Lenovo ThinkSystem SR630 V3 User manual

ThinkSystem SR630 V3
User Guide
Machine Type: 7D72, 7D73, 7D74

Note
Before using this inform tion nd the product it supports, be sure to re d nd underst nd the s fety
inform tion nd the s fety instructions, which re v il ble t:
https://pubs.lenovo.com/s fety_document tion/
In ddition, be sure th t you re f mili r with the terms nd conditions of the Lenovo w rr nty for your server,
which c n be found t:
http://d t centersupport.lenovo.com/w rr ntylookup
Second Edition (May 2023)
© Copyright Lenovo 2023.
LIMITED AND RESTRICTED RIGHTS NOTICE: If d t or softw re is delivered pursu nt to Gener l Services
Administr tion “GSA” contr ct, use, reproduction, or disclosure is subject to restrictions set forth in Contr ct No. GS-
35F-05925.

Contents
Contents . . . . . . . . . . . . . . . . . i
Sa ety . . . . . . . . . . . . . . . . . . v
S fety inspection checklist . . . . . . . . . . . vi
Chapter 1. Introduction . . . . . . . . . 1
Fe tures. . . . . . . . . . . . . . . . . . . 1
Tech Tips . . . . . . . . . . . . . . . . . . 2
Security dvisories . . . . . . . . . . . . . . 3
Specific tions . . . . . . . . . . . . . . . . 3
Technic l specific tions. . . . . . . . . . . 4
Mech nic l specific tions . . . . . . . . . 10
Environment l specific tions . . . . . . . . 10
M n gement options. . . . . . . . . . . . . 15
Chapter 2. Server components . . . . 19
Front view . . . . . . . . . . . . . . . . . 19
Re r view . . . . . . . . . . . . . . . . . 26
Top view . . . . . . . . . . . . . . . . . 31
Front I/O module . . . . . . . . . . . . . . 33
System-bo rd- ssembly l yout . . . . . . . . 35
System-bo rd- ssembly connectors. . . . . 36
System-bo rd- ssembly switches. . . . . . 38
System LEDs nd di gnostics displ y . . . . . . 40
Chapter 3. Parts list . . . . . . . . . . 41
Power cords . . . . . . . . . . . . . . . . 44
Chapter 4. Unboxing and setup . . . . 47
Server p ck ge contents . . . . . . . . . . . 47
Identify the server nd ccess the Lenovo XCl rity
Controller . . . . . . . . . . . . . . . . . 47
Server setup checklist . . . . . . . . . . . . 49
Chapter 5. Hardware replacement
procedures . . . . . . . . . . . . . . . 51
Inst ll tion Guidelines . . . . . . . . . . . . 51
S fety inspection checklist. . . . . . . . . 52
System reli bility guidelines . . . . . . . . 53
Working inside the server with the power on . . 54
H ndling st tic-sensitive devices . . . . . . 54
Memory module inst ll tion rules nd order . . . . 56
DDR5 DIMMs inst ll tion order . . . . . . . 58
Technic l rules . . . . . . . . . . . . . . . 61
PCIe slots nd d pters. . . . . . . . . . 61
Technic l rules for drives . . . . . . . . . 64
Therm l rules . . . . . . . . . . . . . . 65
Power on nd power off the server . . . . . . . 68
Power on the server . . . . . . . . . . . 68
Power off the server . . . . . . . . . . . 68
Server repl cement . . . . . . . . . . . . . 69
Remove the server from the r ck . . . . . . 69
Inst ll the server to the r ck . . . . . . . . 72
Air b ffle repl cement . . . . . . . . . . . . 77
Remove the ir b ffle . . . . . . . . . . . 77
Inst ll the ir b ffle . . . . . . . . . . . . 78
B ckpl ne repl cement. . . . . . . . . . . . 80
Remove the front 2.5-inch drive b ckpl ne . . 80
Inst ll the front 2.5-inch drive b ckpl ne . . . 81
Remove the front 3.5-inch drive b ckpl ne . . 82
Inst ll the front 3.5-inch drive b ckpl ne . . . 84
Remove the front 16-EDSFF drive
b ckpl ne . . . . . . . . . . . . . . . 85
Inst ll the front 16-EDSFF drive b ckpl ne . . 86
Remove the 2.5-inch re r drive b ckpl ne. . . 88
Inst ll the 2.5-inch re r drive b ckpl ne . . . 90
Remove the 7mm drive b ckpl nes . . . . . 91
Inst ll the 7mm drive b ckpl nes . . . . . . 93
CMOS b ttery repl cement . . . . . . . . . . 94
Remove the CMOS b ttery . . . . . . . . 94
Inst ll the CMOS b ttery . . . . . . . . . 97
EDSFF c ge repl cement . . . . . . . . . . . 99
Remove n EDSFF c ge . . . . . . . . . 99
Inst ll n EDSFF c ge . . . . . . . . . . 100
Front I/O module repl cement . . . . . . . . . 102
Remove the front I/O module . . . . . . . . 102
Inst ll the front I/O module. . . . . . . . . 103
Remove the integr ted di gnostics p nel
ssembly . . . . . . . . . . . . . . . 104
Inst ll the integr ted di gnostics p nel
ssembly . . . . . . . . . . . . . . . 106
Remove the extern l LCD c ble (4 x 3.5''
ch ssis) . . . . . . . . . . . . . . . . 108
Inst ll the extern l LCD c ble (4 x 3.5''
ch ssis) . . . . . . . . . . . . . . . . 111
He t sink Torx T30 nut repl cement . . . . . . . 112
Remove he t sink Torx T30 nut . . . . . . 112
Inst ll he t sink Torx T30 nut . . . . . . . 113
Hot-sw p drive repl cement . . . . . . . . . . 115
Remove 2.5/3.5-inch hot-sw p drive . . . . 115
Inst ll 2.5/3.5-inch hot-sw p drive . . . . . 117
Remove hot-sw p EDSFF drive . . . . . . 119
Inst ll hot-sw p EDSFF drive . . . . . . . 121
Hot-sw p power supply unit repl cement . . . . 123
© Copyright Lenovo 2023 i

