LG LG-T370 User manual
Internal Use Only
Service Manual
LG-T370
Date: April, 2012 / Issue 1.0
- 2 -
LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Table Of Contents
1. INTRODUCTION...................................................................3
1.1 Purpose .....................................................................................................3
1.2 Regulatory Information......................................................................3
1.3 Abbreviations..........................................................................................5
2. PERFORMANCE....................................................................7
2.1 H/W Features...........................................................................................7
2.2 Technical Specication........................................................................9
3. TECHNICAL BRIEF..............................................................14
3.1 Digital Main Processor...................................................................... 14
3.2 Power Management ......................................................................... 19
3.3 FEM with integrated Power Amplier Module (SKY77550-
21, U101)....................................................................................................... 33
3.4 Crystal(26 MHz, X201) ...................................................................... 35
3.5 RF Subsystem of PMB8815 (U201) .............................................. 36
3.6 MEMORY(H9DA2GH1GHMMMR, U301 ) .................................. 41
3.7 BT module ............................................................................................. 44
3.8 SIM Card Interface.............................................................................. 45
3.9 LCD Interface........................................................................................ 47
3.10 MiniABB (Battery Charger & MUIC) Interface....................... 50
3.11 Audio Interface................................................................................ 51
3.12 Camera Interface(2M Fixed Focus Camera) .......................... 57
3.13 Touch Interface................................................................................. 60
4. TROUBLE SHOOTING ........................................................62
4.1 RF Component .................................................................................... 62
4.2 RX Trouble ............................................................................................. 63
4.3 Power On Trouble............................................................................... 68
4.4 Charging Trouble................................................................................ 70
4.5 Vibrator Trouble .................................................................................. 72
4.6 LCD Trouble .......................................................................................... 75
4.7 Camera Trouble................................................................................... 79
4.8 Speaker / Receiver Trouble............................................................. 83
4.9 Earphone Trouble............................................................................... 85
4.10 Microphone Trouble....................................................................... 88
4.11 SIM Card Interface Trouble........................................................... 90
4.12 Micro SD (uSD) Trouble ................................................................. 92
4.13 Bluetooth Trouble............................................................................ 94
4.14 FM Radio Trouble............................................................................. 96
4.15 Touch trouble .................................................................................... 98
4.16 Memory trouble.............................................................................100
4.17 Proximity Sensor on/o Trouble Shooting..........................104
5. DOWNLOAD.....................................................................106
6. BLOCK DIAGRAM.............................................................119
7. CIRCUIT DIAGRAM ..........................................................120
8. BGA PIN MAP ..................................................................127
9. PCB LAYOUT.....................................................................129
10. ENGINEERING MODE ....................................................131
11. STAND ALONE TEST ......................................................132
11.1 Introduction.....................................................................................132
11.2 Setting Method ..............................................................................132
11.3 Tx Test .................................................................................................134
11.4 Rx Test.................................................................................................134
12.AUTO CALIBRATION.......................................................137
12.1 Overview...........................................................................................137
12.2 Tachyon Directory..........................................................................137
12.3 Test Equipment Setup..................................................................138
12.4 Procedure..........................................................................................138
12.5 AGC......................................................................................................145
12.6 APC ......................................................................................................145
12.7 ADC......................................................................................................145
12.8 Target Power....................................................................................145
13. EXPLODED VIEW & REPLACEMENT PART LIST ..........146
13.1 EXPLODED VIEW.............................................................................146
13.2 Replacement Parts ........................................................................147
13.3 Accessory ..........................................................................................166
1. INTRODUCTION
- 3 -
LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of
1. INTRODUCTION
This
manual
provides
the
information
necessary
to
repair,
calibration,
description
and
download
the
features
of
this model.
