LG LG-T510 User manual

Internal Use Only
Service Manual
LG-T510
Date: July, 2011 / Issue 1.0

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Table Of Contents
1. INTRODUCTION...................................................................3
1.1 Purpose .....................................................................................................3
1.2 Regulatory Information ......................................................................3
1.3 Abbreviations..........................................................................................5
2. PERFORMANCE....................................................................7
2.1 H/W Features...........................................................................................7
2.2 Technical Specification........................................................................9
3. TECHNICAL BRIEF..............................................................14
3.1 Digital Main Processor...................................................................... 14
3.2 Power Management ......................................................................... 19
3.3 FEM with integrated Power Amplifier Module
(RF7171, U101) ..................................................................................... 32
3.4 Crystal(26 MHz, X201) ...................................................................... 34
3.5 RF Subsystem of PMB8815 (U201).............................................. 35
3.6 MEMORY(H9DA2GH1GHMMMR, U301) ................................... 40
3.7 BT module............................................................................................. 43
3.8 SIM Card Interface.............................................................................. 45
3.9 LCD Interface........................................................................................ 46
3.10 MiniABB (Battery Charger & MUIC) Interface....................... 49
3.11 Keypad Interface............................................................................. 50
3.12 Audio Interface................................................................................. 52
3.13 Camera Interface(2M Fixed Focus Camera) .......................... 58
3.14 Touch Interface................................................................................. 61
4. TROUBLE SHOOTING ........................................................63
4.1 RF Component .................................................................................... 63
4.2 RX Trouble ............................................................................................. 64
4.3 TX Trouble.............................................................................................. 70
4.4 Power On Trouble............................................................................... 76
4.5 Charging Trouble................................................................................ 79
4.6 Vibrator Trouble .................................................................................. 81
4.7 LCD Trouble .......................................................................................... 84
4.8 Camera Trouble................................................................................... 89
4.9 Speaker / Receiver Trouble............................................................. 94
4.10 Earphone Trouble ............................................................................ 98
4.11 Microphone Trouble.....................................................................102
4.12 SIM Card Interface Trouble.........................................................105
4.13 Micro SD (uSD) Trouble ...............................................................110
4.14 Bluetooth Trouble..........................................................................112
4.15 FM Radio Trouble...........................................................................115
4.16 Touch trouble ..................................................................................118
5. DOWNLOAD.....................................................................121
6. REPAIR GUIDE .................................................................134
6.1 Disassemble Main Board...............................................................134
6.2 Disassembly Camera Module......................................................135
6.3 Ready to Rework Camera..............................................................136
6.4 Assembly Camera (Rework)........................................................137
6.5 Soldering Camera Module and Function Test......................138
7. BLOCK DIAGRAM.............................................................139
8. CIRCUIT DIAGRAM ..........................................................140
9. BGA PIN MAP ..................................................................148
10. PCB LAYOUT...................................................................150
11. ENGINEERING MODE ....................................................156
12. STAND ALONE TEST ......................................................157
12.1 Introduction.....................................................................................157
12.2 Setting Method ..............................................................................157
12.3 Tx Test .................................................................................................160
12.4 Rx Test.................................................................................................161
13.AUTO CALIBRATION.......................................................162
13.1 Overview...........................................................................................162
13.2 Tachyon Directory..........................................................................162
13.3 Test Equipment Setup..................................................................163
13.4 Procedure..........................................................................................163
13.5 AGC......................................................................................................170
13.6 APC ......................................................................................................170
13.7 ADC......................................................................................................170
13.8 Target Power....................................................................................170
14. EXPLODED VIEW & REPLACEMENT PART LIST ..........171
14.1 EXPLODED VIEW.............................................................................171
14.2 Replacement Parts ........................................................................172
14.3 Accessory ..........................................................................................188

1. INTRODUCTION
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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of
this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons
other than your company’s employees, agents, subcontractors, or person working on your company’s behalf)
can result in substantial additional charges for your telecommunications services. System users are responsible
for the security of own system. There are may be risks of toll fraud associated with your telecommunications
system. System users are responsible for programming and configuring the equipment to prevent
unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will
prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or
connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair
can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes
could reasonably be expected to affect the use of the this phone or compatibility with the network, the
telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note
that unauthorized alternations or repair may affect the regulatory status of the system and may void any
remaining warranty.

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such as
the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is also
grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.

1. INTRODUCTION
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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
Wireless Application Protocol
WAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM

2. PERFORMANCE
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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2.1 H/W Features
Item Feature Comment
Standard Battery Lithium-Ion, 3.7V 1100mAh
Stand by TIME Up to 696 hrs : Paging Period 5, RSSI 85dBm
Talk time Up to 14hrs : GSM Tx Level 7
Charging time Approx 3hours
RX Sensitivity GSM, EGSM: -108dBm, DCS: -108dBm
TX output power GSM850 : 32.3dBm, EGSM: 32.8dBm(Level 5),
DCS , PCS: 29.8dBm(Level 0)
SIM card type 3V / 1.8V
Display MAIN : 2.8” TFT 240 Ý320 pixel 262K Color
Status Indicator Send Key, End Key, Cancel Key,
Volume Up/Down Key, PWR(Lock) Key
ANT Internal
EAR Phone Jack Yes (3.5Ȱ)
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
GPRS compatibility Class 12
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
Microphone Yes
Approx 3.5hours

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
Travel Adapter Yes
Speaker/Receiver 18x12ȰSpeaker/ Receiver
MIDI SW MIDI (Mono SPK)
Item Feature Comment
Camera 2.0M FF
Bluetooth / FM Radio Bluetooth version 2.1 / Wired FM radio (Earphone needed)
18x12ȰSpeaker/ 1107 Receiver

2. PERFORMANCE
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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2.2 Technical Specification
Item Description Specification
1 Frequency Band
GSM850 EGSM
TX: 824 ~ 849 MHz TX: 880 ~ 915MHz
RX: 869 ~ 894 MHz RX: 925 ~ 960 MHz
DCS
TX: 1710 ~ 1785 MHz
RX: 1805 ~ 1880 MHz
PCS
TX: 1850 ~ 1910 MHz
RX: 1930 ~ 1990 MHz
2 Phase Error RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
4 Power Level
Level Power Toler. Level Power Toler.
6 31dBm ·3dB 14 15dBm ·3dB
7 29dBm ·3dB 15 13dBm ·3dB
8 27dBm ·3dB 16 11dBm ·5dB
9 25dBm ·3dB 17 9dBm ·5dB
10 23dBm ·3dB 18 7dBm ·5dB
11 21dBm ·3dB 19 5dBm ·5dB
12 19dBm ·3dB
GSM850/EGSM
5 33dBm ·2dB 13 17dBm ·3dB
Level Power Toler. Level Power Toler.
1 28dBm ·3dB 9 12dBm ·4dB
2 26dBm ·3dB 10 10dBm ·4dB
3 24dBm ·3dB 11 8dBm ·4dB
4 22dBm ·3dB 12 6dBm ·4dB
5 20dBm ·3dB 13 4dBm ·4dB
6 18dBm ·3dB 14 2dBm ·5dB
7 16dBm ·3dB 15 0dBm ·5dB
DCS/PCS
0 30dBm ·2dB 8 14dBm ·3dB

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
5Output RF Spectrum
(due to modulation)
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
6,000 -71
GSM850/ EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
DCS/PCS
6
Output RF Spectrum
(due to switching
transient)
GSM850/ EGSM
Offset from Carrier (kHz). Max. dBm
400 -19
600 -21
1,200 -21
1,800 -24
Item Description Specification