Remove hot-sw p power supply unit . . . . 123
Inst ll hot-sw p power supply unit . . . . . 128
Intern l CFF RAID d pter repl cement . . . . . 133
Remove the intern l CFF RAID d pter . . . . 133
Inst ll the intern l CFF RAID d pter . . . . . 134
Intrusion switch repl cement . . . . . . . . . 135
Remove n intrusion switch . . . . . . . . 135
Inst ll n intrusion switch . . . . . . . . . 138
Lenovo Neptune(TM) liquid ssisted cooling
module repl cement (tr ined technici ns only). . . 140
Remove the Lenovo Neptune(TM) liquid
ssisted cooling module . . . . . . . . . 140
Inst ll the Lenovo Neptune(TM) liquid ssisted
cooling module . . . . . . . . . . . . . 143
Memory module repl cement . . . . . . . . . 150
Remove memory module . . . . . . . . 150
Inst ll memory module . . . . . . . . . 151
MicroSD c rd repl cement . . . . . . . . . . 153
Remove the MicroSD c rd . . . . . . . . . 154
Inst ll the MicroSD c rd . . . . . . . . . . 155
M.2 b ckpl ne nd M.2 drive repl cement . . . . 157
Remove the M.2 b ckpl ne nd M.2 drive. . . 157
Adjust the ret iner on the M.2 b ckpl ne . . . 159
Inst ll the M.2 b ckpl ne nd M.2 drive. . . . 160
Remove the M.2 c ge nd M.2 b ckpl ne (16-
EDSFF ch ssis) . . . . . . . . . . . . . 162
Inst ll the M.2 c ge nd M.2 b ckpl ne (16-
EDSFF ch ssis) . . . . . . . . . . . . . 164
OCP module repl cement . . . . . . . . . . . 166
Remove the OCP module . . . . . . . . . 166
Inst ll the OCP module . . . . . . . . . . 167
PCIe d pter repl cement. . . . . . . . . . . 169
Remove PCIe d pter . . . . . . . . . . 170
Inst ll PCIe d pter . . . . . . . . . . . 171
Power-supply-unit ir b ffle repl cement . . . . . 172
Remove power-supply-unit ir b ffle . . . . 173
Inst ll power-supply-unit ir b ffle . . . . . 174
Processor nd he t sink repl cement . . . . . . 176
Remove processor nd he t sink . . . . . 176
Sep r te the processor from c rrier nd he t
sink. . . . . . . . . . . . . . . . . . 180
Inst ll processor nd he t sink . . . . . . 181
R ck l tches repl cement . . . . . . . . . . . 187
Remove the r ck l tches . . . . . . . . . 187
Inst ll the r ck l tches . . . . . . . . . . 188
RAID fl sh power module repl cement . . . . . . 189
Remove the RAID fl sh power module on the
ch ssis . . . . . . . . . . . . . . . . 190
Inst ll the RAID fl sh power module on the
ch ssis . . . . . . . . . . . . . . . . 191
Remove the RAID fl sh power module on the
ir b ffle . . . . . . . . . . . . . . . . 194
Inst ll the RAID fl sh power module on the ir
b ffle . . . . . . . . . . . . . . . . . 195
Remove the RAID fl sh power module on the
riser . . . . . . . . . . . . . . . . . 196
Inst ll the RAID fl sh power module on the
riser . . . . . . . . . . . . . . . . . 197
Re r drive ssembly repl cement . . . . . . . . 198
Remove the 2.5-inch re r drive ssembly . . . 198
Inst ll the 2.5-inch re r drive ssembly . . . . 199
Remove the 7mm re r drive ssembly . . . . 202
Inst ll the 7mm re r drive ssembly . . . . . 203
Riser c rd repl cement . . . . . . . . . . . . 204
Remove riser c rd . . . . . . . . . . . 208
Inst ll riser c rd . . . . . . . . . . . . 211
Security bezel repl cement . . . . . . . . . . 213
Remove the security bezel . . . . . . . . . 213
Inst ll the security bezel. . . . . . . . . . 215
Seri l port module repl cement . . . . . . . . 217
Remove seri l port module . . . . . . . . 217
Inst ll seri l port module . . . . . . . . . 219
System bo rd ssembly repl cement (tr ined
technici ns only) . . . . . . . . . . . . . . 221
Firmw re nd RoT Security Module
repl cement (Lenovo tr ined technici ns
only) . . . . . . . . . . . . . . . . . 223
System I/O bo rd repl cement (tr ined
technici ns only). . . . . . . . . . . . . 229
Processor bo rd repl cement (tr ined
technici ns only). . . . . . . . . . . . . 233
System f n repl cement . . . . . . . . . . . 239
Remove system f n. . . . . . . . . . . 239
Inst ll system f n. . . . . . . . . . . . 241
Top cover repl cement . . . . . . . . . . . . 243
Remove the top cover . . . . . . . . . . 243
Inst ll the top cover . . . . . . . . . . . 244
Complete the p rts repl cement . . . . . . . . 246
Chapter 6. Internal cable routing . . . 249
Identifying connectors . . . . . . . . . . . . 250
Drive b ckpl ne connectors . . . . . . . . 250
RAID nd HBA d pter connectors . . . . . 254
Re-timer d pter connectors . . . . . . . . 257
Processor-bo rd connectors for c ble
routing . . . . . . . . . . . . . . . . 257
CFF RAID d pter . . . . . . . . . . . . . . 260
Front I/O module . . . . . . . . . . . . . . 262
Intrusion switch . . . . . . . . . . . . . . . 263
RAID fl sh power modules . . . . . . . . . . 264
M.2 drive b ckpl ne . . . . . . . . . . . . . 267
M.2 b ckpl ne to SFF RAID d pters . . . . 269
7mm drive b ckpl ne . . . . . . . . . . . . 270
7mm b ckpl ne to SFF RAID d pters . . . . 272
ii ThinkSystem SR630 V3 User Guide