1.2 Regulatory Information
A. Security
Toll fraud the unauthorized use of telecommunications system by an unauthorized part (for example persons
Toll
fraud
,
the
unauthorized
use
of
telecommunications
system
by
an
unauthorized
part
(for
example
,
persons
other than your company’s employees, agents, subcontractors, or person working on your company’s behalf)
can result in substantial additional charges for your telecommunications services. System users are responsible
for the security of own system. There are may be risks of toll fraud associated with your telecommunications
system. System users are responsible for programming and configuring the equipment to prevent unauthorized
use. The manufacturer does not warrant that this product is immune from the above case but will prevent
unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to
it
it
.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair can
harm
or
interruption
in
service
to
the
telephone
network,
it
should
disconnect
telephone
service
until
repair
can
be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes
could reasonably be expected to affect the use of the this phone or compatibility with the network, the
telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent.
T
h
e
use
r m
ay
n
ot
m
a
k
e
a
n
y
c
h
a
n
ges
a
n
d/o
r r
epa
ir
s
e
x
pect
as
spec
ifi
ca
ll
y
n
oted
in
t
hi
s
m
a
n
ua
l
.
Th
e
r
e
f
o
r
e,
n
ote
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ
e use ay ot a e a y c a ges a d/o epa s e pect as spec ca y oted t s a ua . e e o e, ote
that unauthorized alternations or repair may affect the regulatory status of the system and may void any
remaining warranty.
- 4 -
LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
E. Notice of Radiated Emissions
T
his model com
p
lies with rules re
g
ardin
g
radiation and radio fre
q
uenc
y
emission as defined b
y
local re
g
ulator
y
2. INTRODUCTION
p g g q y y g y
agencies. In accordance with these agencies, you may be required to provide information such as the following to
the end user.
F. Pictures
T
he pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems
unsuppressed
engines
or
electric
motors
may
cause
problems
.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system
boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ \VX[^
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
1. INTRODUCTION
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LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1.3 Abbreviations
F th f thi l f ll i bb i ti l
1. INTRODUCTION
F
or
th
e purposes o
f
thi
s manua
l
,
f
o
ll
ow
i
ng a
bb
rev
i
a
ti
ons app
l
y:
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC
Digital Signal Processing
DSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Gaussian Minimum Shift Ke
y
in
g
GMS
K
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital
Signal
Processing
DSP
Intermediate Fre
q
uenc
y
IF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
y g
Off t Ph L k d L
OPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
q y
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ ]VX[^
Off
se
t
Ph
ase
L
oc
k
e
d
L
oop
OPLL
- 6 -
LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
Power Amplifier ModulePAM
1. INTRODUCTION
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Real Time Clock
RTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real
Time
Clock
RTC
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
T
ime Division Duplex
T
DD
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ ^VX[^
Wireless Application Protocol
WAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
2. PERFORMANCE
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LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2.1 H/W Features
2. SYSTEM SPECIFICATION
Item Feature Comment
Standard Battery Lithium-Ion, 3.7V 950mAh
Stand by TIME Up to 500 hrs : Paging Period 5, RSSI 85dBm
Talk time
Up to 5hrs : GSM Tx Level 7
Talk
time
Up
to
5hrs
:
GSM
Tx
Level
7
Stand by time Up to 500 hours (Paging Period: 5, RSSI: -85 dBm)
Charging time Approx 3hours
RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm
GSM EGSM: 32 5dBm(Level 5)
TX output power
GSM
,
EGSM:
32
.
