your server. As each machine
was desi ned and built, required safety items were installed to protect users and service technicians from
injury.
Note: The product is not suitable for use at visual display workplaces accordin to §2 of the Workplace
Re ulations.
Note: The set-up of the server is made in the server room only.
CAUTION:
This equipment must be installed or serviced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology Lenovo assumes you are qualified in the
servicing of equipment and trained in recognizing hazards energy levels in products Access to the
equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the
authority responsible for the location
Important: Electrical roundin of the server is required for operator safety and correct system function.
Proper roundin of the electrical outlet can be verified by a certified electrician.
Use the followin checklist to verify that there are no potentially unsafe conditions:
1. Make sure that the power is off and the power cord is disconnected.
2. Check the power cord.
• Make sure that the third-wire round connector is in ood condition. Use a meter to measure third-
wire round continuity for 0.1 ohm or less between the external round pin and the frame round.
• Make sure that the power cord is the correct type.
To view the power cords that are available for the server:
a. Go to:
vi ThinkSystem SR655 V3 User Guide

http://dcsc.lenovo.com/#/
b. Click Preconfigured Model or Configure to order.
c. Enter the machine type and model for your server to display the confi urator pa e.
d. Click Power ➙ Power Cables to see all line cords.
• Make sure that the insulation is not frayed or worn.
3. Check for any obvious non-Lenovo alterations. Use ood jud ment as to the safety of any non-Lenovo
alterations.
4. Check inside the server for any obvious unsafe conditions, such as metal filin s, contamination, water or
other liquid, or si ns of fire or smoke dama e.
5. Check for worn, frayed, or pinched cables.
6. Make sure that the power-supply cover fasteners (screws or rivets) have not been removed or tampered
with.
© Copyri ht Lenovo 2023 vii

viii ThinkSystem SR655 V3 User Guide

Chapter 1 Introduction
The ThinkSystem SR655 V3 server (7D9E and 7D9F) is a 1-socket 2U server that features the 4th eneration
EPYC processor family of AMD. The server offers a broad selection of drive and slot confi urations, hi h
performance, and expansion for various IT workloads. Combinin performance and flexibility, the server is a
reat choice for enterprises of all sizes.
Figure 1. ThinkSystem SR655 V3
Features
Performance, ease of use, reliability, and expansion capabilities were key considerations in the desi n of
your server. These desi n features make it possible for you to customize the system hardware to meet your
needs today and provide flexible expansion capabilities for the future.
Your server implements the followin features and technolo ies:
• Features on Demand
If a Features on Demand feature is inte rated in the server or in an optional device that is installed in the
server, you can purchase an activation key to activate the feature. For information about Features on
Demand, see:
https://fod.lenovo.com/lkms
• Lenovo XClarity Controller (XCC)
The Lenovo XClarity Controller is the common mana ement controller for Lenovo ThinkSystem server
hardware. The Lenovo XClarity Controller consolidates multiple mana ement functions in a sin le chip on
the server system board assembly. Some of the features that are unique to the Lenovo XClarity Controller
are enhanced performance, hi her-resolution remote video, and expanded security options.
The server supports Lenovo XClarity Controller 2 (XCC2). For additional information about Lenovo XClarity
Controller 2 (XCC2), refer to https://sysm t.lenovofiles.com/help/topic/lxcc_frontend/lxcc_overview.html.
• UEFI-compliant server firmware
Lenovo ThinkSystem firmware is Unified Extensible Firmware Interface (UEFI) compliant. UEFI replaces
BIOS and defines a standard interface between the operatin system, platform firmware, and external
devices.
Lenovo ThinkSystem servers are capable of bootin UEFI-compliant operatin systems, BIOS-based
operatin systems, and BIOS-based adapters as well as UEFI-compliant adapters.
Note: The server does not support Disk Operatin System (DOS).
• Large system-memory capacity
The server supports up to 12 TruDDR5 dual inline memory modules (DIMMs) with error correctin code
(ECC). For more information about the specific types and maximum amount of memory, see “Technical
specifications” on pa e 3.
© Copyri ht Lenovo 2023 1