Re r NVMe drive b ckpl ne . . . . . . . . . . 272
C ble routing for b ckpl ne power . . . . . . . 274
Liquid ssisted cooling module. . . . . . . . . 275
6 x 2.5'' SAS/SATA + 4 x 2.5'' AnyB y (liquid
cooling) . . . . . . . . . . . . . . . . 277
6 x 2.5'' SAS/SATA + 2 x 2.5'' AnyB y + 2 x
2.5'' NVMe (liquid cooling) . . . . . . . . . 283
8 x 2.5'' SAS/SATA (liquid cooling) . . . . . 287
8 x 2.5'' U.3 drives with 10 x 2.5'' AnyB y
b ckpl ne (liquid cooling) . . . . . . . . . 291
10 x 2.5'' SAS/SATA (liquid cooling) . . . . . 292
10 x 2.5'' NVMe (liquid cooling) . . . . . . . 296
C ble routing for b ckpl ne sign ls (one
processor) . . . . . . . . . . . . . . . . . 298
4 x 3.5'' front drives (one processor) . . . . . 298
4 x 2.5'' front drives (one processor) . . . . . 311
8 x 2.5'' front drives (one processor) . . . . . 318
10 x 2.5'' front drives (one processor) . . . . 331
C ble routing for b ckpl ne sign ls (two
processors) . . . . . . . . . . . . . . . . 350
4 x 3.5'' front drives . . . . . . . . . . . 350
4 x 2.5'' front drives . . . . . . . . . . . 366
8 x 2.5'' front drives . . . . . . . . . . . 372
10 x 2.5'' front drives . . . . . . . . . . . 382
16-EDSFF drive b ckpl ne . . . . . . . . 428
Chapter 7. System con iguration . . . 431
Set the network connection for the Lenovo XCl rity
Controller . . . . . . . . . . . . . . . . . 431
Set front USB port for Lenovo XCl rity Controller
connection. . . . . . . . . . . . . . . . . 432
Upd te the firmw re . . . . . . . . . . . . . 433
Configure the firmw re . . . . . . . . . . . . 436
En ble Softw re Gu rd Extensions (SGX). . . . . 437
RAID configur tion . . . . . . . . . . . . . 438
Deploy the oper ting system. . . . . . . . . . 438
B ck up the server configur tion . . . . . . . . 439
Chapter 8. Problem
determination . . . . . . . . . . . . . 441
Event logs . . . . . . . . . . . . . . . . . 441
Troubleshooting by system LEDs nd di gnostics
displ y . . . . . . . . . . . . . . . . . . 443
Extern l di gnostics h ndset . . . . . . . . 443
Integr ted di gnostics p nel . . . . . . . . 448
LEDs nd buttons on the front oper tor
p nel . . . . . . . . . . . . . . . . . 453
LEDs on drives . . . . . . . . . . . . . 455
LEDs on the Firmw re nd RoT Security
Module . . . . . . . . . . . . . . . . 456
LEDs on the system bo rd ssembly. . . . . 458
Re r LEDs . . . . . . . . . . . . . . . 461
The LED on the liquid detection sensor
module . . . . . . . . . . . . . . . . 463
Gener l problem determin tion procedures . . . . 463
Resolving suspected power problems . . . . 464
Resolving suspected Ethernet controller
problems . . . . . . . . . . . . . . . 464
Troubleshooting by symptom . . . . . . . . . 465
Cool nt le k problems . . . . . . . . . . 465
H rd disk drive problems . . . . . . . . . 467
Intermittent problems. . . . . . . . . . . 469
Keybo rd, mouse, KVM switch or USB-device
problems . . . . . . . . . . . . . . . 470
Memory problems . . . . . . . . . . . . 471
Monitor nd video problems . . . . . . . . 473
Observ ble problems. . . . . . . . . . . 474
Option l-device problems . . . . . . . . . 477
Perform nce problems . . . . . . . . . . 478
Power on nd power off problems . . . . . . 479
Power problems . . . . . . . . . . . . . 480
Seri l-device problems . . . . . . . . . . 481
Softw re problems. . . . . . . . . . . . 481
Appendix A. Hardware
disassembling or recycle . . . . . . . 483
Dis ssemble the system bo rd ssembly for
recycle . . . . . . . . . . . . . . . . . . 483
Appendix B. Getting help and
technical assistance . . . . . . . . . . 487
Before you c ll . . . . . . . . . . . . . . . 487
Collecting service d t . . . . . . . . . . . . 488
Cont cting Support . . . . . . . . . . . . . 489
Appendix C. Documents and
supports . . . . . . . . . . . . . . . . 491
Documents downlo d . . . . . . . . . . . . 491
Support websites . . . . . . . . . . . . . . 491
Appendix D. Notices. . . . . . . . . . 493
Tr dem rks . . . . . . . . . . . . . . . . 494
Import nt notes . . . . . . . . . . . . . . . 494
Electronic emission notices . . . . . . . . . . 494
T iw n Region BSMI RoHS decl r tion . . . . . 495
T iw n Region import nd export cont ct
inform tion . . . . . . . . . . . . . . . . 495
© Copyright Lenovo 2023 iii

