LG Shine KE970 User manual

Date: January, 2007 / Issue 1.0
Service Manual Model : KE970
Service Manual
KE970

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* The information in this manual is subject to change without notice and should not be construed as a
commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes
to equipment design as advances in engineering and manufacturing methods warrant.
* This manual provides the information necessary to install, program, operate and maintain the KE970.
REVISED HISTORY
Editor Date Issue Contents of Changes S/W Version
G.C. LIM 2006/03/29 0.1

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1. INTRODUCTION ...............................7
1.1 Purpose .................................................. 7
1.2 Regulatory Information............................ 7
1.3 ABBREVIATION ..................................... 9
2. PERFORMANCE .............................11
2.1 H/W Features.........................................11
2.2 Technical specification...........................12
3. TECHNICAL BRIEF ........................17
3.1 KE970 Component Block diagram.........17
3.2 Baseband Processor (BBP)
Introduction ............................................18
3.3 Power management IC ..........................30
3.4 Power ON/OFF ......................................35
3.5 SIM interface..........................................37
3.6 Memory..................................................38
3.7 LCD Display...........................................39
3.8 Keypad Switching & Scanning...............40
3.9 Keypad back-light illumination ...............42
3.10 LCD back light illumination...................43
3.11 Battery current consumption monitor...45
3.12 JTAG & ETM interface connector ........45
3.13 Audio....................................................46
3.14 Multi port switch ...................................48
3.15 USB charging circuit ............................50
3.16 BLUETOOTH.......................................51
3.17 Micro SD external memory card slot.....55
3.18 18pin Multi Media Interface connector.57
3.19 General Description .............................59
3.20 Receiver part........................................61
3.21 Transmitter part....................................62
3.22 RF synthesizer.....................................63
3.23 TCXO...................................................63
3.24 Front End Module control.....................64
3.25 Power Amplifier Module.......................64
4. PCB layout......................................65
4.1 Main & Sub PCB component
placement ..............................................65
5. Trouble shooting............................72
5.1 Trouble shooting test setup....................72
5.2 Power on Trouble...................................72
5.3 Charging trouble ....................................76
5.4 LCD display trouble................................78
5.5 Camera Trouble.....................................80
5.6 Receiver & Speaker trouble...................82
5.7 Microphone trouble ................................84
5.8 Vibrator trouble ......................................86
5.9 Keypad back light trouble.......................88
5.10 Micro SD and SIM card trouble............90
5.11 RF PART TROUBLESHOOTING ........93
6. Download & S/W upgrade...............108
6.1 S/W download setup............................108
6.2 Download program user guide.............109
7. CIRCUIT DIAGRAM ......................117
8. PCB LAYOUT................................123
9. RF Calibration ..............................129
9.1 Test Equipment Setup .........................129
9.2 Calibration Steps..................................129
10. Stand along ................................135
10.1 Test Program Setting.........................135
10.2 Tx Test...............................................137
10.3 Rx Test...............................................138
11. ENGINEERING MODE ................139
12. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 141
12.1 Exploded View .................................. 141
12.2 Replacement Parts ............................146
12.3 Accessory ......................................... 159
Table Of Contents

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1. INTRODUCTION
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1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the KE970.
1.2. Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges you’re your telecommunications
services. System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users
are responsible for programming and configuring the equipment to prevent unauthorized use. LGE
does not warrant that this product is immune from the above case but will prevent unauthorized use of
common-carrier telecommunication service of facilities accessed through or connected to it. LGE will
not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the KE970 or compatibility with the network,
the telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the KE970 must be performed only at the LGE or its authorized agents.
The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION

1. INTRODUCTION
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E. Notice of Radiated Emissions
The KE970 complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
An KE970 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference
from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign.
Following information is ESD handling: Service personnel should ground themselves by using a wrist
strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective
packages until these are used. When returning system boards or parts such as EEPROM to the
factory, use the protective package as described.

1. INTRODUCTION
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1.3 ABBREVIATION
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
CLA Cigar Lighter Adapter
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli-watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
LGE LG Electronics

1. INTRODUCTION
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OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol

2. PERFORMANCE
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2.1 H/W Feature
2. PERFORMANCE
Item Feature Comment
Standard Battery Li-ion, 800mAh
AVG TCVR Current 280mA PL5
Standby Current <2.7mA @PP9
Talk time 3hours (GSM TX Level 7)
Standby time 277 hours (Paging Period:9, RSSI: -85dBm)
Charging time 3 hours
RX Sensitivity GSM900 : -105dBm, DCS/PCS : -105dBm
TX output power GSM900: 32dBm (Level 5)
DCS/PCS: 29dBm (Level 0)
GPRS compatibility Class 10
SIM card type 3V Small
Display 320 x 240 pixels, 2.2 inch wide, 265K color, TFT
Soft icons
Key Pad
Status Indicator 0 ~ 9, #, *, END/PWR, SEND, CLEAR Key
Side Key
Up/Down, AF/Camera double action key
ANT Built in antenna
EAR Phone Jack 18pin multi port Headset jack with Remote controller
PC Synchronization Yes
Speech coding EFR/FR/AMR
Data and Fax Yes
Vibrator Yes
Buzzer No
Voice Recoding Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Bluetooth hands-free kit, Data Kit