• Large data-storage capacity and hot-swap capability
With the hot-swap feature, you can add, remove, or replace hard disk drives without turnin off the server.
Stora e capacity is different dependin on server model. See “Technical specifications” on pa e 3 for
more information.
• Lightpath Diagnostics
Li htpath Dia nostics provides LEDs to help you dia nose problems. For more information about the
Li htpath Dia nostics, see “Troubleshootin by system LEDs and dia nostics display” on pa e 198.
• Redundant networking connection
The Lenovo XClarity Controller provides failover capability to a redundant Ethernet connection with the
applicable application installed. If a problem occurs with the primary Ethernet connection, all Ethernet
traffic that is associated with the primary connection is automatically switched to the optional redundant
Ethernet connection. If the applicable device drivers are installed, this switchin occurs without data loss
and without user intervention.
• Redundant cooling
The redundant coolin by the fans in the server enables continued operation if one rotor of a fan fails.
• ThinkSystem RAID support
The ThinkSystem RAID adapter provides hardware redundant array of independent disks (RAID) support
to create confi urations, supportin RAID levels 0, 1, 5, 6, 10, 50, and 60.
Tech Tips
Lenovo continually updates the support website with the latest tips and techniques that you can use to solve
issues that your server mi ht encounter. These Tech Tips (also called retain tips or service bulletins) provide
procedures to work around issues or solve problems related to the operation of your server.
To find the Tech Tips available for your server:
1. Go to http://datacentersupport.lenovo.com and navi ate to the support pa e for your server.
2. Click on How To’s from the navi ation pane.
3. Click Article Type ➙ Solution from the drop-down menu.
Follow the on-screen instructions to choose the cate ory for the problem that you are havin .
Security advisories
Lenovo is committed to developin products and services that adhere to the hi hest security standards in
order to protect our customers and their data. When potential vulnerabilities are reported, it is the
responsibility of the Lenovo Product Security Incident Response Team (PSIRT) to investi ate and provide
information to our customers so they may put miti ation plans in place as we work toward providin
solutions.
The list of current advisories is available at the followin site:
https://datacentersupport.lenovo.com/product_security/home
Specifications
Summary of the features and specifications of the server. Dependin on the model, some features mi ht not
be available, or some specifications mi ht not apply. The latest specifications information is always available
at https://lenovopress.lenovo.com/.
2ThinkSystem SR655 V3 User Guide

Refer to the below table for specifications cate ories and the content of each cate ory.
Specification
category
Technical specifications Mechanical specifications Environmental specifications
Content • Processor
• Memory
• Internal drives
• Expansion slots
• Stora e controller
• Inte rated functions and I/O
connectors
• Network
• System fan
• Power supplies
• Minimal confi uration for
debu in
• Operatin systems
• Dimension
• Wei ht
• Acoustical noise emissions
• Ambient temperature
mana ement
• Environmental
Technical specifications
Summary of the technical specifications of server. Dependin on the model, some features mi ht not be
available, or some specifications mi ht not apply. The latest specifications information is always available at
https://lenovopress.lenovo.com/.
Processor
Supports fourth- eneration AMD® EPYCTM processors, with 5nm process technolo y.
• One processor with the new LGA 6096 (SP5) socket
• Up to 96 Zen4 cores (192 threads)
• Up to 4 xGMI3 links at up to 32 GT/s
• Maximum Confi urable Thermal Desi n Power (cTDP): up to 400 watts
For a list of supported processors, see https://serverproven.lenovo.com.
Memory
See “Memory module installation rules and order” on pa e 39 for detailed information about memory confi uration and
setup.
• Slots: 12 memory module (DIMM) slots
• Memory module type: TruDDR5 RDIMM 16 GB (1Rx8), 32 GB (1Rx4), 64 GB (2Rx4)
• Capacity:
– Minimum: 16 GB (1 x 16 GB RDIMM)
– Maximum: 0.75 TB (12 x 64 GB RDIMM)
• Speed: 4800 MT/s
For a list of supported memory modules, see https://serverproven.lenovo.com.
Internal drives
• Front drive bays:
– Up to 16 x 2.5-inch hot-swap SAS/SATA/NVMe drives
– Up to 12 x 3.5-inch hot-swap SAS/SATA drives
Chapter 1.Introduction 3