iv ThinkSystem SR630 V3 User Guide

Sa ety
Before inst lling this product, re d the S fety Inform tion.
Antes de inst l r este produto, lei s Inform ções de Segur nç .
在安装本产品之前，请仔细阅读 S fety Inform tion （安全信息）。
Læs sikkerhedsforskrifterne, før du inst llerer dette produkt.
Lees voord t u dit product inst lleert eerst de veiligheidsvoorschriften.
Ennen kuin senn t tämän tuotteen, lue turv ohjeet kohd st S fety Inform tion.
Av nt d'inst ller ce produit, lisez les consignes de sécurité.
Vor der Inst ll tion dieses Produkts die Sicherheitshinweise lesen.
Prim di inst ll re questo prodotto, leggere le Inform zioni sull Sicurezz .
Les sikkerhetsinform sjonen (S fety Inform tion) før du inst llerer dette produktet.
Antes de inst l r este produto, lei s Inform ções sobre Segur nç .
© Copyright Lenovo 2023 v

Antes de inst l r este producto, le l inform ción de segurid d.
Läs säkerhetsinform tionen inn n du inst ller r den här produkten.
Sa ety inspection checklist
Use the inform tion in this section to identify potenti lly uns fe conditions with your server. As e ch m chine
w s designed nd built, required s fety items were inst lled to protect users nd service technici ns from
injury.
Note: The product is not suit ble for use t visu l displ y workpl ces ccording to §2 of the Workpl ce
Regul tions.
Note: The set-up of the server is m de in the server room only.
CAUTION:
This equipment must be installed or serviced by trained personnel, as de ined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard or Sa ety o Electronic Equipment within the Field o Audio/Video,
In ormation Technology and Communication Technology. Lenovo assumes that you are quali ied in
the servicing o equipment and trained in recognizing hazards energy levels in products. Access to the
equipment is by the use o a tool, lock and key, or other means o security, and is controlled by the
authority responsible or the location.
Important: Electric l grounding of the server is required for oper tor s fety nd correct system function.
Proper grounding of the electric l outlet c n be verified by certified electrici n.
Use the following checklist to verify th t there re no potenti lly uns fe conditions:
1. If your working condition necessit tes the server being powered off or you intend to power off, m ke
sure th t the power cord is disconnected.
S002
CAUTION:
vi ThinkSystem SR630 V3 User Guide

The power-control button on the device and the power switch on the power supply do not turn o
the electrical current supplied to the device. The device also might have more than one power
cord. To remove all electrical current rom the device, ensure that all power cords are
disconnected rom the power source.
Note: Under cert in circumst nces, powering off the server is not prerequisite. Refer to the
prec utions before conducting ny t sks.
2. Check the power cord.
• M ke sure th t the third-wire ground connector is in good condition. Use meter to me sure third-
wire ground continuity for 0.1 ohm or less between the extern l ground pin nd the fr me ground.
• M ke sure th t the power cord is the correct type.
To view the power cords th t re v il ble for the server:
. Go to:
http://dcsc.lenovo.com/#/
b. Click Precon igured Model or Con igure to order.
c. Enter the m chine type nd model for your server to displ y the configur tor p ge.
d. Click Power ➙ Power Cables to see ll line cords.
• M ke sure th t the insul tion is not fr yed or worn.
3. Check for ny obvious non-Lenovo lter tions. Use good judgment s to the s fety of ny non-Lenovo
lter tions.
4. Check inside the server for ny obvious uns fe conditions, such s met l filings, cont min tion, w ter or
other liquid, or signs of fire or smoke d m ge.
5. Check for worn, fr yed, or pinched c bles.
6. M ke sure th t the power-supply cover f steners (screws or rivets) h ve not been removed or t mpered
with.
© Copyright Lenovo 2023 vii

