LG LG-A155 User manual

Service Manual Model : LG-A155
Internal Use Only
Service Manual
LG-A155
Date: October, 2010 / Issue 1.0

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION..................................................................5
1.1 Purpose............................................................................................... 5
1.2 Regulatory Information ............................................................... 5
1.3 Abbreviations................................................................................... 7
2. PERFORMANCE...................................................................9
2.1 H/W Features.................................................................................... 9
2.2 Technical Specification...............................................................11
3. TECHNICAL BRIEF.............................................................16
3.1 Digital Main Processor................................................................16
3.2 Power Management....................................................................21
3.3 FEM with integrated Power Amplifier Module
(SKY77547, U303) .........................................................................26
3.4 Clocks ................................................................................................28
3.5 RFSYS of MT6253 (U102) ...........................................................30
3.6 MEMORY(PF38F4050M0Y3DE, U101)..................................32
3.7 BT Module .......................................................................................35
3.8 SIM Card Interface........................................................................39
3.9 Micro-SD Card Interface.............................................................41
3.10 LCD Interface ...............................................................................44
3.11 Battery Charger Interface .......................................................46
3.12 Keypad Interface........................................................................47
3.13 Audio Front-End.........................................................................50
3.15 KEY BACLKLIGHT LED Interface............................................53
3.16 Vibrator Interface .......................................................................54
4. TROUBLE SHOOTING .......................................................55
4.1 RF Component...............................................................................55
4.2 RX Trouble .......................................................................................56
4.3 TX Trouble........................................................................................60
4.4 Power On Trouble.........................................................................64
4.5 Charging Trouble..........................................................................67
4.6 Vibrator Trouble.............................................................................69
4.7 LCD Trouble.....................................................................................71
4.9 Speaker Trouble ............................................................................75
4.10 Earphone Trouble ......................................................................77
4.11 Receiver Trouble.........................................................................79
4.12 Microphone Trouble.................................................................81
4.13 SIM Card Interface Trouble.....................................................83
4.14 SIM2 Card Interface Trouble..................................................85
4.15 KEY backlight Trouble ..............................................................87
4.16 Micro SD (uSD) Trouble............................................................89
4.17 Bluetooth Trouble......................................................................91
4.18 FM Radio Trouble .......................................................................93
5. DOWNLOAD......................................................................95
6. BLOCK DIAGRAM........................................................... 108
7. CIRCUIT DIAGRAM ........................................................ 109
8. BGA PIN MAP ................................................................. 115
9. PCB LAYOUT................................................................... 117
10. ENGINEERING MODE .................................................. 123
11. RF CALIBRATION ......................................................... 125
11.1 Configuration of Tachyon.................................................... 125
11.2 How to use Tachyon............................................................... 127
12 EXPLODED VIEW & REPLACEMENT PART LIST .......... 129
12.1 EXPLODED VIEW...................................................................... 129
12.2 Replacement Parts.................................................................. 131
12.3 Accessory ................................................................................... 142

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LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 5 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ \VX[W
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone service
until repair can be done. A telephone company may temporarily disconnect service as long as repair is
not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION

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LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ ]VX[W
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
1. INTRODUCTION

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ ^VX[W
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC
1. INTRODUCTION

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LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ _VX[W
Wireless Application Protocol
WAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM
1. INTRODUCTION

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2. PERFORMANCE
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ `VX[W
2.1 H/W Features
2. SYSTEM SPECIFICATION
Item Feature Comment
Standard Battery Li-ion Polymer, 3.7V 950mAh
Stand by TIME Up to 200 hrs : Paging Period 5, RSSI 85dBm
Talk time Up to 200min : GSM Tx Level 7
Stand by time Up to 200 hours (Paging Period: 5, RSSI: -85 dBm)
Charging time Approx. 3 hours
RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm
TX output power GSM, EGSM: 32.3dBm(Level 5),
DCS , PCS: 29.5dBm(Level 0)
SIM card type 3V Small
Display MAIN : TFT 176 Ý220 pixel 262K Color
Status Indicator
Hard icons. Key Pad
0 ~ 9, #, *, Up/Down Navigation Key
Menu Key, Clear Key, Back Key, Confirm Key
Send Key, Soft Key(Left/Right)
Volume Key(Up/Down), PWR Key, Camera Key
ANT Internal
EAR Phone Jack Yes
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
GPRS compatibility Class 10
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
Microphone Yes
2. SYSTEM SPECIFICATION