5dBm(Level
5)
,
DCS , PCS: 29.5dBm(Level 0)
SIM card type 3V / 1.8V
Display MAIN : 2.8” TFT 240 Ý320 pixel 262K Color
GPRS compatibility Class 12
Status Indicator Send Key, End Key, Cancel Key,
Volume Up/Down Key, PWR(Lock) Key,
ANT Internal
EAR Phone Jack Yes (3.5Φ)
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
Vibrator Yes
Loud Speaker Yes
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ _VX[^
Voice Recoding Yes
Microphone Yes
- 8 -
LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2. SYSTEM SPECIFICATION
S k /R i
18 12Φ S k /
R i
Item Feature Comment
Travel Adapter Yes
S
pea
k
er
/R
ece
i
ver
18
x
12Φ
S
pea
k
er
/
R
ece
i
ver
MIDI SW MIDI (Mono SPK)
Camera 2.0M FF
Bluetooth / FM Radio Bluetooth version 2.1 / Wired FM radio (Earphone needed)
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ `VX[^
2. PERFORMANCE
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LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2.2 Technical Specification
Item Description Specification
2. SYSTEM SPECIFICATION
1 Frequency Band
GSM850 EGSM
TX: 824 ~ 849 MHz TX: 880 ~ 915MHz
RX: 869 ~ 894 MHz RX: 925 ~ 960 MHz
DCS
TX: 1710 ~ 1785 MHz
RX: 1805 ~ 1880 MHz
PCS
T
X: 1850 ~ 1910 MHz
RX: 1930 ~ 1990 MHz
2 Phase Error RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
Level Power Toler. Level Power Toler.
GSM850/EGSM
Level
Power
Toler.
Level
Power
Toler.
6 31dBm ·3dB 14 15dBm ·3dB
7 29dBm ·3dB 15 13dBm ·3dB
8 27dBm ·3dB 16 11dBm ·5dB
9 25dBm ·3dB 17 9dBm ·5dB
5 33dBm ·2dB 13 17dBm ·3dB
4 Power Level
10 23dBm ·3dB 18 7dBm ·5dB
11 21dBm ·3dB 19 5dBm ·5dB
12 19dBm ·3dB
Level Power Toler. Level Power Toler.
DCS/PCS
1 28dBm ·3dB 9 12dBm ·4dB
2 26dBm ·3dB 10 10dBm ·4dB
3 24dBm ·3dB 11 8dBm ·4dB
4 22dBm ·3dB 12 6dBm ·4dB
0 30dBm ·2dB 8 14dBm ·3dB
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ XWVX[^
5 20dBm ·3dB 13 4dBm ·4dB
6 18dBm ·3dB 14 2dBm ·5dB
7 16dBm ·3dB 15 0dBm ·5dB
- 10 -
LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
Item Description Specification
2. SYSTEM SPECIFICATION
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
GSM850/ EGSM
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
6 000
71
5Output RF Spectrum
(due to modulation)
6
,
000
-
71
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
DCS/PCS
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000
~
<6,000
-
65
3,000
<6,000
65
6,000 -73
6
Output RF Spectrum
(due to switching
transient)
GSM850/ EGSM
Offset from Carrier (kHz). Max. dBm
400 -19
600
21
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ XXVX[^
transient)
600
-
21
1,200 -21
1,800 -24
2. PERFORMANCE
- 11 -
LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Item Description Specification
2. SYSTEM SPECIFICATION
6
Output RF Spectrum
(due to switching
transient)
Offset from Carrier (kHz). Max. dBm
400 -22
600 -24
1
,
200 -24
DCS/PCS
,
1,800 -27
7 Spurious Emissions Conduction, Emission Status
8 Bit Error Ratio
GSM850, EGSM
BER (Class II) < 2.439% @-102 dBm
DCS,PCS
BER (Cl II) 2 439%
100 dB
BER
(Cl
ass
II)
<
2
.
439%
@-
100
dB
m
9 RX Level Report Accuracy ·3 dB
10 SLR 12·3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -
-12
11 Sending Response
300 -12
1,000 -6
2,000 -6
3,000 -6
200 -
0
0
4
4
0
4,000 -
3,400 -9
0
4
12 RLR 4·3 dB
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ XYVX[^
- 12 -
LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
Item Description Specification
Frequency (Hz) Max (dB) Min (dB)
2. SYSTEM SPECIFICATION
13 Receivin
g
Res
p
onse
300 -7
500 -5
1
,
000 -5
Frequency
(Hz)
Max
.
(dB)
Min
.