viii ThinkSystem SR630 V3 User Guide

Chapter 1. Introduction
The ThinkSystem SR630 V3 server (7D72, 7D73, 7D74) is high-perform nce, multi-core 1U r ck server
designed to support m ny kinds of Inform tion Technology (IT) worklo ds with high gility. It c rries the most
dv nced processing nd memory units nd c n sc le up to the st te-of-the- rt liquid cooling solutions. This
server is ide lly suited for IT environments th t require superior processor perform nce, flexible
m n ge bility, nd therm l efficiency.
Figure 1. ThinkSystem SR630 V3
Features
Perform nce, e se of use, reli bility, nd exp nsion c p bilities re key consider tions in the design of your
server. These design fe tures m ke it possible for you to customize the system h rdw re to meet your needs
tod y, nd provide flexible exp nsion c p bilities for the future.
Your server implements the following fe tures nd technologies:
• Features on Demand
If Fe tures on Dem nd fe ture is integr ted in the server or in n option l device th t is inst lled in the
server, you c n purch se n ctiv tion key to ctiv te the fe ture. For inform tion bout Fe tures on
Dem nd, see:
https://fod.lenovo.com/lkms
• Lenovo XClarity Controller (XCC)
The Lenovo XCl rity Controller is the common m n gement controller for Lenovo ThinkSystem server
h rdw re. The Lenovo XCl rity Controller consolid tes multiple m n gement functions in single chip on
the server system bo rd (system bo rd ssembly). Some of the fe tures th t re unique to the Lenovo
XCl rity Controller re enh nced perform nce, higher-resolution remote video, nd exp nded security
options.
The server supports Lenovo XCl rity Controller 2 (XCC2). For ddition l inform tion bout Lenovo XCl rity
Controller 2 (XCC2), refer to https://sysmgt.lenovofiles.com/help/topic/lxcc_frontend/lxcc_overview.html.
• UEFI-compliant server irmware
Lenovo ThinkSystem firmw re is Unified Extensible Firmw re Interf ce (UEFI) compli nt. UEFI repl ces
BIOS nd defines st nd rd interf ce between the oper ting system, pl tform firmw re, nd extern l
devices.
Lenovo ThinkSystem servers re c p ble of booting UEFI-compli nt oper ting systems, BIOS-b sed
oper ting systems, nd BIOS-b sed d pters s well s UEFI-compli nt d pters.
Note: The server does not support Disk Oper ting System (DOS).
• Active Memory
© Copyright Lenovo 2023 1

The Active Memory fe ture improves the reli bility of memory through memory mirroring. Memory
mirroring mode replic tes nd stores d t on two p irs of DIMMs within two ch nnels simult neously. If
f ilure occurs, the memory controller switches from the prim ry p ir of memory DIMMs to the b ckup p ir
of DIMMs.
• Large system-memory capacity
The server supports synchronous dyn mic r ndom- ccess memory (SDRAM) registered du l inline
memory modules (DIMMs) with error correcting code (ECC). For more inform tion bout the specific types
nd m ximum mount of memory, see “Technic l specific tions” on p ge 4.
• Integrated network support
The server comes with n integr ted 1-port Gig bit Ethernet controller with n RJ-45 connector, which
supports connection to 1000 Mbps network.
• Large data-storage capacity and hot-swap capability
With the hot-sw p fe ture, you c n dd, remove, or repl ce h rd disk drives without turning off the server.
Stor ge c p city is different depending on server models. See “Technic l specific tions” on p ge 4 for
more inform tion.
• Lightpath Diagnostics
Lightp th Di gnostics provides LEDs to help you di gnose problems. For more inform tion bout the
Lightp th Di gnostics, see “System LEDs nd di gnostics displ y” on p ge 40.
• Mobile access to Lenovo Service In ormation website
The server provides QR code on the system service l bel, which is on the cover of the server, th t you
c n sc n using QR code re der nd sc nner with mobile device to get quick ccess to the Lenovo
Service Inform tion website. The Lenovo Service Inform tion website provides ddition l inform tion for
p rts inst ll tion, repl cement videos, nd error codes for server support.
• Active Energy Manager
Lenovo XCl rity Energy M n ger is power nd temper ture m n gement solution for d t centers. You
c n monitor nd m n ge the power consumption nd temper ture of Converged, NeXtSc le, System x,
nd ThinkServer servers, nd improve energy efficiency using Lenovo XCl rity Energy M n ger.
• Redundant networking connection
The Lenovo XCl rity Controller provides f ilover c p bility to redund nt Ethernet connection with the
pplic ble pplic tion inst lled. If problem occurs with the prim ry Ethernet connection, ll Ethernet
tr ffic th t is ssoci ted with the prim ry connection is utom tic lly switched to the option l redund nt
Ethernet connection. If the pplic ble device drivers re inst lled, this switching occurs without d t loss
nd without user intervention.
• Redundant cooling
The redund nt cooling by the f ns in the server en bles continued oper tion if one of the f n rotors f ils.
See “Therm l rules” on p ge 65 for more inform tion.
• ThinkSystem RAID support
The ThinkSystem RAID d pter provides h rdw re redund nt rr y of independent disks (RAID) support
to cre te configur tions. The st nd rd RAID d pter provides RAID levels 0, 1, nd 10. Option l RAID
d pter with RAID 5, 50, 6, nd 60 is v il ble for purch se.
Tech Tips
Lenovo continu lly upd tes the support website with the l test tips nd techniques th t you c n use to solve
issues th t your server might encounter. These Tech Tips ( lso c lled ret in tips or service bulletins) provide
procedures to work round issues or solve problems rel ted to the oper tion of your server.
2ThinkSystem SR630 V3 User Guide