Expansion slots
• Up to six PCIe slots
• One OCP module slot
PCIe slot availability is based on riser selection. See “Rear view” on pa e 18 and “PCIe slots and PCIe adapters” on
pa e 40.
Storage controller
• ThinkSystem RAID 940-8i 4GB Flash PCIe Gen4 12Gb Adapter
• ThinkSystem RAID 940-16i 4GB Flash PCIe Gen4 12Gb Adapter
• ThinkSystem RAID 940-16i 8GB Flash PCIe Gen4 12Gb Adapter
Note: For more information about the RAID/HBA adapters, see Lenovo ThinkSystem RAID Adapter and HBA Reference.
Integrated functions and I/O connectors
• Lenovo XClarity Controller (XCC), which provides service processor control and monitorin functions, video
controller, and remote keyboard, video, mouse, and remote drive capabilities.
– The server supports Lenovo XClarity Controller 2 (XCC2). For additional information about Lenovo XClarity
Controller 2 (XCC2), refer to https://sysm t.lenovofiles.com/help/topic/lxcc_frontend/lxcc_overview.html.
• Front connectors:
– One VGA connector (optional)
– One USB 3.1 Gen 1 (5 Gbps) connector
– One USB 2.0 connector
– One external dia nostics connector
• Rear connectors:
– One VGA connector
– Three USB 3.1 Gen 1 (5 Gbps) connectors
– One XCC system mana ement port
– Two or four Ethernet connectors on the OCP module (optional)
Network
• OCP module
System fan
• Supported fan types:
– Standard fan 6038 (sin le-rotor, 17000 RPM)
– Performance fan 6056 (dual-rotor, 21000 RPM)
• Fan redundancy: N + 1 redundancy, one redundant fan rotor
– Without riser 3: four hot-swap system fans (one redundant fan rotor)
– With riser 3: six hot-swap system fans (one redundant fan rotor)
Notes:
• Sin le-rotor hot-swap fans cannot be mixed with dual-rotor hot-swap fans.
• The redundant coolin by the fans in the server enables continued operation if one rotor of a fan fails.
4ThinkSystem SR655 V3 User Guide

Power supplies
The server supports up to two power supplies for redundancy.
Power supply 200–240 V ac 240 V dc
ThinkSystem V3 1100W (230Vac) Titanium Hot-Swap Power
Supply
√ √
ThinkSystem 1800W (230V) v2 Platinum Hot-Swap Power Supply √ √
CAUTION:
• 240 V dc input (input range: 180-300 V dc) is supported in Chinese Mainland ONLY
• Power supply with 240 V dc input cannot support hot plugging power cord function Before removing the
power supply with dc input, please turn off server or disconnect dc power sources at the breaker panel or by
turning off the power source Then, remove the power cord
Minimal configuration for debugging
• One processor
• One memory module in slot 7
• One power supply
• One HDD/SSD drive (if OS is needed for debu in )
• Five system fans
Operating systems
Supported and certified operatin systems:
• Microsoft Windows Server
• VMware ESXi
References:
• Complete list of available operatin systems: https://lenovopress.lenovo.com/osi .
• OS deployment instructions, see “Deploy the operatin system” on pa e 195.
Mechanical specifications
Summary of the mechanical specifications of server. Dependin on the model, some features mi ht not be
available, or some specifications mi ht not apply. The latest specifications information is always available at
https://lenovopress.lenovo.com/.
Dimension
• Form factor: 2U
• Hei ht: 86.5 mm (3.4 inches)
• Width:
– With rack latches: 482.0 mm (19.0 inches)
– Without rack latches: 444.6 mm (17.5 inches)
• Depth: 763.7 mm (30.1 inches)
Note: The depth is measured with rack latches installed, but without the security bezel installed.
Chapter 1.Introduction 5