(dB)
100 -
200 -
2
*
0
-12
0
g p
,
3,000 -5
4,000
3,400 -10
2
2
2
* Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
14 STMR > 17 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35
-30
17.5
22.5
-20
-10
0
7
10
30.7
33.3
33.7
31.7
25.5
16 Distortion
17 Side Tone Distortion Three stage distortion < 10%
18 System frequency
(13 MHz) tolerance ≤ 2.5 ppm
19 32.768KHz tolerance ≤ 30 ppm
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ XZVX[^
20 Ringer Volume
At least 55 dBspl under below conditions:
1. Ringer set as ringer.
2. Test distance set as 1 m
dB to ARL (dB) Level Ratio (dB)
Frequency (Hz) Max.(dB) Min.(dB)
2. PERFORMANCE
- 13 -
LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. SYSTEM SPECIFICATION
Item Description Specification
Fast Charge : Typ 400 mA
21 Charge Current
Fast
Charge
:
Typ
.
400
mA
Slow Charge : Typ. 95mA
Total Charging Time : < 3.5 hours
Bar Number Power
7
7
> 5
Over -92
93
·
2
2 -> 1
4 -> 2
-104 ·2
-98 ·2
-101 ·2
22 Antenna Display
7
-
>
5
5 -> 4
-
93
·
2
1 -> 0 -106 ·2
0 -> OFF Under -106
Battery icon color : Green
Æ
Red
Battery Bar Status Percent (%)
Full (16 level)
Decrease gradually 94~10%
23 Battery Indicator
≥ 94%
≤
10%
Battery
icon
color
:
Green
Æ
Red
Empty( 0 level )
24 Low Voltage Warning
( Blinking Bar)
10%, 5% 2times (standby) – Speaker
≤ 10% at every 1min. (call) - Receiver
25
Forced shut down
0
%
(
about
3
35
V)
≤
10%
≤ 2%
25
Voltage
0
%
(
about
3
.
35
V)
27 Battery Type
Lithium-Ion Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 950mAh
Switching
mode charger
26 Sustain RTC
without battery Over 2 hours
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ X[VX[^
28 Travel Charger
Switching
-
mode
charger
Input: 100 ~ 240V, 50/60 Hz
Output: 4.8V, 400mA
80mA
93~10%
Battery Bar Status Percent (%)
- 14 -
LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
FM- radio
Digital -
Mic rophone
ARM1176
RAM ROMcache
Ex ternal
Mem ory-IF
USI F
Measurem ent
I F( A/D)
SD/ M MC SI M
GSM
TEAKLite
RF
Control
GSM
Cipher GPTU
I² S / DAI
IR - Memory
Loud -
speaker
Mic Supply
generation
HSR
HSL
EPP
EPN
LSP
LSN
MICP1
MICN1
MICP2
MICN2
Mic
MUX
VM I C
VU M IC
16 Ohm
100 mW
8 Ohm
700 mW
2x 16 Ohm
2x 30 m W
Stereo
Headset
Earpiece
Charge Pump
( negative voltage for
bipolar audio out )
VM M C
VA N ALPM U
VU SB
LAUX
Char g e
DC/ DC
Buck
Vi b rato r
64 - bit bus 32 - bit bus
IF
GM SK
DAC
SD
PL L
FEM
32 kH z
XO
DSPADC
PA
c
s
iM
Low -
Po wer
DCXO
R F PM U
USB 2.0
FS
CIF
DCC
Keypad
4k 7
0 . 15 5 %
1. 8V ~2 .5V
VCHARG E 4. 5 V … 20V
2
T
AB
V
N
ESNE
S
PES
N
ES
S
C
CSB
GHC
D
D
V
TN
H
SV
BC 847 S
1 2
6
4
5
3
for example
ZXTP 25020
min.