To find the Tech Tips v il ble for your server:
1. Go to http://d t centersupport.lenovo.com, nd input the model n me or m chine type of your server in
the se rch b r to n vig te to the support p ge.
2. Click on How To’s from the n vig tion p ne.
3. Click Article Type ➙ Solution from the drop-down menu.
Follow the on-screen instructions to choose the c tegory for the problem th t you re h ving.
Security advisories
In order to protect our customers nd their d t , Lenovo is committed to developing products nd services
th t dhere to the highest security st nd rds. When potenti l vulner bilities re reported, it is the
responsibility of the Lenovo Product Security Incident Response Te m (PSIRT) to investig te nd provide
inform tion to our customers so th t they m y put mitig tion pl ns in pl ce s we work tow rd providing
solutions.
The list of current dvisories is v il ble t the following site:
https://d t centersupport.lenovo.com/product_security/home
Speci ications
Summ ry of the fe tures nd specific tions of the server. Depending on the model, some fe tures might not
be v il ble, or some specific tions might not pply.
Refer to the below t ble for specific tions c tegories nd the content of e ch c tegory.
Speci ication
category
Technic l specific tions Mech nic l specific tions Environment l specific tions
Content • Processor
• Memory
• Intern l drives
• Exp nsion slots
• Gr phics processing units
(GPU)
• Integr ted functions nd I/O
connectors
• Network
• Re r button
• RAID d pter
• Host bus d pter
• System f n
• Electric l input
• Minim l configur tion for
debugging
• Oper ting systems
• Dimension
• Weight
• Acoustic l noise emissions
• Ambient temper ture
m n gement
• Environment l
Ch pter 1.Introduction 3

Technical speci ications
Summ ry of the technic l specific tions of the server. Depending on the model, some fe tures might not be
v il ble, or some specific tions might not pply.
• “Processor” on p ge 4
• “Memory” on p ge 5
• “Intern l drives” on p ge 6
• “Exp nsion slots” on p ge 6
• “Gr phics processing unit (GPU)” on p ge 6
• “Integr ted functions nd I/O connectors” on p ge 7
• “Network” on p ge 7
• “Re r button” on p ge 7
• “RAID d pter” on p ge 8
• “Host bus d pter” on p ge 8
• “System f n” on p ge 9
• “Electric l input” on p ge 9
• “Minim l configur tion for debugging” on p ge 10
• “Oper ting systems” on p ge 10
Processor
Processor
Supports multi-core Intel Xeon processors, with integr ted memory controller nd Intel Mesh UPI (Ultr P th
Interconnect) topology.
• Up to two 4th Gen Intel Xeon sc l ble processors with the new LGA 4677-X socket
• Up to 60 cores per socket
• Up to 4 UPI links t up to 16 GT/s
• Therm l Design Power (TDP): up to 350 w tts
For list of supported processors, see: https://serverproven.lenovo.com.
4ThinkSystem SR630 V3 User Guide

Memory
Memory
See “Memory module inst ll tion rules nd order” on p ge 56 for det iled inform tion bout memory configur tion nd
setup.
• Slots: 32 du l inline memory module (DIMM) connectors th t support up to:
– 32 DDR5 DIMMs
• Memory module type:
– TruDDR5 4800MHz RDIMM: 16 GB (1Rx8), 32 GB (2Rx8)
– TruDDR5 4800MHz 10x4 RDIMM: 32 GB (1Rx4), 64 GB (2Rx4)
– TruDDR5 4800MHz 9x4 RDIMM: 32 GB (1Rx4), 64 GB (2Rx4)
– TruDDR5 4800MHz 3DS RDIMM: 128 GB (4Rx4), 256 GB (8Rx4)
• Speed: Oper ting speed depends on processor model nd UEFI settings.
– 4800 MT/s for 1 DIMM per ch nnel
– 4400 MT/s for 2 DIMMs per ch nnel
• Minimum memory: 16 GB
• M ximum memory: 8 TB: 32 x 256 GB 3DS RDIMMs
For list of supported memory options, see https://serverproven.lenovo.com.
For technic l rules for memory modules, see “Memory module inst ll tion rules nd order” on p ge 56.
Ch pter 1.Introduction 5