Weight
Up to 37 k (82 lb), dependin on the server confi uration
Environmental specifications
Summary of the environmental specifications of server. Dependin on the model, some features mi ht not be
available, or some specifications mi ht not apply. The latest specifications information is always available at
https://lenovopress.lenovo.com/.
Acoustical noise emissions
The server has the followin acoustic noise emissions declaration.
Typical Storage GPU
Sound power levels (LWAd)
Idlin 6.6 Bel 7.4 Bel 7.4 Bel
Operatin 8.1 Bel 7.5 Bel 8.6 Bel
Sound pressure level (LpAm)
Idlin 49.9 dBA 59.5 dBA 59.5 dBA
Operatin 65.4 dBA 61.3 dBA 71.2 dBA
The declared sound levels are based on the followin confi urations, which may chan e dependin on confi urations
or conditions.
Config Typical Storage GPU
Chassis (2U) Front 16 x 2.5'' Front 12 x 3.5'' Front 16 x 2.5''
Fan 4 x performance fans 6 x performance fans 6 x performance fans
Processor 1 x 300 W 1 x 240 W 1 x 300 W
DIMM 12 x 64 GB 12 x 64 GB 12 x 64 GB
Drive 16 x 2.4 TB SAS HDDs Front 12 x 2 TB + rear 4 x 2
TB HDDs 16 x 2.4 TB SAS HDDs
RAID 1 x RAID 940-8i 1 x RAID 940-16i 1 x RAID 940-16i
OCP Intel E810-DA2 10/25GbE SFP28 2-Port OCP
PSU 2 x 1800 W 2 x 1800 W 2 x 2400 W
GPU None None 3 x A100
Notes:
• These sound levels were measured in controlled acoustical environments accordin to procedures specified by
ISO7779 and are reported in accordance with ISO 9296.
• Government re ulations (such as those prescribed by OSHA or European Community Directives) may overn noise
level exposure in the workplace and may apply to you and your server installation. The actual sound pressure levels
in your installation depend upon a variety of factors, includin the number of racks in the installation; the size,
materials, and confi uration of the room; the noise levels from other equipment; the room ambient temperature, and
employee's location in relation to the equipment. Further, compliance with such overnment re ulations depends
on a variety of additional factors, includin the duration of employees' exposure and whether employees wear
hearin protection. Lenovo recommends that you consult with qualified experts in this field to determine whether
you are in compliance with the applicable re ulations.
6ThinkSystem SR655 V3 User Guide