10 µF
( 0 V )3 . 05 V … 5 . 1 V (6 V)
002
>ef
h
T 1
A
m5
.1
.x
a
m
7. 5 µA
135 mV …600mV
GH
C
V
4 k3
127 k
470
1.0V…
1,8V
Vcore
LRTC
LSI M
Back -
lig h t
LD O blocking c aps, 100nF
DC/ DC
Batt ery Charger
3.1 Digital Main Processor
Figure. 3.1.1 X-Gold tm 215 Hardware Block Diagram
3. TECHNICAL BRIEF
- 15 -
LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.1.1 General
•
Technology:
•
Technology:
– SoC, Monolithic, 65 nm CMOS
• Package:
– eWLB, 8x9 x0.8 mm
– 0.5 mm pitch
– 240 balls / 6-layer PCB
3 1 2 RF Transceiver
3
.
1
.
2
RF
Transceiver
• Dual-band direct conversion receiver
• Tri/Quad-band possible with external circuitry
• Fully integrated digital controlled X0
• Additional buffer for 2 external system clocks
• Fully digital RF-Synthesizer incl. ΣΔ-Transmitter
3.1.3 Baseband
• DSP:
– 156 MHz TeakLite™
• MCU:
ARM1176
®
@ 208 MHz
–
ARM1176
@
208
MHz
• MCU RAM:
– 3.00Mbit
• Memory I/F:
– 1 Gbit NOR flash/OneNAND flash/SDR SDRAM
– 4 Gbit NAND flash/DDR SDRAM
• Modem:
GPRS l 12 (RX/TX CS1
CS4)
–
GPRS
c
l
ass
12
,
(RX/TX
CS1
-
CS4)
– EGPRS class 12, (RX MCS1-MCS9, TX MCS1-MCS4)
• Cipher Units:
– A51/2/3
– GEA-1/2/3
• Security:
– OMTP TR0
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ X]VX[^
– Secure Boot
– RSA(ROM)/SHA-1(HW accel.)
– OCDS disabling
– Certificate Management
• DSP:
– 178 MHz TeakLite™
• MCU:
– ARM1176® @ 208 MHz
• MCU RAM:
– 3.00Mbit
• Memory I/F:
– 1 Gbit NOR ash/OneNAND ash/SDR SDRAM
– 4 Gbit NAND ash/DDR SDRAM
• Modem:
– GPRS class 12, (RX/TX CS1-CS4)
– EGPRS class 12, (RX MCS1-MCS9, TX MCS1-MCS4)
• Cipher Units:
– A51/2/3
– GEA-1/2/3
• Security:
– OMTP TR0
– Secure Boot
– RSA(ROM)/SHA-1(HW accel.)
– OCDS disabling
– Certicate Management
- 16 -
LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
• Speech Codec:
– FR / HR / EFR / NB-AMR
• Audio Codec (runnin
g
on ARM1176):
g
– SP-MIDI
– SB-ADPCM
– MP3
– WB-AMR
– AAC/AAC+/eAAC+
• Others:
–
DARP (SAIC)
DARP
(SAIC)
– TTY
• Customization:
– E-Fuses
3.1.4 External Memory
•
External Bus Unit
External
Bus
Unit
– 16-bit address bus
– 16-bit address/data muxed bus
– 1.8V support
• Flash / RAM
– NOR Type
– NAND Type (1 bit ECC supported)
Parallel Flash / Cellular RAM(Page & Burst Mode)
–
Parallel
Flash
/
Cellular
RAM(Page
&
Burst
Mode)
- 16-bit AD-multiplexed
- 16-bit AAD-multiplexed
– iNAND Type e.g. oneNAND
– SDRAM
- DDR SDRAM : up to 4 Gbit
- SDR SDRAM : up to 1 Gbit
M d
•
M
emory car
d
– SD/MMC card interface with 1 or 4 data lines
3.1.5 Connectivity
• 3xUSIF (configurable either as SPI or UART), I2C, I2S; Interfaces @ 1.8V
• Direct (U)SIM 1.8/3V
f
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ X^VX[^
• USB2.0 up to 480 Mbit/s (High Speed) w/ external USB Phy over ULPI inter
f
ace
• Stereo Headset (Amplifier integrated)
• 3 external analog measurement PIN’s
• Bluetooth
3. TECHNICAL BRIEF
- 17 -
LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3.1.6 Mixed Signal
• Improved audio performance
•
Improved
audio
performance
• Loudspeaker Audio Class D Amplifier, 700 mW@8 Ω mono for hands-free and ringing
• Stereo Headset 2x30 mW@16 Ω w/o coupling C
• Mono Earpiece 100 mW@16 Ω
• Digital microphone supported
• Differential microphone inputs
3.1.7 FM Radio
• Integrated FM radio
– FM Stereo RDS Receiver
– Sensitivity 2 μV EMF
– Support for US & EU bands
– Stereo recording
3.1.8 Power Management
• Direct-to-Battery Connection
– LDOs (incl. capless)
– DC/DC step-down converter
– DC/DC step-up for white LED supply
• Battery Type
– Li-Polymer
• Charging control
– Battery temperature
– Watchdog protection
– Start-up on flat battery
• External Charger
– Switch mode
• USB battery charging
– USB charging spec 1.0 compliant
• Backlight
– U
p
to 4 serial white LEDs
(
inte
g
rated LDO
)
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ X_VX[^
p ( g )
- 18 -
LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1.9 Main LCD Display
Type
•
Type
– 240*320, QVGA, 262k color (parallel)
• Interface
– Parallel 8/9bit MIPI-DBI Type B
– Serial MIPI-DBI Type C
– Interf. voltage at 1.8V or 2.8V
• gRacr - Display Controller (Hardware)
30 f Di l d i h DMA ( 60 f ) (f ll i l)
–
30
f
ps
Di
sp
l
ay up
d
ate w
i
t
h
out
DMA
(
up to
60
f
ps
)
(f
u
ll
or part
i
a
l)
– Video post processing Scaling, Rotation (90¶steps), Mirroring
– Overlay with alpha blending
– Color conversion YUV -> RGB
– 2D vector graphics (Lines, filled rectangles, Bit block transfer (e.g. sprites, scrolling, antialiased bitmap
fonts)
3 1 10 C
3
.
1
.
10
C
amera
• 2 Mpx YUV parallel interface
• HW JPEG encoder (39 Mpx/sec)
• 39 MHz Pixel Rate
• 15 fps@ 2 Mpx full resolution
3.1.11 Video Capabilities
• Video Decoding MPEG-4/H.263
– QCIF@30 fps
– QVGA@15fps
• Video Encoding MPEG-4/H.263
– QCIF@15 fps
3.1.12 Audio Capabilities
• Polyphonic ring tones
– 64 voices MIDI, SP-MIDI
– FM synthesizer
• AMR-WB
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ X`VX[^
• True ring tones (MP3)
• MP3, eAAC+
• G.722 SB-ADPCM encoding/decoding
3.1.10 Camera
• 3 Mpx YUV parallel interface
• HW JPEG encoder (39 Mpx/sec)
• 39 MHz Pixel Rate
• 15 fps@ 3 Mpx full resolution
3. TECHNICAL BRIEF
3.1.9 Main LCD Display
Type
•
Type
– 240*320, QVGA, 262k color (parallel)
• Interface
– Parallel 8/9bit MIPI-DBI Type B
– Serial MIPI-DBI Type C
– Interf. voltage at 1.8V or 2.8V
• gRacr - Display Controller (Hardware)
30 f Di l d i h DMA ( 60 f ) (f ll i l)
–
30
f
ps
Di
sp
l
ay up
d
ate w
i
t
h
out
DMA
(
up to
60
f
ps
)
(f
u
ll
or part
i
a
l)
– Video post processing Scaling, Rotation (90¶steps), Mirroring
– Overlay with alpha blending
– Color conversion YUV -> RGB
– 2D vector graphics (Lines, filled rectangles, Bit block transfer (e.g. sprites, scrolling, antialiased bitmap
fonts)
3 1 10 C
3
.