Internal drives
Internal drives
Front:
• Up to four 3.5-inch hot-sw p SAS/SATA drives
• Up to four 3.5-inch hot-sw p AnyB y (SAS/SATA/NVMe) drives
• Up to four 2.5-inch hot-sw p SAS/SATA drives
• Up to four 2.5-inch hot-sw p NVMe drives
• Up to eight 2.5-inch hot-sw p SAS/SATA drives
• Up to six 2.5-inch hot-sw p SAS/SATA nd four 2.5-inch hot-sw p AnyB y (SAS/SATA/NVMe) drives
• Up to six 2.5-inch hot-sw p SAS/SATA nd two 2.5-inch hot-sw p AnyB y (SAS/SATA/NVMe) nd two 2.5-inch
hot-sw p NVMe drives
• Up to ten 2.5-inch hot-sw p SAS/SATA drives
• Up to eight 2.5-inch hot-sw p NVMe drives
• Up to ten 2.5-inch hot-sw p NVMe drives
• Up to ten 2.5-inch hot-sw p AnyB y (SAS/SATA/NVMe) drives
• Up to 16 hot-sw p EDSFF drives
Inside:
• Up to two intern l SATA or NVMe M.2 drives
Re r:
• Up to two 2.5-inch hot-sw p SAS/SATA or NVMe drives
• Up to two 7mm hot-sw p SATA or NVMe drives
Notes:
• M.2 nd 7mm drives re not supported t the s me time.
• If 256 GB DIMM is used, re r 2.5-inch drives re not supported.
Expansion slots
Expansion slots
Depending on the model, your server supports up to three PCIe slots in the re r nd up to two PCIe slots in the front.
• PCIe x16, low-profile
• PCIe x16/x16, low-profile + low-profile
• PCIe x16/x16, low profile + full-height
• PCIe x16, full-height
Graphics processing unit (GPU)
Graphics processing unit (GPU)
Your server supports the following GPUs:
• H lf-length, single-wide:
– NVIDIA® A2
– NVIDIA® L4
Note: For GPU supporting rules, see “Therm l rules” on p ge 65.
6ThinkSystem SR630 V3 User Guide

Integrated unctions and I/O connectors
Integrated unctions and I/O connectors
• Lenovo XCl rity Controller (XCC), which provides service processor control nd monitoring functions, video
controller, nd remote keybo rd, video, mouse, nd remote drive c p bilities.
– The server supports Lenovo XCl rity Controller 2 (XCC2). For ddition l inform tion bout Lenovo XCl rity
Controller 2 (XCC2), refer to https://sysmgt.lenovofiles.com/help/topic/lxcc_frontend/lxcc_overview.html.
• One XCC system m n gement port on the re r to connect to systems-m n gement network. This RJ-45
connector is dedic ted to the Lenovo XCl rity Controller functions nd runs t 1 GB speed.
• A group of two or four Ethernet connectors on OCP module
• Up to four USB 3.2 Gen1 (5 Gbps) ports:
– Three on the re r of the server
– (Option l) One on the front of the server1
• One intern l USB 3.2 Gen1 (5 Gbps) port
• (Option l) One USB 2.0 port on the front of the server1
• (Option l) Extern l LCD di gnostics h ndset connector on the front of the server1
• Up to two VGA connectors
– One on the re r of the server
– (Option l) One on the front of the server1
• (Option l) One seri l port connector on the re r of the server2
Notes:
1. Av il ble when the front I/O module is inst lled in the server.
2. Av il ble when the seri l port c ble is inst lled in the server.
Network
Network
• OCP module
Note: The OCP module is n option l p rt. It is def ult to be inst lled in the re r nd option l in the front of the server.
Rear button
Rear button
• NMI button
Ch pter 1.Introduction 7