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LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ XWVX[W
Travel Adapter Yes
Speaker/Receiver 18x12ȰSpeaker/ Receiver
MIDI SW MIDI (Mono SPK)
Item Feature Comment
Camera 0.3M
Bluetooth / FM Radio Bluetooth version 2.1 / 76~108MHz supported
16ȰSpeaker/ 12 x 7 Receiver
2. SYSTEM SPECIFICATION
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ XWVX[W
Travel Adapter Yes
Speaker/Receiver 18x12ȰSpeaker/ Receiver
MIDI SW MIDI (Mono SPK)
Item Feature Comment
Camera 0.3M
Bluetooth / FM Radio Bluetooth version 2.1 / 76~108MHz supported
16ȰSpeaker/ 12 x 7 Receiver
2. SYSTEM SPECIFICATION

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ XXVX[W
2.2 Technical Specification
Item Description Specification
1 Frequency Band
GSM850 EGSM
TX: 824 ~ 849 MHz TX: 880 ~ 915MHz
RX: 869 ~ 894 MHz RX: 925 ~ 960 MHz
DCS
TX: 1710 ~ 1785 MHz
RX: 1805 ~ 1880 MHz
PCS
TX: 1850 ~ 1910 MHz
RX: 1930 ~ 1990 MHz
2 Phase Error RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
4 Power Level
Level Power Toler. Level Power Toler.
6 31dBm ·3dB 14 15dBm ·3dB
7 29dBm ·3dB 15 13dBm ·3dB
8 27dBm ·3dB 16 11dBm ·5dB
9 25dBm ·3dB 17 9dBm ·5dB
10 23dBm ·3dB 18 7dBm ·5dB
11 21dBm ·3dB 19 5dBm ·5dB
12 19dBm ·3dB
GSM850/EGSM
5 33dBm ·2dB 13 17dBm ·3dB
Level Power Toler. Level Power Toler.
1 28dBm ·3dB 9 12dBm ·4dB
2 26dBm ·3dB 10 10dBm ·4dB
3 24dBm ·3dB 11 8dBm ·4dB
4 22dBm ·3dB 12 6dBm ·4dB
5 20dBm ·3dB 13 4dBm ·4dB
6 18dBm ·3dB 14 2dBm ·5dB
7 16dBm ·3dB 15 0dBm ·5dB
DCS/PCS
0 30dBm ·2dB 8 14dBm ·3dB
2. SYSTEM SPECIFICATION

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LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ XYVX[W
6
Output RF Spectrum
(due to switching
transient)
1,800 -24
5Output RF Spectrum
(due to modulation)
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
6,000 -71
GSM850/ EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
DCS/PCS
GSM850/ EGSM
Offset from Carrier (kHz). Max. dBm
400 -19
600 -21
1,200 -21
Item Description Specification
2. SYSTEM SPECIFICATION

- 13 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ XZVX[W
Item Description Specification
6
Output RF Spectrum
(due to switching
transient)
Offset from Carrier (kHz). Max. dBm
400 -22
600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
8 Bit Error Ratio
GSM850, EGSM
BER (Class II) < 2.439% @-102 dBm
DCS,PCS
BER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy ·3 dB
10 SLR 8·3 dB
11 Sending Response
300 -12
1,000 -6
2,000 -6
3,000 -6
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000 -
3,400 -9
0
0
4
4
-12
0
0
4
12 RLR 2·3 dB
DCS/PCS
2. SYSTEM SPECIFICATION

- 14 -
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ X[VX[W
Item Description Specification
13 Receiving Response
300 -7
500 -5
1,000 -5
3,000 -5
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000
3,400 -10
2
*
0
2
-12
0
2
2
14 STMR 13·5 dB
* Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
15 Stability Margin > 6 dB
-20
-10
0
7
dB to ARL (dB) Level Ratio (dB)
-35
-30
10
30.7
33.3
33.7
31.7
17.5
22.5
25.5
16 Distortion
17 Side Tone Distortion Three stage distortion < 10%
18 System frequency
(13 MHz) tolerance ˺2.5 ppm
19 32.768KHz tolerance ˺30 ppm
20 Ringer Volume
At least 65 dBspl under below conditions:
1. Ringer set as ringer.
2. Test distance set as 50 cm
2. SYSTEM SPECIFICATION