2. PERFORMANCE
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2.2 Technical specification
Item Description Specification
GSM900
TX: 890 + 0.2 x n MHz
RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )
EGSM
1 Frequency Band TX: 890 + 0.2 x (n-1024) MHz
RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )
DCS1800
TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)
RX: TX + 95 MHz
PCS1900
TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810)
RX: TX + 80MHz
2 Phase Error RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1ppm
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
4 Power Level 12 19 dBm 3dB
DCS1800/PCS1900
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB

2. PERFORMANCE
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Item Description Specification
GSM900/EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
5Output RF Spectrum 6,000 -71
(due to modulation) DCS1800/PCS1900
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
GSM850
Offset from Carrier (kHz) Max. (dBm)
Output RF Spectrum 400 -19
6(due to switching transient) 600 -21
1,200 -21
1,800 -24

2. PERFORMANCE
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Item Description Specification
DCS1800/PCS1900
Offset from Carrier (kHz). Max. (dBm)
Output RF Spectrum 400 -22
6(due to switching transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
GSM850
8 Bit Error Ratio BER (Class II) < 2.439% @-102dBm
DCS1800/PCS1900
BER (Class II) < 2.439% @-100dBm
9 Rx Level Report accuracy 3 dB
10 SLR 8 3 dB
11 Sending Response
12 RLR -15 3 dB
13 Receiving Response
*Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.

2. PERFORMANCE
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Item Description Specification
14 STMR > 17 dB
15 Stability Margin > 40 dB
16 Idle Noise Sending < -64dB
17 Idle Noise Receiving < -47dB
18 Side tone Distortion Three stage distortion < 10%
19 <Change> System frequency 2.5ppm
(26 MHz) tolerance
20 <Change>32.768KHz tolerance 30ppm
Standby
21 Power consumption - Normal 5.2mA(Mix. power)
22 Talk Time GSM900/Lvl 7(Battery Capacity 800mA) : Min. 2.5 hr
GSM900/Lvl 12(Battery Capacity 800 mA) : Min. 3hr
Under conditions, at least Min. 250 hr
1. Brand new and full 800mAh battery
23 Standby Time 2. Full charge, no receive/send and keep GSM in idle mode.
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
At least 65 dB under below conditions:
24 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
25 Charge Voltage Fast Charge : < 450 mA
Slow Charge: < 55mA
Antenna Bar Number Power
5 -85 dBm ~
4 -90 dBm ~ -86 dBm
26 Antenna Display 3 -95 dBm ~ -91 dBm
2 -100 dBm ~ -96 dBm
1 -105 dBm ~ -101 dBm
0 ~ -105 dBm

2. PERFORMANCE
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Item Description Specification
Battery Bar Number Voltage( 0.05V)
4 3.86V~4.2V
27 Battery Indicator 3 3.75V~3.85V
2 3.75V~3.69V
1 3.69V~3.62V
0 3.62V~
28 Low Voltage Warning 3.62V↓0.05V (Call)
3.50V↓0.05V (Standby)
29 Forced shut down Voltage 3.35 0.05 V
1 Li-ion Battery
30 Battery Type Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 800mAh
Switching-mode charger
31 Travel Charger Input: 100 ~ 240 V, 50/60Hz
Out put: 4.8, 0.9A

3. TECHNICAL BRIEF
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3.1. KE970 Component Block diagram.
KE970 is composed with 3 different PCB part such as main PCB, keypad FPCB and slide FPCB.
3. TECHNICAL BRIEF
Figure 1. KE970 Hardware architecture

3. TECHNICAL BRIEF
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3.2. Baseband Processor (BBP) Introduction
3.2.1 General Description
S-GOLD2TM is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital
functionality of a cellular radio. Additionally S-GOLD2TM Provides multimedia extensions such as
camera, software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and
mixed signal portions of the base band in 0.13um, 1.5V technology. The chip will fully support the FR,
EFR, HR and AMR-NB vocoding. S-GOLD2TM support multi-slot operation modes HSCSD (up to class
10), GPRS for high speed data application (up to class 12) and EGPRS (up to class 12) without
additional external hardware.
Figure 2. Top level block diagram of the S-GOLD2TM (PMB8876)