Environment
ThinkSystem SR655 V3 complies with ASHRAE Class A2 specifications with most confi urations, and dependin on
the hardware confi uration, also complies with ASHRAE Class A3, and Class A4 specifications. System performance
may be impacted when operatin temperature is outside ASHRAE A2 specification.
Dependin on the hardware confi uration, SR655 V3 server also complies with ASHRAE Class H1 specification.
System performance may be impacted when operatin temperature is outside ASHRAE H1 specification.
The restrictions to ASHRAE support are as follows:
• The ambient temperature must be limited to 35°C if the server has any of the followin components:
– Broadcom 57454 10GBASE-T 4-port OCP
– PCIe network interface cards (NICs) at a rate reater than or equal to 100 GB
– Parts with AOC and at a rate of 25 GB
• The ambient temperature must be limited to 30°C if the server has any of the followin components:
– 24 x 2.5" or 12 x 3.5" front drives
– Parts with AOC and at a rate of reater than 25 GB
– Group E (320W <= cTDP <= 400W) processors
For detailed thermal information, see “Thermal rules” on pa e 41.
Note:
When the ambient temperature is reater than the supported max temperature, the server will shut down (ASHRAE 45°
C). The server will not power on a ain until the ambient temperature falls within the supported temperature ran e.
• Air temperature:
– Operatin
– ASHRAE class H1: 5°C to 25°C (41°F to 77°F)
The maximum ambient temperature decreases by 1°C for every 500 m (1640 ft) increase in altitude above 900
m (2,953 ft)
– ASHRAE class A2: 10°C to 35°C (50°F to 95°F)
The maximum ambient temperature decreases by 1°C for every 300 m (984 ft) increase in altitude above 900
m (2,953 ft)
– ASHRAE class A3: 5°C to 40°C (41°F to 104°F)
The maximum ambient temperature decreases by 1°C for every 175 m (574 ft) increase in altitude above 900
m (2,953 ft)
– ASHRAE class A4: 5°C to 45°C (41°F to 113°F)
The maximum ambient temperature decreases by 1°C for every 125 m (410 ft) increase in altitude above 900
m (2,953 ft)
– Server off: 5°C to 45°C (41°F to 113°F)
– Shipment/stora e: -40°C to 60°C (-40°F to 140°F)
• Maximum altitude: 3,050 m (10,000 ft)
• Relative Humidity (non-condensin ):
– Operatin
– ASHRAE class H1: 8%–80%; maximum dew point: 17°C (62.6°F)
– ASHRAE class A2: 8%–80%; maximum dew point: 21°C (70°F)
– ASHRAE class A3: 8%–85%; maximum dew point: 24°C (75°F)
– ASHRAE class A4: 8%–90%; maximum dew point: 24°C (75°F)
– Shipment/stora e: 8% to 90%
Chapter 1.Introduction 7

Particulate contamination
Attention: Airborne particulates (includin metal flakes or particles) and reactive ases actin alone or in
combination with other environmental factors such as humidity or temperature mi ht pose a risk to the
device that is described in this document.
Risks that are posed by the presence of excessive particulate levels or concentrations of harmful ases
include dama e that mi ht cause the device to malfunction or cease functionin alto ether. This
specification sets forth limits for particulates and ases that are intended to avoid such dama e. The limits
must not be viewed or used as definitive limits, because numerous other factors, such as temperature or
moisture content of the air, can influence the impact of particulates or environmental corrosives and aseous
contaminant transfer. In the absence of specific limits that are set forth in this document, you must
implement practices that maintain particulate and as levels that are consistent with the protection of human
health and safety. If Lenovo determines that the levels of particulates or ases in your environment have
caused dama e to the device, Lenovo may condition provision of repair or replacement of devices or parts
on implementation of appropriate remedial measures to miti ate such environmental contamination.
Implementation of such remedial measures is a customer responsibility.
Table 1. Limits for particulates an gases
Contaminant Limits
Reactive ases Severity level G1 as per ANSI/ISA 71.04-19851:
• The copper reactivity level shall be less than 300 An stroms per month (Å/month ≈ 0.0039 μ /
cm2-hour wei ht ain).2
• The silver reactivity level shall be less than 200 Å/month (Å/month ≈ 0.0035 μ /cm2-hour
wei ht ain).3
• The reactive monitorin of aseous corrosivity must be conducted approximately 5 cm (2 in.) in
front of the rack on the air inlet side at one-quarter and three-quarter frame hei ht off the floor
or where the air velocity is much hi her.
Airborne
particulates Data centers must meet the cleanliness level of ISO 14644-1 class 8.
For data centers without airside economizer, the ISO 14644-1 class 8 cleanliness mi ht be met by
choosin one of the followin filtration methods:
• The room air mi ht be continuously filtered with MERV 8 filters.
• Air enterin a data center mi ht be filtered with MERV 11 or preferably MERV 13 filters.
For data centers with airside economizers, the choice of filters to achieve ISO class 8 cleanliness
depends on the specific conditions present at that data center.
• The deliquescent relative humidity of the particulate contamination should be more than 60%
RH.4
• Data centers must be free of zinc whiskers.5
1 ANSI/ISA-71.04-1985. Environmental con itions for process measurement an control systems: Airborne
contaminants. Instrument Society of America, Research Trian le Park, North Carolina, U.S.A.
2 The derivation of the equivalence between the rate of copper corrosion rowth in the thickness of the corrosion
product in Å/month and the rate of wei ht ain assumes that Cu2S and Cu2O row in equal proportions.
3 The derivation of the equivalence between the rate of silver corrosion rowth in the thickness of the corrosion
product in Å/month and the rate of wei ht ain assumes that A 2S is the only corrosion product.
4 The deliquescent relative humidity of particulate contamination is the relative humidity at which the dust absorbs
enou h water to become wet and promote ionic conduction.
5 Surface debris is randomly collected from 10 areas of the data center on a 1.5 cm diameter disk of sticky
electrically conductive tape on a metal stub. If examination of the sticky tape in a scannin electron microscope
reveals no zinc whiskers, the data center is considered free of zinc whiskers.
8ThinkSystem SR655 V3 User Guide