RAID adapter
RAID adapter
Support the ollowing RAID adapters:
• ThinkSystem RAID 5350-8i PCIe 12Gb Ad pter
• ThinkSystem RAID 540-8i PCIe 12Gb Ad pter
• ThinkSystem RAID 540-16i PCIe 12Gb Ad pter
• ThinkSystem RAID 9350-8i 2GB Fl sh PCIe 12Gb Ad pter
• ThinkSystem RAID 9350-16i 4GB Fl sh PCIe 12Gb Ad pter
• ThinkSystem RAID 940-8i 4GB Fl sh PCIe Gen4 12Gb Ad pter
• ThinkSystem RAID 940-8i 4GB Fl sh PCIe Gen4 12Gb Ad pter (Tri-mode)
• ThinkSystem RAID 940-16i 4GB Fl sh PCIe Gen4 12Gb Ad pter
• ThinkSystem RAID 940-16i 4GB Fl sh PCIe Gen4 12Gb Ad pter (Tri-mode)
• ThinkSystem RAID 940-8e 4GB Fl sh PCIe Gen4 12Gb Ad pter
• ThinkSystem RAID 940-16i 8GB Fl sh PCIe Gen4 12Gb Ad pter
• ThinkSystem RAID 940-16i 8GB Fl sh PCIe Gen4 12Gb Ad pter (Tri-mode)
• ThinkSystem RAID 5350-8i PCIe 12Gb Intern l Ad pter
• ThinkSystem RAID 940-16i 8GB Fl sh PCIe Gen4 12Gb Intern l Ad pter
• ThinkSystem RAID 9350-8i 2GB Fl sh PCIe Gen 4 12Gb Intern l Ad pter
• ThinkSystem RAID 9350-16i 4GB Fl sh PCIe Gen 4 12Gb Intern l Ad pter
Host bus adapter
Host bus adapter
Support the ollowing HBAs:
• ThinkSystem 4350-8i SAS/SATA 12Gb HBA
• ThinkSystem 4350-16i SAS/SATA 12Gb HBA
• ThinkSystem 440-8i SAS/SATA 12Gb HBA
• ThinkSystem 440-8e SAS/SATA 12Gb HBA
• ThinkSystem 440-16i SAS/SATA 12Gb HBA
• ThinkSystem 440-16e SAS/SATA 12Gb HBA
• ThinkSystem 440-16i SAS/SATA PCIe Gen4 12Gb Intern l HBA
• ThinkSystem QLogic 16Gb Enh nced Gen5 FC Single-port HBA
• ThinkSystem QLogic 16Gb Enh nced Gen5 FC Du l-port HBA
• ThinkSystem Emulex 16Gb Gen6 FC Single-port HBA
• ThinkSystem Emulex 16Gb Gen6 FC Du l-port HBA
8ThinkSystem SR630 V3 User Guide

System an
System an
• Supported f n types:
– St nd rd f n 4056 (21000 RPM)
– Perform nce f n 4056 (28000 RPM)
• F n redund ncy: N+1 redund ncy, one redund nt f n rotor
– One processor: six hot-sw p du l-rotor system f ns (one redund nt f n rotor)
– Two processors: eight hot-sw p du l-rotor system f ns (one redund nt f n rotor)
Note:
The redund nt cooling by the f ns in the server en bles continued oper tion if one rotor of f n f ils.
If there is n OCP module inst lled, when the system is powered off but still plugged in to AC power, system f n 1 nd
f n 2 will continue to spin t much lower speed. This is the system design to provide proper cooling for the OCP
module.
Electrical input
Electrical input
One or two hot-sw p power supply units for redund ncy support:
Table 1. Electrical input for po er supply units
Power supply 100–127 V ac 200–240 V ac 240 V dc -48 V dc
750-w tt 80 PLUS Pl tinum √ √ √
1100-w tt 80 PLUS
Pl tinum
√ √ √
1800-w tt 80 PLUS
Pl tinum
√ √
750-w tt 80 PLUS Tit nium √ √
1100-w tt 80 PLUS
Tit nium
√ √
1800-w tt 80 PLUS
Tit nium
√ √
1100-w tt -48 V DC √
CAUTION:
• 240 V dc input is supported in Chinese Mainland ONLY.
• Power supply with 240 V dc input cannot support hot plugging power cord unction. Be ore removing the
power supply with dc input, please turn o server or disconnect dc power sources at the breaker panel or by
turning o the power source. Then, remove the power cord.
Ch pter 1.Introduction 9

Minimal con iguration or debugging
Minimal con iguration or debugging
• One processor in processor socket 1
• One memory module in slot 7
• One power supply unit
• One HDD/SSD drive, one M.2 drive, or one 7mm drive (if OS is needed for debugging)
• Six system f ns (with one processor)
Operating systems
Operating systems
Supported nd certified oper ting systems:
• Microsoft Windows Server
• VMw re ESXi
• Red H t Enterprise Linux
• SUSE Linux Enterprise Server
• C nonic l Ubuntu
References:
• Complete list of v il ble oper ting systems: https://lenovopress.lenovo.com/osig.
• OS deployment instructions: Follow the dopted combin tion to inst ll DDR5 DIMMs (see “Deploy the oper ting
system” on p ge 438).
Mechanical speci ications
Summ ry of the mech nic l specific tions of the server. Depending on the model, some fe tures might not
be v il ble, or some specific tions might not pply.
Dimension
1U server
• Height: 43.0 mm (1.69 inches)
• Width:
– With r ck l tches: 482 mm (18.98 inches)
– Without r ck l tches: 434.4 mm (17.10 inches)
• Depth: 787.6 mm (31.01 inches)
Note: The depth is me sured with r ck l tches nd the h ndle of the power supply unit included.
Weight
• With p ck ge: up to 26.3 kg (57.98 lb)
• Without p ck ge: up to 20 kg (44.09 lb)
Environmental speci ications
Summ ry of the environment l specific tions of the server. Depending on the model, some fe tures might
not be v il ble, or some specific tions might not pply.
10 ThinkSystem SR630 V3 User Guide