3. TECHNICAL BRIEF
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3.2.2. Block Description
• Processing core
ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,
and the Jazelle Java extension for Java acceleration.
- TEAKLite DSP core
• ARM-Memory
- 32k Byte Boot ROM on the AHB
- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 16k Byte Cache for Program (internal)
- 8k Byte tightly coupled memory for Program(internal)
- 8k Byte Cache for Data(internal)
- 8k Byte tightly coupled memory for Data(internal)
• DSP-Memory
- 104K x 16bit Program ROM
- 8k x 16bit Program RAM
- 60k x 16bit Data ROM
- 37k x 16bit Data RAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit
• Shared Memory Block
1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.
• Controller Bus system
The processor cores and their peripherals are connected by powerful buses. Multi-layer AHB for
connecting the ARM and the other master capable building blocks with the internal and external
memories and with the peripheral buses.
• Clock system
The clock system allows widely independent selection of frequencies for the essential parts of the
S-GOLD2. Thus power consumption and performance can be optimized for each application.
• Functional Hardware block
- CPU and DSP Timers
- MOVE coprocessor performing motion estimation for video encoding algorithms
(H.263, MPEG-4)
- Programmable PLL with additional phase shifters for system clock generation
- GSM Timer Module that off-loads the CPU from radio channel timing
- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)
- GMSK Modulator: gauss-filter with B*T=0.3
- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter
- Hardware accelerators for equalizer and channel decoding.
- Incremental Redundancy memory for EDGE class 12 support
- A5/1, A5/2, A5/3 Cipher unit
- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

3. TECHNICAL BRIEF
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- Advanced static and dynamic power management features including TDMA-Frame synchronous
low power mode and enhanced CPU modes(idle and sleep modes)
- Pulse Number Modulation output for Automatic Frequency Correction(AFC)
- Serial RF Control interface: support of direct conversion RF
- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI)
serial data transmission
- 1 Serial Synchronous SPI compatible interfaces in the controller domain
- 1 Serial Synchronous SPI compatible interface in the TEAKLite domain
- 2 USART with autobaud detection, hardware flow control and integrated IrDA controller
supporting IrDA’s SIR standard (up to 115.2Kbps)
- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards (up to 4Mbps)
- I2C-bus interface (e.g. connection to S/M power)
- A fast display interface supporting serial and parallel interconnection
- An ITU-R BT.656 compatible Camera interface.
- Programmable clock output for a camera
- An multimedia/Secure Digital Card Interface (MMCI/SD:SDIO capable)
3.2.3. External Devices connected to memory interface
Table 1 Memory interface
3.2.4. RF Interface (T_OUT)
S-Gold2 uses this interface to control RF IC and Peripherals. 13 signals are provided switch on/off RF
ICs Periodically each TDMA frame.
Table 2 RF Interface Spec.
Device Name Maker Remark
FLASH PF38F5060M0Y0B0 Intel Synchronous / A synchronous
SDRAM PF38F5060M0Y0B0 Intel Synchronous 104MHz
LCD IL220DBN1A LGIT 8bit access 3times transmission
Melody IC Not Used S/W Infineon Software CODEC
T_OUT
Resource Interconnection Description
T_OUT0 TXON_PA PAM Power on
T_OUT1 VIBRATOR_EN VBRATOR ON-
T_OUT2 PA_BAND TX RF band select
T_OUT3 ANT_SW1 FEM control
T_OUT4 ANT_SW2 FEM control
T_OUT5 ANT_SW3 FEM control
T_OUT6 MODE PAM Mode select

3. TECHNICAL BRIEF
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3.2.5. USART Interface
KE970 have two UART Drivers as follow :
- USART1 : Hardware Flow Control / SW upgrade / Calibration
- USART2 : SW debug trace.
Table 3 USART Interface Spec.
3.2.6. ADC channel
BBP ADC block is composed of 7 external ADC channel . This block operates charging process and
other related process by reading battery voltage and other analog values.
Table 4 S-Gold2 ADC channel usage
USART_0(USART1)
Resource Name Remark
USART0_TXD TXD_0 Transmit Data
USART0_RXD RXD_0 Receive Data
USART0_CTS CTS_0 Clear To Send
USART0_RTS RTS_0 Request To Send
DSR N.C.
USART_1(USART2)
USART1_TXD TX_DEBUG Trace data tx
USART1_RXD RX_DEBUG Trace data rx
USART1_CTS N.C. N.C.
USART1_RTS N.C. N.C.
ADC channel
Resource Interconnection Description
M0 BATT_TEMP Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 JACK_TYPE Accessory type detect
M7 H/W VERSION S-Gold2 H/W version detect
M8 VSUPPLY Battery supply voltage measure
M9 I_MONITOR Current consumption measure
M10 REMOTE_ADC Remote control key detect