Management options
The XClarity portfolio and other system mana ement options described in this section are available to help
you mana e the servers more conveniently and efficiently.
Overview
Options Description
Lenovo XClarity Controller
Baseboard mana ement controller. (BMC)
Consolidates the service processor functionality, Super I/O, video controller, and
remote presence capabilities into a sin le chip on the server system board (system
board assembly).
Interface
• CLI application
• Web GUI interface
• Mobile application
• REST API
Usage and downloads
https://sysm t.lenovofiles.com/help/topic/lxcc_frontend/lxcc_overview.html
Lenovo XClarity Administrator
Centralized interface for multi-server mana ement.
Interface
• Web GUI interface
• Mobile application
• REST API
Usage and downloads
http://sysm t.lenovofiles.com/help/topic/com.lenovo.lxca.doc/au _product_pa e.html
Lenovo XClarity Essentials
toolset
Portable and li ht toolset for server confi uration, data collection, and firmware
updates. Suitable both for sin le-server or multi-server mana ement contexts.
Interface
• OneCLI: CLI application
• Bootable Media Creator: CLI application, GUI application
• UpdateXpress: GUI application
Usage and downloads
http://sysm t.lenovofiles.com/help/topic/xclarity_essentials/overview.html
Chapter 1.Introduction 9

Options Description
Lenovo XClarity Provisionin
Mana er
UEFI-based embedded GUI tool on a sin le server that can simplify mana ement
tasks.
Interface
• Web interface (BMC remote access)
• GUI application
Usage and downloads
https://sysm t.lenovofiles.com/help/topic/lxpm_frontend/lxpm_product_pa e.html
Important:
Lenovo XClarity Provisionin Mana er (LXPM) supported version varies by product.
All versions of Lenovo XClarity Provisionin Mana er are referred to as Lenovo
XClarity Provisionin Mana er and LXPM in this document, unless specified
otherwise. To see the LXPM version supported by your server, o to https://
sysm t.lenovofiles.com/help/topic/lxpm_frontend/lxpm_product_pa e.html.
Lenovo XClarity Inte rator
Series of applications that inte rate the mana ement and monitorin functionalities of
the Lenovo physical servers with the software used in a certain deployment
infrastructure, such as VMware vCenter, Microsoft Admin Center, or Microsoft System
Center while deliverin additional workload resiliency.
Interface
• GUI application
Usage and downloads
https://sysm t.lenovofiles.com/help/topic/lxci/lxci_product_pa e.html
Lenovo XClarity Ener y
Mana er
Application that can mana e and monitor server power and temperature.
Interface
• Web GUI Interface
Usage and downloads
https://datacentersupport.lenovo.com/solutions/lnvo-lxem
Lenovo Capacity Planner
Application that supports power consumption plannin for a server or rack.
Interface
• Web GUI Interface
Usage and downloads
https://datacentersupport.lenovo.com/solutions/lnvo-lcp
10 ThinkSystem SR655 V3 User Guide