- 15 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ X\VX[W
2. SYSTEM SPECIFICATION
Item Description Specification
21 Charge Current
Fast Charge : Typ. 430 mA
Slow Charge : Typ. 80mA
Total Charging Time : < 3 hours
2 -> 1
0 -> OFF
Bar Number Power
4 -> 2
-104 ·2
Under -106
-98 ·2
-101 ·2
22 Antenna Display
2 -> 1
1 -> 0
Battery Bar Number Voltage
3
3 -> 2 3.72 ·0.05 V
23 Battery Indicator
24 Low Voltage Warning
( Blinking Bar)
˺3.45 ·0.05V (Call), Once per 1 minute.(Receiver)
˺3.4 ·0.05V (Standby), Once per 3 minute.(Speaker)
25 Forced shut down
Voltage 3.35 ·0.05V
27 Battery Type
Li-Ion Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 800mAh
28 Travel Charger
Switching-mode charger
Input: 100 ~ 350V, 50/60 Hz
Output: 5.1 V, 400 mA
˻3.73·0.05 V
26 Sustain RTC
without battery Over 50 hours
3.62 ·0.05 V
3.45 ·0.05 V
7
7 -> 5
5 -> 4
Over -93
-93 ·2
1 -> 0 -106 ·2

- 16 -
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 Digital Main Processor
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ X]VX[W
3. TECHNICAL BRIEF
3.1 Digital Main Processor
Figure. 3.1.1 MT6253 Hardware Block Diagram
3. TECHNICAL BRIEF
Figure. 3.1.1 MT6253 Hardware Block Diagram

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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ X^VX[W
3. TECHNICAL BRIEF
3.1.1 General
• Integrated voice-band, audio-band and base-band analog front ends.
• Package:
– aQFN, 11.5x11.5x0.85 mm
– 0.47 mm pitch
– 260balls, 0.47mm pitch package
3.1.2 MCU Subsystem
• ARM7EJ-S 32-bit RISC processor
• High performance multi-layer AMBA bus
• Operating frequency 52/104MHz
• Dedicated DMA bus, 7DMA channels
• 144KB 0n-chip SRAM
• On-chip boot ROM for Factory Flash Programming
• Watchdog timer for system crash recovery
• 3 sets of General Purpose Timer
• Circuit Switch Data coprocessor
• Division coprocessor
3.1.3 External Memory Interface
• Supports up to 3 external devices
• Supports 16-bit memory components with maximum size of up to 64M Bytes for each bank
• Supports Flash and SRAM/PSRAM with Burst Mode
• Support legacy industry standard parallel LCD Interface
• Suppport multi-media companion chips with 8/16 bits data width
• Configurable driving strength for memory interface
3.1.4 User Interface
• 6-row x 7-column keypad control with hardware scanner
• Support multi key press for gaming
• SIM/USIM Controller with hardware T=0/T=1 protocol control
• Real Time Clock(RTC) operating with a separate power supply
• General Purpose I/Os (GPIOs)
• 1 set of Pulse Width Modulation(PWM) Output
• Alerter Output with Enhanced PWM or PDM
• Maximum 7 external interrupt lines
3.1.5 Security
• Support security key and 128bit chip unique ID

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LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ X_VX[W
3. TECHNICAL BRIEF
3.1.6 Connectivity
• 3 sets of UART with hardware flow control and speed up to 921600 bps
• IrDA modulator/demodulator with hardware framer supports SIR mode of operation
• HS/FS/LS USB 2.0 Device controller
• Multi Media Card/Secure Digital Memory Card/Memory Stick/Memory Stick Prto/SDIO host controller
• Supports SDIO interface for SDIO peripherals as well as WIFI connectivity
• DAI/PCM and !2S interface for Audio application
3.1.7 Low Power Schemes
• Power Down Mode for analog and digital circuits
• Processor Sleep Mode
• Pause Mode of 32KHs clocking at Standby State
• 3-channel Auxiliary 10-bit A/D Converter for application usage other than battery monitoring
3.1.8 Power and Supply Management
• 2.8V to 4.7V Input Range
• Charger Input up to 8V
• 11 sets of LDO Optimized Specific GSM Sub-systems
• One LDO for RF transceiver
• High Operation Efficiency and Low Stand-by Current
• Dual SIM Card Interface
• One boost regulator and Four Open-Drain Output Current Regulators to Supply/Control the LED
• LDO type Vibrator
• One NMOS switch to control R(GB) LED
• Thermal Overload Protection
• Under Voltage Lock-out Protection
• Over Voltage Protection
3.1.9 Integrated RF Receiver
• Direct conversion architecture
• Quad band differential input LNAs
• Quadrature RF mixers
• Fully integrated channel filter with f3dB=150kHs
• 95dB gain with 60dB gain control range
• No IIP2 calibration