1
.
10
C
amera
• 2 Mpx YUV parallel interface
• HW JPEG encoder (39 Mpx/sec)
• 39 MHz Pixel Rate
• 15 fps@ 2 Mpx full resolution
3.1.11 Video Capabilities
• Video Decoding MPEG-4/H.263
– QCIF@30 fps
– QVGA@15fps
• Video Encoding MPEG-4/H.263
– QCIF@15 fps
3.1.12 Audio Capabilities
• Polyphonic ring tones
– 64 voices MIDI, SP-MIDI
– FM synthesizer
• AMR-WB
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ X`VX[^
• True ring tones (MP3)
• MP3, eAAC+
• G.722 SB-ADPCM encoding/decoding
3. TECHNICAL BRIEF
- 19 -
LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3.2 Power Management
A mobile platform requires power supplies for different functions. These power supplies are generated in the
3. TECHNICAL BRIEF
integrated power management Unit (PMU). The PMU is designed to deliver the power for a typical standard
phone.
Figure. 3-2-1 Block Figure of the PMU Modules X-Gold tm 215
DC/DC Step Down Converter for 1.8V (SD1)
The DC/DC converter generates a 1.8V supply rail. This voltage rail is used to supply main parts of the system,
like the digital core of the chip (via LDO LCORE), some parts of the mixed signal macro, parts of the RF macro and
the external memory if a 1.8V memory is used. The efficiency of the DC/DC converter is optimized for an average
load current of 100mA. That is the load current estimated for the GSM talk mode.
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ YWVX[^
3.2 Power Management
A mobile platform requires power supplies for different functions. These power supplies are generated in the
3. TECHNICAL BRIEF
integrated power management Unit (PMU). The PMU is designed to deliver the power for a typical standard
phone.
Figure. 3-2-1 Block Figure of the PMU Modules X-Gold tm 215
DC/DC Step Down Converter for 1.8V (SD1)
The DC/DC converter generates a 1.8V supply rail. This voltage rail is used to supply main parts of the system,
like the digital core of the chip (via LDO LCORE), some parts of the mixed signal macro, parts of the RF macro and
the external memory if a 1.8V memory is used. The efficiency of the DC/DC converter is optimized for an average
load current of 100mA. That is the load current estimated for the GSM talk mode.
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ YWVX[^
- 20 -
LGE Internal Use Only Copyright © 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
Linear voltage Regulators (low dropout) LDOs
The LDOs are used to generate the supply for the different supply domains not directly supplied out of the
DC/DC converter.
The VSIM output current is high enough to drive USB SIM cards.
LCORE
Th LCORE LDO id th VCORE l d f t f th di it l t f th hi
Th
e
LCORE
LDO
prov
id
es
th
e
VCORE
supp
l
y use
d
f
or mos
t
o
f
th
e
di
g
it
a
l
par
t
s o
f
th
e c
hi
p
LPMU
The LPMU provides VPMU sued for the PMU supply, e.g. for the startup state machine and analog parts like ADC,
sense amplifier etc.
LUSB
The LUSB LDO generates the supply for the USB transceiver (output driver and input). If no USB interface is
required, LUSB can be used as general purpose LDO.
LAUX
T
he LAUX generates VAUX. It is a general purpose LDO and can be used for different functions depending on the
phone application, e.g. for the display or Camera.
LMMC
The LMMC generates VMMC. It is a general purpose LDO and can be used e,g. for memory cards
LSIM
The LSIM LDO generates the VSIM supply for the SIM card and interface. It is designed to supply Standard SIM
cards.
Other LDOs
ͽͶͺΟΥΖΣΟΒΝΆΤΖΟΝΪ YXVX[^
The RF module has implemented several LDO’s for different RF Power domain.
The mixed signal module has some LDO’s for the audio driver and microphone supply.
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