- 19 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ X`VX[W
3. TECHNICAL BRIEF
3.1.10 Integrated RF Transmitter
• Offset phase lock loop
• IQ modulator DC offset calibration by BB ADC/DAC
• Precise quadrature by IF divide-by-4
• Integrated loop filter
3.1.11 Integrated RF Frequency Synthesizer
• Programmable fractional-N synthesizer
• Integrated wide range RFVCO
• Integrated loop filter
• Fast setting time suitable for multi-slot SPRS applications
3.1.12 Integrated RF Digitally-Controlled Crystal Oscillator(DCXO)
• One-pin 26MHz crystal oscillator
• On-chip programmable capacitor array for cross tune
3.1.13 Radio Interface and Baseband Front End
• GMSK modulator with analog I and Q channel outputs
• 10-bit D/A Converter for uplink baseband I and Q signals
• 14-bit high resolution A/D Converter for downlink baseband I and Q signals
• Calibration mechanism of offset and gain mismatch for baseband A/D Converter and D/A
Converter
• 10-bit D/A Converter for Automatic Power Control
• Programmable Radio RX filter with adaptive bandwidth control
• Dedicated Rx filter for FB acquisition
• 6-Pin Baseband Parallel Interface(BRI) with programmable driving strength
• Multi-band support
3.1.14 Voice and Modem CODEC
• Digital tone generation
• Voice Memo
• Noise Reduction
• Echo Suppression
• Advanced Sidetone Oscillation Reduction
• Digital sidetone generator with programmable gain
• Two programmable acoustic compensation filters
• GSM/GPRS quad vocoders for adaptive multirate(AMR), enhanced full rate(EFR), full
rate(FR), and half rate(HR)
• GSM channel coding, equalization and A5/1, A5/2 and A5/3 ciphering
• GPRS GEA1, GEA2 and GEA3 ciphering

- 20 -
LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ YWVX[W
3. TECHNICAL BRIEF
3.1.15 Voice Interface and Voice Front End
• Two microphone inputs sharing one low noise amplifier with programmable gain and automatic
gain control(AGC) mechanism
• Voice power amplifier with programmable gain
• 2nd order Sigma-delta A/D Converter for voice uplink path
• D/A Converter for voice downlink path
• Supporter for voice downlink path
• Supports half-duplex hands-free operation
• Compliant with GSM 03.05
3.1.16 LCD Interface
• Dedicated Parallel Interface supports 2 external 8/9 bit Parallel Interface, and Serial interface for LCM
3.1.17 LCD Controller
• Supports LCM format: RGB332, RGB444, RGB565, RGB666, RGB888
• Supports LCD module with maximum resolution up to 240x320 at 16bpp
• Capable of combining display memories with up to 4 blending layers
• Accelerated Gamma correction with programmable gamma table.
• Supports hardware display rotation for each layer
3.1.18 Audio CODEC
• Wavetable synthesis with up to 64 tones
• Advanced wavetable synthesizer capable of generating and 47 sets of percussions
• PCM Playback and Record
• Digital Audio Playback
3.1.19 Audio Interface and Audio Front End
• Supports I2S interface
• High resolution D/A Converters for Stereo Audio playback
• Stereo analog input for stereo audio source
• Analog multiplexer for Stereo Audio
• FM Radio Recording
• Stereo to Mono Conversion
• HE-AAC decode support

- 21 -
Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
ʹΠΡΪΣΚΘΙΥι ͽ͸ͶΝΖΔΥΣΠΟΚΔΤͺΟΔͲΝΝΣΚΘΙΥΣΖΤΖΣΧΖΕ
΀ΟΝΪΗΠΣΥΣΒΚΟΚΟΘΒΟΕΤΖΣΧΚΔΖΡΦΣΡΠΤΖΤ
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ YXVX[W
3.2 Power Management
Power management unit, so called PMU, is integrated into analog part. To facilitate software control and
interface design, PMU control share the CCI interface along with other analog parts, such as BBTX, BBRX,
VBI and ABI during FT.
Figure. 3.2.1 PMU system block diagram
3. TECHNICAL BRIEF
3.2.1 Low Dropout Regulators(LDOs), Buck converterand Reference
The PMU Integrates 12 LDOs that are optimized for their given functions by balancing quiescent current,
dropout voltage, line/load regulation, and output noise.
RF LDO (Vrf)
The RF LDO is a linear regulator that could source 180mA (max) with 2.8V output voltage. It
supplies the RF circuitry of the handset. The LDO is optimized for high performance and adequate
quiescent current.